JP2004130371A5 - - Google Patents

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Publication number
JP2004130371A5
JP2004130371A5 JP2002299520A JP2002299520A JP2004130371A5 JP 2004130371 A5 JP2004130371 A5 JP 2004130371A5 JP 2002299520 A JP2002299520 A JP 2002299520A JP 2002299520 A JP2002299520 A JP 2002299520A JP 2004130371 A5 JP2004130371 A5 JP 2004130371A5
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JP
Japan
Prior art keywords
joined body
body according
metal
joined
sintered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002299520A
Other languages
Japanese (ja)
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JP2004130371A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2002299520A priority Critical patent/JP2004130371A/en
Priority claimed from JP2002299520A external-priority patent/JP2004130371A/en
Priority to CNB038009056A priority patent/CN100337782C/en
Priority to KR1020047000955A priority patent/KR20050040812A/en
Priority to TW092125572A priority patent/TWI284581B/en
Priority to EP03788702A priority patent/EP1578559B1/en
Priority to DE60326760T priority patent/DE60326760D1/en
Priority to PCT/JP2003/011797 priority patent/WO2004026526A1/en
Priority to US10/484,454 priority patent/US20040245648A1/en
Publication of JP2004130371A publication Critical patent/JP2004130371A/en
Publication of JP2004130371A5 publication Critical patent/JP2004130371A5/ja
Pending legal-status Critical Current

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Claims (10)

２つ以上の部材を接合した接合体であって、該部材の接合部には、金属の焼結組織からなる金属焼結部を含むことを特徴とする接合体。  A joined body in which two or more members are joined, wherein the joined portion of the members includes a sintered metal portion made of a sintered metal structure. 前記金属焼結部は、金属粒子からなる金属核の周囲を有機化合物で結合・被覆することによって生成した複合型金属ナノ粒子を主体とする接合材料を前記部材の接合部に介在させ、該接合材料を所定の位置に保持した状態で加熱・焼成して前記部材を接合することによって得られたものであることを特徴とする請求項１記載の接合体。  The metal sintered part interposes a bonding material mainly composed of composite metal nanoparticles generated by bonding and coating the periphery of a metal nucleus composed of metal particles with an organic compound in the bonding part of the member, and 2. The joined body according to claim 1, wherein the joined body is obtained by joining the members by heating and firing in a state where the material is held at a predetermined position. 前記複合型金属ナノ粒子の金属核の平均直径は、１００ｎｍ以下で０．５ｎｍ以上であることを特徴とする請求項２記載の接合体。The bonded body according to claim 2, wherein the average diameter of the metal core of the composite metal nanoparticle is 100 nm or less and 0.5 nm or more. 前記接合材料には、骨材が添加されていることを特徴とする請求項２または３記載の接合体。The joined body according to claim 2 or 3 , wherein an aggregate is added to the joining material. 前記骨材は、金属、プラスチックまたは金属、プラスチック以外の無機物のうちのいずれか１種または複数種を組合せたものであることを特徴とする請求項４記載の接合体。The joined body according to claim 4, wherein the aggregate is one or a combination of metals, plastics, or metals and inorganic substances other than plastics. 前記骨材の大きさは、平均粒子径が１００μｍ以下であることを特徴とする請求項４または５記載の接合体。The joined body according to claim 4 or 5, wherein the aggregate has an average particle diameter of 100 µm or less. 前記有機化合物は、Ｃ，Ｈ及び／またはＯを主成分としたものであることを特徴とする請求項２乃至６のいずれかに記載の接合体。The joined body according to any one of claims 2 to 6, wherein the organic compound is mainly composed of C, H and / or O. 前記複合型金属ナノ粒子は、その金属核の平均直径が１００ｎｍ程度以下であることを特徴とする請求項２乃至７のいずれかに記載の接合体。The joined body according to any one of claims 2 to 7 , wherein the composite metal nanoparticles have an average diameter of a metal nucleus of about 100 nm or less. 前記複合型金属ナノ粒子の金属核は、金、銀、パラジウムまたは銅を主成分とすることを特徴とする請求項２乃至８のいずれかに記載の接合体。The joined body according to any one of claims 2 to 8 , wherein the metal core of the composite metal nanoparticle contains gold, silver, palladium, or copper as a main component. 前記金属焼結部は、半導体ベアチップの基材への接合部、または半導体パッケージの配線板への接合部に形成されていることを特徴とする請求項１乃至９のいずれかに記載の接合体。The joined body according to any one of claims 1 to 9 , wherein the sintered metal part is formed at a joint part of a semiconductor bare chip to a base material or a joint part of a semiconductor package to a wiring board. .
JP2002299520A 2002-09-18 2002-10-11 Joined body Pending JP2004130371A (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2002299520A JP2004130371A (en) 2002-10-11 2002-10-11 Joined body
US10/484,454 US20040245648A1 (en) 2002-09-18 2003-09-17 Bonding material and bonding method
EP03788702A EP1578559B1 (en) 2002-09-18 2003-09-17 Bonding method
KR1020047000955A KR20050040812A (en) 2002-09-18 2003-09-17 Bonding material and bonding method
TW092125572A TWI284581B (en) 2002-09-18 2003-09-17 Bonding material and bonding method
CNB038009056A CN100337782C (en) 2002-09-18 2003-09-17 Joining material and joining method
DE60326760T DE60326760D1 (en) 2002-09-18 2003-09-17 PROCESS FOR CONNECTING
PCT/JP2003/011797 WO2004026526A1 (en) 2002-09-18 2003-09-17 Bonding material and bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002299520A JP2004130371A (en) 2002-10-11 2002-10-11 Joined body

Publications (2)

Publication Number Publication Date
JP2004130371A JP2004130371A (en) 2004-04-30
JP2004130371A5 true JP2004130371A5 (en) 2005-08-25

Family

ID=32288629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002299520A Pending JP2004130371A (en) 2002-09-18 2002-10-11 Joined body

Country Status (1)

Country Link
JP (1) JP2004130371A (en)

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JP4069867B2 (en) 2004-01-05 2008-04-02 セイコーエプソン株式会社 Member joining method
JP4378239B2 (en) 2004-07-29 2009-12-02 株式会社日立製作所 A semiconductor device, a power conversion device using the semiconductor device, and a hybrid vehicle using the power conversion device.
JP2006093420A (en) * 2004-09-24 2006-04-06 Oki Electric Ind Co Ltd Mounting method of semiconductor device
JP4514581B2 (en) * 2004-10-06 2010-07-28 忠正 藤村 Lead-free solder composite powder and lead-free solder solder paste
WO2006057467A1 (en) * 2004-11-26 2006-06-01 Seoul National University Industry Foundation Method for large-scale production of monodisperse nanoparticles
EP2047943A4 (en) 2006-07-05 2012-12-19 Fuji Electric Co Ltd Cream solder and method of soldering electronic part
JP4873160B2 (en) * 2007-02-08 2012-02-08 トヨタ自動車株式会社 Joining method
JP4876979B2 (en) * 2007-03-05 2012-02-15 戸田工業株式会社 Joining member and joining method
US8555491B2 (en) 2007-07-19 2013-10-15 Alpha Metals, Inc. Methods of attaching a die to a substrate
DE102009000192A1 (en) * 2009-01-14 2010-07-15 Robert Bosch Gmbh Sintered material, sintered compound and method for producing a sintered compound
JP2010283105A (en) * 2009-06-04 2010-12-16 Hitachi Metals Ltd Wiring board cooling mechanism and method of manufacturing the same, and bonding structure and method of manufacturing the same
KR101623449B1 (en) 2009-07-14 2016-05-23 도와 일렉트로닉스 가부시키가이샤 Bonding material and bonding method each using metal nanoparticles
JP5824201B2 (en) * 2009-09-11 2015-11-25 Ｄｏｗａエレクトロニクス株式会社 Bonding material and bonding method using the same
JP2011165745A (en) * 2010-02-05 2011-08-25 Mitsubishi Electric Corp Ceramic package
JP6018831B2 (en) * 2011-08-05 2016-11-02 積水化学工業株式会社 Manufacturing method of bonded structure
JP5804838B2 (en) * 2011-08-11 2015-11-04 古河電気工業株式会社 Ceramic joint
JP2012124497A (en) * 2011-12-26 2012-06-28 Hitachi Metals Ltd Semiconductor device
JP5705150B2 (en) * 2012-02-16 2015-04-22 株式会社ノリタケカンパニーリミテド Metal fine particle dispersion and method for producing the same
JP2014017364A (en) * 2012-07-09 2014-01-30 Panasonic Corp Manufacturing system and manufacturing method of component mounting substrate
JP6380791B2 (en) * 2013-08-09 2018-08-29 国立大学法人大阪大学 Joining method using micro-sized silver particles
JP6346807B2 (en) * 2014-07-02 2018-06-20 積水化学工業株式会社 Conductive particles, bonding composition, bonded structure, and manufacturing method of bonded structure
CN107649690A (en) * 2017-09-08 2018-02-02 苏州汉尔信电子科技有限公司 A kind of low-temperature sintering nanometer tin particles and preparation method thereof

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JPH0524942A (en) * 1991-07-16 1993-02-02 Hitachi Maxell Ltd Joining method and adhesive
JP2794360B2 (en) * 1992-03-11 1998-09-03 三ツ星ベルト株式会社 Bonding method of materials to be bonded selected from metals and ceramics, and bonding agent used therefor
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JP3205793B2 (en) * 1996-12-19 2001-09-04 株式会社巴製作所 Ultrafine particles and method for producing the same
JP4162342B2 (en) * 1999-12-21 2008-10-08 株式会社荏原製作所 Transparent conductive film and method for producing the same
JP4020549B2 (en) * 1999-11-17 2007-12-12 株式会社荏原製作所 Printed circuit board and manufacturing method thereof
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JP3942816B2 (en) * 2000-10-25 2007-07-11 ハリマ化成株式会社 Brazing joining method between metals

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