JP2008186567A5 - - Google Patents
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- Publication number
- JP2008186567A5 JP2008186567A5 JP2007236609A JP2007236609A JP2008186567A5 JP 2008186567 A5 JP2008186567 A5 JP 2008186567A5 JP 2007236609 A JP2007236609 A JP 2007236609A JP 2007236609 A JP2007236609 A JP 2007236609A JP 2008186567 A5 JP2008186567 A5 JP 2008186567A5
- Authority
- JP
- Japan
- Prior art keywords
- dielectric
- metal layer
- spring metal
- flexure
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims 20
- 239000002184 metal Substances 0.000 claims 20
- 238000000034 method Methods 0.000 claims 3
- 238000005530 etching Methods 0.000 claims 2
- 230000007935 neutral effect Effects 0.000 claims 2
- 239000000725 suspension Substances 0.000 claims 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229920000728 polyester Polymers 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/627,521 | 2007-01-26 | ||
| US11/627,521 US7813082B2 (en) | 2007-01-26 | 2007-01-26 | Head suspension flexure with inline lead portions positioned at a level between levels of first and second surfaces of the spring metal layer |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008186567A JP2008186567A (ja) | 2008-08-14 |
| JP2008186567A5 true JP2008186567A5 (enExample) | 2010-08-12 |
| JP4820790B2 JP4820790B2 (ja) | 2011-11-24 |
Family
ID=39667684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007236609A Active JP4820790B2 (ja) | 2007-01-26 | 2007-09-12 | インライン型リード部を有するヘッドサスペンションフレクシャ |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US7813082B2 (enExample) |
| JP (1) | JP4820790B2 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8605389B1 (en) | 2006-06-09 | 2013-12-10 | Western Digital Technologies, Inc. | Head gimbal assembly including a conductive trace disposed upon a continuous dielectric layer segment without overlying a gimbal arm |
| US8045296B1 (en) * | 2007-11-29 | 2011-10-25 | Hutchinson Technology Incorporated | Aligned coverlay and metal layer windows for integrated lead suspensions |
| US20100046351A1 (en) * | 2008-08-22 | 2010-02-25 | Nitto Denko Corporation | Copper residual stress relaxation reduction means for hard disk drive slider gimbals |
| US8462464B1 (en) * | 2009-11-24 | 2013-06-11 | Magnecomp Corporation | High strength flying leads for multi-layer flexure designs |
| JP5591602B2 (ja) * | 2010-06-24 | 2014-09-17 | 日本発條株式会社 | フレキシャ及びその配線部形成方法 |
| JP5201174B2 (ja) * | 2010-06-29 | 2013-06-05 | 大日本印刷株式会社 | サスペンション用基板およびその製造方法 |
| US8758910B2 (en) * | 2010-06-29 | 2014-06-24 | Dai Nippon Printing Co., Ltd. | Substrate for suspension, and production process thereof |
| US8792212B1 (en) | 2010-09-14 | 2014-07-29 | Western Digital (Fremont), Llc | Robust gimbal design for head gimbal assembly |
| US9025282B1 (en) | 2011-02-10 | 2015-05-05 | Hutchinson Technology Incorporated | Elongated trace tethers for disk drive head suspension flexures |
| US8208224B1 (en) | 2011-08-29 | 2012-06-26 | Western Digital Technologies, Inc. | Suspension assemblies for minimizing stress on slider solder joints |
| US8488281B1 (en) | 2011-09-13 | 2013-07-16 | Western Digital (Fremont), Llc | Disk drive suspension assembly having a flexure bond pad shelf separate from a tongue |
| US8693141B1 (en) * | 2011-11-08 | 2014-04-08 | Western Digital (Fremont), Llc | Systems and methods for providing stacked writer leads for magnetic transducers |
| US8792213B1 (en) | 2013-02-20 | 2014-07-29 | Western Digital Technologies, Inc. | Tethered gimbal on suspension for improved flyability |
| US8976491B1 (en) | 2013-05-09 | 2015-03-10 | Western Digital Technologies, Inc. | Disk drive head suspension distal non-op shock limiter with branched arms |
| US8797691B1 (en) | 2013-05-21 | 2014-08-05 | Western Digital Technologies, Inc. | Disk drive head suspension with a single piezoelectric element adhered to rotary-actuated and non-actuated portions of a structural layer of a tongue of a laminated flexure |
| US8982513B1 (en) | 2013-05-21 | 2015-03-17 | Western Digital Technologies, Inc. | Disk drive head suspension with dual piezoelectric elements adhered to rotary-actuated and non-actuated portions of a structural layer of a tongue of a laminated flexure |
| KR101416159B1 (ko) * | 2013-09-06 | 2014-07-14 | 주식회사 기가레인 | 접촉 패드를 구비하는 인쇄회로기판 |
| JP6020621B2 (ja) * | 2015-02-23 | 2016-11-02 | 大日本印刷株式会社 | サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ |
| JP2016170838A (ja) | 2015-03-12 | 2016-09-23 | 株式会社東芝 | サスペンションアッセンブリ、ヘッドサスペンションアッセンブリ、およびこれを備えたディスク装置 |
| JP6047630B2 (ja) * | 2015-06-23 | 2016-12-21 | 日東電工株式会社 | 回路付サスペンション基板 |
| US10910003B2 (en) | 2016-05-18 | 2021-02-02 | Hutchinson Technology Incorporated | Process coupons used in manufacturing flexures |
| JP2017059293A (ja) * | 2016-12-12 | 2017-03-23 | 大日本印刷株式会社 | サスペンション用基板、サスペンション、ヘッド付サスペンションおよびハードディスクドライブ |
| US10600436B1 (en) * | 2019-01-04 | 2020-03-24 | Seagate Technology Llc | Slider with trailing edge top bond pad interconnect |
| US12002497B2 (en) * | 2020-01-31 | 2024-06-04 | Magnecomp Corporation | Suspension damping |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6427019A (en) * | 1987-07-23 | 1989-01-30 | Hitachi Ltd | Head slider supporter |
| JPH10247310A (ja) * | 1996-12-19 | 1998-09-14 | Hutchinson Technol Inc | 温湿補整用の順次配置され金属裏打ちされ懸架された絶縁体部分を備えた一体型リード懸架装置湾曲体 |
| JP3605497B2 (ja) * | 1997-07-11 | 2004-12-22 | 日本発条株式会社 | ディスク装置用サスペンション |
| JP3935309B2 (ja) * | 2000-06-08 | 2007-06-20 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
| JP3692314B2 (ja) | 2001-07-17 | 2005-09-07 | 日東電工株式会社 | 配線回路基板 |
| JP3877631B2 (ja) | 2002-04-10 | 2007-02-07 | 日本発条株式会社 | ディスクドライブ用サスペンションの配線部材 |
| JP3891912B2 (ja) * | 2002-10-09 | 2007-03-14 | 日本発条株式会社 | ディスクドライブ用サスペンション |
| US7012017B2 (en) | 2004-01-29 | 2006-03-14 | 3M Innovative Properties Company | Partially etched dielectric film with conductive features |
| JP4019068B2 (ja) * | 2004-05-10 | 2007-12-05 | 日東電工株式会社 | 回路付サスペンション基板 |
| JP2007537562A (ja) | 2004-05-14 | 2007-12-20 | ハッチンソン テクノロジー インコーポレーティッド | サスペンションアセンブリ用貴金属導電性リードの作製方法 |
| US7349184B2 (en) * | 2004-08-31 | 2008-03-25 | Hitachi Global Storage Technologies | System and apparatus for continuous reference plane for wireless suspension |
| JP4330580B2 (ja) * | 2005-12-09 | 2009-09-16 | 日本発條株式会社 | 多層グランド層のヘッド・サスペンション及びその製造方法、多層グランド層のフレキシャ及びその製造方法 |
| US8082656B1 (en) * | 2007-09-04 | 2011-12-27 | Hutchinson Technology Incorporated | Method for manufacturing a disk drive head suspension |
-
2007
- 2007-01-26 US US11/627,521 patent/US7813082B2/en active Active
- 2007-09-12 JP JP2007236609A patent/JP4820790B2/ja active Active
-
2010
- 2010-09-07 US US12/876,867 patent/US8448329B2/en active Active
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