M337118 八、新型說明： 【新型所屬之技術領域】 本創作是有關於—種·感應卡之結構改良，尤指一種除 =rr易於量產製造之功效外二= 易，折而造成損壞，使該感應卡具有較佳 【先前技術】 按〃般習用之電子晶片卡5 (如第一及第二圖所 丁八係纟+片本體5 1、一導電膠層5 2及一晶片5 3所構^ 4卡片本體5丄之—面上係設有―容置區$工 1 "亥谷置區511之二側係分別設有一導電部5 1 2， 且該卡片本體5 1内部係埋設與導電部5 i 2連接之感測 線圈5 1 3，该導電膠層5 2係設於容置區5工工中，·該 晶片5 3係設置於容置區5丄i中且層疊於導電膠層5 2 上’而該晶片5 3對應容置區5 χ χ之—面上係設有二接 點5 3 1，使該接點5 3 1可透過導電膠層5 2與各導電 部5 1 2形成導通；藉此，構成一電子晶片卡5。 但疋由於該電子晶片卡5於製造時，係先製作出埋設 感測線圈5 1 3之卡片本體5 1，之後再逐一設置導電部 5 1 2、導電膠層5 2及一晶片5 3等元件，使得製作之 手績較為繁複，而於大量製造時常會耗費較多之工時及工 序’使得不良率提高，而影響電子晶片卡5之品質； 另由於該卡片本體5 1係為硬質塑膠材質所製成，且 M337118 感測線圈5 1 3係為銅之材質所繞設而成，因此該卡片本 體5 1不但會因為不慎之拗折而產生斷裂，且當卡片本體 5 1文拗折時，亦會同時影響其内部之感測線-$ 1 3， 使该感測線圈5 1 3因變形或相互搭接而形成短路；再者 由於该電子晶片卡5之晶片5 3僅係以導電膠層5 2固設 於容置區5 1 1巾，ϋ此當該電子晶片卡5於攜帶時受到 擠壓、或使用一段時間之後，常會使該晶片5 3有鬆動之 情形發生，導致晶片5 3之接點5 3 1與各導電部5 1 2 產生接觸不良之狀況，而影響晶片5 3使用時之電器特性。 【新型内容】 因此，本創作之主要目的係在於，除可使該感應卡達 到易於量產製造之功放外，亦可使該感應卡於使用時不易 因彎折而造成損壞，使該感應卡具有較佳之電器特性。 為達上述之目的，本創作係一種感應卡之結構改良， 包含一底層；一層疊於底層一面上之保護層，該保護層之 適當處係設有穿孔；-層疊於保護層一面上之感應層，該 感應層上係設有感應線圈，而該感應線圈係電性連接有一 對應设於穿孔中之晶片；以及一層疊於感應層一面上之印 刷層，該印刷層上係具有圖樣區。 【實施方式】 睛參閱『第二、四及第五圖』所示，係分別為本創作 之立體分解示意圖、本創作之立體外觀示意圖及本創作之 M337118 第四圖A-A剖面示意圖。如圖所示：本創作係一種感應卡 之結構改良，其至少係由一底層1、一保護層2、一感應 層3以及一印刷層4所構成。 • # 上述所提之底層1係可依所需為適當之尺寸。 該保護層2係層疊於上述底層1之一面上，且該保護 - 層2之適當處係設有穿孔2 1。 該感應層3係層疊於上述保護層2之一面上，且該感 ^ 應層3上係以蝕刻方式成形有感應線圈3 1，且該感應線 圈3 1係可為錫之材質，而該感應線圈3 1係電性連接有 一對應設於穿孔2 1中之晶片3 2。 該印刷層4係層疊於上述感應層3之一面上，且該印 刷層4上係具有圖樣區4 1。如是，藉由上述之結構構成 一全新之感應卡之結構改良。 請參閱『第六及第七圖』所示，係分別為本創作製作 時之分解狀態示意圖及本創作製作時之層疊狀態示意圖。 φ 如圖所示：當本創作於製作時，係可取大尺寸之底層1 a、 保護層2 a、感應層3 a以及印刷層4 a，而於該保護層2 a 之預定位置上開設多數穿孔2 1 a，且於該感應層3 a上蝕 刻出多數感應線圈3 1 a，而各感應線圈3 1 a係分別電性 連接有一晶片3 2 a，並於該印刷層4上設置多數圖樣區4 1 a，之後將底層1 a、保護層2 a、感應層3 a以及印刷層 4a加以層疊，使3 2a對應設於穿孔2 la中，而各圖樣 區4 1則與感應線圈3 1 a對應，待層疊之後再以熱壓方 式將底層1 a、保護層2 a、感應層3 a以及印刷層4 a加以 M337118 結合，最後再依據各圖樣區4 1 a周緣之邊線以所需之工 具進行裁切，進而製作出多數如第二圖所示之感應卡，如 此，即可達到易於量產製造之功效； * 9 而由於該底層1 a、保護層2 a、感應層3 a以及印刷層 4a係別為（可撓性）之材質，因此當該感應卡於使用時 不易因彎折而造成外觀或感應線圈3 1 a之損壞，使該感 應卡具有較佳之電器特性，而不會有接觸不良之情形發生。 綜上所述，本創作感應卡之結構改良可有效改善習用 之種種缺點，除可使該感應卡達到易於量產製造之功效 外，亦可使該感應卡於使用時不易因彎折而造成損壞，使 該感應卡具有較佳之電器特性，進而使本創作之産生能更 進步、更實用、更符合使用者之所須，確已符合創作專利 申請之要件，爰依法提出專利申請。 惟以上所述者，僅為本創作之較佳實施例而已，當不 能以此限定本創作實施之範圍；故，凡依本創作申請專利 範圍及創作說明書内容所作之簡單的等效變化與修飾，皆 應仍屬本創作專利涵蓋之範圍内。 【圖式簡單說明】 第一圖，係習用之立體分解示意圖。 第二圖，係習用之剖面狀態示意圖。 第三圖，係本創作之立體分解示意圖。 第四圖，係本創作之立體外觀示意圖。 第五圖，係本創作之第四圖A-A剖面示意圖。 M337118 第六圖，係本創作製作時之分解狀態示意圖。 第七圖，係本創作製作時之層疊狀態示意圖。 【主要元件符號說明】 (習用部分） 電子晶片卡 5 卡片本體 5 1 容置區 5 11 導電部 5 12 感測線圈 5 13 導電膠層 5 2 晶片 5 3 接點 5 3 1 (本創作部分） 底層 1 1 a 保護層 2 2 a 穿孔 2 1 、2 1 a 感應層 3 3 a 感應線圈 3 1 、3 1 a 晶片 3 2 、3 2 a 印刷層 4 4 a 圖樣區 4 1 、4 laM337118 VIII. New description: [New technical field] This creation is about the structural improvement of the type-inductive card, especially one that is easy to mass-produce and manufacture according to the effect of =rr, which causes damage and damage. The inductive card has a preferred [prior art] electronic chip card 5 (as in the first and second figures), the first body and the second body 5 1 , a conductive adhesive layer 5 2 and a wafer 5 3 The structure of the card body 5 is provided with a "receiving area" and a second side of the hugu area 511, and a conductive portion 5 1 2 is provided, and the card body 5 1 is internally embedded. a sensing coil 5 1 3 connected to the conductive portion 5 i 2 , the conductive adhesive layer 52 is disposed in the accommodating region 5, and the wafer 53 is disposed in the accommodating region 5丄i and laminated on the The conductive adhesive layer 5 2 is on the same side, and the wafer 5 3 is provided with two contacts 5 3 1 on the surface of the accommodating region 5 使 使, so that the contact 5 3 1 can pass through the conductive adhesive layer 52 and each conductive The portion 51 is formed to be electrically connected; thereby, an electronic chip card 5 is formed. However, since the electronic chip card 5 is manufactured, a card book for embedding the sensing coil 5 1 3 is first prepared. 5, then the conductive portion 5 1 2, the conductive adhesive layer 5 2 and a wafer 5 3 are arranged one by one, which makes the production performance more complicated, and often consumes more labor hours and processes in the mass production. The defect rate is increased to affect the quality of the electronic chip card 5; and since the card body 51 is made of a hard plastic material, and the M337118 sensing coil 5 1 3 is made of copper material, the The card body 5 1 not only breaks due to inadvertent folding, but also affects the inner sensing line - $ 1 3 when the card body 5 1 is folded, so that the sensing coil 5 1 3 is deformed. Or a mutual short circuit is formed to form a short circuit; in addition, since the wafer 5 3 of the electronic chip card 5 is fixed only in the accommodating area 51 1 by the conductive adhesive layer 5 2 , when the electronic chip card 5 is carried After being squeezed or used for a period of time, the wafer 53 is often loosened, resulting in a contact failure between the contacts 5 3 1 of the wafer 53 and the conductive portions 5 1 2, which affects the wafer 5 3 . Electrical characteristics when using. [New content] Therefore, this creation The purpose of the invention is that, in addition to making the induction card reach the power amplifier which is easy to mass-produce, the induction card can also be easily damaged by bending during use, so that the induction card has better electrical characteristics. The purpose of the present invention is to improve the structure of a proximity card, comprising: a bottom layer; a protective layer laminated on one side of the bottom layer; the protective layer is provided with a perforation; and a sensing layer laminated on one side of the protective layer, An induction coil is disposed on the sensing layer, and the induction coil is electrically connected to a wafer corresponding to the through hole; and a printed layer laminated on one side of the sensing layer, the printed layer having a pattern area. [Embodiment] The eye is shown in the "Second, Fourth, and Fifth Figures", which is a three-dimensional exploded view of the creation, a three-dimensional appearance of the creation, and a cross-sectional view of the fourth section of the M337118. As shown in the figure, the present invention is a structural improvement of a proximity card, which is composed of at least a bottom layer 1, a protective layer 2, a sensing layer 3, and a printing layer 4. • # The above-mentioned bottom layer 1 can be appropriately sized as needed. The protective layer 2 is laminated on one surface of the underlayer 1 and the protective layer 2 is provided with a perforation 21 in a suitable place. The sensing layer 3 is laminated on one surface of the protective layer 2, and the sensing layer 3 is formed by etching on the sensing layer 3, and the sensing coil 31 is made of tin material, and the sensing layer The coil 3 1 is electrically connected to a wafer 3 2 corresponding to the hole 21 . The printed layer 4 is laminated on one surface of the above-mentioned sensing layer 3, and the printing layer 4 has a pattern area 41. If so, the structure of the new induction card is improved by the above structure. Please refer to the "Sixth and Seventh Diagrams" for a breakdown of the state of the creation and the layout of the creation. φ As shown in the figure: when the creation is made, a large-sized bottom layer 1 a, a protective layer 2 a, a sensing layer 3 a , and a printed layer 4 a may be taken, and a majority is opened at a predetermined position of the protective layer 2 a . a plurality of induction coils 3 1 a are etched on the sensing layer 3 a , and each of the induction coils 3 1 a is electrically connected to a wafer 3 2 a, and a plurality of patterns are disposed on the printed layer 4 After the region 4 1 a, the bottom layer 1 a, the protective layer 2 a, the sensing layer 3 a and the printed layer 4 a are laminated such that the 3 2 a is correspondingly disposed in the through hole 2 la , and each of the pattern regions 4 1 and the induction coil 3 1 a corresponding, after lamination, the underlayer 1 a, the protective layer 2 a, the sensing layer 3 a and the printed layer 4 a are combined with M337118 by heat pressing, and finally according to the edge of the peripheral edge of each pattern area 4 1 a to the desired The tool is cut to produce a majority of the proximity card as shown in the second figure, so that the mass production can be achieved; *9 and because of the bottom layer 1 a, the protective layer 2 a, the sensing layer 3 a and The printed layer 4a is made of (flexible) material, so when the card is used, it is not easy to be bent. The appearance or damage of the induction coil 3 1 a causes the induction card to have better electrical characteristics without the occurrence of poor contact. In summary, the structural improvement of the inventive proximity card can effectively improve various disadvantages of the conventional use, in addition to making the induction card easy to mass-produce, and also making the induction card less prone to bending due to use. The damage makes the card have better electrical characteristics, which makes the creation of the creation more progressive, more practical, and more in line with the needs of the user. It has indeed met the requirements for the creation of a patent application, and has filed a patent application according to law. However, the above is only the preferred embodiment of the present invention, and the scope of the creation of the present invention cannot be limited by this; therefore, the simple equivalent changes and modifications made by the scope of the patent application and the content of the creation specification are All should remain within the scope of this creation patent. [Simple description of the diagram] The first diagram is a three-dimensional decomposition diagram of the conventional use. The second figure is a schematic diagram of the profile state of the conventional use. The third picture is a three-dimensional exploded view of the creation. The fourth picture is a three-dimensional appearance of the creation. The fifth picture is a cross-sectional view of the fourth figure A-A of this creation. M337118 The sixth picture is a schematic diagram of the decomposition state of the creation of this creation. The seventh picture is a schematic diagram of the stacked state at the time of creation. [Main component symbol description] (customized part) Electronic chip card 5 Card body 5 1 accommodating area 5 11 Conductive part 5 12 Sense coil 5 13 Conductive adhesive layer 5 2 Wafer 5 3 Contact 5 3 1 (This creation part) Bottom layer 1 1 a protective layer 2 2 a perforation 2 1 , 2 1 a sensing layer 3 3 a induction coil 3 1 , 3 1 a wafer 3 2 , 3 2 a printing layer 4 4 a pattern area 4 1 , 4 la