JP2009044030A5 - - Google Patents

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Publication number
JP2009044030A5
JP2009044030A5 JP2007208938A JP2007208938A JP2009044030A5 JP 2009044030 A5 JP2009044030 A5 JP 2009044030A5 JP 2007208938 A JP2007208938 A JP 2007208938A JP 2007208938 A JP2007208938 A JP 2007208938A JP 2009044030 A5 JP2009044030 A5 JP 2009044030A5
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Japan
Prior art keywords
conductor pattern
pattern
coil
electronic component
insulator layer
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JP2007208938A
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JP4973996B2 (en
JP2009044030A (en
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Priority to JP2007208938A priority Critical patent/JP4973996B2/en
Priority claimed from JP2007208938A external-priority patent/JP4973996B2/en
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Publication of JP2009044030A5 publication Critical patent/JP2009044030A5/ja
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Claims (7)

第1の絶縁体層を介して重なる第1の導体パターンと第2の導体パターンとを、前記第1の絶縁体層に設けられた複数のビアホールで並列接続してなる複数のコイルパターンを有する積層電子部品において、
第１のコイルパターンを構成する第1の導体パターンは、第2の導体パターンの一端部と積層方向に重なりビアホールで接続されるとともに、前記第2の導体パターンの一端部と他端部との間の複数箇所にてビアホールで接続されるが、前記第2の導体パターンの他端部は接続されて無く、
前記前記第2の導体パターンの他端部は、第２のコイルパターンを構成する第1の導体パターンと第2の絶縁体層に設けられたビアホールで接続され、第１のコイルパターンと、第２のコイルパターンとを直列に接続し、螺旋状に形成されたコイルとしたことを特徴とする積層電子部品。 A plurality of coil patterns formed by connecting in parallel a plurality of via holes provided in the first insulator layer, the first conductor pattern and the second conductor pattern overlapping via the first insulator layer; In laminated electronic components,
First conductor patterns constituting the first coil pattern is connected with heavy Do Ri via hole to an end and the stacking direction of the second conductor pattern, one end and the other end of the second conductor pattern Is connected with via holes at a plurality of locations between the parts, the other end of the second conductor pattern is not connected,
The other end portion of said second conductive pattern is connected with the first conductor pattern and a via hole provided on the second insulator layer constituting the second coil pattern, the first coil pattern, A laminated electronic component, wherein the coil is formed in a spiral shape by connecting the second coil pattern in series. 前記第1の導体パターンは略3/4ターン〜略1ターンに形成された導体パターンであり、
前記第2の導体パターンは略1ターンに形成された導体パターンであることを特徴とする請求項1に記載の積層電子部品。 The first conductor pattern is a conductor pattern formed in approximately 3/4 turn to approximately 1 turn,
2. The multilayer electronic component according to claim 1, wherein the second conductor pattern is a conductor pattern formed in substantially one turn . 少なくとも一部のコイルパターンにおいて、前記第1の絶縁体層と前記第2の絶縁体層のいずれか一方を磁性体とし、他方を非磁性体として、磁気ギャップを形成したことを特徴とする請求項1又は2に記載の積層電子部品。 The magnetic gap is formed by forming one of the first insulator layer and the second insulator layer as a magnetic body and the other as a non-magnetic body in at least a part of the coil pattern. Item 3. The laminated electronic component according to Item 1 or 2 . 少なくとも一部のコイルパターンにおいて、その内側の領域に第3の絶縁体層を配置し、前記第1及び第2の絶縁体層を磁性体で形成し、前記第3の絶縁体層を非磁性体で形成し、磁気ギャップを形成したことを特徴とする請求項1又は2に記載の積層電子部品。 In at least a part of the coil pattern, a third insulator layer is disposed in an inner region of the coil pattern, the first and second insulator layers are formed of a magnetic material, and the third insulator layer is nonmagnetic. 3. The multilayer electronic component according to claim 1, wherein the laminated electronic component is formed of a body to form a magnetic gap . 第1の絶縁体層の厚みが第2の絶縁体層の厚みよりも薄いことを特徴とする請求項1至4のいずれかに記載の積層電子部品。   5. The multilayer electronic component according to claim 1, wherein the thickness of the first insulator layer is thinner than the thickness of the second insulator layer. 一部のコイルパターンを構成する第1の導体パターン及び／又は第2の導体パターンの幅が、他のコイルパターンを構成する第1の導体パターンと第2の導体パターンの幅よりも、幅広であることを特徴とする請求項1乃至5のいずれかに記載の積層電子部品。   The width of the first conductor pattern and / or the second conductor pattern constituting a part of the coil pattern is wider than the width of the first conductor pattern and the second conductor pattern constituting the other coil pattern. 6. The multilayer electronic component according to claim 1, wherein the multilayer electronic component is provided. 表面に半導体集積回路部品を実装し、前記半導体集積回路部品と前記コイルを接続したことを特徴とする請求項1乃至6のいずれかに記載の積層電子部品。   7. The multilayer electronic component according to claim 1, wherein a semiconductor integrated circuit component is mounted on a surface, and the semiconductor integrated circuit component and the coil are connected.
JP2007208938A 2007-08-10 2007-08-10 Laminated electronic components Active JP4973996B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007208938A JP4973996B2 (en) 2007-08-10 2007-08-10 Laminated electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007208938A JP4973996B2 (en) 2007-08-10 2007-08-10 Laminated electronic components

Publications (3)

Publication Number Publication Date
JP2009044030A JP2009044030A (en) 2009-02-26
JP2009044030A5 true JP2009044030A5 (en) 2011-08-11
JP4973996B2 JP4973996B2 (en) 2012-07-11

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JP2007208938A Active JP4973996B2 (en) 2007-08-10 2007-08-10 Laminated electronic components

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Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009016937A1 (en) * 2007-07-30 2009-02-05 Murata Manufacturing Co., Ltd. Chip-type coil component
CN102362320B (en) * 2009-03-26 2014-07-30 株式会社村田制作所 Electronic part and manufacturing method therefor
JP5644852B2 (en) 2010-03-31 2014-12-24 株式会社村田製作所 Electronic component and manufacturing method thereof
WO2012020590A1 (en) * 2010-08-11 2012-02-16 株式会社村田製作所 Electronic component
JP5682548B2 (en) * 2011-12-14 2015-03-11 株式会社村田製作所 Multilayer inductor element and manufacturing method thereof
KR101792273B1 (en) * 2012-06-14 2017-11-01 삼성전기주식회사 Multi-layered chip electronic component
JP2014060289A (en) * 2012-09-18 2014-04-03 Murata Mfg Co Ltd Laminated coil component
WO2014050552A1 (en) * 2012-09-28 2014-04-03 株式会社村田製作所 Impedance conversion circuit and wireless communication device
JP2014187276A (en) * 2013-03-25 2014-10-02 Fdk Corp Multilayer inductor
JP6030512B2 (en) 2013-07-09 2016-11-24 東光株式会社 Multilayer electronic components
WO2015008611A1 (en) * 2013-07-18 2015-01-22 株式会社 村田製作所 Method for manufacturing laminated inductor element
CN206472116U (en) * 2013-11-05 2017-09-05 株式会社村田制作所 Laminated coil and communication terminal
JP2016139742A (en) * 2015-01-28 2016-08-04 株式会社村田製作所 Coil component
JP6686979B2 (en) 2017-06-26 2020-04-22 株式会社村田製作所 Multilayer inductor
KR102494322B1 (en) * 2017-11-22 2023-02-01 삼성전기주식회사 Coil component
KR102064072B1 (en) 2018-04-26 2020-01-08 삼성전기주식회사 Inductor
JP7136009B2 (en) * 2019-06-03 2022-09-13 株式会社村田製作所 Laminated coil parts
JP7151738B2 (en) * 2020-03-10 2022-10-12 株式会社村田製作所 Laminated coil parts
JP7485073B2 (en) 2020-10-20 2024-05-16 株式会社村田製作所 Multilayer coil parts

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2539613Y2 (en) * 1989-12-27 1997-06-25 京セラ株式会社 Chip inductor
JPH08130115A (en) * 1994-10-31 1996-05-21 Fuji Elelctrochem Co Ltd Electronic chip component
JP2004311828A (en) * 2003-04-09 2004-11-04 Mitsubishi Materials Corp Stacked common mode choke coil and its manufacturing method
ATE395708T1 (en) * 2005-01-07 2008-05-15 Murata Manufacturing Co LAMINATED SPOOL
KR101372963B1 (en) * 2006-01-31 2014-03-11 히타치 긴조쿠 가부시키가이샤 Laminated component and module using same

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