CN102362320B - Electronic part and manufacturing method therefor - Google Patents
Electronic part and manufacturing method therefor Download PDFInfo
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- CN102362320B CN102362320B CN201080012972.2A CN201080012972A CN102362320B CN 102362320 B CN102362320 B CN 102362320B CN 201080012972 A CN201080012972 A CN 201080012972A CN 102362320 B CN102362320 B CN 102362320B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000004020 conductor Substances 0.000 claims abstract description 271
- 239000012212 insulator Substances 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 24
- BGOFCVIGEYGEOF-UJPOAAIJSA-N helicin Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1OC1=CC=CC=C1C=O BGOFCVIGEYGEOF-UJPOAAIJSA-N 0.000 claims description 7
- 238000000605 extraction Methods 0.000 abstract 4
- 239000000919 ceramic Substances 0.000 description 23
- 238000002788 crimping Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 229910000859 α-Fe Inorganic materials 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 5
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- QQONPFPTGQHPMA-UHFFFAOYSA-N Propene Chemical compound CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 229960004643 cupric oxide Drugs 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910000480 nickel oxide Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- -1 18d Substances 0.000 description 1
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- 206010021143 Hypoxia Diseases 0.000 description 1
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- DQMUQFUTDWISTM-UHFFFAOYSA-N O.[O-2].[Fe+2].[Fe+2].[O-2] Chemical compound O.[O-2].[Fe+2].[Fe+2].[O-2] DQMUQFUTDWISTM-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 229910007565 Zn—Cu Inorganic materials 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 230000001146 hypoxic effect Effects 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
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- 238000007790 scraping Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/002—Details of via holes for interconnecting the layers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
Provided are an electronic part for which it is not necessary to change the shapes of extraction conductors or the positions of via hole conductors when the number of coil turns is changed, and a manufacturing method therefor. A coil (L) is incorporated in a layered body (12a) and is provided with coil conductors (18a-18d), extraction conductors (16a, 16b), and via hole conductors (b1-b5). The coil conductors (18) are provided in magnetic layers (14e-14h) and mutually overlap at a point (A). The via hole conductor (b1) is provided in a magnetic layer (14d) and overlaps the coil conductors (18a-18d) at the point (A), and is also connected to the extraction conductor (16a). The extraction conductor (16a) is connected to an external electrode which is not shown. The via hole conductor (b1) is connected to the coil conductor (18a) at a position other than a terminal of the coil conductor (18a).
Description
Technical field
The present invention relates to electronic unit and manufacture method thereof, say more definitely, relate to the electronic unit and the manufacture method thereof that in duplexer, are built-in with coil.
Background technology
As electronic unit in the past, be known to the Stacked inductor (chip inductor) that patent documentation 1 is recorded.Referring to accompanying drawing, this Stacked inductor is described.Fig. 8 is the exploded perspective view of the duplexer 112 of Stacked inductor.
The duplexer 112 of Stacked inductor is made up of magnetic layer 114 (114a～114k), and is built-in with coil L.Magnetic layer 114 is the rectangular layer being made up of Ni-Cu-Zn based ferrite equimagnetic elastomer material, stacked in the mode of arranging in order from the upside of stacked direction.
Coil L is made up of conductor introduction 116 (116a, 116b), coil-conductor 118 (118a～118c) and through hole (via hole) conductor b11～b14.Coil-conductor 118a～118c has the number of turns of 3/4 circle and the linear conductor that rectangular one side is cut off, and is arranged at magnetic layer 114e～114g.Conductor introduction 116a, 116b are separately positioned on than the position of the upside of the more close stacked direction of coil-conductor 118a～118c or downside, specifically, are arranged at magnetic layer 114d, 114h.This conductor introduction 116 plays respectively the effect of connecting coil L and outer electrode (not shown).Via conductors b11～b14 is arranged to respectively connect magnetic layer 114d～114g along stacked direction, is connected to conductor introduction 116 and the coil-conductor 118 of adjacency on stacked direction.Thus, form spiral helicine coil L.
But, in the Stacked inductor of recording at patent documentation 1, can not change the design of coil-conductor 118 and change the number of turns of coil L.In more detail, append the magnetic layer 114 that is provided with coil-conductor 118 by the downside of the stacked direction at magnetic layer 114d, thus, can increase the number of turns of coil L.And, by removing the magnetic layer 114 of downside of the stacked direction that is positioned at magnetic layer 114d, can reduce the number of turns of coil L.Below, describe as example taking the situation of the number of turns that reduces coil L.
Coil L shown in Fig. 8 has the number of turns of 13/4 circle.In the case of wanting, the number of turns of this coil L is changed to 9/4 circle, as shown in Figure 8, replace magnetic layer 114d, 114e, as long as the magnetic layer 114l that is provided with conductor introduction 116c is inserted between magnetic layer 114c and magnetic layer 114f.And, in the case of the number of turns of coil L is changed to 5/4 circle, as shown in Figure 8, replace magnetic layer 114d～114f, as long as the magnetic layer 114m that is provided with conductor introduction 116d is inserted between magnetic layer 114c and magnetic layer 114g.
But, in the Stacked inductor of recording at patent documentation 1, in the case of changing the number of turns of coil L, need to prepare 3 kinds of conductor introduction 116a, 116c, 116d.Correspondingly, also need to prepare the position of 3 kinds of via conductors b11, b15, b16.
Patent documentation 1: Japanese Patent Publication 5-57816 communique
Summary of the invention
Therefore, the object of the present invention is to provide in the time changing the number of turns of coil, without electronic unit and the manufacture method thereof of shape, the position of via conductors etc. that changes conductor introduction.
The electronic unit that this aspect of of the present present invention is related, is characterized in that, above-mentioned electronic unit possesses: by the stacked duplexer forming of multiple insulator layers; Be built in the spiral helicine coil in above-mentioned duplexer; And be arranged at the surperficial outer electrode of above-mentioned duplexer, above-mentioned coil comprises: multiple coil-conductors, described multiple coil-conductor is arranged at the interarea of the upside of the stacked direction of above-mentioned insulator layer, and when overlook observation from stacked direction, the specified point on this insulator layer is overlapped; And first via conductors, this first via conductors is arranged at above-mentioned insulator layer, when overlook observation from stacked direction, overlapping at above-mentioned specified point and above-mentioned multiple coil-conductor, and be electrically connected with said external electrode, be provided with the above-mentioned insulator layer of above-mentioned the first via conductors, be arranged at than the position of upside of the more close stacked direction of above-mentioned multiple insulator layers that is provided with above-mentioned coil-conductor, above-mentioned the first via conductors is in the time overlooking observation from stacked direction, the position beyond the end of above-mentioned coil-conductor is connected with this coil-conductor.
The manufacture method of the related electronic unit of an aspect of of the present present invention, it is characterized in that, above-mentioned electronic unit is made up of the surperficial outer electrode that is built-in with the duplexer of spiral helicine coil and is arranged at this duplexer, and the manufacture method of above-mentioned electronic unit possesses: the operation of preparing multiple insulator layers; By overlook while observing from stacked direction and above-mentioned multiple insulator layer the overlapping coil-conductor of specified point be formed at the operation of above-mentioned multiple insulator layers; To be electrically connected with said external electrode and overlook while observing and overlapping the first via conductors of above-mentioned specified point is formed at the operation of above-mentioned insulator layer from stacked direction; Adjustment is formed with the number of above-mentioned multiple insulator layers of above-mentioned coil-conductor, so that above-mentioned coil has the desirable number of turns, stacked described multiple insulator layers, and than being formed with the upside of the more close stacked direction of described multiple insulator layers of this coil-conductor or the position of downside, the operation of the stacked above-mentioned insulator layer that is formed with above-mentioned the first via conductors; And the operation of formation said external electrode.
According to the present invention, in the time changing the number of turns of coil, without the shape, the position of via conductors etc. that change conductor introduction.
Brief description of the drawings
Fig. 1 is the stereoscopic figure of the related electronic unit of one embodiment of the present invention.
Fig. 2 is the exploded perspective view of the duplexer of the electronic unit of Fig. 1.
Fig. 3 is the exploded perspective view of the duplexer of the related electronic unit of reference example.
Fig. 4 is the exploded perspective view of the duplexer of the electronic unit of Fig. 1.
Fig. 5 is the exploded perspective view of the duplexer of the related electronic unit of variation.
Fig. 6 is the stereoscopic figure of the related electronic unit of other execution mode.
Fig. 7 is the exploded perspective view of the duplexer of the electronic unit of Fig. 6.
Fig. 8 is the exploded perspective view of the duplexer of the Stacked inductor recorded of patent documentation 1.
Embodiment
Below, the related electronic unit of one embodiment of the present invention and manufacture method thereof are described.
(formation of electronic unit)
Fig. 1 is the stereoscopic figure of electronic unit 10a, 10b.Fig. 2 and Fig. 4 are the exploded perspective views of the duplexer 12a of electronic unit 10a.Fig. 3 is the exploded perspective view of the duplexer 12a ' of the related electronic unit 10a ' of reference example.Below, the stacked direction of electronic unit 10a is defined as to z direction of principal axis, the direction on the long limit along electronic unit 10a is defined as to x direction of principal axis, the direction of the minor face along electronic unit 10a is defined as to y direction of principal axis.
As shown in Figure 1, electronic unit 10a possesses rectangular-shaped duplexer 12a and is positioned at the axial two ends of x and is formed at 2 outer electrodes 13 (13a, 13b) of the side (surface) of duplexer 12a.
As shown in Figure 2, duplexer 12a consists of along z direction of principal axis is stacked in order magnetic layer 14 (14a～14l), is built-in with spiral helicine coil L.Magnetic layer 14 is the rectangular insulator layers that such as, are made up of the magnetic ferrite of tool (Ni-Zn-Cu ferrite or Ni-Zn ferrite etc.).
Coil L comprises conductor introduction (inner conductor) 16 (16a, 16b), coil-conductor (inner conductor) 18 (18a～18d) and via conductors b1～b5.Conductor introduction 16, coil-conductor 18 and via conductors b1～b5 are made up of for example conductive material taking Ag as principal component.
Coil-conductor 18a～18d is separately positioned on the interarea of the axial positive direction side of z of magnetic layer 14e～14h.Shape after the part that coil-conductor 18 has respectively a linear conductor of ring-type is cut off, has the number of turns (being 3/4 circle in the present embodiment) (n is natural number) of (n/n+1) circle.Specifically, coil-conductor 18a has and is positioned at " コ " word shape that the long limit of the axial negative direction side of y is cut off.Coil-conductor 18b has " コ " word shape after the minor face that is positioned at the axial positive direction side of x is cut off.Coil-conductor 18c has " コ " word shape after the long limit that is positioned at the axial positive direction side of y is cut off.Coil-conductor 18d has " コ " word shape after the minor face that is positioned at the axial negative direction side of x is cut off.
In addition, as shown in Figure 2, coil-conductor 18 respectively in bight or end by the some A～D on magnetic layer 14.Specifically, the two ends of coil-conductor 18a are positioned at a B, C, and the bight of coil-conductor 18a is positioned at an A, D.The two ends of coil-conductor 18b are positioned at an A, B, and the bight of coil-conductor 18b is positioned at a C, D.The two ends of coil-conductor 18c are positioned at an A, D, and the bight of coil-conductor 18c is positioned at a B, C.The two ends of coil-conductor 18d are positioned at a C, D, and the bight of coil-conductor 18d is positioned at an A, B.Therefore,, when overlook observation from z direction of principal axis, coil-conductor 18a～18d overlaps at an A～D.The coil-conductor 18 with above formation overlaps when overlook observation from z direction of principal axis, forms the track of ring-type (rectangle).And then some A～D is positioned at each bight of this track.
Conductor introduction 16a is arranged on the axial positive direction side than the more close z of coil-conductor 18, and is arranged at the interarea of the axial positive direction side of z of magnetic layer 14d.This conductor introduction 16a is led to the side of the axial negative direction side of x of duplexer 12a, and 13a is connected with outer electrode.And conductor introduction 16a is overlapping with the annular orbit being formed by coil-conductor 18 when overlook observation from z direction of principal axis.Therefore, conductor introduction 16a is in the time overlooking observation from z direction of principal axis, overlapping at an A and coil-conductor 18a～18d.
Conductor introduction 16b is arranged at the axial negative direction side than the more close z of coil-conductor 18, and is arranged at the interarea of the axial positive direction side of z of magnetic layer 14i.This conductor introduction 16b is led to the side of the axial positive direction side of x of duplexer 12, and 13b is connected with outer electrode.And conductor introduction 16b is in the time overlooking observation from z direction of principal axis, overlapping with the annular orbit that utilizes coil-conductor 18 to form.
Via conductors b2～b4 is arranged to connect magnetic layer 14e～14g along z direction of principal axis, is connected with the coil-conductor 18 of adjacency on z direction of principal axis.Specifically, coil-conductor 18 be positioned at the some A～D of end with on z direction of principal axis the coil-conductor 18 of adjacency overlapping.And then via conductors b2～b4 is connected with the coil-conductor 18 of adjacency on z direction of principal axis., coil-conductor 18a is overlapping at the some B and the coil-conductor 18b that are positioned at end.The point B of via conductors b2 connecting coil conductor 18a, 18b.Coil-conductor 18b is overlapping at the some A and the coil-conductor 18c that are positioned at end.The point A of via conductors b3 connecting coil conductor 18b, 18c.Coil-conductor 18c is overlapping at the some D and the coil-conductor 18d that are positioned at end.The point D of via conductors b4 connecting coil conductor 18c, 18d.
And hole conductor b1 is arranged to connect magnetic layer 14d along z direction of principal axis, this magnetic layer 14d is arranged at than the axial positive direction side of the more close z of magnetic layer 14e～14h that is provided with coil-conductor 18.And then via conductors b1 is in the time overlooking observation from z direction of principal axis, overlapping at an A and coil-conductor 18, and is electrically connected with outer electrode 13a via conductor introduction 16a.Thus, via conductors b1 connects conductor introduction 16a and coil-conductor 18a at an A.At this, the two ends of coil-conductor 18a are positioned at a B, C.Therefore, via conductors b1 is in the time overlooking observation from z direction of principal axis, and the position beyond the end of coil-conductor 18a is connected with this coil-conductor 18a., via conductors b1 is connected with this coil-conductor 18a under the state of the end of vacant coil-conductor 18a.
And via conductors b5 is arranged to connect magnetic layer 14h along z direction of principal axis.And then via conductors b5 is positioned at a C when overlook observation from z direction of principal axis.Thus, via conductors b5 connects conductor introduction 16b and coil-conductor 18d at a C.Utilize above such conductor introduction 16, coil-conductor 18 and via conductors b1～b5 to form spiral helicine coil L.
(manufacture method of electronic unit)
Referring to Fig. 1 and Fig. 2, the manufacture method of electronic unit 10a is described.
First, preparation will become the ceramic green sheet (green sheet) of magnetic layer 14.Specifically, the ratio with regulation is weighed to di-iron trioxide (Fe
2o
3), each material of zinc oxide (ZnO), nickel oxide (NiO) and cupric oxide (CuO) drops into ball mill as raw material, carries out wet mixed.By the mixture crushed after being dried obtaining, the powder obtaining is carried out at 800 DEG C to the preroast of one hour.After the powders calcined obtaining being carried out to case of wet attrition in ball mill, dry then broken, obtain ferrite ceramics powder.
Add bonding agent (vinyl acetate resin, water soluble propene etc.) and plasticizer, wetted material, dispersant to this ferrite ceramics powder, in ball mill, mix, then carry out deaeration by decompression.Utilize scraping blade method that the ceramic slurry obtaining is formed as to sheet on slide glass and make it dry, thus, making the ceramic green sheet that will become magnetic layer 14.
Next, form respectively via conductors b1～b5 at the ceramic green sheet that will become magnetic layer 14d～14h.Specifically, to the ceramic green sheet illuminating laser beam that will become magnetic layer 14d～14h, form through hole.Next, utilize the conductive paste of the methods such as printing coating to these filling through holes Ag, Pd, Cu, Au or their alloy etc.Now, via conductors b1～b5 overlook from z direction of principal axis be formed as respectively while observing with an A, B, A, D, C overlapping.
Next, will become on the ceramic green sheet of magnetic layer 14d～14i, utilize the method such as silk screen printing, photoetching process to apply the conductive paste using Ag, Pd, Cu, Au or their alloy etc. as principal component, form thus coil-conductor 18a～18d and conductor introduction 16a, 16b.Now, coil-conductor 18a～18d and conductor introduction 16a are formed as when overlook observation from z direction of principal axis overlapping with some A.In addition, form the operation of coil-conductor 18a～18d and conductor introduction 16a, 16b and also can in same operation, carry out the operation of filling through hole conductive paste.And, also can be by alternately printing conductive paste and magnetic layer is made female duplexer.
Next, stacked each ceramic green sheet.Specifically, for being formed with coil-conductor 18 and will becoming the ceramic green sheet of magnetic layer 14e～14h, adjustment will become magnetic layer 14e～14h ceramic green sheet number and carry out stacked so that coil L has the desirable number of turns.Now, so that the interarea that is provided with coil-conductor 18 and will becomes the ceramic green sheet of magnetic layer 14 is positioned at the mode of the axial positive direction side of z, the stacked ceramic green sheet that will become magnetic layer 14.
Specifically, configuration will become the ceramic green sheet of magnetic layer 14l.Next, on the ceramic green sheet that will become magnetic layer 14l, configure the ceramic green sheet that will become magnetic layer 14k.Afterwards, will become the ceramic green sheet of magnetic layer 14k with respect to magnetic layer 14l crimping.Crimping condition is the pressure of 100 tons～120 tons and the time about 3～30 seconds.Afterwards, the ceramic green sheet that will become magnetic layer 14j, 14i, 14h, 14g, 14f, 14e is carried out to stacked and crimping by this order similarly.Next, than being formed with coil-conductor 18 and will becoming the axial positive direction side of the more close z of ceramic green sheet of magnetic layer 14, the stacked ceramic green sheet that is formed with via conductors b1 and will becomes magnetic layer 14d.Finally, will become the ceramic green sheet of magnetic layer 14c, 14b, 14a by this sequential cascade crimping.Thus, form the coil L of the number of turns with 13/4 circle.In addition,, the coil L of the number of turns that has 9/4 circle in formation, as shown in Figure 3, stacked and crimping will become the ceramic green sheet of magnetic layer 14a～14d, 14g～14l.And the coil L of the number of turns that has 5/4 circle in formation, as shown in Figure 4, stacked and crimping will become the ceramic green sheet of magnetic layer 14a～14d, 14h～14l.So, according to the number of turns of coil L, adjust the number of the magnetic layer 14 that is formed with coil-conductor 18.Utilize above operation to form female duplexer.Utilize hydrostatic extruding etc. to implement formal crimping to this mother's duplexer.
Next, utilize cutting edge female duplexer to be cut into the duplexer 12a of given size.Thus, the duplexer 12a not fired.This duplexer 12a not firing is gone adhesive treatment and fired.Go adhesive treatment for example in hypoxic atmosphere, under the condition of 500 DEG C and 2 hours, to carry out.Fire under the condition of for example 800 DEG C～900 DEG C and 2.5 hours and carry out.
Duplexer 12a after utilizing above operation to obtain firing.Duplexer 12a is implemented to barrel finishing, carry out chamfering.Afterwards, by utilizing the method coating principal components such as such as infusion process on the surface of duplexer 12a for silver-colored electrode cream and carrying out burn-back, thus, formation will become the silver electrode of outer electrode 13a, 13b.The burn-back of silver electrode is carried out 1 hour at 800 DEG C.
Finally, implement plating Ni/ plating Sn by the surface to silver electrode, form outer electrode 13a, 13b.Via above operation, complete the electronic unit 10a shown in Fig. 1.
(effect)
According to above electronic unit 10a and manufacture method thereof, as described below, can not change the shape of conductor introduction 16a and the position of via conductors b1 and change the number of turns of coil L.In more detail, in the case of the number of turns of increase and decrease coil L, append by the axial negative direction side of the z at magnetic layer 14d the magnetic layer 14 that is provided with coil-conductor 18, can increase the number of turns of coil L.And, by removing the magnetic layer 14 of the axial negative direction side of z that is positioned at magnetic layer 14d, can reduce the number of turns of coil L.Below, describe as example taking the situation of the number of turns that reduces coil L.
Coil L shown in Fig. 2 has the number of turns of 13/4 circle.In the case of the number of turns of this coil L is changed to 9/4 circle, as shown in Figure 3, need only and remove magnetic layer 14e, 14f.And, in the case of the number of turns of coil L is changed to 5/4 circle, as shown in Figure 4, need only and remove magnetic layer 14e～14g.
At this, as shown in Figure 2, conductor introduction 16a and via conductors b1 are in the time overlooking observation from z direction of principal axis, overlapping at an A and coil-conductor 18a～18d.Thus, for the coil-conductor 18 of any one shape in coil-conductor 18a～18d, conductor introduction 16a can both be connected with it by via conductors b1., as shown in Figure 3 and 4, for coil-conductor 18c, 18d, conductor introduction 16a also can be connected with it by via conductors b1.Therefore,, according to electronic unit 10a and manufacture method thereof, can not change the shape of conductor introduction 16a and the position of via conductors b1 and change the number of turns of coil L.
And in the electronic unit 10a shown in Fig. 2 and Fig. 4, via conductors b1 is connected with this coil-conductor 18a, 18d under the state of the end of vacant coil-conductor 18a, 18d.This means, be not that the mode of connecting through hole conductor designs conductor introduction with the end of not vacant coil-conductor 18a, 18d, but can design conductor introduction 16a with any one mode being connected in coil-conductor 18a～18d with via conductors b1.That is, in the time observing electronic unit 10a, as shown in Fig. 2 and Fig. 4, if under the state of the end of vacant coil-conductor 18a, 18d connecting through hole conductor b1, can judge it is the related electronic unit of the present application.In addition with the electronic unit 10a ' shown in Fig. 3 as a reference example, be whether to be the cause of the related electronic unit of the present application because only depend on observation electronic unit 10a ' to differentiate.
And as shown in Fig. 2 and Fig. 4, via conductors b1 is connected with this coil-conductor 18a, 18d under the state of the end of vacant coil-conductor 18a, 18d.Therefore,, even if the magnetic layer 14d of Fig. 2 and Fig. 4 moves to the axial negative direction lateral deviation of x when stacked, via conductors b1 and coil-conductor 18a, 18d also can not open circuit.
And coil-conductor 18a～18d overlaps, overlook observation from z direction of principal axis, form rectangular track, and then conductor introduction 16a is in the time overlooking observation, with this rectangular Orbital Overlap from z direction of principal axis.Thus, overlooking from z direction of principal axis while observing, can there is not conductor introduction 16a and cross the situation of the inside of coil L.Consequently, the high inductance value of keeping coil L.
And coil-conductor 18a～18d has the number of turns of 3/4 circle, and overlaps, when overlook observation from z direction of principal axis, form rectangular track.The part being cut off in such coil-conductor 18 is long limit and the minor face of the rectangular track between the position connecting at via conductors.,, in coil-conductor 18, some A～D that via conductors connects is not cut off.Therefore, in electronic unit 10a, via conductors b1 is overlooking from z direction of principal axis while observing, if with some A～D in any one is overlapping.Therefore, the degree of freedom in the design of conductor introduction 16a uprises.
(variation)
Below, with reference to accompanying drawing, the variation of electronic unit 10a is described.Fig. 5 is the exploded perspective view of the duplexer 12b of the related electronic unit 10b of variation.
The difference of electronic unit 10a, 10b is the shape of conductor introduction 16a and the position of via conductors b1.In more detail, in electronic unit 10a, as shown in Figure 2, conductor introduction 16a and via conductors b1 are overlapping at an A and coil-conductor 18a～18d.On the other hand, in electronic unit 10b, as shown in Figure 4, conductor introduction 16a and via conductors b1 are overlapping at a D and coil-conductor 18a～18d.According to this electronic unit 10b, also can not change the shape of conductor introduction 16a and the position of via conductors b1 and change the number of turns of coil L.
In addition, as mentioned above, coil-conductor 18a～18d is beyond an A, D, also overlapping at a B, C.Therefore, conductor introduction 16a is for example putting B, C and coil-conductor 18a～18d is overlapping.
(other execution mode)
Electronic unit involved in the present invention is not limited to electronic unit 10a, the 10b shown in above-mentioned execution mode, in the scope of its purport, can change.
Fig. 6 is the stereoscopic figure of the related electronic unit 10c of other execution mode.Fig. 7 is the exploded perspective view of the duplexer 12c of this electronic unit 10c.Below, the stacked direction of electronic unit 10c is defined as to z direction of principal axis, the direction on the limit along electronic unit 10c is defined as to x direction of principal axis, will be defined as y direction of principal axis with x direction of principal axis and the orthogonal direction of z direction of principal axis.In addition,, centered by the difference of above-mentioned electronic unit 10c and electronic unit 10a, describe.
As shown in Figure 6, electronic unit 10c be positioned at the axial two ends of z duplexer 12c upper surface and below there is outer electrode 13a, 13b.And as shown in Figure 7, electronic unit 10c does not have conductor introduction 16a, 16b.Replace above-mentioned conductor introduction 16a, 16b, possess via conductors b21～b23, b27～b29 and bonding conductor 19a～19f.
Via conductors b21～b23 is overlapping with some B when overlook observation from z direction of principal axis, and is arranged to connect magnetic layer 14m～14o along z direction of principal axis.Thus, via conductors b21～b23 is connected at a B with coil-conductor 18e, and coil-conductor 18e is electrically connected with outer electrode 13a.
And via conductors b27～b29 is overlapping with some B when overlook observation from z direction of principal axis, and be arranged to connect magnetic layer 14s～14u along z direction of principal axis.Thus, via conductors b27～b29 is connected at a B with coil-conductor 18g via via conductors b26, and coil-conductor 18g is electrically connected with outer electrode 13b.
And, bonding conductor 19a～19f be arranged in respectively magnetic layer 14m～14o, 14s～14u and via conductors b21～b23, b27～b29 overlapping.Owing to being the state of end of vacant coil-conductor 18e, therefore, even magnetic layer 14o when stacked to the axial positive direction skew of y, via conductors b23 and coil-conductor 18e also can not open circuit.
As electronic unit 10c, coil L also can be electrically connected with outer electrode 13a, 13b via via conductors b21～b23, b27～b29.In this case, if via conductors b23 be arranged to A～D in any one is overlapping, can not change via conductors b21～b23 position and adjust the length of coil L.
In addition, in the manufacture method of electronic unit 10a, stacked to upside from downside according to the order of magnetic layer 14l, 14k, 14j, 14i, 14h, 14g, 14f, 14e, 14d, 14c, 14b, 14a.But the lamination order of magnetic layer 14 is not limited thereto.For example, also can be according to the sequential cascade of magnetic layer 14a～14l.In this case, magnetic layer 14 is stacked towards the mode of downside to be provided with the interarea of coil-conductor 18.And then magnetic layer 14d is disposed at than the position of the downside of the more close stacked direction of magnetic layer 14e～14l.
In industry, utilize possibility
The present invention is useful for electronic unit and manufacture method thereof, particularly in the aspect excellence such as shape, the position of via conductors without change conductor introduction in the time changing the number of turns of coil.
Symbol description:
A～D: point; L: coil; B1～b5, b21～b29: via conductors; 10a, 10b, 10c: electronic unit; 12a～12c: duplexer; 13a, 13b: outer electrode; 14a～14u: magnetic layer; 16a, 16b: conductor introduction; 18a～18g: coil-conductor; 19a～19f: bonding conductor.
Claims (6)
1. an electronic unit, is characterized in that,
Described electronic unit possesses:
The duplexer forming by stacked multiple insulator layers;
Be built in the spiral helicine coil in described duplexer; And
Be arranged at the surperficial outer electrode of described duplexer,
Described coil comprises:
Multiple coil-conductors, described multiple coil-conductor is arranged at the interarea of the upside of the stacked direction of described insulator layer, at least a portion in described multiple coil-conductor forms the track of ring-type overlook overlapped while observing from stacked direction, overlooking from stacked direction while observing, on this insulator layer, be arranged at specified point on the track of described ring-type overlapped; And
The first via conductors, is arranged at described insulator layer, overlooking from stacked direction while observing, when described specified point and described multiple coil-conductor are overlapping and the Orbital Overlap of described ring-type, and is electrically connected with described outer electrode,
Be provided with the described insulator layer of described the first via conductors, be arranged at than the position of upside of the more close stacked direction of described multiple insulator layers that is provided with described coil-conductor,
Described the first via conductors is in the time overlooking observation from stacked direction, the position beyond the end of corresponding coil-conductor is connected with this coil-conductor,
Described coil also comprises inner conductor, and this inner conductor is arranged on the interarea of the upside of the stacked direction of described insulator layer, and described the first via conductors is electrically connected with described outer electrode,
Described inner conductor is overlooking from stacked direction while observing, not overlapping with the inside of the track of described ring-type,
The end of the described coil-conductor connecting at described the first via conductors, described the first via conductors being connected with described inner conductor does not connect.
2. electronic unit according to claim 1, is characterized in that, the Orbital Overlap of described inner conductor and described ring-type.
3. electronic unit according to claim 1, is characterized in that,
Described multiple coil-conductor in the time that n is natural number, have (n/n+1) circle the number of turns, and be positioned at the described specified point place of end with on stacked direction the described coil-conductor of adjacency overlapping,
Described coil also comprises multiple the second via conductors, and described multiple the second via conductors are connected to the described coil-conductor of adjacency on stacked direction at described specified point place.
4. a manufacture method for electronic unit, is characterized in that,
Described electronic unit is made up of the surperficial outer electrode that is built-in with the duplexer of spiral helicine coil and is arranged at this duplexer,
The manufacture method of described electronic unit possesses:
Prepare the operation of multiple insulator layers;
By overlook while observing from stacked direction and described multiple insulator layer the overlapping multiple coil-conductors of specified point be formed at the operation of described multiple insulator layers, in this operation, form described multiple coil-conductor with at least a portion in described multiple coil-conductors overlooking the mode of track overlapped while observing and that form ring-type from stacked direction, and described specified point is arranged on the track of described ring-type;
By be electrically connected with described outer electrode and from stacked direction overlook while observing and described specified point overlapping time and the first via conductors of the Orbital Overlap of described ring-type be formed at the operation of described insulator layer;
Adjustment is formed with the number of described multiple insulator layers of described coil-conductor, so that described coil has the desirable number of turns, stacked described multiple insulator layers, and than being formed with the upside of the more close stacked direction of described multiple insulator layers of this coil-conductor or the position of downside, the operation of the stacked described insulator layer that is formed with described the first via conductors;
Form the operation of described outer electrode; And
Form the operation of the inner conductor that this first via conductors is electrically connected with described outer electrode at the described insulator layer that is formed with described the first via conductors, described inner conductor is in the time overlooking observation from stacked direction, not overlapping with the inside of the track of described ring-type, the end of the described coil-conductor connecting at described the first via conductors, described the first via conductors being connected with described inner conductor does not connect.
5. the manufacture method of electronic unit according to claim 4, is characterized in that,
The manufacture method of this electronic unit also possesses the operation of multiple the second via conductors each other of described coil-conductor that are formed for being connected to adjacency on stacked direction at the described specified point place of described multiple insulator layers that is formed with described coil-conductor,
Forming in the operation of described coil-conductor, form as follows described coil-conductor,, in the time that n is natural number, have the number of turns of (n/n+1) circle, and be positioned at the described specified point of end, on stacked direction, the described coil-conductor of adjacency overlaps each other.
6. the manufacture method of electronic unit according to claim 4, is characterized in that,
Forming in the operation of described inner conductor, to form this inner conductor with the overlapping mode of described annular orbit.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
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| JP2009077123 | 2009-03-26 | ||
| JP2009-077123 | 2009-03-26 | ||
| PCT/JP2010/050718 WO2010109936A1 (en) | 2009-03-26 | 2010-01-21 | Electronic part and manufacturing method therefor |
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| CN102362320A CN102362320A (en) | 2012-02-22 |
| CN102362320B true CN102362320B (en) | 2014-07-30 |
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| JP2016139742A (en) * | 2015-01-28 | 2016-08-04 | 株式会社村田製作所 | Coil component |
| CN105098300A (en) * | 2015-09-11 | 2015-11-25 | 禾邦电子（中国）有限公司 | Common-mode filter and manufacturing method therefor |
| JP6459946B2 (en) * | 2015-12-14 | 2019-01-30 | 株式会社村田製作所 | Electronic component and manufacturing method thereof |
| CN107968247B (en) * | 2017-11-28 | 2020-01-10 | 上海坤锐电子科技有限公司 | Antenna structure, reader and intelligent vending equipment |
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| CN1191376A (en) * | 1996-11-21 | 1998-08-26 | Tdk株式会社 | Multilayer electronic part and method for producing the same |
| CN1624826A (en) * | 2003-12-05 | 2005-06-08 | 株式会社村田制作所 | Method of manufacturing multilayered electronic component and multilayered component |
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| JPH0354808A (en) * | 1989-07-21 | 1991-03-08 | Murata Mfg Co Ltd | Laminated inductance component |
| JP3351738B2 (en) * | 1998-05-01 | 2002-12-03 | 太陽誘電株式会社 | Multilayer inductor and manufacturing method thereof |
| JP4973996B2 (en) * | 2007-08-10 | 2012-07-11 | 日立金属株式会社 | Laminated electronic components |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1191376A (en) * | 1996-11-21 | 1998-08-26 | Tdk株式会社 | Multilayer electronic part and method for producing the same |
| CN1624826A (en) * | 2003-12-05 | 2005-06-08 | 株式会社村田制作所 | Method of manufacturing multilayered electronic component and multilayered component |
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| JP平3-54808A 1991.03.08 |
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| CN102362320A (en) | 2012-02-22 |
| JPWO2010109936A1 (en) | 2012-09-27 |
| WO2010109936A1 (en) | 2010-09-30 |
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