WO2009147899A1

WO2009147899A1 - Electronic part and method for manufacturing the same

Info

Publication number: WO2009147899A1
Application number: PCT/JP2009/057383
Authority: WO
Inventors: 都美河田
Original assignee: 株式会社村田製作所
Priority date: 2008-06-06
Filing date: 2009-04-10
Publication date: 2009-12-10

Abstract

Provided is an electronic part having a preferable DC superposition characteristic. Also provided is a method for manufacturing the electronic part. The electronic part includes: a layered body (12) formed by layering magnetic layers (16d to 16f) and non-magnetic layers (16a to 16c and 16g to 16j); and a coil (L) which is a spiral coil formed on the layered body (12). The coil (L) has: a plurality of belt-shaped electrodes (22) formed to be aligned on the magnetic layer (16d); a plurality of belt-shaped electrodes (20) formed to be aligned on the non-magnetic layer (16g); and via hole conductors (b1, b2) formed to extend in the z-axis direction in the layered body (12) and connecting the belt-shaped electrodes (20, 22).

Description

Electronic component and manufacturing method thereof

The present invention relates to an electronic component and a method for manufacturing the same, and more specifically to an electronic component having a coil incorporated in a laminate and a method for manufacturing the same.

As a conventional electronic component, for example, a multilayer coil component described in Patent Document 1 is known. The laminated coil component described in Patent Document 1 will be described below with reference to the drawings. FIG. 8 is a perspective view of the laminated coil component 200 described in Patent Document 1. FIG.

A laminated coil component 200 shown in FIG. 8 includes a laminated body 202 and a coil L ′ built in the laminated body 202. The laminate 202 is configured by laminating a plurality of magnetic layers. The coil L ′ has a coil axis in a direction orthogonal to the stacking direction, and is configured by connecting a plurality of

strip electrodes

204 and 206 and a plurality of via-hole conductors 208. More specifically, the belt-like electrode 204 is formed of lines formed in parallel to each other on the magnetic layer that is relatively disposed on the upper side in the stacking direction among the magnetic layers constituting the stacked body 202. Electrode. The strip electrode 206 is a linear electrode formed in parallel with each other on the magnetic layer disposed relatively on the lower layer side in the stacking direction among the magnetic layers constituting the stacked body 202. It is. The via-hole conductor 206 is formed so as to extend in the stacking direction, and connects the strip electrode 204 and the strip electrode 206. The coil L ′ is configured as described above.

By the way, in the laminated coil component 200, there is a problem that magnetic saturation occurs due to a relatively small direct current, and the inductance value of the coil L ′ is rapidly reduced. That is, the laminated coil component 200 has a problem that the direct current superimposition characteristic is poor.

More specifically, in the laminated coil component 200, the magnetic material layer is laminated on both the upper layer side of the magnetic material layer where the belt-like electrode 204 is formed and the lower layer side of the magnetic material layer where the belt-like electrode 206 is formed. ing. Therefore, the periphery of the coil L ′ is surrounded by a magnetic layer, and the laminated coil component 200 constitutes a so-called closed magnetic circuit type coil. In the closed magnetic circuit type coil, since the magnetic flux circulating around the coil becomes a closed magnetic circuit, magnetic flux leakage hardly occurs around the coil. Therefore, in the laminated coil component 200, even with a relatively small direct current, the magnetic flux density becomes too large, magnetic saturation occurs, and the inductance value rapidly decreases. Therefore, when the laminated coil component 200 is used as a power inductor for a DCDC converter, sufficient conversion efficiency cannot be obtained.

JP 2005-142302 A

Therefore, an object of the present invention is to provide an electronic component having good direct current superposition characteristics and a method for manufacturing the same.

An electronic component according to an aspect of the present invention includes a stacked body in which insulating layers are stacked, and a spiral coil formed in the stacked body, and the stacked body includes only the inside of the coil. The magnetic material is provided.

An electronic component according to another aspect of the present invention includes a laminated body in which insulating layers are laminated, and a spiral coil formed in the laminated body, and the coil is relatively laminated. A plurality of first strip electrodes formed on the insulating layer disposed on the upper side in the direction, and a plurality of second electrodes formed on the insulating layer disposed on the lower side in the stacking direction. And a plurality of connecting portions formed so as to extend in the stacking direction on the side surface of the insulating layer and connecting the first belt electrode and the second belt electrode.

In the electronic component manufacturing method according to an aspect of the present invention, the plurality of first strip electrodes and the plurality of second strip electrodes are connected by the plurality of via-hole conductors, thereby forming a spiral shape in the stacked body. In the method of manufacturing the electronic component constituting the coil, the plurality of first band-like electrodes are provided on each of the plurality of first regions defined on the first insulating sheet and arranged in a matrix. Forming a plurality of second strip electrodes in each of a plurality of second regions defined on the second insulating sheet and arranged in a matrix, and a third Forming the plurality of via-hole conductors at the boundaries of the plurality of third regions defined on the insulating sheet and arranged in a matrix, and the first region to the third region coincide with each other Let the first Laminating an edge sheet or the third insulating sheet to obtain a mother laminated body, and cutting the mother laminated body along the boundaries of the plurality of second regions to obtain a laminated body; It is characterized by providing.

According to the present invention, since the magnetic body is provided only inside the coil, it is possible to obtain good direct current superposition characteristics.

According to the present invention, the coil is disposed on the lower side in the stacking direction and the plurality of first strip electrodes formed in the insulating layer disposed on the upper side in the stacking direction. A plurality of second strip electrodes formed on the insulating layer, and a plurality of strips formed on the side surfaces of the insulating layer so as to extend in the stacking direction and connecting the first strip electrode and the second strip electrode. Therefore, good direct current superposition characteristics can be obtained.

1 is an external perspective view of an electronic component according to an embodiment of the present invention. It is a disassembled perspective view of the laminated body of the electronic component of FIG. 3A is an exploded perspective view of the laminate of FIG. 2, and FIG. 3B is an external perspective view of an electronic component being manufactured. 4A is a perspective view of the electronic component from the x-axis direction, and FIG. 4B is a perspective view of the laminated coil component from the arrow X direction. It is the graph which showed the direct current superposition characteristic of the 1st model and the 2nd model. It is the perspective view which showed the ceramic green sheet used for manufacture of an electronic component. It is a cross-section figure of the electronic component which concerns on other embodiment. 2 is a perspective view of a laminated coil component described in Patent Document 1. FIG.

Hereinafter, an electronic component and a manufacturing method thereof according to an embodiment of the present invention will be described.

(Electronic component configuration)
FIG. 1 is an external perspective view of an electronic component 10a according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the multilayer body 12 of the electronic component 10a. FIG. 3A is an exploded perspective view of the laminated body 12, and FIG. 3B is an external perspective view of the electronic component 10a being manufactured. Hereinafter, the stacking direction of the electronic component 10a is defined as the z-axis direction, the direction along the long side of the electronic component 10a is defined as the x-axis direction, and the direction along the short side of the electronic component 10a is defined as the y-axis direction. To do. The x axis, the y axis, and the z axis are orthogonal to each other.

The electronic component 10a includes a laminate 12 and external electrodes 14a and 14b as shown in FIG. The laminated body 12 has a rectangular parallelepiped shape, and a coil L (not shown in FIG. 1) is formed. The laminate 12 has side surfaces S1 and S2 at both ends in the x-axis direction, and side surfaces S3 and S4 at both ends in the y-axis direction. The external electrodes 14a and 14b are electrically connected to the coil L, and are formed to cover the side surfaces S1 and S2.

As shown in FIG. 2, the multilayer body 12 includes a plurality of rectangular nonmagnetic layers 16a to 16c, magnetic layers 16d to 16f, and nonmagnetic layers 16g to 16j (insulating layers) from above in the z-axis direction. They are stacked in order. Specifically, the multilayer body 12 includes a plurality of magnetic layers 16d to 16f made of ferromagnetic ferrite (for example, Ni—Zn—Cu ferrite or Ni—Zn ferrite) and nonmagnetic ferrite (for example, A plurality of non-magnetic layers 16a to 16c and 16g to 16j made of Zn—Cu ferrite or Zn ferrite) are laminated. In the present embodiment, the magnetic layer refers to a layer made of a material that functions as a magnetic body in the range of −55 ° C. to 125 ° C., and the nonmagnetic layer refers to a nonmagnetic layer in the range of −55 ° C. to 125 ° C. A layer made of a material that functions as a body. In the following, when referring to the individual magnetic layers 16d to 16f and the nonmagnetic layers 16a to 16c and 16g to 16j, an alphabet is added after the reference symbol, and when referring to them collectively, the reference symbol is used. Omit the back alphabet.

The coil L is a spiral coil that advances in the x-axis direction while rotating as shown in FIG. That is, the coil axis of the coil L is parallel to the x-axis direction. As shown in FIG. 2, the coil L includes lead electrodes 18a and 18b, a plurality of

strip electrodes

20 and 22, and a plurality of via-hole conductors b1 to b4.

The lead electrodes 18a and 18b and the plurality of strip-shaped electrodes 20 are formed on the nonmagnetic layer 16g that is relatively disposed on the lower side in the z-axis direction. More specifically, the plurality of strip-like electrodes 20 are formed so as to have a negative inclination in the xy plane and to be parallel to each other when viewed in plan from the upper side in the z-axis direction. Yes. Furthermore, the strip electrode 20 is formed so as to connect sides located at both ends in the y-axis direction. Each strip electrode 20 does not necessarily have to be parallel.

The extraction electrode 18a has a substantially L shape, and more specifically, extends in parallel with the strip electrode 20 from the near side in the y-axis direction, and is bent in the middle to be left in the x-axis direction. It has a shape drawn to the side. Similarly, the extraction electrode 18b has a substantially L shape, and more specifically, extends in parallel with the strip electrode 20 from the back side in the y-axis direction and is bent in the middle to be x-axis. It has a shape drawn to the right side in the direction. The extraction electrodes 18a and 18b are connected to the external electrodes 14a and 14b, respectively.

The plurality of strip electrodes 22 are formed on the magnetic layer 16d that is relatively disposed on the upper side in the z-axis direction. More specifically, the plurality of strip electrodes 22 are formed so as to have a positive inclination in the xy plane and to be parallel to each other when viewed in plan from the upper side in the z-axis direction. Yes. Furthermore, the strip electrode 22 is formed so as to connect the sides located at both ends in the y-axis direction. Each strip electrode 22 does not necessarily have to be parallel.

The via-hole conductor b3 is connected to the end on the back side in the y-axis direction of the strip electrode 22 and is formed so as to penetrate the magnetic layer 16d in the z-axis direction. The via-hole conductor b4 is connected to the end on the near side in the y-axis direction of the strip electrode 22 and is formed so as to penetrate the magnetic layer 16d in the z-axis direction. The via-hole conductors b3 and b4 are in contact with the back side in the y-axis direction or the near side in the y-axis direction of the magnetic layer 16d and have a semicircular shape. That is, the via-hole conductors b3 and b4 have a shape obtained by dividing a normal via-hole conductor in half.

The via-hole conductors b1 and b2 are formed at positions corresponding to the via-hole conductors b3 and b4 when viewed in plan from the z-axis direction in each of the magnetic layers 16e and 16f. The via-hole conductors b1 and b2 are in contact with the back side in the y-axis direction or the near side in the y-axis direction of the magnetic layers 16e and 16f, respectively, and have a semicircular shape. That is, the via-hole conductors b1 and b2 have a shape obtained by dividing a normal via-hole conductor in half.

By laminating the magnetic layers 16d to 16f and the nonmagnetic layer 16g configured as described above in this order, as shown in FIG. 3A, the magnetic layers 16d to 16f and the nonmagnetic layer 16g are formed. A spiral coil L is formed which travels in the x-axis direction while rotating the laminated body 24 made of. More specifically, the via-hole conductors b1 and b3 are connected to each other so as to extend in the z-axis direction on the side surface on the far side in the y-axis direction of the multilayer body 24 and to extend in the y-axis direction of the strip electrode 20 It functions as a connecting portion that connects the end on the back side and the end on the back side in the y-axis direction of the strip electrode 22. Similarly, the via-hole conductors b2 and b4 are connected to each other so as to extend in the z-axis direction on the side surface on the near side in the y-axis direction of the multilayer body 24 and on the near side in the y-axis direction of the strip electrode 20 And an end portion on the near side in the y-axis direction of the strip electrode 22 functions as a connection portion.

As shown in FIG. 3A, the nonmagnetic layers 16a to 16c are stacked on the upper side of the stacked body 24 in the z-axis direction, and the nonmagnetic layers 16h to 16c are stacked on the lower side of the stacked body 24 in the z-axis direction. The stacked body 12 is configured by stacking 16j. Further, as shown in FIG. 3B, the external electrodes 14a and 14b are formed so as to cover the side surfaces S1 and S2 located at both ends in the x-axis direction of the multilayer body 12, respectively. However, in the state shown in FIG. 3B, the via-hole conductors b1 to b4 (the via-hole conductors b1 and b3 are not shown in FIG. 3B) are exposed to the outside, which may cause a short circuit. is there. Therefore, as shown in FIG. 1, the side surface S3 on the near side in the y-axis direction of the laminate 12 and the side surface S4 on the far side in the y-axis direction of the laminate 12 have relatively low magnetic permeability and insulating properties. It is covered with an insulating material such as a high epoxy resin.

(effect)
According to the electronic component 10a configured as described above, the via-hole conductors b1 to b4 are formed so as to extend in the z-axis direction on the side surfaces of the magnetic layers 16d to 16f. Compared with the laminated coil component 200 in which a magnetic body is present around ', it has better direct current superimposition characteristics. Hereinafter, description will be given with reference to the drawings. 4A is a perspective view of the electronic component 10a from the x-axis direction, and FIG. 4B is a perspective view of the laminated coil component 200 from the arrow X direction.

As shown in FIG. 4B, in the laminated coil component 200, since the magnetic material is also present outside the via-hole conductor 208, the magnetic flux generated in the coil L ′ is a via-hole as indicated by an arrow Φ1 ′. It passes through the magnetic body both inside and outside the conductor 208. Therefore, the magnetic flux generated in the coil L ′ is less likely to leak, and the laminated coil component 200 has a magnetic flux density that is too large even if the DC current is relatively small, causing magnetic saturation.

On the other hand, as shown in FIG. 4A, in the electronic component 10a, there is no magnetic body outside the via-hole conductors b1 to b4 in the y-axis direction. Therefore, the magnetic flux generated in the coil L does not pass through the magnetic body outside the via-hole conductors b1 to b4 in the y-axis direction as indicated by the arrow Φ1. Therefore, the magnetic flux generated in the coil L is likely to leak. As described above, in the electronic component 10a, since the inductance value due to magnetic saturation does not easily decrease compared to the multilayer coil component 200, the electronic component 10a has better DC superposition characteristics than the multilayer coil component 200. is doing.

Furthermore, according to the electronic component 10a, the layers located between the strip electrode 20 and the strip electrode 22 in the z-axis direction are the magnetic layers 16d, 16e, and 16f. Further, the layers stacked above the magnetic layer 16d in the z-axis direction and the layers stacked below the magnetic layer 16f in the z-axis direction are non-magnetic layers 16a to 16c, 16g to 16j. With such a configuration, the magnetic material is present only in the coil L in the laminated body 12. When the magnetic material is present only inside the coil L, the electronic component 10a has a better DC superposition characteristic than the laminated coil component 200 in which the magnetic material is present around the coil L ′. . Hereinafter, description will be given with reference to the drawings.

As shown in FIG. 4B, in the laminated coil component 200, since a magnetic body exists around the coil L ′, the magnetic flux generated in the coil L ′ is as indicated by arrows Φ1 ′ and Φ2 ′. The magnetic material passes through both inside and outside of the coil L ′. Therefore, the magnetic flux generated in the coil L ′ is less likely to leak, and the laminated coil component 200 has a magnetic flux density that is too large even if the DC current is relatively small, causing magnetic saturation.

On the other hand, as shown in FIG. 4A, in the electronic component 10a, there is no magnetic material around the coil L. More specifically, the non-magnetic layers 16a to 16c and 16g to 16j exist above and below the coil L in the z-axis direction, and air layers exist on the left and right of the coil L in the y-axis direction. Therefore, the magnetic flux generated in the coil L passes through the magnetic body only inside the coil L and does not pass through the magnetic body outside the coil L, as indicated by arrows Φ1 and Φ2. For this reason, the magnetic flux generated in the coil L is likely to leak, and in the electronic component 10a, the magnetic flux density increases and magnetic saturation is suppressed. As described above, in the electronic component 10 a, since the inductance value due to magnetic saturation is less likely to be suddenly reduced than in the laminated coil component 200, the electronic component 10 a is more excellent in direct current superposition than the laminated coil component 200. It has characteristics.

In order to clarify the effect of the electronic component 10a, the inventor of the present application conducted an experiment described below. More specifically, a first model corresponding to the electronic component 10a and a second model corresponding to the laminated coil component 200 were produced, and the DC superposition characteristics of these models were examined. The conditions of the first model and the second model are as follows. The side gap L is a distance from the via-hole conductors b1 and 208 in FIG. 4 to the side surfaces of the

multilayer bodies

12 and 202. The vertical outer layer thickness is the distance from the

strip electrodes

20, 22, 204, 206 to the upper surface or the lower surface of the laminate 12, 202.

First model Size: 2.5mm x 2.0mm x 0.9mm
Side gap: 0mm
Outer layer thickness in the vertical direction: 0.1 mm
Number of turns: 10
Second model Size: 2.5mm x 2.0mm x 0.9mm
Side gap: 0.2mm
Outer layer thickness in the vertical direction: 0.2 mm
Number of turns: 10

FIG. 5 is a graph showing the DC superposition characteristics of the first model and the second model. The vertical axis represents the inductance value, and the horizontal axis represents the direct current value. According to FIG. 5, in the second model, only a relatively small DC current flows and the inductance value decreases rapidly, whereas in the first model, a relatively large current flows. Even if it flows, the inductance value does not decrease so much. Therefore, it can be understood from this experiment that the electronic component 10a has better direct current superimposition characteristics than the laminated coil component 200.

Furthermore, in the electronic component 10a, as shown in FIG. 4A, the via-hole conductors b1 to b4 are formed to extend in the z-axis direction on the side surfaces of the magnetic layers 16d to 16f. On the other hand, in the multilayer coil component 200, as shown in FIG. 4B, the via-hole conductor 208 is formed inside the multilayer body 202. Therefore, the via-hole conductors b1 to b4 are positioned on the outer side in the y-axis direction of the multilayer body 12 as compared with the via-hole conductor 208. Thereby, the inner diameter of the coil L of the electronic component 10 a becomes larger than the inner diameter of the coil L ′ of the multilayer coil component 200, and the electronic component 10 a can easily obtain an inductance value larger than that of the multilayer coil component 200.

(Method for manufacturing electronic parts)
Below, the manufacturing method of the electronic component 10a is demonstrated, referring drawings. FIG. 6 is a perspective view showing the ceramic green sheets 116a to 116j used for manufacturing the electronic component 10a. The ceramic green sheets 116a to 116j are sheets before firing and cutting of the nonmagnetic layers 16a to 16c, the magnetic layers 16d to 16f, and the nonmagnetic layers 16g to 16j, respectively.

Ceramic green sheets 116d to 116f to be the magnetic layers 16d to 16f are produced by the following steps. Ferric oxide (Fe ₂ O ₃ ), zinc oxide (ZnO), nickel oxide (NiO), and copper oxide (CuO) are weighed at a predetermined ratio, and each material is put into a ball mill as a raw material. Mix. The obtained mixture is dried and then pulverized, and the obtained powder is calcined at 750 ° C. for 1 hour. The obtained calcined powder is wet pulverized by a ball mill, dried and then crushed to obtain a ferrite ceramic powder.

To this ferrite ceramic powder, a binder (vinyl acetate, water-soluble acrylic, etc.), a plasticizer, a wetting material, and a dispersing agent are added and mixed with a ball mill, and then defoamed under reduced pressure. The obtained ceramic slurry is formed into a sheet by the doctor blade method and dried to produce ceramic green sheets 116d to 116f.

Next, ceramic green sheets 116a to 116c and 116g to 116j to be the nonmagnetic layers 16a to 16c and 16g to 16j are manufactured by the following steps. Ferric oxide (Fe ₂ O ₃ ), zinc oxide (ZnO), and copper oxide (CuO) are weighed at a predetermined ratio, and the respective materials are put into a ball mill as raw materials, and wet blending is performed. The obtained mixture is dried and then pulverized, and the obtained powder is calcined at 750 ° C. for 1 hour. The obtained calcined powder is wet pulverized by a ball mill, dried and then crushed to obtain a ferrite ceramic powder.

To this ferrite ceramic powder, a binder (vinyl acetate, water-soluble acrylic, etc.), a plasticizer, a wetting material, and a dispersing agent are added and mixed with a ball mill, and then defoamed under reduced pressure. The obtained ceramic slurry is formed into a sheet by a doctor blade method and dried to produce ceramic green sheets 116a to 116c and 116g to 116j.

Next, the via-hole conductor B1 is formed in each of the ceramic green sheets 116e and 116f. Specifically, as shown in FIG. 6, the ceramic green sheets 116e and 116f have a region E1 corresponding to one of the magnetic layers 16e and 16f. The region E1 is arranged in a matrix in the ceramic green sheets 116e and 116f. As shown in FIG. 6, a via hole is formed by irradiating the boundary of each region E1 with a laser beam. Next, the via hole is filled with a conductive paste such as Ag, Pd, Cu, Au or an alloy thereof by a method such as printing.

Next, a via-hole conductor B2 is formed on the ceramic green sheet 116d. Specifically, as shown in FIG. 6, the ceramic green sheet 116d has a region E2 corresponding to one magnetic layer 16d. The region E2 is arranged in a matrix in the ceramic green sheet 116d. As shown in FIG. 6, a via hole is formed by irradiating the boundary of each region E2 with a laser beam. Next, the via hole is filled with a conductive paste such as Ag, Pd, Cu, Au or an alloy thereof by a method such as printing.

Next, a conductive paste mainly composed of Ag, Pd, Cu, Au, or an alloy thereof is applied on the ceramic green sheet 116d by a method such as a screen printing method or a photolithography method, whereby the strip electrode 22 is applied. Form. Specifically, as shown in FIG. 6, five strip electrodes 22 are formed in each of the plurality of regions E2. The step of forming the strip electrode 22 and the step of filling the via hole with the conductive paste may be performed in the same step.

Next, a conductive paste mainly composed of Ag, Pd, Cu, Au, or an alloy thereof is applied onto the ceramic green sheet 116g by a method such as a screen printing method or a photolithography method, whereby the extraction electrode 18a. , 18b and the strip electrode 20 are formed. Specifically, as shown in FIG. 6, a region E3 corresponding to one nonmagnetic layer 16g is defined in the ceramic green sheet 116g. The region E3 is arranged in a matrix in the ceramic green sheet 116g. As shown in FIG. 6, lead electrodes 18a and 18b and four strip electrodes 22 are formed in each of the plurality of regions E3.

Next, as shown in FIG. 6, ceramic green sheets 116a to 116j are laminated. The ceramic green sheets 116a to 116j are stacked one by one with the regions E1 to E3 coinciding from the lower side in the z-axis direction to the upper side. More specifically, the ceramic green sheet 116j is disposed. Next, the ceramic green sheet 116i is disposed and temporarily pressed onto the ceramic green sheet 116j. Thereafter, the ceramic

green sheets

116h, 116g, 116f, 116e, 116d, 116c, 116b, and 116a are similarly laminated and temporarily pressed in this order to obtain a mother laminated body. Further, the mother laminate is subjected to main pressure bonding by a hydrostatic pressure press or the like at a pressure of 1.0 to 1.2 t / cm ² .

Next, the mother laminate is cut into a laminate 12 having a size of 2.5 mm × 2.0 mm by guillotine cutting to obtain an unfired laminate 12. At this time, the mother laminate is cut along the region E1 of FIG. As a result, the via-hole conductors B1 and B2 located on the respective boundaries of the regions E1 and E2 are divided in half, and the via-hole conductors b1 to b4 are formed. The unfired laminate 12 is subjected to binder removal processing and firing. The binder removal treatment is performed, for example, in a low oxygen atmosphere at 500 ° C. for 2 hours. Firing is performed, for example, at 1000 ° C. for 2 hours.

The fired laminated body 12 is obtained through the above steps. The laminated body 12 is chamfered by barrel processing. Thereafter, a silver electrode to be the external electrodes 14a and 14b is formed on the surface of the laminate 12 by applying and baking an electrode paste whose main component is silver by a method such as an immersion method. The silver electrode is dried at 120 ° C. for 10 minutes, and the silver electrode is baked at 890 ° C. for 60 minutes. Furthermore, the external electrodes 14a and 14b are formed by performing Ni plating / Sn plating on the surface of the silver electrode. As a result, the electronic component 10a being manufactured has a structure shown in FIG.

Finally, an insulating material such as an epoxy resin having a relatively low magnetic permeability and high insulation is applied on the via-hole conductors b1 to b4. Through the above steps, an electronic component 10a as shown in FIG. 1 is completed.

(Other embodiments)
The electronic component 10a is not limited to that shown in the embodiment. Therefore, it can be modified within the scope of the gist. For example, in the electronic component 10a, the extraction electrodes 18a and 18b and the strip electrode 20 are formed on the non-magnetic layer 16g, but may be formed on the magnetic layer. That is, the nonmagnetic layer 16g is not necessarily made of a nonmagnetic material and may be made of a magnetic material.

In the electronic component 10a, the coil axis is parallel to the x-axis direction and the stacking direction is parallel to the z-axis direction, but the relationship between the coil axis and the stacking direction is not limited to this. For example, the coil axis and the stacking direction may be parallel. Below, the electronic component which concerns on other embodiment is demonstrated, referring FIG. FIG. 7 is a sectional structural view of the electronic component 10b. In FIG. 7, the stacking direction of the electronic component 10b is defined as the z-axis direction. The coil axis of the coil L of the electronic component 10b is parallel to the z-axis direction.

The electronic component 10b includes a laminated body 212, external electrodes 214a and 214b, and a coil L. The laminated body 212 is configured by laminating an insulating layer including a magnetic layer 218 and a nonmagnetic layer 220. The coil L is configured by connecting a plurality of coil electrodes 222 arranged in the z-axis direction.

In the electronic component 10b, similarly to the electronic component 10a, the magnetic layer 218 is provided only inside the coil L, and the non-magnetic layer 220 is provided outside the coil L. Also in the electronic component 10b having the above configuration, a good DC superposition characteristic can be obtained as compared with the laminated coil component 200, similarly to the electronic component 10a.

The present invention is useful for an electronic component and a manufacturing method thereof, and is particularly excellent in that it has a good direct current superposition characteristic.

B1, B2, b1 to b4 Via-hole conductor L Coil 10a,

10b Electronic component

12, 24, 212

Laminated body

14a, 14b, 214a, 214b External electrode 16a to 16c, 16g to 16j, 220 Nonmagnetic layer 16d to 16f, 218 Magnetic layer 18a,

18b Lead electrode

20, 22 Strip electrode E1-E3 region 116a-116j Ceramic green sheet 222 Coil electrode

Claims

A laminated body in which insulating layers are laminated;
A helical coil formed in the laminate;
With
In the laminated body, a magnetic body is provided only inside the coil,
Electronic parts characterized by
The coil is
A plurality of first strip electrodes formed on the insulating layer, which are disposed relatively above the stacking direction;
A plurality of second strip electrodes formed on the insulating layer relatively below the stacking direction;
A plurality of connecting portions that are formed so as to extend in the stacking direction in the stacked body and connect the first strip electrode and the second strip electrode;
Including
The electronic component according to claim 1, wherein:
The coil axis of the coil is orthogonal to the stacking direction;
The electronic component according to claim 2, wherein:
In the stacking direction, the insulating layer located between the first strip electrode and the second strip electrode is made of a magnetic material,
The connecting portion is formed on a side surface of the insulating layer made of a magnetic material;
The electronic component according to claim 2 or claim 3, wherein:
The connecting portion is covered with an insulating material;
The electronic component according to claim 4, wherein:
The insulating layer stacked above the insulating layer in which the first strip electrode is formed, and the insulating layer in the stack direction more than the insulating layer in which the second strip electrode is formed The insulating layer laminated on the lower side is made of a non-magnetic material;
The electronic component according to any one of claims 2 to 5, characterized by the above-mentioned.
The connecting portion is a via-hole conductor;
The electronic component according to any one of claims 1 to 6, characterized by the above-mentioned.
A laminated body in which insulating layers are laminated;
A helical coil formed in the laminate;
With
The coil is
A plurality of first strip electrodes formed on the insulating layer, which are disposed relatively above the stacking direction;
A plurality of second strip electrodes formed on the insulating layer relatively below the stacking direction;
A plurality of connecting portions that are formed on the side surfaces of the insulating layer so as to extend in the laminating direction and connect the first strip electrode and the second strip electrode;
Including
Electronic parts characterized by
The insulating layer located between the first strip electrode and the second strip electrode in the stacking direction is made of a magnetic material;
The electronic component according to claim 8, wherein:
The connecting portion is a via-hole conductor;
10. The electronic component according to claim 8, wherein the electronic component is any one of claims 8 and 9.
In the method of manufacturing an electronic component that forms a spiral coil in a laminate by connecting a plurality of first strip electrodes and a plurality of second strip electrodes by a plurality of via-hole conductors,
Forming the plurality of first band-shaped electrodes in each of the plurality of first regions defined on the first insulating sheet and arranged in a matrix;
Forming the plurality of second strip electrodes in each of a plurality of second regions defined on the second insulating sheet and arranged in a matrix;
Forming the plurality of via-hole conductors at boundaries of a plurality of third regions that are defined on the third insulating sheet and arranged in a matrix;
Stacking the first insulating sheet or the third insulating sheet so as to match the first region to the third region, and obtaining a mother laminate;
Cutting the mother laminate along the boundaries of the plurality of second regions to obtain a laminate;
Providing
A method of manufacturing an electronic component characterized by the above.