JP2011091221A - Electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component suppressing interlayer separation of a laminate. <P>SOLUTION: The laminate 12 is formed by laminating an insulating layer 16 formed of a magnetic material and an insulating layer 17 formed of a non-magnetic material. A coil L is a helical coil formed by connecting coil conductor layers 18. The coil conductor layers 18a, 18b, 18d-18f form a rectangular annular track R as seen planarly from a z-axial direction. As seen planarly from the z-axial direction, the coil conductor layer 18c contacts the insulating layer 17 from the negative side of the z-axial direction, and circles inside the track R. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an electronic component, and more particularly, to an electronic component having a laminate in which a plurality of insulator layers are laminated.

  As a conventional electronic component, an open magnetic circuit type multilayer coil component (hereinafter simply referred to as a multilayer coil component) described in Patent Document 1 is known. The laminated coil component will be described below.

  The laminated coil component has a coil part containing a spiral coil configured by electrically connecting a plurality of coil conductor patterns, and an outer layer part laminated on the outside of the coil part. And the nonmagnetic ceramic layer is arrange | positioned in the position of the approximate center of a coil part in the lamination direction of laminated coil components. In the laminated coil component having the above configuration, magnetic saturation is unlikely to occur because the nonmagnetic ceramic layer is provided. Therefore, the laminated coil component has excellent direct current superposition characteristics.

  However, in the multilayer coil component described in Patent Document 1, delamination may occur in the nonmagnetic ceramic layer. Hereinafter, description will be given with reference to the drawings. FIG. 4 is a cross-sectional structure diagram in the vicinity of the nonmagnetic ceramic layer of the multilayer coil component described in Patent Document 1.

  The laminated coil component is configured by laminating a magnetic ceramic layer 502 (502a to 502d) and a nonmagnetic ceramic layer 500. On the magnetic ceramic layer 502 and the nonmagnetic ceramic layer 500, coil conductor patterns 504 (504a to 504e) are provided.

  In the laminated coil component having the above configuration, the thickness in the lamination direction in the region where the coil conductor pattern 504 is provided is larger than the thickness in the lamination direction in the region where the coil conductor pattern 504 is not provided. Therefore, the magnetic ceramic layer 502 and the nonmagnetic ceramic layer 500 have a shape protruding upward in the stacking direction in the region where the coil conductor pattern 504 is provided. Therefore, the normal lines of the joining surfaces of the magnetic ceramic layer 502 and the nonmagnetic ceramic layer 500 are inclined with respect to the stacking direction at both ends of the portion where the magnetic ceramic layer 502 and the nonmagnetic ceramic layer 500 protrude upward in the stacking direction. End up. As a result, sufficient pressure is not applied to the magnetic ceramic layer 502 and the nonmagnetic ceramic layer 500 during the compression bonding. Furthermore, the material of the magnetic ceramic layer 502 and the material of the nonmagnetic ceramic layer 500 are different. As described above, delamination is particularly likely to occur between the magnetic ceramic layers 502 b and 502 c and the nonmagnetic ceramic layer 500.

JP 2005-259774 A

  Then, the objective of this invention is providing the electronic component which can suppress that delamination generate | occur | produces in a laminated body.

  An electronic component according to an aspect of the present invention includes a plurality of first insulator layers having a first permeability, and a second insulator layer having a second permeability smaller than the first permeability. And a spiral coil that is built in the multilayer body and formed by connecting a plurality of conductor layers, and the second insulator. When the conductor layer that is in contact with the layer from above in the stacking direction and the conductor layer provided below the conductor layer in the stacking direction are viewed in plan from the stacking direction, It is characterized by not circling on an annular track.

  According to this invention, it can suppress that delamination generate | occur | produces in a laminated body.

1 is an external perspective view of an electronic component according to an embodiment of the present invention. It is a disassembled perspective view of the laminated body of the electronic component which concerns on one Embodiment. FIG. 2 is a cross-sectional structural view taken along line AA of the electronic component in FIG. FIG. 6 is a cross-sectional structure diagram in the vicinity of a nonmagnetic ceramic layer of a multilayer coil component described in Patent Document 1.

  The electronic component according to the embodiment of the present invention will be described below.

(Configuration of electronic parts)
A configuration of an electronic component according to an embodiment of the present invention will be described. FIG. 1 is an external perspective view of an electronic component 10 according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the multilayer body 12 of the electronic component 10 according to the embodiment. FIG. 3 is a sectional structural view taken along line AA of the electronic component 10 of FIG. Hereinafter, the stacking direction of the electronic component 10 is defined as the z-axis direction, the direction along the short side of the electronic component 10 is defined as the x-axis direction, and the direction along the long side of the electronic component 10 is defined as the y-axis direction. To do. In FIG. 3, the external electrode 14 is omitted.

  As shown in FIGS. 1 and 2, the electronic component 10 includes a laminated body 12, external electrodes 14 (14a, 14b), lead conductor layers 19 (19a, 19b), and a coil (electronic element) L (see FIG. 1). Not shown). The laminated body 12 has a rectangular parallelepiped shape and incorporates a coil L.

  The external electrode 14a is provided on the side surface of the multilayer body 12 located on the negative direction side in the y-axis direction. The external electrode 14b is provided on the side surface of the multilayer body 12 positioned on the positive direction side in the y-axis direction. That is, the external electrodes 14 a and 14 b are provided on the side surfaces of the stacked body 12 that face each other.

  As shown in FIG. 2, the laminated body 12 is configured by laminating the insulator layers 16a, 16b, 17, 16c to 16f) so that they are arranged in this order from the positive direction side to the negative direction side in the z-axis direction. Has been. The insulator layer 16 (16a to 16f) is a rectangular layer made of a magnetic material (for example, Ni—Cu—Zn-based ferrite). The insulator layer 17 is a rectangular layer made of a nonmagnetic material (for example, Cu—Zn-based ferrite) and crosses the coil L. The thickness of the insulator layer 17 is smaller than the thickness of the insulator layer 16 as shown in FIG. In addition, a magnetic material or a nonmagnetic material means a material that functions as a magnetic material or a nonmagnetic material in a temperature range of −55 ° C. or more and + 125 ° C. or less, respectively. Hereinafter, the surface on the positive direction side in the z-axis direction of the insulator layers 16 and 17 is referred to as a front surface, and the surface on the negative direction side in the z-axis direction of the insulator layers 16 and 17 is referred to as a back surface.

  As shown in FIG. 2, the coil L is configured by connecting a coil conductor layer 18 (18a to 18f) and via-hole conductors b1 to b5. The coil L is a spiral coil having a coil axis parallel to the z-axis direction.

  As shown in FIG. 2, the coil conductor layer 18 is provided on the back surfaces of the insulator layers 16a, 16b, 17, 16c to 16e. The coil conductor layers 18a, 18b, and 18d to 18f are linear conductors that form a rectangular annular track R by overlapping each other when viewed in plan from the z-axis direction. The coil conductor layer 18 c circulates inside the annular track R when viewed in plan from the z-axis direction. That is, the coil conductor layer 18b in contact with the insulator layer 17 from the upper side in the z-axis direction, and the coil conductor layers 18c to 18c provided on the negative direction side in the z-axis direction from the coil conductor layer 18b. A part of the coil conductor layer 18 of 18f (in this embodiment, the coil conductor layer 18c in contact with the insulator layer 17 from the negative side in the z-axis direction) is viewed in plan view from the z-axis direction. It goes around the inside of the track R. Further, the coil conductor layers 18a, 18b, 18d to 18f other than the coil conductor layer 18c circulate on the track R when viewed in plan from the z-axis direction.

  Furthermore, the coil conductor layer 18c partially overlaps with the coil conductor layers 18a, 18b, and 18d to 18f when viewed in plan from the z-axis direction. In the electronic component 10, the coil conductor layer 18 c overlaps the coil conductor layers 18 a, 18 b, 18 d to 18 f by a half of the line width at the outer peripheral portion.

  The coil conductor layer 18 has a line width of 200 μm and a thickness of 50 μm. Furthermore, the coil conductor layer 18a has 5/8 turns. The coil conductor layers 18b to 18e have 7/8 turns. The coil conductor layer 18f has a 1/8 turn number. In the following, in the coil conductor layer 18, when viewed in plan from the positive side in the z-axis direction, the upstream end on the counterclockwise direction is the upstream end, and the downstream end on the counterclockwise direction is the downstream end. To do. The number of turns of the coil conductor layer 18 is not limited to 7/8 turns. Therefore, the number of turns of the coil conductor layer 18 may be, for example, 1/2 turn or 3/4 turn.

  As shown in FIG. 2, each of the via-hole conductors b1 to b5 is provided so as to penetrate the insulator layers 16b, 17, and 16c to 16e in the z-axis direction, and is adjacent to the coil conductor layer in the z-axis direction. 18 are connected to each other. Specifically, the via-hole conductor b1 penetrates the insulator layer 16b in the z-axis direction, and is connected to the downstream end of the coil conductor layer 18a and the upstream end of the coil conductor layer 18b. The via-hole conductor b2 penetrates the insulator layer 17 in the z-axis direction, and is connected to the downstream end of the coil conductor layer 18b and the upstream end of the coil conductor layer 18c. The via-hole conductor b3 penetrates the insulator layer 16c in the z-axis direction, and is connected to the downstream end of the coil conductor layer 18c and the upstream end of the coil conductor layer 18d. The via-hole conductor b4 penetrates the insulator layer 16d in the z-axis direction, and is connected to the downstream end of the coil conductor layer 18d and the upstream end of the coil conductor layer 18e. The via-hole conductor b5 penetrates the insulator layer 16e in the z-axis direction, and is connected to the downstream end of the coil conductor layer 18e and the upstream end of the coil conductor layer 18f.

  As shown in FIG. 2, the lead conductor layer 19a is connected to the upstream end of the coil conductor layer 18a on the back surface of the insulator layer 16a and on the short side of the insulator layer 16a on the negative side in the y-axis direction. By being pulled out, it is connected to the external electrode 14a. The lead conductor layer 19b is connected to the downstream end of the coil conductor layer 18f on the back surface of the insulator layer 16e, and is drawn out to the short side of the insulator layer 16e on the positive side in the y-axis direction. 14b.

(Method for manufacturing electronic parts)
Below, the manufacturing method of the electronic component 10 is demonstrated, referring FIG. 1 thru | or FIG. Below, the manufacturing method of the one electronic component 10 is demonstrated. In practice, however, a large laminate of green ceramic sheets is laminated to produce a mother laminate, and the mother laminate is cut to produce a plurality of electronic components 10 simultaneously.

First, a ceramic green sheet to be the insulator layer 16 is prepared. Specifically, ferric oxide (Fe ₂ O ₃ ), zinc oxide (ZnO), nickel oxide (NiO), and copper oxide (CuO) were weighed at a predetermined ratio and each material was put into a ball mill as a raw material. Wet preparation. The obtained mixture is dried and pulverized, and the obtained powder is calcined at 800 ° C. for 1 hour. The obtained calcined powder is wet pulverized by a ball mill, dried and then crushed to obtain a ferrite ceramic powder.

  To this ferrite ceramic powder, a binder (vinyl acetate, water-soluble acrylic, etc.), a plasticizer, a wetting material and a dispersing agent are added and mixed with a ball mill, and then defoamed under reduced pressure. The obtained ceramic slurry is formed into a sheet shape on a carrier sheet by a doctor blade method and dried to produce a ceramic green sheet to be the insulator layer 16.

Next, a ceramic green sheet to be the insulator layer 17 is prepared. Specifically, each material obtained by weighing ferric oxide (Fe ₂ O ₃ ), zinc oxide (ZnO) and copper oxide (CuO) at a predetermined ratio is put into a ball mill as a raw material, and wet blending is performed. The obtained mixture is dried and pulverized, and the obtained powder is calcined at 800 ° C. for 1 hour. The obtained calcined powder is wet pulverized by a ball mill, dried and then crushed to obtain a ferrite ceramic powder.

  A binder (vinyl acetate, water-soluble acrylic, etc.), a plasticizer, a wetting material, and a dispersing agent are added to the ferrite ceramic powder, and the mixture is mixed with a ball mill, and then defoamed under reduced pressure. The obtained ceramic slurry is formed into a sheet shape on a carrier sheet by a doctor blade method and dried to produce a ceramic green sheet to be the insulator layer 17.

  Next, via-hole conductors b1 to b5 are formed in each of the ceramic green sheets to be the insulator layers 16b, 17, 16c to 16e. Specifically, a via hole is formed by irradiating a ceramic green sheet to be the insulator layers 16b, 17, 16c to 16e with a laser beam. Further, the via hole conductors b1 to b5 are formed by filling the via hole with a paste made of a conductive material such as Ag, Pd, Cu, Au, or an alloy thereof by a method such as printing.

  Next, by applying a paste made of a conductive material on the back surface of the ceramic green sheet to be the insulator layers 16a to 16e, 17 by a method such as a screen printing method or a photolithography method, the coil conductor layer 18 ( 18a to 18f) and the lead conductor layer 19 (19a, 19b) are formed. The paste made of a conductive material is obtained by adding varnish and a solvent to Ag, for example.

  The step of forming the coil conductor layer 18 (18a to 18f) and the lead conductor layer 19 (19a, 19b) and the step of filling the via hole with the paste made of a conductive material may be performed in the same step. Good.

  Next, the ceramic green sheets to be the insulator layers 16a, 16b, 17, 16c to 16f are laminated and pressure-bonded so as to be arranged in this order from the positive direction side in the z-axis direction to the negative direction side, and an unfired laminated body Get 12. Specifically, a ceramic green sheet to be the insulator layer 16f is disposed, and the ceramic green sheet to be the insulator layer 16e is laminated on the ceramic green sheet to be the insulator layer 16f, and is temporarily bonded. Thereafter, the ceramic green sheet to be the insulator layer 16d, the ceramic green sheet to be the insulator layer 16c, the ceramic green sheet to be the insulator layer 17, the ceramic green sheet to be the insulator layer 16b, and the insulator layer The ceramic green sheets to be 16a are also laminated in this order, and temporarily pressed. Then, this press-bonding is performed on the unfired laminate 12 by an isostatic press. The unfired laminate 12 as shown in FIG. 3 is completed through the above steps.

  Next, the unbaked laminate 12 is subjected to binder removal processing and baking. The binder removal treatment is performed, for example, in a low oxygen atmosphere at 850 ° C. for 2 hours. Firing is performed, for example, at 870 ° C. to 900 ° C. for 2.5 hours.

  The fired laminated body 12 is obtained through the above steps. The laminated body 12 is chamfered by barrel processing. Thereafter, an electrode paste made of a conductive material containing Ag as a main component is applied to the surface of the laminate 12. Then, the applied electrode paste is baked at a temperature of about 800 ° C. for 1 hour. Thereby, the silver electrode which should become external electrode 14a, 14b is formed.

  Finally, the external electrodes 14a and 14b are formed by performing Ni plating / Sn plating on the surface of the silver electrode. Through the above steps, the electronic component 10 as shown in FIG. 1 is completed.

(effect)
According to the electronic component 10 as described above, delamination between the insulator layers 16b and 16c and the insulator layer 17 can be suppressed as described below. More specifically, in the laminated coil component described in Patent Document 1, the thickness in the lamination direction in the region where the coil conductor pattern 504 is provided is the thickness in the lamination direction in the region where the coil conductor pattern 504 is not provided. Bigger than. Therefore, the magnetic ceramic layer 502 and the nonmagnetic ceramic layer 500 have a shape protruding upward in the stacking direction in the region where the coil conductor pattern 504 is provided. Therefore, the normal lines of the joining surfaces of the magnetic ceramic layer 502 and the nonmagnetic ceramic layer 500 are inclined with respect to the stacking direction at both ends of the portion where the magnetic ceramic layer 502 and the nonmagnetic ceramic layer 500 protrude upward in the stacking direction. End up. As a result, sufficient pressure is not applied to the magnetic ceramic layer 502 and the nonmagnetic ceramic layer 500 during the compression bonding. Furthermore, the material of the magnetic ceramic layer 502 and the material of the nonmagnetic ceramic layer 500 are different. As described above, delamination is particularly likely to occur between the magnetic ceramic layers 502b and 502c and the nonmagnetic ceramic layer 500.

  Therefore, in the electronic component 10, the coil conductor layer 18b that is in contact with the insulator layer 17 from the upper side in the z-axis direction, and the negative side in the z-axis direction from the coil conductor layer 18b are provided. A part of the coil conductor layers 18c to 18f of the coil conductor layers 18c to 18f circulates inside the track R when viewed in plan from the z-axis direction. Therefore, as shown in FIG. 3, the coil conductor layers 18a to 18f (the coil conductor layer 18f is not shown in FIG. 3) do not line up in the z-axis direction. Therefore, the electronic component 10 is not provided with the thickness in the z-axis direction of the region where the coil conductor layers 18a to 18f are provided and the coil conductor layers 18a to 18f as compared with the laminated coil component described in Patent Document 1. The difference from the thickness of the region in the z-axis direction is reduced. Therefore, the amount by which the insulator layers 16a, 16b, and 17 located on the positive side in the z-axis direction from the coil conductor layer 18c protrude toward the positive side in the z-axis direction is small. Therefore, the amount by which the boundary between the insulator layers 16b and 16c and the insulator layer 17 protrudes in the z-axis direction is also reduced. Therefore, a sufficient pressure is applied to the insulating layers 16b, 16c, and 17 at the time of pressure bonding. As a result, in the electronic component 10, it is possible to suppress delamination between the insulator layers 16 b and 16 c and the insulator layer 17.

  The coil conductor layers 18a, 18b, 18d to 18f go around the track R, and the coil conductor layer 18c goes inside the track R. Thereby, the coil diameter of the coil L can be enlarged as much as possible. As a result, in the electronic component 10, the inductance value of the coil L can be increased.

  The coil conductor layer 18c partially overlaps with the coil conductor layers 18a, 18b, and 18d to 18f when viewed in plan from the z-axis direction. Thereby, as will be described below, in the electronic component 10, the inductance value of the coil L can be increased. More specifically, when the coil conductor layer 18c and the coil conductor layers 18a, 18b, and 18d to 18f do not partially overlap, the coil conductor layer 18c and the coil conductor layer are viewed in plan view from the z-axis direction. A gap is generated between 18a, 18b, and 18d to 18f. Therefore, the magnetic flux generated by the coil conductor layer 18c and the magnetic flux generated by the coil conductor layers 18a, 18b, and 18d to 18f tend to pass through the gap. However, the direction of the magnetic flux generated by the coil conductor layer 18c is opposite to the direction of the magnetic flux generated by the coil conductor layers 18a, 18b, 18d to 18f. Therefore, these magnetic fluxes cancel each other. Therefore, the presence of such a gap prevents the inductance value of the coil L from being increased.

  On the other hand, when the coil conductor layer 18c and the coil conductor layers 18a, 18b, and 18d to 18f partially overlap, the above-described gap does not occur. Therefore, the magnetic flux generated by the coil conductor layer 18c and the magnetic flux generated by the coil conductor layers 18a, 18b, and 18d to 18f do not cancel each other. As a result, in the electronic component 10, the inductance value of the coil L can be increased.

  In addition, if the size of the portion where the coil conductor layer 18c and the coil conductor layers 18a, 18b, and 18d to 18f overlap with each other is large, the inner diameter of the coil L is increased, so that the inductance value is increased. On the other hand, if the size of the portion where the coil conductor layer 18c and the coil conductor layers 18a, 18b, and 18d to 18f overlap is small, the amount by which the insulator layers 16b and 17 protrude to the positive side in the z-axis direction is small. Therefore, delamination can be effectively suppressed. Therefore, from the viewpoint of achieving both a large inductance value and suppression of delamination, the coil conductor layer 18c has a coil conductor layer 18a, 18b, 18d˜ It is desirable to overlap with 18f.

(Other embodiments)
The electronic component according to the present invention is not limited to the electronic component 10 according to the above embodiment, but can be changed within the scope of the gist thereof. Hereinafter, electronic components according to other embodiments will be described.

  In the electronic component 10, the coil conductor layer 18 c circulates inside the track R when viewed in plan from the z-axis direction. However, the coil conductor layer 18 that circulates inside the track R is not limited to the coil conductor layer 18c. In the electronic component 10, it is only necessary to suppress delamination between the insulator layers 16 b and 16 c and the insulator layer 17. Therefore, any one of the coil conductor layers 18c to 18f only needs to go around the inside of the track R. The coil conductor layers 18c to 18f are conductor layers located on the negative side in the z-axis direction relative to the coil conductor layer 18b in contact with the insulator layer 17 from the positive side in the z-axis direction. As a result, the amount by which the insulator layers 16a, 16b, and 17 positioned on the positive side in the z-axis direction from the coil conductor layers 18c to 18f protrude toward the positive side in the z-axis direction is reduced. Therefore, the amount by which the boundary between the insulator layers 16b and 16c and the insulator layer 17 protrudes in the z-axis direction is also reduced. Therefore, a sufficient pressure is applied to the insulating layers 16b, 16c, and 17 at the time of pressure bonding. As a result, it is possible to suppress delamination between the insulator layers 16b and 16c and the insulator layer 17.

  The coil conductor layer 18b may circulate inside the track R when viewed in plan from the z-axis direction. As shown in FIG. 3, the coil conductor layer 18 b is in contact with the insulator layer 17 from the positive side in the z-axis direction. Therefore, when the coil conductor layer 18b orbits the inside of the track R, the insulator layers 16a and 16b located on the positive side in the z-axis direction from the coil conductor layer 18b protrude toward the positive side in the z-axis direction. The amount becomes smaller. As a result, the amount by which the boundary between the insulator layer 16b and the insulator layer 17 protrudes in the z-axis direction is also reduced. Therefore, a sufficient pressure is applied to the insulating layers 16b and 17 during the pressure bonding. As a result, it is possible to suppress delamination between the insulator layer 16b and the insulator layer 17.

  In the electronic component 10, the coil conductor layers 18 a, 18 b, 18 d to 18 f circulate on one track R. However, the coil conductor layers 18a, 18b, and 18d to 18f do not need to circulate on one track R. In the electronic component 10, the cause of delamination between the insulator layers 16b and 16c and the insulator layer 17 is that the insulator layer 17 is in contact with the insulator layer 17 from the positive side in the z-axis direction as described above. Coil conductor layers 18c to 18f located on the negative direction side in the z-axis direction with respect to the coil conductor layer 18b are aligned in the z-axis direction. Therefore, in the electronic component 10, the coil conductor layers 18 c to 18 f may not circulate on one track R when viewed from the positive side in the z-axis direction. Therefore, the coil L may be not a column but a cone, for example.

  In the electronic component 10, the coil conductor layer 18 is provided on the back surfaces of the insulator layers 16 and 17, but may be provided on the surfaces of the insulator layers 16 and 17.

  The insulator layer 16 is made of a magnetic material, and the insulator layer 17 is made of a nonmagnetic material. However, the material of the insulator layer 16 and the material of the insulator layer 17 are not limited to this. The insulator layer 16 has a first magnetic permeability, and the insulator layer 17 only needs to have a second magnetic permeability smaller than the first magnetic permeability.

  As described above, the present invention is useful for electronic components, and is particularly excellent in that delamination can be prevented from occurring in the laminate.

L coil R track b1 to b5 via-hole conductor 10 electronic component 12 laminate 14a, 14b external electrode 16a-16f, 17 insulator layer 18a-18f coil conductor layer 19a, 19b lead conductor layer

Claims (6)

A laminate in which a plurality of first insulator layers having a first permeability and a second insulator layer having a second permeability smaller than the first permeability are laminated; ,
A helical coil that is built in the laminate and configured by connecting a plurality of conductor layers;
With
The conductor layer in contact with the second insulator layer from the upper side in the stacking direction, and the conductor layer provided on the lower side in the stacking direction than the conductor layer are planarly viewed from the stacking direction Is not going around one circular orbit,
Electronic parts characterized by The conductor layer in contact with the second insulator layer from the upper side in the stacking direction, and a part of the conductor layer provided on the lower side in the stacking direction than the conductor layer The conductor layer, when viewed in plan from the stacking direction, circulates inside the track,
The conductor layers other than the part of the conductor layers circulate on the track when viewed in plan from the stacking direction;
The electronic component according to claim 1. The part of the conductor layer is any one of the conductor layers provided on the lower side in the stacking direction than the conductor layer in contact with the second insulator layer from the upper side in the stacking direction;
The electronic component according to claim 2. The part of the conductor layer is the conductor layer in contact with the second insulator layer from below in the stacking direction;
The electronic component according to claim 2, wherein: The conductor layer in contact with the second insulator layer from the upper side in the stacking direction, and a part of the conductor layer provided on the lower side in the stacking direction than the conductor layer The conductor layer partially overlaps the conductor layer other than the part of the conductor layer when viewed in plan from the stacking direction;
The electronic component according to claim 2, wherein: The thickness of the second insulator layer is thinner than the thickness of the first insulator layer;
The electronic component according to claim 1, wherein:

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