JP2011187535A - Electronic component, and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component reducing DC resistance of a coil, and to provide a method of manufacturing the same. <P>SOLUTION: A laminate 12 is formed by laminating an insulator layer 16 and an insulator layer 17 having a porosity higher than that of the insulator layer 16. The coil L is built into the laminate 12 and includes coil conductors 18, 19. The coil conductor 18 is disposed on the insulator layer 16. The coil conductor 19 is disposed on the insulator layer 17 laminated on the insulator layer 16 with the coil conductor 18 disposed and is connected with the coil conductor 18 via a conductor entering countless holes formed in the insulator layer 17. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic component and a manufacturing method thereof, and more particularly to an electronic component including a coil and a manufacturing method thereof.

  As a conventional electronic component, for example, a multilayer chip inductor described in Patent Document 1 is known. In the chip inductor described in Patent Document 1, a laminated body is configured by laminating ferrite sheet pieces. The laminate has a built-in coil. The coil is spirally formed by connecting a plurality of coil patterns through through-hole conductors. Two coil patterns having the same shape are connected in parallel by through-hole conductors. That is, in the multilayer chip inductor, the coil has a double spiral structure. According to the multilayer chip inductor as described above, it is possible to reduce the DC resistance without increasing the number of turns.

  By the way, there is a demand for further reducing the DC resistance of the coil in the electronic component incorporating the coil.

Japanese Utility Model Publication No. 5-57817

  Accordingly, an object of the present invention is to provide an electronic component that can reduce the DC resistance of a coil and a method for manufacturing the same.

  An electronic component according to an aspect of the present invention includes a laminate in which a first insulator layer and a second insulator layer having a higher porosity than the first insulator layer are laminated, A coil built in the laminate, and the coil includes a first coil conductor provided on the first insulator layer, and the first coil conductor provided with the first coil conductor. A second coil conductor provided on the second insulator layer laminated on the one insulator layer, and innumerable holes provided in the second insulator layer. And a second coil conductor connected to the first coil conductor via an intervening conductor.

  The method for manufacturing an electronic component according to one aspect of the present invention includes a step of preparing a first ceramic green sheet, a step of preparing a second ceramic green sheet mixed with a granular vanishing member that disappears by heating, Forming a first coil conductor constituting a coil on the first ceramic green sheet; forming a second coil conductor constituting the coil on the second ceramic green sheet; A step of forming a laminate by laminating the second ceramic green sheet on the first ceramic green sheet; and a step of firing the laminate to eliminate the disappearing member. It is characterized by.

  The method for manufacturing an electronic component according to another aspect of the present invention includes a step of preparing a first ceramic paste, a step of preparing a second ceramic paste mixed with a granular vanishing member that disappears by heating, Forming a first ceramic green layer by using a first ceramic paste; forming a first coil conductor constituting a coil on the first ceramic green layer; and the first ceramic green. Forming a second ceramic green layer on the layer using the second ceramic paste; forming a second coil conductor constituting the coil on the second ceramic green layer; Firing the laminate including the first ceramic green layer and the second ceramic green layer to eliminate the disappearing member; It is example, and said.

  According to the present invention, the DC resistance of the coil can be reduced.

1 is an external perspective view of an electronic component according to an embodiment of the present invention. It is a disassembled perspective view of the laminated body of the electronic component which concerns on one Embodiment. It is a fragmentary sectional view of the electronic component of FIG.

  Below, the electronic component which concerns on embodiment of this invention, and its manufacturing method are demonstrated.

(Configuration of electronic parts)
A configuration of an electronic component according to an embodiment of the present invention will be described. FIG. 1 is an external perspective view of an electronic component 10 according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the multilayer body 12 of the electronic component 10 according to the embodiment. FIG. 3 is a partial cross-sectional view of the electronic component 10 of FIG.

  Hereinafter, the stacking direction of the electronic components 10 is defined as the z-axis direction, and the directions along two sides of the upper surface of the electronic component 10 on the positive direction side in the z-axis direction are defined as the x-axis direction and the y-axis direction. The x-axis direction, the y-axis direction, and the z-axis direction are orthogonal to each other. In the electronic component 10, surfaces positioned on both sides in the z-axis direction are referred to as an upper surface and a lower surface, and surfaces connecting the upper surface and the lower surface are referred to as side surfaces.

  As shown in FIGS. 1 and 2, the electronic component 10 includes a laminated body 12, external electrodes 14 (14 a and 14 b), and a coil L.

  As shown in FIG. 1, the laminated body 12 has a rectangular parallelepiped shape and incorporates a coil L. As shown in FIG. 2, the laminated body 12 is configured by laminating insulating layers 16 (16a to 16m) and 17 (17d to 17j). The insulator layer 16 is a rectangular layer made of a magnetic material (for example, Ni—Cu—Zn ferrite). The insulator layer 17 is a rectangular layer made of a magnetic material (for example, Ni—Cu—Zn-based ferrite) having a higher porosity than the insulator layer 16. Therefore, the insulator layer 17 has innumerable holes as shown in FIG. The porosity of the insulator layer 16 is 3% or less, and the porosity of the insulator layer 17 is 60%. The magnetic material means a material that functions as a magnetic material in a temperature range of −55 ° C. or higher and + 125 ° C. or lower. Hereinafter, the surface on the positive direction side in the z-axis direction of the insulator layers 16 and 17 is referred to as a front surface, and the surface on the negative direction side in the z-axis direction of the insulator layers 16 and 17 is referred to as a back surface.

  The insulating layers 17d to 17j and the insulating layers 16d to 16j are stacked so as to be alternately arranged in the z-axis direction. More specifically, the insulator layers 16d to 16j are arranged in this order from the positive direction side to the negative direction side in the z-axis direction. The insulator layers 17d to 17j are stacked on the positive side in the z-axis direction of the insulator layers 16d to 16j, respectively. The insulator layers 16a to 16c are stacked so as to be arranged in this order on the positive side in the z-axis direction of the insulator layer 17d, and the insulator layers 16k to 16m are negative in the z-axis direction of the insulator layer 16j. They are stacked in this order on the side.

  As shown in FIG. 1, the external electrode 14 a is provided so as to cover the side surface of the multilayer body 12 located on the negative direction side in the x-axis direction. As shown in FIG. 1, the external electrode 14 b is provided so as to cover the side surface of the multilayer body 12 positioned on the positive side in the x-axis direction. Furthermore, the external electrodes 14a and 14b are folded back with respect to the upper surface, the lower surface and the side surface adjacent to the side surface. The external electrodes 14 a and 14 b function as connection terminals that electrically connect a circuit outside the electronic component 10 and the coil L.

  The coil L is built in the laminated body 12, and is comprised by the coil conductors 18 (18a-18g) and 19 (19a-19g) and the via-hole conductors b1-b18, as shown in FIG. The coil L is configured to form a double spiral by connecting the coil conductors 18 and 19 and the via-hole conductors b1 to b18, and extends along the z-axis direction (that is, parallel to the z-axis direction). ) Has a coil axis.

  As shown in FIG. 2, the coil conductors 18 a to 18 g are provided on the surfaces of the insulator layers 16 d to 16 j, and are U-shaped linear shapes that rotate clockwise when viewed in plan from the z-axis direction. It is a conductor layer. More specifically, the coil conductors 18a to 18g have a number of turns of 3/4, and are along the three sides of the insulator layers 16d to 16j. The coil conductor 18a is provided along three sides of the insulator layer 16d other than the short side on the negative direction side in the x-axis direction. The coil conductor 18a is drawn out to the short side on the negative direction side in the x-axis direction and is connected to the external electrode 14a. The coil conductor 18b is provided along three sides of the insulator layer 16e other than the long side on the negative direction side in the y-axis direction. The coil conductor 18c is provided along three sides other than the short side on the positive direction side in the x-axis direction in the insulator layer 16f. The coil conductor 18d is provided along three sides of the insulator layer 16g other than the long side on the positive direction side in the y-axis direction. The coil conductor 18e is provided along three sides other than the short side on the negative direction side in the x-axis direction in the insulator layer 16h. The coil conductor 18f is provided along three sides of the insulator layer 16i other than the long side on the negative direction side in the y-axis direction. The coil conductor 18g is provided along three sides other than the short side on the positive direction side in the x-axis direction in the insulator layer 16j. The coil conductor 18g is drawn out to the short side on the positive direction side in the x-axis direction, and is connected to the external electrode 14b.

  As shown in FIG. 2, the coil conductors 19 a to 19 g are provided on the surfaces of the insulator layers 17 d to 17 j, and are U-shaped linear shapes that rotate clockwise when viewed in plan from the z-axis direction. It is a conductor layer. More specifically, the coil conductors 19a to 19g have a number of turns of 3/4 and are along the three sides of the insulator layers 17d to 17j. The coil conductor 19a is provided along three sides other than the short side on the negative direction side in the x-axis direction in the insulator layer 17d. The coil conductor 19a is drawn out to the short side on the negative direction side in the x-axis direction, and is connected to the external electrode 14a. The coil conductor 19b is provided along three sides of the insulator layer 17e other than the long side on the negative direction side in the y-axis direction. The coil conductor 19c is provided along three sides other than the short side on the positive direction side in the x-axis direction in the insulator layer 17f. The coil conductor 19d is provided along three sides other than the long side on the positive direction side in the y-axis direction in the insulator layer 17g. The coil conductor 19e is provided along three sides of the insulator layer 17h other than the short side on the negative direction side in the x-axis direction. The coil conductor 19f is provided along three sides of the insulator layer 17i other than the long side on the negative direction side in the y-axis direction. The coil conductor 19g is provided along three sides other than the short side on the positive direction side in the x-axis direction in the insulator layer 17j. The coil conductor 19g is drawn out to the short side on the positive direction side in the x-axis direction, and is connected to the external electrode 14b.

  The coil conductors 18a to 18g and the coil conductors 19a to 19g as described above are sandwiched between the insulator layers 17d to 17j, have the same shape, and coincide when viewed in plan from the z-axis direction. It overlaps in the state. In the following, in the coil conductors 18 and 19, when viewed in plan from the positive direction side in the z-axis direction, the end portion on the upstream side in the clockwise direction is the upstream end, and the end portion on the downstream side in the clockwise direction is the downstream end. . The number of turns of the coil conductors 18 and 19 is not limited to 3/4 turns. Therefore, the number of turns of the coil conductors 18 and 19 may be, for example, 1/2 turn or 7/8 turn.

  As shown in FIG. 2, the via-hole conductors b1 to b18 are provided so as to penetrate the insulator layers 16d to 16i and 17d to 17j in the z-axis direction. More specifically, the via-hole conductor b1 penetrates the insulator layer 17d in the z-axis direction, and is connected to the downstream end of the coil conductor 19a and the downstream end of the coil conductor 18a. The via-hole conductor b2 penetrates the insulator layer 16d in the z-axis direction, and is connected to the downstream end of the coil conductor 18a and the upstream end of the coil conductor 19b. The via-hole conductor b3 penetrates the insulator layer 17e in the z-axis direction, and is connected to the upstream end of the coil conductor 19b and the upstream end of the coil conductor 18b. The via-hole conductor b4 penetrates the insulator layer 17e in the z-axis direction and is connected to the downstream end of the coil conductor 19b and the downstream end of the coil conductor 18b. The via-hole conductor b5 penetrates the insulator layer 16e in the z-axis direction and is connected to the downstream end of the coil conductor 18b and the upstream end of the coil conductor 19c. The via-hole conductor b6 passes through the insulator layer 17f in the z-axis direction, and is connected to the upstream end of the coil conductor 19c and the upstream end of the coil conductor 18c. The via-hole conductor b7 passes through the insulator layer 17f in the z-axis direction, and is connected to the downstream end of the coil conductor 19c and the downstream end of the coil conductor 18c. The via-hole conductor b8 passes through the insulator layer 16f in the z-axis direction, and is connected to the downstream end of the coil conductor 18c and the upstream end of the coil conductor 19d. The via-hole conductor b9 penetrates the insulator layer 17g in the z-axis direction, and is connected to the upstream end of the coil conductor 19d and the upstream end of the coil conductor 18d. The via-hole conductor b10 penetrates the insulator layer 17g in the z-axis direction and is connected to the downstream end of the coil conductor 19d and the downstream end of the coil conductor 18d. The via-hole conductor b11 penetrates the insulator layer 16g in the z-axis direction, and is connected to the downstream end of the coil conductor 18d and the upstream end of the coil conductor 19e. The via-hole conductor b12 penetrates the insulator layer 17h in the z-axis direction, and is connected to the upstream end of the coil conductor 19e and the upstream end of the coil conductor 18e. The via-hole conductor b13 penetrates the insulator layer 17h in the z-axis direction, and is connected to the downstream end of the coil conductor 19e and the downstream end of the coil conductor 18e. The via-hole conductor b14 passes through the insulator layer 16h in the z-axis direction, and is connected to the downstream end of the coil conductor 18e and the upstream end of the coil conductor 19f. The via-hole conductor b15 penetrates the insulator layer 17i in the z-axis direction and is connected to the upstream end of the coil conductor 19f and the upstream end of the coil conductor 18f. The via-hole conductor b16 penetrates the insulator layer 17i in the z-axis direction and is connected to the downstream end of the coil conductor 19f and the downstream end of the coil conductor 18f. The via-hole conductor b17 penetrates the insulator layer 16i in the z-axis direction and is connected to the downstream end of the coil conductor 18f and the upstream end of the coil conductor 19g. The via-hole conductor b18 penetrates the insulator layer 17j in the z-axis direction, and is connected to the upstream end of the coil conductor 19g and the upstream end of the coil conductor 18g.

  As described above, the both ends of the coil conductors 18b to 18f and the both ends of the coil conductors 19b to 19f are respectively via hole conductors b3, b4, b6, b7, b9, b10, b12 provided in the insulator layers 17e to 17i. , B13, b15, b16. Also, one end of the coil conductors 18a and 18g and one end of the coil conductors 19a and 19g are connected via via-hole conductors b1 and b18 provided in the insulator layers 17d and 17j, respectively. The other ends of the coil conductors 18a and 18g and the other ends of the coil conductors 19a and 19g are connected via external electrodes 14a and 14b, respectively.

  Incidentally, in the electronic component 10, the porosity of the insulator layer 17 is higher than the porosity of the insulator layer 16. Therefore, as shown in FIG. 3, when the laminated body 12 is fired, part of the coil conductors 18 and 19 is melted and enters the holes of the insulator layer 17. Thus, as shown in FIG. 3, the coil conductor 19 provided on the insulator layer 17 laminated on the insulator layer 16 provided with the coil conductor 18 is provided on the insulator layer 17. The coil conductor 18 is connected to the coil conductor 18 through a number of conductors that have entered a myriad of holes. More specifically, the coil conductor 18a and the coil conductor 19a are connected via a conductor that has entered a myriad of holes provided in the insulator layer 17d. The coil conductor 18b and the coil conductor 19b are connected via a conductor that has entered an infinite number of holes provided in the insulating layer 17e. The coil conductor 18c and the coil conductor 19c are connected via a conductor that has entered a myriad of holes provided in the insulator layer 17f. The coil conductor 18d and the coil conductor 19d are connected via a conductor that has entered an infinite number of holes provided in the insulator layer 17g. The coil conductor 18e and the coil conductor 19e are connected via a conductor that has entered a myriad of holes provided in the insulator layer 17h. The coil conductor 18f and the coil conductor 19f are connected via a conductor that has entered an infinite number of holes provided in the insulator layer 17i. The coil conductor 18g and the coil conductor 19g are connected via a conductor that has entered a myriad of holes provided in the insulator layer 17j.

(Method for manufacturing electronic parts)
Below, the manufacturing method of the electronic component 10 is demonstrated, referring drawings. In the following, a method for manufacturing one electronic component 10 will be described. In practice, a large mother ceramic green sheet is laminated to produce a mother laminated body, and further, the mother laminated body is cut. Thus, a plurality of laminated bodies are produced at the same time.

First, a ceramic green sheet to be the insulator layer 16 is prepared. Specifically, ferric oxide (Fe ₂ O ₃ ), zinc oxide (ZnO), nickel oxide (NiO), and copper oxide (CuO) were weighed at a predetermined ratio, and each material was put into a ball mill as a raw material. Wet preparation. The obtained mixture is dried and pulverized, and the obtained powder is calcined at 800 ° C. for 1 hour. The obtained calcined powder is wet pulverized by a ball mill, dried and then crushed to obtain a ferrite ceramic powder.

  To this ferrite ceramic powder, a binder (vinyl acetate, water-soluble acrylic, etc.), a plasticizer, a wetting material and a dispersant are added and mixed by a ball mill, and then defoamed by reduced pressure. The obtained ceramic slurry is formed into a sheet shape on a carrier sheet by a doctor blade method and dried to produce a ceramic green sheet to be the insulator layer 16. The thickness of the ceramic green sheet to be the insulator layer 16 is 20 μm to 25 μm.

Next, a ceramic green sheet to be the insulator layer 17 is prepared. Specifically, ferric oxide (Fe ₂ O ₃ ), zinc oxide (ZnO), nickel oxide (NiO), and copper oxide (CuO) were weighed at a predetermined ratio, and each material was put into a ball mill as a raw material. Wet preparation. The obtained mixture is dried and pulverized, and the obtained powder is calcined at 800 ° C. for 1 hour. The obtained calcined powder is wet pulverized by a ball mill, dried and then crushed to obtain a ferrite ceramic powder.

  To this ferrite ceramic powder, a binder (vinyl acetate, water-soluble acrylic, etc.), a plasticizer, a wetting material, a dispersing agent and a disappearing member are added and mixed with a ball mill, and then defoamed under reduced pressure. The vanishing member is a powder made of spherical fine particle polymer having an average particle diameter of 8 μm, and disappears by heating at the time of firing the laminate 12 described later. The vanishing member is made of, for example, crosslinked methyl methacrylate. Further, the volume ratio of the ferrite ceramic powder to the disappearing member was set to 40:60. The obtained ceramic slurry is formed into a sheet shape on a carrier sheet by a doctor blade method and dried to produce a ceramic green sheet to be the insulator layer 17 mixed with the disappearing member.

  Next, via-hole conductors b1 to b18 are formed on the ceramic green sheets to be the insulator layers 16d to 16i and 17d to 17j, respectively. Specifically, via holes are formed by irradiating the ceramic green sheets to be the insulator layers 16d to 16i and 17d to 17j with a laser beam. Further, the via holes are filled with a paste made of a conductive material such as Ag, Pd, Cu, Au, or an alloy thereof by a method such as printing and coating to form via hole conductors b1 to b18.

  Next, the coil conductors 18a to 18g are formed by applying a paste made of a conductive material on the ceramic green sheets to be the insulator layers 16d to 16j by a method such as a screen printing method or a photolithography method. The paste made of a conductive material is obtained by adding varnish and a solvent to Ag, for example.

  Next, the coil conductors 19a to 19g are formed by applying a paste made of a conductive material on the ceramic green sheets to be the insulator layers 17d to 17j by a method such as a screen printing method or a photolithography method. The paste made of a conductive material is obtained by adding varnish and a solvent to Ag, for example.

  The step of forming the coil conductors 18 and 19 and the step of filling the via hole with a paste made of a conductive material (Ag or Ag-Pt) may be performed in the same step.

  Next, ceramic green sheets to be the insulator layers 16 and 17 are laminated one by one and temporarily pressed to obtain an unfired laminate 12. The ceramic green sheets to be the insulator layers 16 and 17 are laminated one by one and temporarily pressed. Then, this press-bonding is performed on the unfired laminate 12 by an isostatic press. The conditions of the hydrostatic press are a pressure of 100 MPa and a temperature of 45 ° C. By compression, the thickness of the ceramic green sheet to be the insulator layers 16 and 17 is compressed to about 10 μm. On the other hand, the average particle diameter of the disappearing member is 8 μm. Therefore, in the ceramic green sheet to be the insulator layer 17, a disappearing member that contacts both the coil conductor 18 and the coil conductor 19 that are adjacent in the stacking direction is generated.

  Next, the unbaked laminate 12 is subjected to binder removal processing and baking. The binder removal treatment is performed, for example, in a low oxygen atmosphere at 850 ° C. for 2 hours. Firing is performed at 900 ° C. to 930 ° C. for 2.5 hours, for example. Thereby, the disappearing member disappears by heating, and innumerable holes are formed in the insulator layer 17. As described above, since a part of the disappearing member is in contact with both the coil conductor 18 and the coil conductor 19, a hole that contacts both the coil conductor 18 and the coil conductor 19 is formed. A part of the coil conductors 18 and 19 is melted by heating and enters the holes. As a result, the coil conductor 18 and the coil conductor 19 are connected at a number of locations by a conductor that has entered innumerable voids. Thereafter, the surface of the laminate 12 is subjected to barrel polishing to chamfer.

  Next, an electrode paste made of a conductive material containing Ag as a main component is applied to the side surfaces of the laminated body 12 located at both ends in the x-axis direction. Then, the applied electrode paste is baked at a temperature of about 800 ° C. for 1 hour. Thereby, the silver electrode which should become the external electrode 14 is formed. Further, the external electrode 14 is formed by performing Ni plating / Sn plating on the surface of the silver electrode to be the external electrode 14. Through the above steps, the electronic component 10 is completed.

(effect)
According to the electronic component 10 as described above, the DC resistance of the coil L can be reduced. More specifically, in the multilayer chip inductor described in Patent Document 1, both ends of two coil patterns having the same shape are connected to each other by through-hole conductors. Thereby, in the chip inductor described in Patent Document 1, the direct current resistance of the coil is reduced.

  On the other hand, in the electronic component 10, the coil conductor 18 and the coil conductor 19 are connected at a number of locations by a conductor that has entered a myriad of holes provided in the insulator layer 17. That is, the coil conductor 18 and the coil conductor 19 are connected to each other by a conductor that has entered a hole.

  As described above, the number of connection portions between the coil conductor 18 and the coil conductor 19 in the electronic component 10 is larger than the connection portion between the coil patterns in the multilayer chip inductor. Therefore, the DC resistance between the coil conductor 18 and the coil conductor 19 is smaller than the DC resistance between the coil patterns. As a result, the direct current resistance of the coil L can be reduced.

  In the electronic component 10, the coil conductor 18 and the coil conductor 19 are sandwiched between the insulator layers 17, have the same shape, and match when viewed in plan from the z-axis direction. overlapping. As a result, the coil conductor 18 and the coil conductor 19 are connected to each other by a conductor that has entered a hole provided in the insulator layer 17 over substantially the entire surface. As a result, the DC resistance between the coil conductor 18 and the coil conductor 19 is reduced, and the DC resistance of the coil L is reduced.

  In the electronic component 10, both ends of the coil conductor 18 sandwiching the insulator layer 17 and both ends of the coil conductor 19 are connected via via-hole conductors provided in the insulator layer 17. Thereby, the direct current resistance between the coil conductor 18 and the coil conductor 19 is further reduced, and the direct current resistance of the coil L is further reduced.

(Other embodiments)
The electronic component according to the present invention is not limited to the electronic component 10 shown in the embodiment. Therefore, the electronic component according to the present invention can be changed within the scope of the gist.

  The coil conductor 18 and the coil conductor 19 sandwiching the insulator layer 17 have the same shape and are overlapped in a state of being coincident when viewed in plan from the z-axis direction. However, the coil conductor 18 only needs to overlap at least part of the adjacent coil conductors 19 with the insulator layer 17 interposed therebetween. Therefore, the coil conductor 18 does not have to have the same shape as the adjacent coil conductors 19 with the insulator layer 17 interposed therebetween.

  Further, as shown in FIG. 2, the coil L has a spiral shape having a longitudinal direction in the z-axis direction by connecting a plurality of coil conductors 18 and 19 by via-hole conductors b1 to b18. However, the shape of the coil L is not limited to a spiral. For example, the coil L may be spiral.

  In addition, although the electronic component 10 shall be produced by the sheet | seat lamination method, it may be produced by the printing method. Below, the manufacturing method of the electronic component 10 in the case of producing by the printing method will be briefly described with reference to FIG.

  First, a ceramic paste used for the insulator layer 16 is prepared. The method for producing the ceramic paste is the same as the method for producing the ceramic slurry of the ceramic green sheet to be the insulator layer 16, and therefore further explanation is omitted.

  Next, a ceramic paste mixed with a granular disappearing member that disappears by heating is prepared. The method for producing the ceramic paste is the same as the method for producing the ceramic slurry of the ceramic green sheet to be the insulator layer 17 and will not be described further.

  Next, a ceramic green layer to be the insulator layers 16j to 16m is formed using a ceramic paste used for the insulator layer 16. Then, a coil conductor 18g is formed on the ceramic green layer to be the insulator layer 16j by a screen printing method or the like.

  Next, a ceramic green layer to be the insulator layer 17j is formed on the ceramic green layer to be the insulator layer 16j by using a ceramic paste used for the insulator layer 17. At this time, a via hole to be the via hole conductor b18 is formed in the ceramic green layer to be the insulator layer 17j. Then, a coil conductor 19g is formed on the ceramic green layer to be the insulator layer 17j by a screen printing method or the like. When the coil conductor 19g is formed, the via-hole conductor b18 is also formed. Thereafter, similar processes are repeated to form ceramic green sheets and coil conductors 18 and 19 and via-hole conductors b1 to b17 to be the insulator layers 16 and 17. Thereby, the unfired laminated body 12 is obtained. Since the process performed after this is the same as the process already demonstrated, description is abbreviate | omitted.

  As described above, the present invention is useful for an electronic component and a manufacturing method thereof, and is particularly excellent in that the direct current resistance of the coil can be reduced.

L coil b1 to b18 Via hole conductor 10 Electronic component 12 Laminated body 14a, 14b External electrode 16a to 16m, 17d to 17j Insulator layer 18a to 18g, 19a to 19g Coil conductor

Claims (5)

A laminate in which a first insulator layer and a second insulator layer having a higher porosity than the first insulator layer are laminated;
A coil built in the laminate;
With
The coil is
A first coil conductor provided on the first insulator layer;
A second coil conductor provided on the second insulator layer laminated on the first insulator layer on which the first coil conductor is provided, the second coil conductor comprising: A second coil conductor connected to the first coil conductor via a conductor that has entered an infinite number of holes provided in the insulator layer;
Including
Electronic parts characterized by The first coil conductor and the second coil conductor have the same shape, and overlap when viewed in plan from the stacking direction;
The electronic component according to claim 1. Both ends of the first coil conductor and both ends of the second coil conductor are connected via via-hole conductors provided in the second insulator layer;
The electronic component according to claim 2. Preparing a first ceramic green sheet;
Preparing a second ceramic green sheet mixed with a granular disappearing member that disappears by heating;
Forming a first coil conductor constituting a coil on the first ceramic green sheet;
Forming a second coil conductor constituting the coil on the second ceramic green sheet;
Forming a laminate by laminating the second ceramic green sheet on the first ceramic green sheet;
Firing the laminate, and eliminating the disappearing member;
Having
A method of manufacturing an electronic component characterized by Preparing a first ceramic paste;
A step of preparing a second ceramic paste mixed with a granular disappearing member that disappears by heating;
Forming a first ceramic green layer using the first ceramic paste;
Forming a first coil conductor constituting a coil on the first ceramic green layer;
Forming a second ceramic green layer on the first ceramic green layer using the second ceramic paste;
Forming a second coil conductor constituting the coil on the second ceramic green layer;
Firing the laminate including the first ceramic green layer and the second ceramic green layer to eliminate the disappearing member;
Having
A method of manufacturing an electronic component characterized by

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