WO2012124561A1

WO2012124561A1 - Electronic part

Info

Publication number: WO2012124561A1
Application number: PCT/JP2012/055786
Authority: WO
Inventors: 喜人大坪
Original assignee: 株式会社村田製作所
Priority date: 2011-03-16
Filing date: 2012-03-07
Publication date: 2012-09-20
Also published as: JPWO2012124561A1; JP5445884B2

Abstract

Provided is an electronic part, wherein reliability of electrical connections between side face conductors and main-face conductors can be improved without forming a cover layer. The electronic part is provided with: (a) a main body (12) comprising a plurality of insulation layers (12p-12w) laminated together; (b) main-face conductors (16a/16b) formed on at least one main face (12a/12b) at one side in the laminating direction of the main body (12); (c) side face conductors (14) that penetrate insulation layers (12q-12v), that are exposed at the outer circumference end faces of the insulation layers (12q-12v), and that are formed continuously so as to reach insulation layers (12p, 12w) on which the main-face conductors (16a, 16b) are formed; and (d) outermost conductors (14a, 14b) that penetrate the insulation layers (12p, 12w) on which the main-face conductors (16a, 16b) are formed, and at least portions of which are arranged more to the inner side of the main body (12) than the side face conductors (14), when viewed from the laminating direction. The main-face conductors (16a, 16b) and the side face conductors (14) are electrically connected with the outermost conductors (14a, 14b) interposed therebetween.

Description

Electronic components

The present invention relates to an electronic component, and more particularly to an electronic component including a main body on which an insulating layer is laminated.

Provided is an electronic component comprising a main body with an insulating layer laminated, a side conductor formed on a side surface of the main body, and a main surface conductor formed on the main surface of the main body, and the side conductor and the main surface conductor are connected. ing.

For example, in the multilayer inductor 11 shown in the perspective view of FIG. 10, the side conductor 15A is formed on the side surface of the main body 16 on which the insulating layers are laminated, and the main surface conductors 13a to 13g are formed on the main surface of the main body 16. Side conductor 15A and main surface conductors 13a to 13g are spirally connected to form spiral coil L. A cover layer 17 is formed on the main body 16, and the side conductor 15A and the main surface conductors 13a to 13g are covered with the cover layer 17 so as not to be exposed to the outside (see, for example, Patent Document 1).

JP 2003-59722 A

覆う Covering the side conductor and the main surface conductor with a coating layer improves the reliability of the connection between the side conductor and the main surface conductor.

However, the coating layer needs to be formed by an appropriate method by selecting a material in consideration of the influence on the adhesion and the characteristics of the electronic component. For this reason, the coating layer cannot be easily formed, and a process for forming the coating layer needs to be added, resulting in an increase in cost.

In view of such circumstances, the present invention is intended to provide an electronic component that can improve the reliability of electrical connection between a side conductor and a main conductor without forming a coating layer.

In order to solve the above problems, the present invention provides an electronic component configured as follows.

The electronic component includes: (a) a main body including a plurality of insulating layers stacked on each other; (b) a main surface conductor formed on the main surface of the main body on at least one side in the stacking direction in which the insulating layers are stacked; (C) side conductors that pass through the insulating layers adjacent to each other, are exposed at the outer peripheral end surface of the insulating layer, and are continuously formed so as to reach the insulating layer on which the main surface conductor is formed; ) The outermost layer that penetrates through the insulating layer on which the main surface conductor is formed and at least a part of the outermost conductor is disposed on the inner side of the main body than the side conductor when viewed from the stacking direction in which the insulating layer is stacked. A conductor. The main surface conductor and the side surface conductor are electrically connected via the outermost conductor.

In the above configuration, the main surface conductor and the outermost conductor include portions that are connected to each other inside the main body rather than the side conductors when viewed from the stacking direction. Compared to the case where the conductors are connected to each other only in the region where the side conductors overlap, they are connected more reliably.

According to the above configuration, the main surface conductor and the outermost conductor are connected by providing the portion where the main surface conductor and the outermost conductor are connected at a position away from the corner where the side surface of the main body and the main surface intersect. Can be made difficult to be disconnected. Thereby, the reliability of the electrical connection between the side conductor and the main conductor is improved.

In a preferred aspect, all of the outermost conductors are arranged inside the main body rather than the side conductors when viewed from the lamination direction of the insulating layer. A wiring conductor that electrically connects the outermost conductor and the side conductor is formed between the insulating layer on which the main surface conductor is formed and the insulating layer adjacent to the insulating layer.

In this case, the main surface conductor and the side surface conductor are electrically connected via the outermost conductor and the wiring conductor. The main surface conductor is connected to the outermost conductor formed away from the vicinity of the corner of the main body. Compared with the case where the main surface conductor is connected in the vicinity of the corner of the main body, it is possible to prevent the connecting portion with the outermost conductor from being rubbed and worn or peeled off from the main body. Therefore, the reliability of electrical connection between the main surface conductor and the side surface conductor is further improved.

In another preferable aspect, the outermost conductor is exposed on an outer peripheral end face of the insulating layer on which the main surface conductor is formed. The outermost conductor overlaps the side conductor and protrudes outside the side conductor when viewed from the stacking direction.

In this case, the outermost conductor and the side conductor can be connected without using the wiring conductor that connects the outermost conductor and the side conductor, and the configuration can be simplified.

In the other aspect described above, preferably, when viewed from the stacking direction, the main surface conductor and the outermost conductor have a shape obtained by dividing circles having different diameters arranged concentrically.

In this case, an electronic component can be manufactured by forming concentric and different diameter through holes in the insulating layer through which the outermost conductor penetrates and the insulating layer through which the side conductor penetrates, thereby simplifying the configuration. .

Preferably, the insulating layer through which the side conductor and the outermost conductor penetrate includes a magnetic ceramic material.

In this case, an electronic component including an inductor element can be formed.

In a preferred aspect, the electronic component is an inductor element in which a coil conductor is formed by the main surface conductor, the side surface conductor, and the outermost conductor that are electrically connected to each other.

According to the present invention, the reliability of electrical connection between the side conductor and the main conductor can be improved without forming a coating layer.

It is the schematic which shows the external appearance of an electronic component. Example 1 It is principal part sectional drawing of an electronic component. Example 1 It is the schematic which shows the external appearance of an electronic component. (Modification) It is a disassembled perspective view of an electronic component. (Modification) It is the schematic which shows the external appearance of an electronic component. (Example 2) It is principal part sectional drawing of an electronic component. (Example 2) It is the schematic which shows the external appearance of an electronic component. (Comparative example) It is principal part sectional drawing of an electronic component. (Comparative example) It is principal part sectional drawing of an electronic component. (Comparative example) It is a perspective view of an electronic component. (Conventional example)

Hereinafter, embodiments of the present invention will be described with reference to FIGS.

Example 1 An electronic component 10 of Example 1 will be described with reference to FIGS. 1 and 2.

FIG. 1 is a schematic view showing the external appearance of the electronic component 10. FIG. 2 is a cross-sectional view of a principal part taken along line AA in FIG.

As shown in FIGS. 1 and 2, in the electronic component 10,

main surface conductors

16a and 16b are formed on the

main surfaces

12a and 12b of the main body 12 on which the insulating layers 12p to 12w are laminated.

The side conductors 14 (side surfaces) that pass through the insulating layers 12q to 12v and are exposed to the outer peripheral end surfaces of the insulating layers 12q to 12v, that is, the pair of

side surfaces

12c and 12d that face each other, are adjacent to the adjacent insulating layers 12q to 12v. Only the 12c side is shown). The side conductors 14 are continuously formed so as to reach the

insulating layers

12p and 12w where the

main surface conductors

16a and 16b are formed.

Outer conductors

14a and 14b penetrating through the

insulating layers

12p and 12w are formed on the insulating

layers

12p and 12w on which the

main surface conductors

16a and 16b are formed. The

outermost conductors

14a and 14b are formed so that all of the

outermost conductors

14a and 14b are more than the side conductors 14 when viewed from the stacking direction of the insulating layers 12p to 12w (vertical direction in FIGS. 1 and 2). It is formed so that it may be arranged inside.

Out of the main surfaces of the

insulating layers

12p and 12w on which the

main surface conductors

16a and 16b are formed, the outermost conductors along the main surface opposite to the

main surfaces

12a and 12b on which the

main surface conductors

16a and 16b are formed. Wiring

conductors

15a and 15b that electrically connect 14a and 14b and the side conductors 14 are formed.

The electronic component 10 is a module component including an LC filter, for example. In this case, the

main surface conductors

16a and 16b, the

outermost conductors

14a and 14b, the

wiring conductors

15a and 15b, and the side conductors 14 are spirally connected to form an inductor element. The insulating layers 12p to 12w include a magnetic ceramic material.

In the electronic component 10, a connection electrode 16 s for mounting another electronic component on the electronic component 10 may be formed on a part of the main surface conductor 16 a of the one main surface 12 a of the main body 12. Moreover, you may form the external electrode not shown for mounting the electronic component 10 on a circuit board etc. by a part of main surface conductor 16b of the other main surface 12b of the main body 12. FIG.

The side conductor 14 and the

main conductors

16a and 16b are electrically connected via the

wiring conductors

15a and 15b and the

outermost conductors

14a and 14b. The

main surface conductors

16a, 16b and the

outermost conductors

14a, 14b are connected at positions away from

corners

12m, 12n, 12i, 12j where the side surfaces 12c, 12d of the main body 12 and the

main surfaces

12a, 12b intersect. . As a result, it is possible to suppress disconnection of the connection between the

main surface conductors

16a and 16b and the

outermost conductors

14a and 14b. Therefore, the reliability of the electrical connection between the side surface conductor 14 and the

main surface conductors

16a and 16b is improved. improves.

The electronic component 10 can be produced by, for example, laminating ceramic green sheets, dividing them, and firing them.

That is, by forming a through hole in the ceramic green sheet and filling the through hole with a conductive paste, via hole conductors that become the side conductors 14 and the

outermost conductors

14a and 14b are formed. Further, a conductive paste is applied to the front or back surface of the ceramic green sheet by screen printing or the like to form in-plane conductor patterns that become the

main surface conductors

16a and 16b and the

wiring conductors

15a and 15b.

Next, ceramic green sheets are laminated and pressure-bonded to form a laminated body, and the laminated body is cut so as to divide the via-hole conductor that becomes the side conductor, and is divided into pieces.

Next, the individual pieces are baked, and if necessary, the surface of the portions that become the side conductors 14 and the

main conductors

16a and 16b is plated.

In addition, according to the configuration of the first embodiment, an electronic component including only an inductor element may be manufactured instead of the module component.

Also, in the configuration of the first embodiment, an insulating layer may be a dielectric ceramic layer to produce a dielectric ceramic element or module component.

<Modification> An electronic component 10k of a modification including only an inductor element, that is, an electronic component 10k that is an inductor element will be described with reference to FIGS.

FIG. 3 is a schematic view showing the external appearance of the electronic component 10k. FIG. 4 is an exploded perspective view of the electronic component 10k.

In the electronic component 10k, main surface conductors 16g to 16j and 16u to 16w are formed on the

main surfaces

12a and 12b of the main body 12 on which the insulating layers 12p to 12w are laminated, as shown in FIGS. The insulating layers 12p to 12w are formed using a magnetic ceramic material.

As shown in FIG. 4, the electronic component 10k includes main surface conductors 16g to 16j, 16u to 16w, outermost conductors 24g to 24i, 24u to 24w; 25g to 25i, 25u to 25w, wiring conductors 26g to 26i, 26u to 26w; 27g to 27i, 27u to 27w, and side conductors 14g to 14i, 14u to 14w are formed by laminating and firing insulating layers 12p to 12w in which portions are formed in advance.

Specifically, the insulating

layers

12p and 12w at both ends in the stacking direction (vertical direction in FIG. 4) are formed by forming main surface conductors 16g to 16j and 16u to 16w on the main surfaces that become the

main surfaces

12a and 12b of the main body 12. Outer conductors 24g-24i, 24u-24w; 25g-25i, 25u-25w penetrating the

layers

12p, 12w are formed.

Side conductors 14g to 14i and 14u to 14w are formed along the outer peripheral end surfaces of the insulating layers 12q to 12v which are arranged between the insulating

layers

12p and 12w at both ends in the stacking direction and are adjacent to each other. The side conductors 14g to 14i; 14u to 14w are connected to each other in the stacking direction and reach the insulating

layers

12p and 12w at both ends in the stacking direction. As shown in FIG. 3, the side conductors 14 g to 14 i are exposed on one side 12 c of the main body 12. Although not shown in FIG. 3, the side conductors 14u to 14w are also exposed on the other side surface 12d of the main body 12 in the same manner.

As shown in FIG. 4, the insulating

layers

12q and 12v adjacent to the insulating

layers

12p and 12w at both ends in the stacking direction have wiring conductors 26g to 26i, 26u to 26w; 27g on the main surface facing the insulating

layers

12p and 12w. To 27i and 27u to 27w are formed. The wiring conductors 26g-26i, 26u-26w; 27g-27i, 27u-27w are outermost conductors 24g-24i, 24u-24w; 25g-25i, 25u-25w formed on the insulating

layers

12p, 12w at both ends in the stacking direction. Connected to.

Main surface conductors 16g-16j, 16p-16r, outermost conductors 24g-24i, 24u-24w; 25g-25i, 25u-25w and side conductors 14g-14i, 14u-14w are electrically connected to each other. Forming a coil conductor.

That is, as shown in FIG. 3 and FIG. 4, the outermost conductor 24g, the wiring conductor 26g, the side conductor 14g, the wiring conductor 27g, the outermost conductor in order from the leftmost main surface conductor 16g on one main surface 12a of the main body 12. Conductor 25g, main surface conductor 16u, outermost conductor 25u, wiring conductor 27u, side conductor 14u, wiring conductor 26u, outermost conductor 24u, main surface conductor 16h, outermost conductor 24h, wiring conductor 26h, side conductor 14h, wiring conductor 27h, outermost conductor 25h, main surface conductor 16v, outermost conductor 25v, wiring conductor 27v, side conductor 14v, wiring conductor 26v, outermost conductor 24v, main surface conductor 16i, outermost conductor 24i, wiring conductor 26i, side conductor 14i, wiring conductor 27i, outermost conductor 25i, main surface conductor 16w, outermost conductor 25w, wiring conductor 27w, side conductor 14w, wiring conductor 26w, outermost conductor 24w Te, to the rightmost side of the main surface conductor 16j in one main surface 12a of the body 12, is connected to the spiral coil conductors are formed.

The main surface conductors 16g to 16j, 16u to 16w and the outermost conductors 24g to 24i, 24u to 24w; 25g to 25i, 25u to 25w are corners where the side surfaces 12c and 12d of the main body 12 intersect with the

main surfaces

12a and 12b. They are connected at positions away from 12m, 12n, 12i, and 12j. Accordingly, it is possible to suppress disconnection of the connection between the main surface conductors 16g to 16j and 16u to 16w and the outermost conductors 24g to 24i and 24u to 24w; 25g to 25i and 25u to 25w. The reliability of the electrical connection between ˜14i and 14u to 14w and the main surface conductors 16g to 16j and 16u to 16w is improved.

The electronic component 10k can be mounted on the mounting substrate by using the

wide portions

16p and 16q of the

main surface conductors

16g and 16j formed on the one main surface 10a of the electronic component 10k as connection electrodes.

Of course, similarly to a general laminated chip coil,

end electrodes

12e and 12f (see FIG. 3) of the main body 12 and external electrodes covering the vicinity thereof are formed on both ends of the main body 12, and the external electrodes are formed on both ends of the coil conductor. The

principal surface conductors

16g and 16j may be connected.

Example 2 An electronic component 10a of Example 1 will be described with reference to FIGS.

FIG. 5 is a schematic view showing the appearance of the electronic component 10a. FIG. 6 is a cross-sectional view of a principal part taken along line AA in FIG.

As shown in FIGS. 5 and 6, the electronic component 10a is configured in substantially the same manner as the electronic component 10 of the first embodiment. Below, the same code | symbol is used for the component similar to Example 1, and it demonstrates centering around difference.

In the electronic component 10a, the main surface conductor 16c is formed only on one main surface 12a of the main body 12 on which the insulating layers 12p to 12w are laminated. The outermost conductor 14c formed on the insulating layer 12p on which the main surface conductor 16c is formed is exposed on the outer peripheral end surface (that is, the side surface 12c of the main body 12) of the insulating layer 12p on which the main surface conductor 16c is formed, and When viewed from the stacking direction, it overlaps the side conductor 14k and protrudes outside the side conductor 14k.

For example, when viewed from the stacking direction, the outermost conductor 14c and the side conductor 14k have a substantially semicircular shape obtained by dividing circles having different diameters arranged concentrically, and the outer diameter of the outermost conductor 14c is the side conductor. It is larger than the outer diameter of 14k.

The side conductor 14k is continuously formed on the insulating layers 12p to 12t between the insulating layer 12q adjacent to the insulating layer 12p on which the main surface conductor 16c is formed and the insulating layer 12t at the intermediate position in the main body 12. Yes. One end 14p of the side conductor 14k is connected to the outermost conductor 14c. The other end 14q of the side conductor 14k is connected to a wiring conductor 15c formed between the insulating

layers

12t and 12u at an intermediate position in the main body 12.

The side conductor 14k and the main conductor 16c are electrically connected via the outermost conductor 14c. The main surface conductor 16c and the outermost conductor 14c are connected to each other at a position inside the main body 12 relative to the side surface conductor 14k when viewed from the stacking direction. Thus, by providing a portion where the main surface conductor 16c and the outermost conductor 15c are connected at a position away from the corner 12m where the side surface 12c of the main body 12 and the main surface 12a intersect, the main surface conductor 16c and the outermost conductor 16c are provided. It is possible to make it difficult to disconnect the connection with the outer conductor 14c. This improves the reliability of electrical connection between the side conductors 14k and the main conductor 16c.

Since the outermost conductor 14c and the side conductor 14k are connected without a wiring conductor connecting the outermost conductor 14c and the side conductor 14k, the configuration of the electronic component 10a is simplified.

<Comparative Example> An electronic component 10x of a comparative example will be described with reference to FIGS.

FIG. 7 is a schematic diagram showing the external appearance of the electronic component 10x. 8 and 9 are cross-sectional views of the main part taken along line AA in FIG.

7 and 8, in the electronic component 10x, side conductors 14x are formed on all the insulating layers of the main body 12.

Ends

16p and 16q of

main surface conductors

16x and 16y formed on

main surfaces

12a and 12b of the main body 12 are connected to both

ends

14y and 14z of the side conductor 14x. That is, the

end portions

16p and 16q of the

main surface conductors

16x and 16y are formed so as to reach the

corner portions

12m and 12n of the main body 12, and are connected to the side conductors 14x in the vicinity of the

corner portions

12m and 12n of the main body 12. .

The

end portions

16p and 16q of the

main surface conductors

16x and 16y are formed in the vicinity of the

corner portions

12m and 12n of the main body 12. The vicinity of the

corner portions

12m and 12n of the main body 12 is the portion that is most easily rubbed before the electronic component 10x is mounted on the circuit board. Therefore, the main body 12 is thinned or peeled off, and ends of the

main surface conductors

16x and 16y. The

parts

16p and 16q are easily disconnected as schematically shown in FIG.

On the other hand, if the part to which the main surface conductor is connected is away from the vicinity of the corner of the main body as in Example 1 and Example 2, it is difficult to disconnect.

<Summary> As described above, the main surface conductor and the outermost conductor are configured so as to include a portion connected to each other inside the main body rather than the side surface conductor when viewed from the stacking direction. The reliability of the electrical connection between the side conductor and the main conductor can be improved without forming a layer.

It should be noted that the present invention is not limited to the above embodiment, and can be implemented with various modifications.

For example, the insulating layer of the main body is not limited to ceramic but may be formed of resin or the like.

10, 10a, 10k, 10x Electronic component 12

Main body

12a,

12b Main surface

12c,

12d Side surface

12e, 12f

End surface

12m, 12n Corner portion 12p-12w Insulating layer 14

Side surface conductors

14a, 14b, 14c Outermost conductors 14g-14i, 14k , 14u to 14w,

14x Side conductors

15a, 15b,

15c Wiring conductors

16a, 16b, 16c, 16g to 16j, 16u to 16w, 16x, 16y Main surface conductors 24g to 24i, 24u to 24w Outermost conductors 25g to 25i, 25u ~ 25w Outermost conductor 26g ~ 26i, 26u ~ 26w Wiring conductor 27g ~ 27i, 27u ~ 27w Wiring conductor

Claims

A body including a plurality of insulating layers stacked on each other;
A main surface conductor formed on the main surface of the main body on at least one side in the stacking direction in which the insulating layers are stacked;
Side conductors that pass through the insulating layers adjacent to each other, are exposed at the outer peripheral end surface of the insulating layer, and are continuously formed so as to reach the insulating layer on which the main surface conductor is formed,
The outermost conductor that penetrates the insulating layer on which the main surface conductor is formed and that is at least partially disposed on the inner side of the main body than the side conductor when viewed from the stacking direction in which the insulating layer is stacked When,
With
The electronic component, wherein the main surface conductor and the side surface conductor are electrically connected via the outermost conductor.
All of the outermost conductor is disposed inside the main body rather than the side conductor when viewed from the stacking direction of the insulating layer,
A wiring conductor that electrically connects the outermost conductor and the side conductor is formed between the insulating layer on which the main surface conductor is formed and the insulating layer adjacent to the insulating layer. The electronic component according to claim 1, wherein:
The outermost conductor is exposed on an outer peripheral end surface of the insulating layer on which the main surface conductor is formed, and overlaps with the side conductor and protrudes outside the side conductor when viewed from the stacking direction. The electronic component according to claim 1, wherein the electronic component is characterized.
4. The electronic component according to claim 3, wherein the main surface conductor and the outermost conductor have a shape obtained by dividing a concentrically arranged circle having different outer diameters when viewed from the stacking direction. .
The electronic component according to any one of claims 1 to 4, wherein the insulating layer through which the side conductor and the outermost conductor penetrate includes a magnetic ceramic material.
The electronic component according to claim 5, wherein the electronic component is an inductor element in which a coil conductor is formed by the main surface conductor, the side surface conductor, and the outermost conductor electrically connected to each other.