WO2014115433A1 - Coil component and electronic device - Google Patents

Coil component and electronic device Download PDF

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Publication number
WO2014115433A1
WO2014115433A1 PCT/JP2013/082927 JP2013082927W WO2014115433A1 WO 2014115433 A1 WO2014115433 A1 WO 2014115433A1 JP 2013082927 W JP2013082927 W JP 2013082927W WO 2014115433 A1 WO2014115433 A1 WO 2014115433A1
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WO
WIPO (PCT)
Prior art keywords
coil
conductor
coil component
sheet
main surface
Prior art date
Application number
PCT/JP2013/082927
Other languages
French (fr)
Japanese (ja)
Inventor
用水邦明
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN201390000873.1U priority Critical patent/CN204808996U/en
Publication of WO2014115433A1 publication Critical patent/WO2014115433A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices

Definitions

  • the present invention relates to a coil component configured by providing a coil conductor pattern inside a substrate and an electronic device to which the coil component is attached.
  • Some coil parts are configured by providing a coil conductor pattern between layers of a resin multilayer substrate (see Patent Document 1).
  • a coil component is formed by etching a metal film on a resin sheet having a metal film affixed on one side to form a coil conductor pattern, and laminating a plurality of sheets and thermocompression bonding. Can be manufactured.
  • one main surface attached to the sheet is a rough surface having a large surface roughness and the other main surface is a smooth surface having a small surface roughness.
  • the bonding strength of the metal film to the sheet is high.
  • an object of the present invention is to provide a coil component that can prevent loss of current flowing through the coil conductor pattern and has excellent high-frequency characteristics, and an electronic device to which the coil component is attached.
  • the coil component of the present invention is a laminated body having a configuration in which an insulating layer and a wiring layer are laminated, and a coil shape having the lamination direction of the laminated body as an axis, and at least one provided in the wiring layer
  • the surface roughness of the interface closest to the planar conductor is smaller than the average surface roughness of all the interfaces.
  • the surface roughness of the interface closest to the planar conductor is smaller than the average surface roughness of all the interfaces.
  • the laminate is formed by laminating a plurality of sheets including a sheet to which a metal film is bonded, the coil conductor pattern is formed by patterning the metal film, It is preferable that the surface roughness of the interface bonded to the sheet is larger than the interface opposite to the interface bonded to the sheet.
  • one of the two interfaces of the metal film is a rough surface and the other interface is a smooth surface. Since the metal film is bonded to the sheet on the rough surface side, the bonding strength of the metal film in the sheet bonded with the metal film is improved.
  • the planar conductor may be a conductor connected to the ground.
  • a mounting electrode may be formed on a main surface of the multilayer body that is close to the planar conductor.
  • the electronic device of the present invention may include the above-described coil component and an object on which the coil component is disposed, and the object may include the planar conductor.
  • the surface roughness of the interface closest to the planar conductor is smaller than the average surface roughness of all the interfaces. To do. That is, since the interface closest to the planar conductor among all the interfaces parallel to the planar conductor of the coil conductor pattern is configured as a smooth surface, loss of current flowing through the coil conductor pattern can be reduced, and good high frequency The characteristics can be realized.
  • first main surface (Z1) the surface of the coil component that faces the external substrate
  • second main surface (Z2) the surface opposite to the first main surface (Z1) of the coil component
  • FIG. 1A is a perspective view of the coil component 1 according to the first embodiment, showing a state in which the coil component 1 is arranged with the first main surface (Z1) side facing up.
  • the coil component 1 includes a laminated body 2 and a pattern coil 3.
  • the laminate 2 is a hexahedron, and is made of a highly thermoplastic resin such as a liquid crystal polymer, another thermoplastic resin, a low-temperature sintered ceramic, or the like.
  • mounting electrodes 31A and 31B are formed on the first main surface (Z1), and the coil component 1 has a surface mounting type configuration.
  • the pattern coil 3 is configured as a laminated coil and is provided inside the laminated body 2.
  • FIG. 1 (B) is an exploded perspective view of the coil component 1 and shows a state where the coil component 1 is arranged with the first main surface (Z1) side facing up.
  • the laminate 2 includes sheets 11, 12, 13, 14, and 15.
  • the laminate 2 is configured by laminating sheets 11 to 15 in order from the first main surface (Z1) to the second main surface (Z2).
  • the sheet 11 includes an insulating layer 21, a wiring layer 31, and a via-hole conductor 41.
  • the insulating layer 21 is made of an insulator such as resin, and has an outer shape that is rectangular when viewed in plan from the stacking direction.
  • the wiring layer 31 is stacked on the first main surface (Z1) side of the insulating layer 21.
  • the via-hole conductor 41 penetrates the insulating layer 21 in the stacking direction.
  • mounting electrodes 31A and 31B are provided on the wiring layer 31, mounting electrodes 31A and 31B are provided. The mounting electrodes 31A and 31B are connected to electrodes on an external substrate (not shown).
  • the sheet 12 includes an insulating layer 22, a wiring layer 32, and a via hole conductor 42.
  • the insulating layer 22 is made of an insulator such as a resin, and has a rectangular outer shape in plan view from the stacking direction.
  • the wiring layer 32 is stacked on the first main surface (Z1) side of the insulating layer 22.
  • the via-hole conductor 42 penetrates the insulating layer 22 in the stacking direction.
  • the sheet 13 includes an insulating layer 23, a wiring layer 33, and a via-hole conductor 43.
  • the insulating layer 23 is made of an insulator such as resin, and has a rectangular outer shape in plan view from the stacking direction.
  • the wiring layer 33 is stacked on the first main surface (Z1) side of the insulating layer 23.
  • the via-hole conductor 43 penetrates the insulating layer 23 in the stacking direction.
  • the sheet 14 includes an insulating layer 24, a wiring layer 34, and a via hole conductor 44.
  • the insulating layer 24 is made of an insulator such as resin, and has an outer shape that is rectangular when viewed in plan from the stacking direction.
  • the wiring layer 34 is stacked on the first main surface (Z1) side of the insulating layer 24.
  • the via-hole conductor 44 penetrates the insulating layer 24 in the stacking direction.
  • the sheet 15 includes an insulating layer 25 and a wiring layer 35.
  • the insulating layer 25 is made of an insulator such as a resin, and has a rectangular outer shape in plan view from the stacking direction.
  • the wiring layer 35 is stacked on the first main surface (Z1) side of the insulating layer 25.
  • the pattern coil 3 includes a coil conductor 33A, a coil conductor 34A, and a coil conductor 35A, and has an inductance.
  • the coil conductor 33 ⁇ / b> A is provided in the wiring layer 33 of the sheet 13 and extends so as to rotate along the outer edge of the sheet 13.
  • the coil conductor 34 ⁇ / b> A is provided in the wiring layer 34 of the sheet 14 and extends so as to rotate along the outer edge of the sheet 14.
  • the coil conductor 35 ⁇ / b> A is provided in the wiring layer 35 of the sheet 15 and extends so as to rotate along the outer edge of the sheet 15.
  • the coil conductor 33 ⁇ / b> A, the coil conductor 34 ⁇ / b> A, and the coil conductor 35 ⁇ / b> A are connected via via-hole conductors 43 and 44 so as to have a coil shape with the stacking direction of the multilayer body 2 as an axis.
  • the coil conductor 33 ⁇ / b> A, the coil conductor 34 ⁇ / b> A, and the coil conductor 35 ⁇ / b> A are provided so as to overlap each other in a loop shape when viewed from the stacking direction of the multilayer body 2.
  • the coil conductor 33A of the pattern coil 3 is connected to the mounting electrode 31A of the sheet 11 via the via-hole conductors 41 and 42.
  • connection conductor 32 ⁇ / b> A is provided on the wiring layer 32 of the sheet 12.
  • a connection conductor 35 ⁇ / b> B is provided on the wiring layer 35 of the sheet 15.
  • the connection conductors 32A, 35B are connected via via-hole conductors 42, 43, 44.
  • the connection conductor 32A is connected to the mounting electrode 31B of the sheet 11 via the via-hole conductor 41.
  • the connection conductor 35B is connected to the coil conductor 35A of the pattern coil 3. Therefore, the mounting electrode 31B and the pattern coil 3 are connected via the connection conductors 32A and 35B.
  • the coil component 1 has a surface mount type (LGA type) configuration in which the mounting electrodes 31A and 31B are provided on the first main surface (Z1) of the multilayer body 2. Therefore, the area occupied by the external substrate for mounting the coil component 1 is as small as the area of the coil component 1. Further, when a shield case is provided so as to cover the coil component 1, even if there is not enough clearance between the coil component 1 and the shield case, a short circuit occurs in the mounting electrodes 31A and 31B due to contact with the shield case. There is no.
  • LGA type surface mount type
  • FIG. 2 is a side cross-sectional view for explaining an example of the manufacturing method of the coil component 1 and shows a state in which the respective parts are arranged with the surface on the second main surface (Z2) side facing up.
  • the coil component 1 is manufactured by providing a large number of parts to be the coil components 1 on a large sheet, forming the plurality of coil components 1 at a time, and then cutting out each coil component 1.
  • sheets 11 to 15 are prepared in the first step shown in FIG.
  • Each of the sheets 11 to 15 includes the insulating layers 21 to 25 and the wiring layers 31 to 35 as described above.
  • the wiring layers 31 to 35 are in the state of a metal film such as a copper foil that is previously attached to the entire surface of one side of the insulating layers 21 to 25.
  • the interfaces of the wiring layers 31 to 35 configured as metal films are configured as a smooth surface 30A and a rough surface 30B.
  • the smooth surface 30A is a surface having a surface roughness of about 1 ⁇ m, for example.
  • the rough surface 30B is a surface having a surface roughness of about 3 to 5 ⁇ m, for example.
  • As the surface roughness the arithmetic average roughness defined by [JIS B 0601-2001] is adopted.
  • the wiring layers 31 to 35 are bonded to the insulating layers 21 to 25 through the rough surface 30B, respectively. As a result, the wiring layers 31 to 35 and the insulating layers 21 to 25 are bonded with stronger bonding strength than when the wiring layers 31 to 25 are bonded via the smooth surface 30A.
  • the metal films constituting the wiring layers 31 to 35 of the sheets 11 to 15 are patterned by etching or the like.
  • the mounting electrodes 31A and 31B, the coil conductors 33A to 35A, and the connection conductors 32A and 35B are formed.
  • a metal film is not penetrated through the insulating layers 21 to 25 of the sheets 11 to 14 by a laser or the like but a through hole is formed through the insulating layer, and then a conductive material such as a conductive paste is provided inside the through hole.
  • the via-hole conductors 41 to 44 are formed.
  • the sheets 11 to 15 are overlapped with the wiring layers 31 to 35 facing the first main surface (Z1) side. That is, the sheets 11 to 15 are overlapped with the smooth surfaces 30A of the wiring layers 31 to 35 facing the first main surface (Z1). Then, the sheets 11 to 15 are thermocompression bonded, and thereby the sheets 11 to 15 are joined to each other. In this way, as shown in FIG. 2C, the coil component 1 in which the pattern coil 3 is provided in the laminated body 2 is manufactured.
  • the external substrate 9 is a printed wiring board and includes a built-in ground electrode 91 and a component mounting electrode 92.
  • the external substrate 9 corresponds to an object in the electronic device described in the claims.
  • the component mounting electrode 92 is formed on the component mounting surface of the external substrate 9.
  • the built-in ground electrode 91 is formed inside the external substrate 9 so as to be parallel to the component mounting surface of the external substrate 9, and corresponds to the planar conductor described in the claims.
  • the coil component 1 is mounted on the external substrate 9 by bonding the mounting electrodes 31 ⁇ / b> A and 31 ⁇ / b> B to the component mounting electrode 92 of the external substrate 9 via the solder 93.
  • the pattern coil 3 of the coil component 1 faces the built-in ground electrode 91.
  • the coil conductors 33A to 35A each have the smooth surface 30A facing the external substrate 9 side.
  • the surface roughness of the interface on the first main surface (Z1) side of the coil conductor 33A closest in parallel to the built-in ground electrode 91 is the surface roughness of all the interfaces parallel to the built-in ground electrode 91 of the coil conductors 33A to 35A. It becomes smaller than the average of the surface roughness.
  • the [average surface roughness of all interfaces parallel to the built-in ground electrode 91 of the coil conductors 33A to 35A] can be determined as follows, for example. That is, the arithmetic mean roughness of the first principal surface (Z1) side surfaces of the coil conductors 33A to 35A is Ra11, Ra21, Ra31, and the arithmetic average of the surfaces of the coil conductors 33A to 35A on the second principal surface (Z2) side.
  • the roughness is Ra12, Ra22, Ra32, the areas of the coil conductors 33A to 35A are A1, A2, and A3, and [average surface roughness of all interfaces parallel to the built-in ground electrode 91 of the coil conductors 33A to 35A] If Ra ′, it is expressed by the following equation.
  • Ra ′ (Ra11 ⁇ A1 + Ra12 ⁇ A1 + Ra21 ⁇ A2 + Ra22 ⁇ A2 + Ra31 ⁇ A3 + Ra32 ⁇ A3) / (A1 + A1 + A2 + A2 + A3 + A3) Therefore, the [surface roughness of the interface on the first main surface (Z1) side of the coil conductor 33A closest to the built-in ground electrode 91 in parallel] is [all of the surface parallel to the built-in ground electrode 91 of the coil conductors 33A to 35A]. Smaller than the average of the surface roughness of the interface] means that the following equation holds.
  • the coil conductors 33A to 35A, the mounting electrodes 31A and 31B, and the connection conductors 32A and 35B all have a smooth surface 30A on the external substrate 9, that is, on the first main surface (Z1) side.
  • the other electrode of the coil conductor 33A for example, one or both of the coil conductor 34A and the coil conductor 35A may be configured such that the rough surface 30B faces the external substrate 9 side.
  • the mounting electrodes 31A and 31B and the connection conductors 32A and 35B may be configured such that the rough surface 30B faces the external substrate 9 side.
  • the surface facing the second main surface (Z2) side of the coil conductor 33A is configured as the rough surface 30B, but is the same as the surface facing the first main surface (Z1) side of the coil conductor 33A.
  • the surface facing the second main surface (Z2) may also be configured as the smooth surface 30A.
  • FIG. 3A is a plan view of the coil component 51 according to the second embodiment as viewed from the first main surface (Z1) side.
  • FIG. 3B is a side sectional view of the coil component 51 mounted on the external substrate.
  • the coil component 51 includes a laminated body 52 and a pattern coil 53.
  • the pattern coil 53 is provided as a planar coil and is provided inside the stacked body 52.
  • the laminate 52 includes an insulating layer 71, a wiring layer 81, and a resist layer 72.
  • the insulating layer 71 is made of an insulator such as a resin, and has a rectangular outer shape in plan view from the stacking direction.
  • the wiring layer 81 is stacked on the first main surface (Z1) side.
  • the resist layer 72 is laminated on the first main surface (Z1) side of the insulating layer 71 and the wiring layer 81.
  • the pattern coil 53 is configured in the wiring layer 81 as a coil conductor extending in a spiral shape when viewed from the stacking direction of the stacked body 52, and has an inductance.
  • the aforementioned resist layer 72 is provided with openings at positions overlapping with both ends of the pattern coil 53 when viewed from the stacking direction of the stacked body 52, and the resist coil 72 has the pattern coil 53 on the first main surface (Z1) side. Both ends are exposed. Both ends of the pattern coil 53 exposed from the resist layer 72 to the first main surface (Z1) side are configured as mounting electrodes 81A and 81B.
  • the interface on the first main surface (Z1) side of the pattern coil 53 is configured as a smooth surface 80A.
  • the interface on the second main surface (Z2) side of the pattern coil 53 is configured as a rough surface 80B.
  • the smooth surface 80A is a surface having a surface roughness of about 1 ⁇ m, for example.
  • the rough surface 80B is a surface having a surface roughness of about 3 to 5 ⁇ m, for example.
  • As the surface roughness the arithmetic average roughness defined by [JIS B 0601-2001] is adopted.
  • the pattern coil 53 is bonded to the insulating layer 71 through the rough surface 80B. Thereby, the pattern coil 53 and the insulating layer 71 are joined with stronger joining strength than the case where they are joined via the smooth surface 80A.
  • the coil component 51 is mounted on the external substrate 9 and used as shown in FIG.
  • the external substrate 9 is a printed wiring board and includes a built-in ground electrode 91 and a component mounting electrode 92.
  • the external substrate 9 corresponds to the object described in the claims.
  • the component mounting electrode 92 is formed on the component mounting surface of the external substrate 9.
  • the built-in ground electrode 91 is formed inside the external substrate 9 so as to be parallel to the component mounting surface of the external substrate 9, and corresponds to the planar conductor described in the claims.
  • the coil component 51 is mounted on the external substrate 9 by bonding the mounting electrodes 81A and 81B to the component mounting electrode 92 of the external substrate 9 via the solder 93.
  • the pattern coil 53 of the coil component 51 faces the built-in ground electrode 91 and the smooth surface 80A faces the external substrate 9 side. Accordingly, the surface roughness of the interface on the first main surface (Z1) side of the pattern coil 53 is the surface roughness of both interfaces of the first main surface (Z1) side and the second main surface (Z2) side of the pattern coil 53. It is smaller than the average.
  • the pattern coil 53 of the coil component 51 is configured as a planar coil, the entire surface of the pattern coil 53 facing the built-in ground electrode 91 becomes the smooth surface 80A, and the conductor loss of the current flowing through the pattern coil 53 is small. Become. And the high frequency characteristic with few dispersion
  • FIG. 4A is a perspective view of the coil component 101 according to the third embodiment, showing a state in which the coil component 101 is arranged with the second main surface (Z2) facing upward.
  • the coil component 101 includes a laminated body 102 and a pattern coil 103.
  • the stacked body 102 is provided with mounting electrodes 136A and 136B so as to cover the outer surfaces near both ends in the direction orthogonal to the stacking direction, and the coil component 101 is configured as a chip type.
  • a marker 137 is provided on the second main surface (Z2) of the stacked body 102 so that the mounting direction can be determined.
  • the pattern coil 103 is configured as a laminated coil, and is provided inside the laminated body 102.
  • FIG. 4B is an exploded perspective view of the coil component 101.
  • the laminate 102 includes sheets 111, 112, 113, 114, and 115.
  • the laminate 102 is configured by laminating sheets 111 to 115 in order from the first main surface (Z1) to the second main surface (Z2).
  • the sheet 111 includes an insulating layer 121.
  • the insulating layer 121 is made of an insulator such as resin, and has an outer shape that is rectangular when viewed in plan from the stacking direction.
  • the sheet 112 includes an insulating layer 122, a wiring layer 132, and a via-hole conductor 142.
  • the insulating layer 122 is made of an insulator such as resin, and has a rectangular outer shape in plan view from the stacking direction.
  • the wiring layer 132 is stacked on the first main surface (Z1) side of the insulating layer 122.
  • the via-hole conductor 142 penetrates the insulating layer 122 in the stacking direction.
  • the sheet 113 includes an insulating layer 123, a wiring layer 133, and a via-hole conductor 143.
  • the insulating layer 123 is made of an insulator such as resin, and has a rectangular outer shape in plan view from the stacking direction.
  • the wiring layer 133 is stacked on the first main surface (Z1) side of the insulating layer 123.
  • the via-hole conductor 143 passes through the insulating layer 123 in the stacking direction.
  • the sheet 114 includes an insulating layer 124, a wiring layer 134, and a via hole conductor 144.
  • the insulating layer 124 is made of an insulator such as resin, and has a rectangular outer shape in plan view from the stacking direction.
  • the wiring layer 134 is stacked on the first main surface (Z1) side of the insulating layer 124.
  • the via-hole conductor 144 penetrates the insulating layer 124 in the stacking direction.
  • the sheet 115 includes an insulating layer 125 and a wiring layer 135.
  • the insulating layer 125 is made of an insulator such as resin, and has a rectangular outer shape in plan view from the stacking direction.
  • the wiring layer 135 is stacked on the first main surface (Z1) side of the insulating layer 125.
  • the pattern coil 103 includes a coil conductor 132A, a coil conductor 133A, and a coil conductor 134A, and has an inductance.
  • the coil conductor 132 ⁇ / b> A is provided in the wiring layer 132 of the sheet 112 and extends so as to rotate along the outer edge of the sheet 112.
  • the coil conductor 133 ⁇ / b> A is provided on the wiring layer 133 of the sheet 113 and extends so as to rotate along the outer edge of the sheet 113.
  • the coil conductor 134 ⁇ / b> A is provided in the wiring layer 134 of the sheet 114 and extends so as to rotate along the outer edge of the sheet 114.
  • the coil conductor 132 ⁇ / b> A, the coil conductor 133 ⁇ / b> A, and the coil conductor 134 ⁇ / b> A are connected via via-hole conductors 142 and 143 so as to have a coil shape with the stacking direction of the multilayer body 102 as an axis.
  • the coil conductor 132A, the coil conductor 133A, and the coil conductor 134A are provided so as to overlap each other in a loop shape when viewed from the stacking direction of the stacked body 102.
  • the coil conductor 132A is drawn out to the edge of the sheet 112 and connected to the mounting electrode 136A.
  • the coil conductor 134A is drawn to the sheet 115 via the via-hole conductor 144, and is drawn to the edge of the sheet 115 by the connection conductor 135A provided on the sheet 115 and connected to the mounting electrode 136B.
  • FIG. 4C is a side sectional view of the coil component 101 mounted on the external substrate 9.
  • the coil component 101 is used by being mounted on the external substrate 9.
  • the external substrate 9 is a printed wiring board and includes a built-in ground electrode 91 and a component mounting electrode 92.
  • the external substrate 9 corresponds to the object described in the claims.
  • the component mounting electrode 92 is formed on the component mounting surface of the external substrate 9.
  • the built-in ground electrode 91 is formed inside the external substrate 9 so as to be parallel to the component mounting surface of the external substrate 9, and corresponds to the planar conductor described in the claims.
  • the coil component 101 is mounted on the external substrate 9 by bonding the mounting electrodes 136A and 136B to the component mounting electrode 92 of the external substrate 9 via the solder 93.
  • the coil conductors 132A, 133A, 134A and the connection conductor 135A of the pattern coil 103 are configured such that the interface on the first main surface (Z1) side is a smooth surface 130A. Further, the coil conductors 132A, 133A, 134A and the connection conductor 135A of the pattern coil 103 are configured such that the interface on the second main surface (Z2) side is a rough surface 130B.
  • the smooth surface 130A is a surface having a surface roughness of about 1 ⁇ m, for example.
  • the rough surface 130B is a surface having a surface roughness of about 3 to 5 ⁇ m, for example.
  • the pattern coil 103 of the coil component 101 faces the built-in ground electrode 91, and the smooth surface 130A of the coil conductors 132A, 133A, 134A is the external substrate. It faces 9 side. Therefore, the surface roughness of the interface on the first main surface (Z1) side of the coil conductor 132A of the pattern coil 103 is smaller than the average of the surface roughness of all the interfaces of the pattern coil 103.
  • the pattern coil 103 of the coil component 101 is configured, even if the pattern coil 103 is opposed to the built-in ground electrode 91, the conductor loss of the current flowing through the pattern coil 103 is small and varies as the coil component 101. It is possible to realize excellent high-frequency characteristics with little.
  • the coil conductors 132A to 134A are all configured such that the smooth surface 130A faces the external substrate 9, but other electrodes such as the coil conductor 133A and the coil conductor One or both of the conductors 134A may be configured such that the rough surface 130B faces the external substrate 9 side.
  • the surface facing the second main surface (Z2) side of the coil conductor 132A is configured as the rough surface 130B, but is the same as the surface facing the first main surface (Z1) side of the coil conductor 132A.
  • the surface facing the second main surface (Z2) may be configured as the smooth surface 130A.
  • FIG. 5A is a perspective view of a coil component 151 according to the fourth embodiment
  • FIG. 5B is an exploded perspective view showing an enlarged main part of the coil component 151 according to the fourth embodiment.
  • FIG. Each figure shows a state in which the coil component 151 is arranged with the first main surface (Z1) facing upward.
  • the coil component 151 is configured as a flat cable.
  • the coil component 151 includes a laminated body 152, a pattern coil 153, a transmission line 154, and connectors 155A and 155B.
  • the laminated body 152 is configured by extending a direction perpendicular to the stacking direction as a longitudinal direction, and connectors 155A and 155B are provided on the first main surface (Z1) at both ends in the extending direction.
  • the transmission line 154 is provided in the laminated body 152 so as to connect between the connector 155A and the connector 155B.
  • the pattern coil 153 is provided so as to be inserted into the intermediate portion of the transmission line 154 inside the multilayer body 152.
  • the stacked body 152 includes a resist layer 161, a sheet 162, a sheet 163, a sheet 164, and a resist layer 165.
  • the laminated body 152 is configured by laminating a resist layer 161, a sheet 162, a sheet 163, a sheet 164, and a resist layer 165 in order from the first main surface (Z1) to the second main surface (Z2).
  • the resist layer 161 is laminated on the first main surface (Z1) side of the sheet 162.
  • the sheet 162 includes an insulating layer 172 and a wiring layer 182.
  • the insulating layer 172 is made of an insulator such as resin.
  • the wiring layer 182 is stacked on the first main surface (Z1) side of the insulating layer 172.
  • the wiring layer 182 is covered with the resist layer 161 on the first main surface (Z1) side.
  • the sheet 163 includes an insulating layer 173, a wiring layer 183, and a via-hole conductor 193.
  • the insulating layer 173 is made of an insulator such as resin.
  • the wiring layer 183 is stacked on the first main surface (Z1) side of the insulating layer 173.
  • the wiring layer 183 is covered with the sheet 162 on the first main surface (Z1) side.
  • the sheet 164 includes an insulating layer 174, a wiring layer 184, and a via hole conductor 194.
  • the insulating layer 174 is made of an insulator such as resin.
  • the wiring layer 184 is stacked on the second main surface (Z2) side of the insulating layer 174.
  • the resist layer 165 is laminated on the second main surface (Z2) side of the sheet 164 and covers the second main surface (Z2) side of the wiring layer 184.
  • the pattern coil 153 has inductance and is provided so as to extend spirally in the wiring layer 183.
  • the transmission line 154 is a take-up plate type transmission line including signal lines 183A and 183B, planar ground electrodes 182A and 182B, and a grid-like ground electrode 184A.
  • the signal lines 183A and 183B are provided in the wiring layer 183.
  • the planar ground electrodes 182A and 182B are provided on the wiring layer 182.
  • the grid-like ground electrode 184A is provided on the wiring layer 184.
  • the signal line 183A and the planar ground electrode 182A are opposed to each other via the insulating layer 172, and the signal line 183A and the grid-like ground electrode 184A are opposed to each other via the insulating layers 173 and 174.
  • the signal line 183B and the planar ground electrode 182B are opposed to each other via the insulating layer 172, and the signal line 183B and the grid-like ground electrode 184A are opposed to each other via the insulating layers 173 and 174.
  • One end of the signal line 183A is connected to one end of the pattern coil 153.
  • One end of the signal line 183B is connected to a connection conductor 184B provided in the wiring layer 184 via a via-hole conductor 193.
  • the connection conductor 184B is connected to the other end of the pattern coil 153 via the via-hole conductor 193.
  • FIG. 6A is a side view of the electronic device 150 having the coil component 151.
  • the electronic device 150 includes a first external substrate 191, a second external substrate 192, and a battery pack 195.
  • the electronic device 150 is an electronic device that further includes a housing (not shown) and other components, such as a mobile phone or a tablet terminal.
  • the first external substrate 191 and the second external substrate 192 are arranged at an interval so that the principal surface normal directions thereof are parallel to each other.
  • the battery pack 195 has a metal case and is disposed between the first external substrate 191 and the second external substrate 192.
  • the first external substrate 191 has a receptacle 191A.
  • the second external substrate 192 has a receptacle 192A.
  • the coil component 151 is attached to the electronic device 150 by connecting the connector 155A to the receptacle 191A of the first external substrate 191 and connecting the connector 155B to the receptacle 192A of the second external substrate 192.
  • the coil component 151 passes through the top surface side of the battery pack 195 while being bent so as to bypass the battery pack 195.
  • FIG. 6B is a side cross-sectional view showing an enlarged main part of the electronic device 150.
  • the interface on the first main surface (Z1) side is configured as the smooth surface 180A, and on the second main surface (Z2) side.
  • the interface is configured as a rough surface 180B.
  • the interface on the second main surface (Z2) side is configured as a smooth surface 180A
  • the interface on the first main surface (Z1) side is configured as a rough surface 180B.
  • the smooth surface 180A is a surface having a surface roughness of about 1 ⁇ m, for example.
  • the rough surface 180B is a surface having a surface roughness of about 3 to 5 ⁇ m, for example.
  • the pattern coil 153 of the coil component 151 faces the metal case of the battery pack 195, and the smooth surface 180A of the pattern coil 153 faces the metal case side of the battery pack 195. Yes. Therefore, the battery pack 195 corresponds to the object described in the claims, and the metal case of the battery pack 195 corresponds to the planar conductor described in the claims.
  • the surface roughness of the interface on the first main surface (Z1) side of the pattern coil 153 is smaller than the surface roughness of the interface on the second main surface (Z2) side of the pattern coil 153. For this reason, even if the pattern coil 153 is opposed to the metal case of the battery pack 195, the conductor loss of the current flowing through the pattern coil 153 is small. Therefore, excellent high frequency characteristics with little variation can be realized as the coil component 151.
  • mounting electrodes 32A , 35B, 135A, 184B ... connecting conductors 33A, 34A, 35A, 132A, 133A, 134A ... coil conductor 41, 2, 43, 44, 142, 143, 144, 193, 194 ... via-hole conductors 9, 191, 192 ... external substrate 91 ... built-in ground electrode 92 ... component mounting electrodes 10, 50, 100, 150 ... electronic devices 72, 161, 165... Resist layer 137.
  • Marker 154 Transmission line 155 A, 155 B.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

A coil component (1) is equipped with a layered body (2) and coil conductors (33A, 34A, 35A). The layered body (2) is configured by layering insulating layers (21-25) and wiring layers (31-35). The coil conductors (33A, 34A, 35A) have a coil shape with the layering direction of the layered body (2) as the axis thereof, and are provided in the wiring layers (33-35). The coil component (1) is used with the coil conductor (33A) facing the built-in ground electrode (91) of an external substrate (9). The surface roughness of the interface of the nearest coil conductor (33A) parallel to the built-in ground electrode (91) is less than the average surface roughness of all interfaces of the coil conductors (33A, 34A, 35A) parallel to the built-in ground electrode (91).

Description

コイル部品および電子機器Coil parts and electronic equipment
　この発明は、基板内部にコイル導体パターンを設けて構成されているコイル部品と、コイル部品が取り付けられている電子機器とに関するものである。 The present invention relates to a coil component configured by providing a coil conductor pattern inside a substrate and an electronic device to which the coil component is attached.
　コイル部品として、樹脂多層基板の層間にコイル導体パターンを設けて構成されているものがある（特許文献１参照。）。このようなコイル部品は、片面に金属膜が貼り付けられている樹脂製のシートに対して金属膜のエッチングを行ってコイル導体パターンを形成し、複数のシートを積層して熱圧着させることにより製造することができる。 Some coil parts are configured by providing a coil conductor pattern between layers of a resin multilayer substrate (see Patent Document 1). Such a coil component is formed by etching a metal film on a resin sheet having a metal film affixed on one side to form a coil conductor pattern, and laminating a plurality of sheets and thermocompression bonding. Can be manufactured.
　シートに貼り付けられる金属膜としては、シートに貼り付けられる一方の主面を、表面粗さが大きい粗面とし、他方の主面を、表面粗さが小さい滑面としたものがある。この金属膜を貼り付けたシートでは、金属膜のシートに対する接合強度が高いものになる。 As the metal film to be attached to the sheet, there is one in which one main surface attached to the sheet is a rough surface having a large surface roughness and the other main surface is a smooth surface having a small surface roughness. In the sheet with the metal film attached, the bonding strength of the metal film to the sheet is high.
国際公開第２０１０／０１６３４５号パンフレットInternational Publication No. 2010/016345 Pamphlet
　金属膜が貼り付けられたシートにより作製されたコイル部品を、外部基板や電子機器に取り付ける場合、コイル部品がグランドに対向すると、コイル部品の向きによっては高周波特性の劣化が生じることがある。 When attaching a coil component made of a sheet with a metal film attached to an external substrate or an electronic device, when the coil component faces the ground, the high frequency characteristics may be deteriorated depending on the orientation of the coil component.
　これは、コイル導体パターンの両主面で表面粗さが異なることにより、コイル導体パターンの粗面側が外部基板や外部部品のグランドに対向すると、コイル導体パターンを流れる電流の損失（導体損）が大きくなってしまうためと考えられる。このような電流の損失は、コイル導体パターンを流れる信号周波数が高いほど顕著に発生することになる。 This is because when the rough surface side of the coil conductor pattern faces the ground of the external substrate or external component due to the difference in surface roughness between the two main surfaces of the coil conductor pattern, the loss of current flowing through the coil conductor pattern (conductor loss) is reduced. This is thought to be due to an increase in size. Such a loss of current becomes more prominent as the signal frequency flowing through the coil conductor pattern is higher.
　そこで、本発明の目的は、コイル導体パターンを流れる電流の損失を防ぐことができ、高周波特性の優れたコイル部品と、そのコイル部品が取り付けられた電子機器と、を提供することにある。 Therefore, an object of the present invention is to provide a coil component that can prevent loss of current flowing through the coil conductor pattern and has excellent high-frequency characteristics, and an electronic device to which the coil component is attached.
　この発明のコイル部品は、絶縁層と配線層とが積層されている構成の積層体と、前記積層体の積層方向を軸とするコイル状であり、前記配線層に設けられている少なくとも一つ以上のコイル導体パターンと、を備え、前記コイル導体パターンを平面導体に対向させて利用されるコイル部品であって、前記積層体に含まれる前記コイル導体パターンの前記平面導体に並行する全ての界面のうち、前記平面導体に最も近接する界面の表面粗さは、前記全ての界面の平均の表面粗さよりも小さいことを特徴とする。 The coil component of the present invention is a laminated body having a configuration in which an insulating layer and a wiring layer are laminated, and a coil shape having the lamination direction of the laminated body as an axis, and at least one provided in the wiring layer A coil component that is used with the coil conductor pattern opposed to a planar conductor, all interfaces parallel to the planar conductor of the coil conductor pattern included in the laminate. Of these, the surface roughness of the interface closest to the planar conductor is smaller than the average surface roughness of all the interfaces.
　この構成では、積層体に含まれるコイル導体パターンの前記平面導体に並行する全ての界面のうちの、平面導体に最も近接する界面の表面粗さを、全ての界面の平均の表面粗さよりも小さくすることにより、コイル導体パターンを流れる電流の損失を低減することができる。 In this configuration, of all the interfaces parallel to the planar conductor of the coil conductor pattern included in the laminate, the surface roughness of the interface closest to the planar conductor is smaller than the average surface roughness of all the interfaces. By doing so, loss of current flowing through the coil conductor pattern can be reduced.
　上述のコイル部品において、前記積層体は、金属膜が接合されたシートを含む複数のシートを積層してなり、前記コイル導体パターンは、前記金属膜をパターニングしてなり、前記金属膜は、前記シートに接合された界面の表面粗さが、前記シートに接合された界面とは反対側の界面よりも大きいと好適である。 In the coil component described above, the laminate is formed by laminating a plurality of sheets including a sheet to which a metal film is bonded, the coil conductor pattern is formed by patterning the metal film, It is preferable that the surface roughness of the interface bonded to the sheet is larger than the interface opposite to the interface bonded to the sheet.
　この構成では、金属膜の２つの界面のうちの一方の界面が粗面となり、他方の界面が滑面となる。そして、金属膜が粗面側でシートに接合されているので、金属膜が接合されたシートにおける金属膜の接合強度が向上する。 In this configuration, one of the two interfaces of the metal film is a rough surface and the other interface is a smooth surface. Since the metal film is bonded to the sheet on the rough surface side, the bonding strength of the metal film in the sheet bonded with the metal film is improved.
　上述のコイル部品において、前記平面導体はグランドに接続される導体であってもよい。 In the coil component described above, the planar conductor may be a conductor connected to the ground.
　上述のコイル部品において、前記積層体の前記平面導体に近接する主面に、実装電極が形成されていてもよい。 In the coil component described above, a mounting electrode may be formed on a main surface of the multilayer body that is close to the planar conductor.
　この発明の電子機器は、上述のコイル部品と、前記コイル部品を配置する対象物とを備え、前記対象物は、前記平面導体を有していてもよい。 The electronic device of the present invention may include the above-described coil component and an object on which the coil component is disposed, and the object may include the planar conductor.
　この発明のコイル部品および電子機器では、コイル導体パターンの平面導体に並行する全ての界面のうちの、平面導体に最も近接する界面の表面粗さを、全ての界面の平均の表面粗さよりも小さくする。即ち、コイル導体パターンの平面導体に並行する全ての界面のうちの平面導体に最も近接する界面を滑面として構成するので、コイル導体パターンを流れる電流の損失を低減することができ、良好な高周波特性を実現できる。 In the coil component and the electronic device of the present invention, of all the interfaces parallel to the planar conductor of the coil conductor pattern, the surface roughness of the interface closest to the planar conductor is smaller than the average surface roughness of all the interfaces. To do. That is, since the interface closest to the planar conductor among all the interfaces parallel to the planar conductor of the coil conductor pattern is configured as a smooth surface, loss of current flowing through the coil conductor pattern can be reduced, and good high frequency The characteristics can be realized.
本発明の第１の実施形態に係るコイル部品の斜視図および分解斜視図である。It is the perspective view and exploded perspective view of the coil component which concern on the 1st Embodiment of this invention. 本発明の第１の実施形態に係るコイル部品の製造方法を示す側面断面図である。It is side surface sectional drawing which shows the manufacturing method of the coil components which concern on the 1st Embodiment of this invention. 本発明の第２の実施形態に係るコイル部品の平面図および側面断面図である。It is the top view and side sectional drawing of a coil component which concern on the 2nd Embodiment of this invention. 本発明の第３の実施形態に係るコイル部品の斜視図、分解斜視図、および側面断面図である。It is the perspective view of the coil component which concerns on the 3rd Embodiment of this invention, an exploded perspective view, and side surface sectional drawing. 本発明の第４の実施形態に係るコイル部品の斜視図および分解斜視図である。It is the perspective view and exploded perspective view of the coil component which concern on the 4th Embodiment of this invention. 本発明の第４の実施形態に係るコイル部品の実装状態での側面断面図である。It is side surface sectional drawing in the mounting state of the coil components which concern on the 4th Embodiment of this invention.
　以下、第１の実施形態に係るコイル部品および電子機器について説明する。 Hereinafter, the coil component and the electronic device according to the first embodiment will be described.
　以下の説明では、コイル部品を外部基板に実装する際に、コイル部品の外部基板に対向する面を第１主面（Ｚ１）と称する。また、コイル部品の第１主面（Ｚ１）とは反対側の面を第２主面（Ｚ２）と称する。 In the following description, when the coil component is mounted on the external substrate, the surface of the coil component that faces the external substrate is referred to as a first main surface (Z1). Further, the surface opposite to the first main surface (Z1) of the coil component is referred to as a second main surface (Z2).
　図１（Ａ）は、第１の実施形態に係るコイル部品１の斜視図であり、第１主面（Ｚ１）側を上に向けてコイル部品１を配置した状態を示している。 FIG. 1A is a perspective view of the coil component 1 according to the first embodiment, showing a state in which the coil component 1 is arranged with the first main surface (Z1) side facing up.
　コイル部品１は、積層体２とパターンコイル３とを備えている。積層体２は、六面体であり、液晶ポリマーなどの熱可塑性の高い樹脂や、他の熱可塑性樹脂、低温焼結セラミックス等により構成されている。積層体２は、第１主面（Ｚ１）に実装電極３１Ａ，３１Ｂが形成されており、コイル部品１は表面実装型の構成となっている。パターンコイル３は、積層コイルとして構成されており、積層体２の内部に設けられている。 The coil component 1 includes a laminated body 2 and a pattern coil 3. The laminate 2 is a hexahedron, and is made of a highly thermoplastic resin such as a liquid crystal polymer, another thermoplastic resin, a low-temperature sintered ceramic, or the like. In the laminate 2, mounting electrodes 31A and 31B are formed on the first main surface (Z1), and the coil component 1 has a surface mounting type configuration. The pattern coil 3 is configured as a laminated coil and is provided inside the laminated body 2.
　図１（Ｂ）は、コイル部品１の分解斜視図であり、第１主面（Ｚ１）側を上に向けてコイル部品１を配置した状態を示している。 FIG. 1 (B) is an exploded perspective view of the coil component 1 and shows a state where the coil component 1 is arranged with the first main surface (Z1) side facing up.
　積層体２は、シート１１，１２，１３，１４，１５を備えている。積層体２は、シート１１～１５を、第１主面（Ｚ１）から第２主面（Ｚ２）にかけて順に積層して構成されている。 The laminate 2 includes sheets 11, 12, 13, 14, and 15. The laminate 2 is configured by laminating sheets 11 to 15 in order from the first main surface (Z1) to the second main surface (Z2).
　シート１１は、絶縁層２１と、配線層３１と、ビアホール導体４１と、を備えている。絶縁層２１は、樹脂等の絶縁体からなり、積層方向から平面視した外形が矩形状である。配線層３１は、絶縁層２１の第１主面（Ｚ１）側に積層されている。ビアホール導体４１は、絶縁層２１を積層方向に貫通している。配線層３１には、実装電極３１Ａ，３１Ｂが設けられている。実装電極３１Ａ，３１Ｂは、図示していない外部基板の電極に接続される。 The sheet 11 includes an insulating layer 21, a wiring layer 31, and a via-hole conductor 41. The insulating layer 21 is made of an insulator such as resin, and has an outer shape that is rectangular when viewed in plan from the stacking direction. The wiring layer 31 is stacked on the first main surface (Z1) side of the insulating layer 21. The via-hole conductor 41 penetrates the insulating layer 21 in the stacking direction. On the wiring layer 31, mounting electrodes 31A and 31B are provided. The mounting electrodes 31A and 31B are connected to electrodes on an external substrate (not shown).
　シート１２は、絶縁層２２と、配線層３２と、ビアホール導体４２と、備えている。絶縁層２２は、樹脂等の絶縁体からなり、積層方向から平面視した外形が矩形状である。配線層３２は、絶縁層２２の第１主面（Ｚ１）側に積層されている。ビアホール導体４２は、絶縁層２２を積層方向に貫通している。 The sheet 12 includes an insulating layer 22, a wiring layer 32, and a via hole conductor 42. The insulating layer 22 is made of an insulator such as a resin, and has a rectangular outer shape in plan view from the stacking direction. The wiring layer 32 is stacked on the first main surface (Z1) side of the insulating layer 22. The via-hole conductor 42 penetrates the insulating layer 22 in the stacking direction.
　シート１３は、絶縁層２３と、配線層３３と、ビアホール導体４３と、備えている。絶縁層２３は、樹脂等の絶縁体からなり、積層方向から平面視した外形が矩形状である。配線層３３は、絶縁層２３の第１主面（Ｚ１）側に積層されている。ビアホール導体４３は、絶縁層２３を積層方向に貫通している。 The sheet 13 includes an insulating layer 23, a wiring layer 33, and a via-hole conductor 43. The insulating layer 23 is made of an insulator such as resin, and has a rectangular outer shape in plan view from the stacking direction. The wiring layer 33 is stacked on the first main surface (Z1) side of the insulating layer 23. The via-hole conductor 43 penetrates the insulating layer 23 in the stacking direction.
　シート１４は、絶縁層２４と、配線層３４と、ビアホール導体４４と、備えている。絶縁層２４は、樹脂等の絶縁体からなり、積層方向から平面視した外形が矩形状である。配線層３４は、絶縁層２４の第１主面（Ｚ１）側に積層されている。ビアホール導体４４は、絶縁層２４を積層方向に貫通している。 The sheet 14 includes an insulating layer 24, a wiring layer 34, and a via hole conductor 44. The insulating layer 24 is made of an insulator such as resin, and has an outer shape that is rectangular when viewed in plan from the stacking direction. The wiring layer 34 is stacked on the first main surface (Z1) side of the insulating layer 24. The via-hole conductor 44 penetrates the insulating layer 24 in the stacking direction.
　シート１５は、絶縁層２５と、配線層３５と、備えている。絶縁層２５は、樹脂等の絶縁体からなり、積層方向から平面視した外形が矩形状である。配線層３５は、絶縁層２５の第１主面（Ｚ１）側に積層されている。 The sheet 15 includes an insulating layer 25 and a wiring layer 35. The insulating layer 25 is made of an insulator such as a resin, and has a rectangular outer shape in plan view from the stacking direction. The wiring layer 35 is stacked on the first main surface (Z1) side of the insulating layer 25.
　パターンコイル３は、コイル導体３３Ａとコイル導体３４Ａとコイル導体３５Ａとを備えており、インダクタンスを有している。コイル導体３３Ａは、シート１３の配線層３３に設けられており、シート１３の外縁に沿って回るように延伸している。コイル導体３４Ａは、シート１４の配線層３４に設けられており、シート１４の外縁に沿って回るように延伸している。コイル導体３５Ａは、シート１５の配線層３５に設けられており、シート１５の外縁に沿って回るように延伸している。コイル導体３３Ａとコイル導体３４Ａとコイル導体３５Ａとは、積層体２の積層方向を軸とするコイル状となるように、ビアホール導体４３，４４を介して接続されている。コイル導体３３Ａとコイル導体３４Ａとコイル導体３５Ａは、積層体２の積層方向から視ると、互いにループ状に重なるように設けられている。 The pattern coil 3 includes a coil conductor 33A, a coil conductor 34A, and a coil conductor 35A, and has an inductance. The coil conductor 33 </ b> A is provided in the wiring layer 33 of the sheet 13 and extends so as to rotate along the outer edge of the sheet 13. The coil conductor 34 </ b> A is provided in the wiring layer 34 of the sheet 14 and extends so as to rotate along the outer edge of the sheet 14. The coil conductor 35 </ b> A is provided in the wiring layer 35 of the sheet 15 and extends so as to rotate along the outer edge of the sheet 15. The coil conductor 33 </ b> A, the coil conductor 34 </ b> A, and the coil conductor 35 </ b> A are connected via via- hole conductors 43 and 44 so as to have a coil shape with the stacking direction of the multilayer body 2 as an axis. The coil conductor 33 </ b> A, the coil conductor 34 </ b> A, and the coil conductor 35 </ b> A are provided so as to overlap each other in a loop shape when viewed from the stacking direction of the multilayer body 2.
　また、パターンコイル３のコイル導体３３Ａは、ビアホール導体４１，４２を介してシート１１の実装電極３１Ａに接続されている。 Further, the coil conductor 33A of the pattern coil 3 is connected to the mounting electrode 31A of the sheet 11 via the via- hole conductors 41 and 42.
　また、シート１２の配線層３２には、接続導体３２Ａが設けられている。シート１５の配線層３５には、接続導体３５Ｂが設けられている。接続導体３２Ａ，３５Ｂは、ビアホール導体４２，４３，４４を介して接続されている。接続導体３２Ａは、ビアホール導体４１を介してシート１１の実装電極３１Ｂに接続されている。接続導体３５Ｂは、パターンコイル３のコイル導体３５Ａと接続されている。したがって、実装電極３１Ｂとパターンコイル３とは、接続導体３２Ａ，３５Ｂを介して接続されている。 In addition, a connection conductor 32 </ b> A is provided on the wiring layer 32 of the sheet 12. A connection conductor 35 </ b> B is provided on the wiring layer 35 of the sheet 15. The connection conductors 32A, 35B are connected via via- hole conductors 42, 43, 44. The connection conductor 32A is connected to the mounting electrode 31B of the sheet 11 via the via-hole conductor 41. The connection conductor 35B is connected to the coil conductor 35A of the pattern coil 3. Therefore, the mounting electrode 31B and the pattern coil 3 are connected via the connection conductors 32A and 35B.
　このようにコイル部品１は、実装電極３１Ａ，３１Ｂを積層体２の第１主面（Ｚ１）に設けて表面実装型（ＬＧＡ型）の構成としている。したがって、コイル部品１を実装するために外部基板で必要とする占有面積が、コイル部品１の面積と同程度と小さくなる。また、コイル部品１を覆うようにシールドケースを設ける場合、コイル部品１とシールドケースとの間のクリアランスが十分に無くても、シールドケースとの接触によって実装電極３１Ａ，３１Ｂでショートが発生することが無い。 As described above, the coil component 1 has a surface mount type (LGA type) configuration in which the mounting electrodes 31A and 31B are provided on the first main surface (Z1) of the multilayer body 2. Therefore, the area occupied by the external substrate for mounting the coil component 1 is as small as the area of the coil component 1. Further, when a shield case is provided so as to cover the coil component 1, even if there is not enough clearance between the coil component 1 and the shield case, a short circuit occurs in the mounting electrodes 31A and 31B due to contact with the shield case. There is no.
　図２は、コイル部品１の製造方法の一例を説明するための側面断面図であり、第２主面（Ｚ２）側となる面を上に向けて各部を配置した状態を示している。また、ここでは、単一のコイル部品１となる部分のみを図中に示している。ただし、実際には、広大なシートに多数のコイル部品１となる部分を設け、複数のコイル部品１を一度に形成したのち、各コイル部品１を切り出すことにより、コイル部品１は製造される。 FIG. 2 is a side cross-sectional view for explaining an example of the manufacturing method of the coil component 1 and shows a state in which the respective parts are arranged with the surface on the second main surface (Z2) side facing up. Here, only the portion that becomes the single coil component 1 is shown in the drawing. However, in practice, the coil component 1 is manufactured by providing a large number of parts to be the coil components 1 on a large sheet, forming the plurality of coil components 1 at a time, and then cutting out each coil component 1.
　まず、図２（Ａ）に示す第１の工程で、シート１１～１５を用意する。シート１１～１５は、それぞれ、前述のように絶縁層２１～２５と配線層３１～３５とを備える。第１の工程においては、配線層３１～３５は、絶縁層２１～２５の片面全面に予め貼り付けられている銅箔等の金属膜の状態である。金属膜として構成されている配線層３１～３５の界面は、滑面３０Ａおよび粗面３０Ｂとして構成されている。滑面３０Ａは、例えば表面粗さが１μｍ程度の面である。粗面３０Ｂは、例えば表面粗さが３～５μｍ程度の面である。表面粗さとしては、［ＪＩＳ　Ｂ　０６０１－２００１］で規格が定められている算術平均粗さを採用する。 First, sheets 11 to 15 are prepared in the first step shown in FIG. Each of the sheets 11 to 15 includes the insulating layers 21 to 25 and the wiring layers 31 to 35 as described above. In the first step, the wiring layers 31 to 35 are in the state of a metal film such as a copper foil that is previously attached to the entire surface of one side of the insulating layers 21 to 25. The interfaces of the wiring layers 31 to 35 configured as metal films are configured as a smooth surface 30A and a rough surface 30B. The smooth surface 30A is a surface having a surface roughness of about 1 μm, for example. The rough surface 30B is a surface having a surface roughness of about 3 to 5 μm, for example. As the surface roughness, the arithmetic average roughness defined by [JIS B 0601-2001] is adopted.
　そして、配線層３１～３５は、それぞれ、粗面３０Ｂを介して絶縁層２１～２５に接合されている。これにより配線層３１～３５と絶縁層２１～２５とを、滑面３０Ａを介して接合する場合よりも、強い接合強度で接合している。 The wiring layers 31 to 35 are bonded to the insulating layers 21 to 25 through the rough surface 30B, respectively. As a result, the wiring layers 31 to 35 and the insulating layers 21 to 25 are bonded with stronger bonding strength than when the wiring layers 31 to 25 are bonded via the smooth surface 30A.
　次に、図２（Ｂ）に示す第２の工程で、シート１１～１５の配線層３１～３５を構成する金属膜をエッチング等によりパターン化する。これにより、実装電極３１Ａ，３１Ｂと、コイル導体３３Ａ～３５Ａと、接続導体３２Ａ，３５Ｂとが形成される。また、シート１１～１４の絶縁層２１～２５にレーザー等により金属膜は貫通しないが絶縁層は貫通する貫通孔を形成した後に貫通孔の内部に導電性ペーストなどの導電材を設ける。これにより、ビアホール導体４１～４４が形成される。 Next, in the second step shown in FIG. 2B, the metal films constituting the wiring layers 31 to 35 of the sheets 11 to 15 are patterned by etching or the like. Thus, the mounting electrodes 31A and 31B, the coil conductors 33A to 35A, and the connection conductors 32A and 35B are formed. In addition, a metal film is not penetrated through the insulating layers 21 to 25 of the sheets 11 to 14 by a laser or the like but a through hole is formed through the insulating layer, and then a conductive material such as a conductive paste is provided inside the through hole. As a result, the via-hole conductors 41 to 44 are formed.
　次に、第３の工程で、シート１１～１５それぞれを、配線層３１～３５を第１主面（Ｚ１）側に向けた状態で、重ね合わせる。即ち、各配線層３１～３５の滑面３０Ａを、第１主面（Ｚ１）側に向けた状態で、シート１１～１５を重ね合わせる。そして、シート１１～１５を熱圧着させ、これにより、シート１１～１５を互いに接合させる。このようにして、図２（Ｃ）に示すように、パターンコイル３を積層体２の内部に設けたコイル部品１が製造される。 Next, in the third step, the sheets 11 to 15 are overlapped with the wiring layers 31 to 35 facing the first main surface (Z1) side. That is, the sheets 11 to 15 are overlapped with the smooth surfaces 30A of the wiring layers 31 to 35 facing the first main surface (Z1). Then, the sheets 11 to 15 are thermocompression bonded, and thereby the sheets 11 to 15 are joined to each other. In this way, as shown in FIG. 2C, the coil component 1 in which the pattern coil 3 is provided in the laminated body 2 is manufactured.
　その後、コイル部品１は、図２（Ｄ）に示すように、外部基板９に実装されて用いられることになる。外部基板９は、プリント配線基板であり、内蔵グランド電極９１と、部品搭載電極９２とを備えている。外部基板９は、特許請求の範囲に記載の電子機器における対象物に相当している。部品搭載電極９２は、外部基板９の部品搭載面に形成されている。内蔵グランド電極９１は、外部基板９の部品搭載面に並行するように、外部基板９の内部に形成されており、特許請求の範囲に記載の平面導体に相当している。外部基板９の部品搭載電極９２に対して、はんだ９３を介して実装電極３１Ａ，３１Ｂを接合することにより、コイル部品１は外部基板９に実装されている。 Thereafter, the coil component 1 is mounted and used on the external substrate 9 as shown in FIG. The external substrate 9 is a printed wiring board and includes a built-in ground electrode 91 and a component mounting electrode 92. The external substrate 9 corresponds to an object in the electronic device described in the claims. The component mounting electrode 92 is formed on the component mounting surface of the external substrate 9. The built-in ground electrode 91 is formed inside the external substrate 9 so as to be parallel to the component mounting surface of the external substrate 9, and corresponds to the planar conductor described in the claims. The coil component 1 is mounted on the external substrate 9 by bonding the mounting electrodes 31 </ b> A and 31 </ b> B to the component mounting electrode 92 of the external substrate 9 via the solder 93.
　このようにしてコイル部品１を外部基板９に実装した電子機器１０では、コイル部品１のパターンコイル３は、内蔵グランド電極９１に対向している。また、コイル導体３３Ａ～３５Ａは、それぞれ、外部基板９側に滑面３０Ａが向いている。 In this way, in the electronic device 10 in which the coil component 1 is mounted on the external substrate 9, the pattern coil 3 of the coil component 1 faces the built-in ground electrode 91. The coil conductors 33A to 35A each have the smooth surface 30A facing the external substrate 9 side.
　したがって、内蔵グランド電極９１に並行して最も近接するコイル導体３３Ａの第１主面（Ｚ１）側の界面の表面粗さは、コイル導体３３Ａ～３５Ａの内蔵グランド電極９１に並行する全ての界面の表面粗さの平均よりも小さくなる。 Therefore, the surface roughness of the interface on the first main surface (Z1) side of the coil conductor 33A closest in parallel to the built-in ground electrode 91 is the surface roughness of all the interfaces parallel to the built-in ground electrode 91 of the coil conductors 33A to 35A. It becomes smaller than the average of the surface roughness.
　なお、［コイル導体３３Ａ～３５Ａの内蔵グランド電極９１に並行する全ての界面の表面粗さの平均］は、例えば、以下のようにして決定することができる。即ち、コイル導体３３Ａ～３５Ａの第１主面（Ｚ１）側の面の算術平均粗さをＲａ１１，Ｒａ２１，Ｒａ３１とし、コイル導体３３Ａ～３５Ａの第２主面（Ｚ２）側の面の算術平均粗さをＲａ１２，Ｒａ２２，Ｒａ３２とし、コイル導体３３Ａ～３５Ａの面積をＡ１，Ａ２，Ａ３とし、［コイル導体３３Ａ～３５Ａの内蔵グランド電極９１に並行する全ての界面の表面粗さの平均］をＲａ’とすれば、次式で表わされる。 The [average surface roughness of all interfaces parallel to the built-in ground electrode 91 of the coil conductors 33A to 35A] can be determined as follows, for example. That is, the arithmetic mean roughness of the first principal surface (Z1) side surfaces of the coil conductors 33A to 35A is Ra11, Ra21, Ra31, and the arithmetic average of the surfaces of the coil conductors 33A to 35A on the second principal surface (Z2) side. The roughness is Ra12, Ra22, Ra32, the areas of the coil conductors 33A to 35A are A1, A2, and A3, and [average surface roughness of all interfaces parallel to the built-in ground electrode 91 of the coil conductors 33A to 35A] If Ra ′, it is expressed by the following equation.
　Ｒａ’＝（Ｒａ１１×Ａ１＋Ｒａ１２×Ａ１＋Ｒａ２１×Ａ２＋Ｒａ２２×Ａ２＋Ｒａ３１×Ａ３＋Ｒａ３２×Ａ３）／（Ａ１＋Ａ１＋Ａ２＋Ａ２＋Ａ３＋Ａ３）
　したがって、［内蔵グランド電極９１に並行して最も近接するコイル導体３３Ａの第１主面（Ｚ１）側の界面の表面粗さ］が、［コイル導体３３Ａ～３５Ａの内蔵グランド電極９１に並行する全ての界面の表面粗さの平均］よりも小さいということは、次式が成立することを表わしている。 Ra ′ = (Ra11 × A1 + Ra12 × A1 + Ra21 × A2 + Ra22 × A2 + Ra31 × A3 + Ra32 × A3) / (A1 + A1 + A2 + A2 + A3 + A3)
Therefore, the [surface roughness of the interface on the first main surface (Z1) side of the coil conductor 33A closest to the built-in ground electrode 91 in parallel] is [all of the surface parallel to the built-in ground electrode 91 of the coil conductors 33A to 35A]. Smaller than the average of the surface roughness of the interface] means that the following equation holds.
　Ｒａ１１＜Ｒａ’
　このように、コイル部品１のパターンコイル３を構成しているので、パターンコイル３を内蔵グランド電極９１に対向させていても、パターンコイル３を流れる電流の導体損は小さく、コイル部品１としてばらつきの少ない優れた高周波特性を実現することができる。 Ra11 <Ra '
Thus, since the pattern coil 3 of the coil component 1 is configured, even if the pattern coil 3 is opposed to the built-in ground electrode 91, the conductor loss of the current flowing through the pattern coil 3 is small and varies as the coil component 1. It is possible to realize excellent high-frequency characteristics with little.
　なお、本実施形態においては、内蔵グランド電極９１に並行して最も近接するコイル導体３３Ａの第１主面（Ｚ１）側の界面だけでなく、内蔵グランド電極９１に部分的に面するコイル導体３３Ｂの第１主面（Ｚ１）側の界面も滑面８０Ａとしているので、パターンコイル３を流れる電流の導体損は、より小さくなっている。 In the present embodiment, not only the interface on the first main surface (Z1) side of the coil conductor 33A closest in parallel to the built-in ground electrode 91 but also the coil conductor 33B partially facing the built-in ground electrode 91. Since the interface on the first main surface (Z1) side is also a smooth surface 80A, the conductor loss of the current flowing through the pattern coil 3 is smaller.
　なお、本実施形態においては、コイル導体３３Ａ～３５Ａ、実装電極３１Ａ，３１Ｂ、および接続導体３２Ａ，３５Ｂを、いずれも、外部基板９側、即ち第１主面（Ｚ１）側に滑面３０Ａが向くように構成しているが、コイル導体３３Ａの他の電極、例えばコイル導体３４Ａとコイル導体３５Ａとのうちの一方または両方を、外部基板９側に粗面３０Ｂが向くように構成してもよい。また、実装電極３１Ａ，３１Ｂや接続導体３２Ａ，３５Ｂを外部基板９側に粗面３０Ｂが向くように構成してもよい。 In the present embodiment, the coil conductors 33A to 35A, the mounting electrodes 31A and 31B, and the connection conductors 32A and 35B all have a smooth surface 30A on the external substrate 9, that is, on the first main surface (Z1) side. The other electrode of the coil conductor 33A, for example, one or both of the coil conductor 34A and the coil conductor 35A may be configured such that the rough surface 30B faces the external substrate 9 side. Good. Further, the mounting electrodes 31A and 31B and the connection conductors 32A and 35B may be configured such that the rough surface 30B faces the external substrate 9 side.
　また、本実施形態においては、コイル導体３３Ａの第２主面（Ｚ２）側を向く面は、粗面３０Ｂとして構成したが、コイル導体３３Ａの第１主面（Ｚ１）側を向く面と同様に、第２主面（Ｚ２）側を向く面も滑面３０Ａとして構成してもよい。 In the present embodiment, the surface facing the second main surface (Z2) side of the coil conductor 33A is configured as the rough surface 30B, but is the same as the surface facing the first main surface (Z1) side of the coil conductor 33A. In addition, the surface facing the second main surface (Z2) may also be configured as the smooth surface 30A.
　次に、本発明の第２の実施形態に係るコイル部品および電子機器について説明する。 Next, a coil component and an electronic device according to the second embodiment of the present invention will be described.
　図３（Ａ）は、第２の実施形態に係るコイル部品５１を第１主面（Ｚ１）側から視た平面図である。図３（Ｂ）は、コイル部品５１を外部基板に実装した状態での側面断面図である。 FIG. 3A is a plan view of the coil component 51 according to the second embodiment as viewed from the first main surface (Z1) side. FIG. 3B is a side sectional view of the coil component 51 mounted on the external substrate.
　コイル部品５１は、積層体５２とパターンコイル５３とを備えている。パターンコイル５３は、平面コイルとして設けられており、積層体５２の内部に設けられている。 The coil component 51 includes a laminated body 52 and a pattern coil 53. The pattern coil 53 is provided as a planar coil and is provided inside the stacked body 52.
　積層体５２は、絶縁層７１と配線層８１とレジスト層７２とを備えている。絶縁層７１は、樹脂等の絶縁体からなり、積層方向から平面視した外形が矩形状であり、第１主面（Ｚ１）側に配線層８１が積層されている。レジスト層７２は、絶縁層７１および配線層８１の第１主面（Ｚ１）側に積層されている。 The laminate 52 includes an insulating layer 71, a wiring layer 81, and a resist layer 72. The insulating layer 71 is made of an insulator such as a resin, and has a rectangular outer shape in plan view from the stacking direction. The wiring layer 81 is stacked on the first main surface (Z1) side. The resist layer 72 is laminated on the first main surface (Z1) side of the insulating layer 71 and the wiring layer 81.
　パターンコイル５３は、積層体５２の積層方向から視て、スパイラル状に延伸されたコイル導体として配線層８１に構成されており、インダクタンスを有している。前述のレジスト層７２は、積層体５２の積層方向から視て、パターンコイル５３の両端に重なる位置に開口が設けられており、レジスト層７２から第１主面（Ｚ１）側にパターンコイル５３の両端が露出する。レジスト層７２から第１主面（Ｚ１）側に露出するパターンコイル５３の両端は、実装電極８１Ａ，８１Ｂとして構成されている。 The pattern coil 53 is configured in the wiring layer 81 as a coil conductor extending in a spiral shape when viewed from the stacking direction of the stacked body 52, and has an inductance. The aforementioned resist layer 72 is provided with openings at positions overlapping with both ends of the pattern coil 53 when viewed from the stacking direction of the stacked body 52, and the resist coil 72 has the pattern coil 53 on the first main surface (Z1) side. Both ends are exposed. Both ends of the pattern coil 53 exposed from the resist layer 72 to the first main surface (Z1) side are configured as mounting electrodes 81A and 81B.
　また、パターンコイル５３の第１主面（Ｚ１）側の界面は、滑面８０Ａとして構成されている。パターンコイル５３の第２主面（Ｚ２）側の界面は、粗面８０Ｂとして構成されている。滑面８０Ａは、例えば表面粗さが１μｍ程度の面である。粗面８０Ｂは、例えば表面粗さが３～５μｍ程度の面である。表面粗さとしては、［ＪＩＳ　Ｂ　０６０１－２００１］で規格が定められている算術平均粗さを採用する。 The interface on the first main surface (Z1) side of the pattern coil 53 is configured as a smooth surface 80A. The interface on the second main surface (Z2) side of the pattern coil 53 is configured as a rough surface 80B. The smooth surface 80A is a surface having a surface roughness of about 1 μm, for example. The rough surface 80B is a surface having a surface roughness of about 3 to 5 μm, for example. As the surface roughness, the arithmetic average roughness defined by [JIS B 0601-2001] is adopted.
　そして、パターンコイル５３は、粗面８０Ｂを介して絶縁層７１に接合されている。これによりパターンコイル５３と絶縁層７１とを、滑面８０Ａを介して接合する場合よりも、強い接合強度で接合している。 The pattern coil 53 is bonded to the insulating layer 71 through the rough surface 80B. Thereby, the pattern coil 53 and the insulating layer 71 are joined with stronger joining strength than the case where they are joined via the smooth surface 80A.
　コイル部品５１は、図３（Ｂ）に示すように、外部基板９に実装されて用いられることになる。外部基板９は、プリント配線基板であり、内蔵グランド電極９１と、部品搭載電極９２とを備えている。外部基板９は、特許請求の範囲に記載の対象物に相当している。部品搭載電極９２は、外部基板９の部品搭載面に形成されている。内蔵グランド電極９１は、外部基板９の部品搭載面に並行するように、外部基板９の内部に形成されており、特許請求の範囲に記載の平面導体に相当している。外部基板９の部品搭載電極９２に対して、はんだ９３を介して実装電極８１Ａ，８１Ｂを接合することにより、コイル部品５１は外部基板９に実装されている。 The coil component 51 is mounted on the external substrate 9 and used as shown in FIG. The external substrate 9 is a printed wiring board and includes a built-in ground electrode 91 and a component mounting electrode 92. The external substrate 9 corresponds to the object described in the claims. The component mounting electrode 92 is formed on the component mounting surface of the external substrate 9. The built-in ground electrode 91 is formed inside the external substrate 9 so as to be parallel to the component mounting surface of the external substrate 9, and corresponds to the planar conductor described in the claims. The coil component 51 is mounted on the external substrate 9 by bonding the mounting electrodes 81A and 81B to the component mounting electrode 92 of the external substrate 9 via the solder 93.
　このようにしてコイル部品５１を外部基板９に実装した電子機器５０は、コイル部品５１のパターンコイル５３が、内蔵グランド電極９１に対向し、外部基板９側に滑面８０Ａが向いている。したがって、パターンコイル５３の第１主面（Ｚ１）側の界面の表面粗さは、パターンコイル５３の第１主面（Ｚ１）側と第２主面（Ｚ２）側との両界面の表面粗さの平均よりも小さくなっている。 In the electronic device 50 in which the coil component 51 is mounted on the external substrate 9 in this way, the pattern coil 53 of the coil component 51 faces the built-in ground electrode 91 and the smooth surface 80A faces the external substrate 9 side. Accordingly, the surface roughness of the interface on the first main surface (Z1) side of the pattern coil 53 is the surface roughness of both interfaces of the first main surface (Z1) side and the second main surface (Z2) side of the pattern coil 53. It is smaller than the average.
　このように、コイル部品５１のパターンコイル５３を平面コイルとして構成しているので、内蔵グランド電極９１に対向するパターンコイル５３の全面が滑面８０Ａとなり、パターンコイル５３を流れる電流の導体損が小さくなる。そして、コイル部品５１としてばらつきの少ない優れた高周波特性を実現することができる。 Thus, since the pattern coil 53 of the coil component 51 is configured as a planar coil, the entire surface of the pattern coil 53 facing the built-in ground electrode 91 becomes the smooth surface 80A, and the conductor loss of the current flowing through the pattern coil 53 is small. Become. And the high frequency characteristic with few dispersion | variations as the coil component 51 is realizable.
　次に、本発明の第３の実施形態に係るコイル部品および電子機器について説明する。 Next, a coil component and an electronic device according to the third embodiment of the present invention will be described.
　図４（Ａ）は、第３の実施形態に係るコイル部品１０１の斜視図であり、第２主面（Ｚ２）を上に向けてコイル部品１０１を配置している状態を示している。 FIG. 4A is a perspective view of the coil component 101 according to the third embodiment, showing a state in which the coil component 101 is arranged with the second main surface (Z2) facing upward.
　コイル部品１０１は、積層体１０２とパターンコイル１０３とを備えている。積層体１０２は、積層方向に直交する方向の両端部近傍の外面を覆うように、実装電極１３６Ａ，１３６Ｂが設けられており、コイル部品１０１は、チップ型として構成されている。また、積層体１０２の第２主面（Ｚ２）には、実装方向が判別できるよう、マーカー１３７が設けられている。パターンコイル１０３は、積層コイルとして構成されており、積層体１０２の内部に設けられている。 The coil component 101 includes a laminated body 102 and a pattern coil 103. The stacked body 102 is provided with mounting electrodes 136A and 136B so as to cover the outer surfaces near both ends in the direction orthogonal to the stacking direction, and the coil component 101 is configured as a chip type. A marker 137 is provided on the second main surface (Z2) of the stacked body 102 so that the mounting direction can be determined. The pattern coil 103 is configured as a laminated coil, and is provided inside the laminated body 102.
　図４（Ｂ）は、コイル部品１０１の分解斜視図である。 FIG. 4B is an exploded perspective view of the coil component 101.
　積層体１０２は、シート１１１，１１２，１１３，１１４，１１５を備えている。積層体１０２は、シート１１１～１１５を、第１主面（Ｚ１）から第２主面（Ｚ２）にかけて順に積層して構成されている。 The laminate 102 includes sheets 111, 112, 113, 114, and 115. The laminate 102 is configured by laminating sheets 111 to 115 in order from the first main surface (Z1) to the second main surface (Z2).
　シート１１１は、絶縁層１２１を備えている。絶縁層１２１は、樹脂等の絶縁体からなり、積層方向から平面視した外形が矩形状である。 The sheet 111 includes an insulating layer 121. The insulating layer 121 is made of an insulator such as resin, and has an outer shape that is rectangular when viewed in plan from the stacking direction.
　シート１１２は、絶縁層１２２と、配線層１３２と、ビアホール導体１４２と、備えている。絶縁層１２２は、樹脂等の絶縁体からなり、積層方向から平面視した外形が矩形状である。配線層１３２は、絶縁層１２２の第１主面（Ｚ１）側に積層されている。ビアホール導体１４２は、絶縁層１２２を積層方向に貫通している。 The sheet 112 includes an insulating layer 122, a wiring layer 132, and a via-hole conductor 142. The insulating layer 122 is made of an insulator such as resin, and has a rectangular outer shape in plan view from the stacking direction. The wiring layer 132 is stacked on the first main surface (Z1) side of the insulating layer 122. The via-hole conductor 142 penetrates the insulating layer 122 in the stacking direction.
　シート１１３は、絶縁層１２３と、配線層１３３と、ビアホール導体１４３と、備えている。絶縁層１２３は、樹脂等の絶縁体からなり、積層方向から平面視した外形が矩形状である。配線層１３３は、絶縁層１２３の第１主面（Ｚ１）側に積層されている。ビアホール導体１４３は、絶縁層１２３を積層方向に貫通している。 The sheet 113 includes an insulating layer 123, a wiring layer 133, and a via-hole conductor 143. The insulating layer 123 is made of an insulator such as resin, and has a rectangular outer shape in plan view from the stacking direction. The wiring layer 133 is stacked on the first main surface (Z1) side of the insulating layer 123. The via-hole conductor 143 passes through the insulating layer 123 in the stacking direction.
　シート１１４は、絶縁層１２４と、配線層１３４と、ビアホール導体１４４と、備えている。絶縁層１２４は、樹脂等の絶縁体からなり、積層方向から平面視した外形が矩形状である。配線層１３４は、絶縁層１２４の第１主面（Ｚ１）側に積層されている。ビアホール導体１４４は、絶縁層１２４を積層方向に貫通している。 The sheet 114 includes an insulating layer 124, a wiring layer 134, and a via hole conductor 144. The insulating layer 124 is made of an insulator such as resin, and has a rectangular outer shape in plan view from the stacking direction. The wiring layer 134 is stacked on the first main surface (Z1) side of the insulating layer 124. The via-hole conductor 144 penetrates the insulating layer 124 in the stacking direction.
　シート１１５は、絶縁層１２５と、配線層１３５と、を備えている。絶縁層１２５は、樹脂等の絶縁体からなり、積層方向から平面視した外形が矩形状である。配線層１３５は、絶縁層１２５の第１主面（Ｚ１）側に積層されている。 The sheet 115 includes an insulating layer 125 and a wiring layer 135. The insulating layer 125 is made of an insulator such as resin, and has a rectangular outer shape in plan view from the stacking direction. The wiring layer 135 is stacked on the first main surface (Z1) side of the insulating layer 125.
　パターンコイル１０３は、コイル導体１３２Ａとコイル導体１３３Ａとコイル導体１３４Ａとを備えており、インダクタンスを有している。コイル導体１３２Ａは、シート１１２の配線層１３２に設けられており、シート１１２の外縁に沿って回るように延伸している。コイル導体１３３Ａは、シート１１３の配線層１３３に設けられており、シート１１３の外縁に沿って回るように延伸している。コイル導体１３４Ａは、シート１１４の配線層１３４に設けられており、シート１１４の外縁に沿って回るように延伸している。コイル導体１３２Ａとコイル導体１３３Ａとコイル導体１３４Ａとは、積層体１０２の積層方向を軸とするコイル状となるように、ビアホール導体１４２，１４３を介して接続されている。コイル導体１３２Ａとコイル導体１３３Ａとコイル導体１３４Ａは、積層体１０２の積層方向から視ると、互いにループ状に重なるように設けられている。 The pattern coil 103 includes a coil conductor 132A, a coil conductor 133A, and a coil conductor 134A, and has an inductance. The coil conductor 132 </ b> A is provided in the wiring layer 132 of the sheet 112 and extends so as to rotate along the outer edge of the sheet 112. The coil conductor 133 </ b> A is provided on the wiring layer 133 of the sheet 113 and extends so as to rotate along the outer edge of the sheet 113. The coil conductor 134 </ b> A is provided in the wiring layer 134 of the sheet 114 and extends so as to rotate along the outer edge of the sheet 114. The coil conductor 132 </ b> A, the coil conductor 133 </ b> A, and the coil conductor 134 </ b> A are connected via via- hole conductors 142 and 143 so as to have a coil shape with the stacking direction of the multilayer body 102 as an axis. The coil conductor 132A, the coil conductor 133A, and the coil conductor 134A are provided so as to overlap each other in a loop shape when viewed from the stacking direction of the stacked body 102.
　また、コイル導体１３２Ａは、シート１１２の縁まで引き出されて実装電極１３６Ａに接続されている。また、コイル導体１３４Ａは、ビアホール導体１４４を介してシート１１５に引き出され、シート１１５に設けられた接続導体１３５Ａにより、シート１１５の縁まで引き出されて実装電極１３６Ｂに接続されている。 Further, the coil conductor 132A is drawn out to the edge of the sheet 112 and connected to the mounting electrode 136A. The coil conductor 134A is drawn to the sheet 115 via the via-hole conductor 144, and is drawn to the edge of the sheet 115 by the connection conductor 135A provided on the sheet 115 and connected to the mounting electrode 136B.
　図４（Ｃ）は、コイル部品１０１を外部基板９に実装した状態での側面断面図である。 FIG. 4C is a side sectional view of the coil component 101 mounted on the external substrate 9.
　コイル部品１０１は、外部基板９に実装されて用いられる。外部基板９は、プリント配線基板であり、内蔵グランド電極９１と、部品搭載電極９２とを備えている。外部基板９は、特許請求の範囲に記載の対象物に相当している。部品搭載電極９２は、外部基板９の部品搭載面に形成されている。内蔵グランド電極９１は、外部基板９の部品搭載面に並行するように、外部基板９の内部に形成されており、特許請求の範囲に記載の平面導体に相当している。外部基板９の部品搭載電極９２に対して、はんだ９３を介して実装電極１３６Ａ，１３６Ｂを接合することにより、コイル部品１０１は外部基板９に実装されている。 The coil component 101 is used by being mounted on the external substrate 9. The external substrate 9 is a printed wiring board and includes a built-in ground electrode 91 and a component mounting electrode 92. The external substrate 9 corresponds to the object described in the claims. The component mounting electrode 92 is formed on the component mounting surface of the external substrate 9. The built-in ground electrode 91 is formed inside the external substrate 9 so as to be parallel to the component mounting surface of the external substrate 9, and corresponds to the planar conductor described in the claims. The coil component 101 is mounted on the external substrate 9 by bonding the mounting electrodes 136A and 136B to the component mounting electrode 92 of the external substrate 9 via the solder 93.
　ここで、パターンコイル１０３のコイル導体１３２Ａ，１３３Ａ，１３４Ａおよび接続導体１３５Ａは、第１主面（Ｚ１）側の界面が滑面１３０Ａとして構成されている。また、パターンコイル１０３のコイル導体１３２Ａ，１３３Ａ，１３４Ａおよび接続導体１３５Ａは、第２主面（Ｚ２）側の界面が粗面１３０Ｂとして構成されている。滑面１３０Ａは、例えば表面粗さが１μｍ程度の面である。粗面１３０Ｂは、例えば表面粗さが３～５μｍ程度の面である。 Here, the coil conductors 132A, 133A, 134A and the connection conductor 135A of the pattern coil 103 are configured such that the interface on the first main surface (Z1) side is a smooth surface 130A. Further, the coil conductors 132A, 133A, 134A and the connection conductor 135A of the pattern coil 103 are configured such that the interface on the second main surface (Z2) side is a rough surface 130B. The smooth surface 130A is a surface having a surface roughness of about 1 μm, for example. The rough surface 130B is a surface having a surface roughness of about 3 to 5 μm, for example.
　このようにしてコイル部品１０１を外部基板９に実装した電子機器１００は、コイル部品１０１のパターンコイル１０３が、内蔵グランド電極９１に対向し、コイル導体１３２Ａ，１３３Ａ，１３４Ａの滑面１３０Ａが外部基板９側に向いている。したがって、パターンコイル１０３のコイル導体１３２Ａにおける第１主面（Ｚ１）側の界面の表面粗さは、パターンコイル１０３の全ての界面の表面粗さの平均よりも小さくなっている。 In the electronic device 100 in which the coil component 101 is mounted on the external substrate 9 in this way, the pattern coil 103 of the coil component 101 faces the built-in ground electrode 91, and the smooth surface 130A of the coil conductors 132A, 133A, 134A is the external substrate. It faces 9 side. Therefore, the surface roughness of the interface on the first main surface (Z1) side of the coil conductor 132A of the pattern coil 103 is smaller than the average of the surface roughness of all the interfaces of the pattern coil 103.
　このように、コイル部品１０１のパターンコイル１０３を構成しているので、パターンコイル１０３を内蔵グランド電極９１に対向させていても、パターンコイル１０３を流れる電流の導体損は小さく、コイル部品１０１としてばらつきの少ない優れた高周波特性を実現することができる。 Thus, since the pattern coil 103 of the coil component 101 is configured, even if the pattern coil 103 is opposed to the built-in ground electrode 91, the conductor loss of the current flowing through the pattern coil 103 is small and varies as the coil component 101. It is possible to realize excellent high-frequency characteristics with little.
　なお、本実施形態においては、コイル導体１３２Ａ～１３４Ａを、いずれも、外部基板９側に滑面１３０Ａが向くように構成しているが、コイル導体１３２Ａの他の電極、例えばコイル導体１３３Ａとコイル導体１３４Ａとのうちの一方または両方は、外部基板９側に粗面１３０Ｂが向くように構成してもよい。 In the present embodiment, the coil conductors 132A to 134A are all configured such that the smooth surface 130A faces the external substrate 9, but other electrodes such as the coil conductor 133A and the coil conductor One or both of the conductors 134A may be configured such that the rough surface 130B faces the external substrate 9 side.
　また、本実施形態においては、コイル導体１３２Ａの第２主面（Ｚ２）側を向く面は、粗面１３０Ｂとして構成したが、コイル導体１３２Ａの第１主面（Ｚ１）側を向く面と同様に、第２主面（Ｚ２）側を向く面も滑面１３０Ａとして構成してもよい。 In the present embodiment, the surface facing the second main surface (Z2) side of the coil conductor 132A is configured as the rough surface 130B, but is the same as the surface facing the first main surface (Z1) side of the coil conductor 132A. In addition, the surface facing the second main surface (Z2) may be configured as the smooth surface 130A.
　次に、本発明の第４の実施形態に係るコイル部品および電子機器について説明する。 Next, a coil component and an electronic device according to the fourth embodiment of the present invention will be described.
　図５（Ａ）は、第４の実施形態に係るコイル部品１５１の斜視図であり、図５（Ｂ）は、第４の実施形態に係るコイル部品１５１の要部を拡大して示す分解斜視図である。各図ともに、第１主面（Ｚ１）を上に向けてコイル部品１５１を配置している状態を示している。 FIG. 5A is a perspective view of a coil component 151 according to the fourth embodiment, and FIG. 5B is an exploded perspective view showing an enlarged main part of the coil component 151 according to the fourth embodiment. FIG. Each figure shows a state in which the coil component 151 is arranged with the first main surface (Z1) facing upward.
　コイル部品１５１は、フラットケーブルとして構成されている。また、コイル部品１５１は、積層体１５２と、パターンコイル１５３と、伝送線路１５４と、コネクタ１５５Ａ，１５５Ｂと、を備えている。積層体１５２は、積層方向に直交する方向を長手方向として延伸して構成されており、延伸方向の両端部の第１主面（Ｚ１）に、コネクタ１５５Ａ，１５５Ｂが設けられている。伝送線路１５４は、積層体１５２の内部に、コネクタ１５５Ａとコネクタ１５５Ｂとの間を接続するように設けられている。パターンコイル１５３は、積層体１５２の内部で、伝送線路１５４の中間部に挿入されるように設けられている。 The coil component 151 is configured as a flat cable. The coil component 151 includes a laminated body 152, a pattern coil 153, a transmission line 154, and connectors 155A and 155B. The laminated body 152 is configured by extending a direction perpendicular to the stacking direction as a longitudinal direction, and connectors 155A and 155B are provided on the first main surface (Z1) at both ends in the extending direction. The transmission line 154 is provided in the laminated body 152 so as to connect between the connector 155A and the connector 155B. The pattern coil 153 is provided so as to be inserted into the intermediate portion of the transmission line 154 inside the multilayer body 152.
　図５（Ｂ）に詳細を示すように、積層体１５２は、レジスト層１６１とシート１６２とシート１６３とシート１６４とレジスト層１６５とを備えている。積層体１５２は、レジスト層１６１とシート１６２とシート１６３とシート１６４とレジスト層１６５とを、第１主面（Ｚ１）から第２主面（Ｚ２）にかけて順に積層して構成されている。 As shown in detail in FIG. 5B, the stacked body 152 includes a resist layer 161, a sheet 162, a sheet 163, a sheet 164, and a resist layer 165. The laminated body 152 is configured by laminating a resist layer 161, a sheet 162, a sheet 163, a sheet 164, and a resist layer 165 in order from the first main surface (Z1) to the second main surface (Z2).
　レジスト層１６１は、シート１６２の第１主面（Ｚ１）側に積層されている。 The resist layer 161 is laminated on the first main surface (Z1) side of the sheet 162.
　シート１６２は、絶縁層１７２と、配線層１８２と、を備えている。絶縁層１７２は、樹脂等の絶縁体からなる。配線層１８２は、絶縁層１７２の第１主面（Ｚ１）側に積層されている。配線層１８２は、第１主面（Ｚ１）側を、レジスト層１６１に覆われている。 The sheet 162 includes an insulating layer 172 and a wiring layer 182. The insulating layer 172 is made of an insulator such as resin. The wiring layer 182 is stacked on the first main surface (Z1) side of the insulating layer 172. The wiring layer 182 is covered with the resist layer 161 on the first main surface (Z1) side.
　シート１６３は、絶縁層１７３と、配線層１８３と、ビアホール導体１９３と、を備えている。絶縁層１７３は、樹脂等の絶縁体からなる。配線層１８３は、絶縁層１７３の第１主面（Ｚ１）側に積層されている。配線層１８３は、第１主面（Ｚ１）側を、シート１６２に覆われている。 The sheet 163 includes an insulating layer 173, a wiring layer 183, and a via-hole conductor 193. The insulating layer 173 is made of an insulator such as resin. The wiring layer 183 is stacked on the first main surface (Z1) side of the insulating layer 173. The wiring layer 183 is covered with the sheet 162 on the first main surface (Z1) side.
　シート１６４は、絶縁層１７４と、配線層１８４と、ビアホール導体１９４と、を備えている。絶縁層１７４は、樹脂等の絶縁体からなる。配線層１８４は、絶縁層１７４の第２主面（Ｚ２）側に積層されている。 The sheet 164 includes an insulating layer 174, a wiring layer 184, and a via hole conductor 194. The insulating layer 174 is made of an insulator such as resin. The wiring layer 184 is stacked on the second main surface (Z2) side of the insulating layer 174.
　レジスト層１６５は、シート１６４の第２主面（Ｚ２）側に積層され、配線層１８４の第２主面（Ｚ２）側を覆っている。 The resist layer 165 is laminated on the second main surface (Z2) side of the sheet 164 and covers the second main surface (Z2) side of the wiring layer 184.
　パターンコイル１５３は、インダクタンスを有しており、配線層１８３でスパイラル状に延伸するように設けられている。 The pattern coil 153 has inductance and is provided so as to extend spirally in the wiring layer 183.
　伝送線路１５４は、信号線１８３Ａ，１８３Ｂと、平面グランド電極１８２Ａ，１８２Ｂと、格子状グランド電極１８４Ａと、を備える取りプレート型の伝送線路である。信号線１８３Ａ，１８３Ｂは、配線層１８３に設けられている。平面グランド電極１８２Ａ，１８２Ｂは、配線層１８２に設けられている。格子状グランド電極１８４Ａは、配線層１８４に設けられている。信号線１８３Ａと平面グランド電極１８２Ａとは、絶縁層１７２を介して対向しており、信号線１８３Ａと格子状グランド電極１８４Ａとは、絶縁層１７３，１７４を介して対向している。また、信号線１８３Ｂと平面グランド電極１８２Ｂとは、絶縁層１７２を介して対向しており、信号線１８３Ｂと格子状グランド電極１８４Ａとは、絶縁層１７３，１７４を介して対向している。 The transmission line 154 is a take-up plate type transmission line including signal lines 183A and 183B, planar ground electrodes 182A and 182B, and a grid-like ground electrode 184A. The signal lines 183A and 183B are provided in the wiring layer 183. The planar ground electrodes 182A and 182B are provided on the wiring layer 182. The grid-like ground electrode 184A is provided on the wiring layer 184. The signal line 183A and the planar ground electrode 182A are opposed to each other via the insulating layer 172, and the signal line 183A and the grid-like ground electrode 184A are opposed to each other via the insulating layers 173 and 174. Further, the signal line 183B and the planar ground electrode 182B are opposed to each other via the insulating layer 172, and the signal line 183B and the grid-like ground electrode 184A are opposed to each other via the insulating layers 173 and 174.
　信号線１８３Ａの一端は、パターンコイル１５３の一端に接続されている。信号線１８３Ｂの一端は、ビアホール導体１９３を介して、配線層１８４に設けられている接続導体１８４Ｂに接続されている。接続導体１８４Ｂは、ビアホール導体１９３を介して、パターンコイル１５３の他端に接続されている。 One end of the signal line 183A is connected to one end of the pattern coil 153. One end of the signal line 183B is connected to a connection conductor 184B provided in the wiring layer 184 via a via-hole conductor 193. The connection conductor 184B is connected to the other end of the pattern coil 153 via the via-hole conductor 193.
　図６（Ａ）は、コイル部品１５１を有する電子機器１５０の側面図である。 FIG. 6A is a side view of the electronic device 150 having the coil component 151.
　電子機器１５０は、第１の外部基板１９１と、第２の外部基板１９２と、バッテリーパック１９５と、を備えている。電子機器１５０は、図示しない筐体や他の構成要素をさらに備える電子機器であり、例えば携帯電話やタブレット型端末などである。第１の外部基板１９１と第２の外部基板１９２とは、互いの主面法線方向が並行するように、間隔を空けて配置されている。バッテリーパック１９５は、金属ケースを有しており、第１の外部基板１９１と第２の外部基板１９２との間に配置されている。 The electronic device 150 includes a first external substrate 191, a second external substrate 192, and a battery pack 195. The electronic device 150 is an electronic device that further includes a housing (not shown) and other components, such as a mobile phone or a tablet terminal. The first external substrate 191 and the second external substrate 192 are arranged at an interval so that the principal surface normal directions thereof are parallel to each other. The battery pack 195 has a metal case and is disposed between the first external substrate 191 and the second external substrate 192.
　第１の外部基板１９１は、レセプタクル１９１Ａを有している。第２の外部基板１９２は、レセプタクル１９２Ａを有している。コイル部品１５１は、第１の外部基板１９１のレセプタクル１９１Ａにコネクタ１５５Ａを接続し、第２の外部基板１９２のレセプタクル１９２Ａにコネクタ１５５Ｂを接続することにより、電子機器１５０に取り付けられている。コイル部品１５１は、バッテリーパック１９５を迂回するように曲がった状態で、バッテリーパック１９５の天面側を通過している。 The first external substrate 191 has a receptacle 191A. The second external substrate 192 has a receptacle 192A. The coil component 151 is attached to the electronic device 150 by connecting the connector 155A to the receptacle 191A of the first external substrate 191 and connecting the connector 155B to the receptacle 192A of the second external substrate 192. The coil component 151 passes through the top surface side of the battery pack 195 while being bent so as to bypass the battery pack 195.
　図６（Ｂ）は、電子機器１５０の要部を拡大して示す側面断面図である。 FIG. 6B is a side cross-sectional view showing an enlarged main part of the electronic device 150.
　ここで、パターンコイル１５３、信号線１８３Ａ，１８３Ｂ、および、平面グランド電極１８２Ａ，１８２Ｂは、第１主面（Ｚ１）側の界面が滑面１８０Ａとして構成され、第２主面（Ｚ２）側の界面が粗面１８０Ｂとして構成されている。また、格子状グランド電極１８４Ａ、および、接続導体１８４Ｂは、第２主面（Ｚ２）側の界面が滑面１８０Ａとして構成され、第１主面（Ｚ１）側の界面が粗面１８０Ｂとして構成されている。滑面１８０Ａは、例えば表面粗さが１μｍ程度の面である。粗面１８０Ｂは、例えば表面粗さが３～５μｍ程度の面である。 Here, in the pattern coil 153, the signal lines 183A and 183B, and the planar ground electrodes 182A and 182B, the interface on the first main surface (Z1) side is configured as the smooth surface 180A, and on the second main surface (Z2) side. The interface is configured as a rough surface 180B. Further, in the grid-like ground electrode 184A and the connection conductor 184B, the interface on the second main surface (Z2) side is configured as a smooth surface 180A, and the interface on the first main surface (Z1) side is configured as a rough surface 180B. ing. The smooth surface 180A is a surface having a surface roughness of about 1 μm, for example. The rough surface 180B is a surface having a surface roughness of about 3 to 5 μm, for example.
　このようにしてコイル部品１５１を取り付けているため、コイル部品１５１のパターンコイル１５３は、バッテリーパック１９５の金属ケースに対向し、パターンコイル１５３の滑面１８０Ａがバッテリーパック１９５の金属ケース側に向いている。したがって、バッテリーパック１９５は、特許請求の範囲に記載の対象物に相当しており、バッテリーパック１９５の金属ケースは、特許請求の範囲に記載の平面導体に相当している。 Since the coil component 151 is attached in this way, the pattern coil 153 of the coil component 151 faces the metal case of the battery pack 195, and the smooth surface 180A of the pattern coil 153 faces the metal case side of the battery pack 195. Yes. Therefore, the battery pack 195 corresponds to the object described in the claims, and the metal case of the battery pack 195 corresponds to the planar conductor described in the claims.
　パターンコイル１５３の第１主面（Ｚ１）側の界面の表面粗さは、パターンコイル１５３の第２主面（Ｚ２）側の界面の表面粗さよりも小さい。このため、パターンコイル１５３をバッテリーパック１９５の金属ケースに対向させていても、パターンコイル１５３を流れる電流の導体損は小さい。したがって、コイル部品１５１としてばらつきの少ない優れた高周波特性を実現することができる。 The surface roughness of the interface on the first main surface (Z1) side of the pattern coil 153 is smaller than the surface roughness of the interface on the second main surface (Z2) side of the pattern coil 153. For this reason, even if the pattern coil 153 is opposed to the metal case of the battery pack 195, the conductor loss of the current flowing through the pattern coil 153 is small. Therefore, excellent high frequency characteristics with little variation can be realized as the coil component 151.
１，５１，１０１，１５１…コイル部品
２，５２，１０２，１５２…積層体
３，５３，１０３，１５３…パターンコイル
１１，１２，１３，１４，１５，１１１，１１２，１１３，１１４，１１５，１６２，１６３，１６４…シート
２１，２２，２３，２４，２５，７１，１２１，１２２，１２３，１２４，１２５，１７２，１７３，１７４…絶縁層
３１，３２，３３，３４，３５，８１，１３２，１３３，１３４，１３５，１８２，１８３，１８４…配線層
３０Ａ，８０Ａ，１３０Ａ，１８０Ａ…滑面
３０Ｂ，８０Ｂ，１３０Ｂ，１８０Ｂ…粗面
３１Ａ，３１Ｂ，８１Ａ，８１Ｂ，１３６Ａ，１３６Ｂ…実装電極
３２Ａ，３５Ｂ，１３５Ａ，１８４Ｂ…接続導体
３３Ａ，３４Ａ，３５Ａ，１３２Ａ，１３３Ａ，１３４Ａ…コイル導体
４１，４２，４３，４４，１４２，１４３，１４４，１９３，１９４…ビアホール導体
９，１９１，１９２…外部基板
９１…内蔵グランド電極
９２…部品搭載電極
１０，５０，１００，１５０…電子機器
７２，１６１，１６５…レジスト層
１３７…マーカー
１５４…伝送線路
１５５Ａ，１５５Ｂ…コネクタ
１８２Ａ，１８２Ｂ…平面グランド電極
１８３Ａ，１８３Ｂ…信号線
１８４Ａ…格子状グランド電極
１９１Ａ，１９２Ａ…レセプタクル
１９５…バッテリーパック 1, 51, 101, 151 ... Coil parts 2, 52, 102, 152 ... Laminate 3, 53, 103, 153 ... Pattern coils 11, 12, 13, 14, 15, 111, 112, 113, 114, 115, 162, 163, 164 ... sheets 21, 22, 23, 24, 25, 71, 121, 122, 123, 124, 125, 172, 173, 174 ... insulating layers 31, 32, 33, 34, 35, 81, 132 133, 134, 135, 182, 183, 184 ... wiring layers 30A, 80A, 130A, 180A ... smooth surfaces 30B, 80B, 130B, 180B ... rough surfaces 31A, 31B, 81A, 81B, 136A, 136B ... mounting electrodes 32A , 35B, 135A, 184B ... connecting conductors 33A, 34A, 35A, 132A, 133A, 134A ... coil conductor 41, 2, 43, 44, 142, 143, 144, 193, 194 ... via- hole conductors 9, 191, 192 ... external substrate 91 ... built-in ground electrode 92 ... component mounting electrodes 10, 50, 100, 150 ... electronic devices 72, 161, 165... Resist layer 137. Marker 154. Transmission line 155 A, 155 B.

Claims (5)

  1. 　絶縁層と配線層とが積層されている構成の積層体と、
    　前記積層体の積層方向を軸とするコイル状であり、前記配線層に設けられている少なくとも一つ以上のコイル導体パターンと、
    　を備え、
    　前記コイル導体パターンを平面導体に対向させて利用されるコイル部品であって、
    　前記積層体に含まれる前記コイル導体パターンの前記平面導体に並行する全ての界面のうちの、前記平面導体に最も近接する界面の表面粗さは、前記全ての界面の平均の表面粗さよりも小さいことを特徴とする、
    　コイル部品。     A laminate in which an insulating layer and a wiring layer are laminated;
    A coil shape with the lamination direction of the laminate as an axis, and at least one coil conductor pattern provided in the wiring layer;
    With
    A coil component used by facing the planar conductor to the coil conductor pattern,
    Of all the interfaces parallel to the planar conductor of the coil conductor pattern included in the laminate, the surface roughness of the interface closest to the planar conductor is smaller than the average surface roughness of all the interfaces. It is characterized by
    Coil parts.
  2. 　前記積層体は、金属膜が接合されたシートを含む複数のシートを積層してなり、
    　前記コイル導体パターンは、前記金属膜をパターニングしてなり、
    　前記金属膜は、前記シートに接合された界面の表面粗さが、前記シートに接合された界面とは反対側の界面よりも大きい、
    　請求項１に記載のコイル部品。     The laminate is formed by laminating a plurality of sheets including a sheet to which a metal film is bonded,
    The coil conductor pattern is formed by patterning the metal film,
    The metal film has a larger surface roughness of the interface bonded to the sheet than the interface opposite to the interface bonded to the sheet.
    The coil component according to claim 1.
  3. 　前記平面導体はグランドに接続される導体である、
    　請求項１または２に記載のコイル部品。     The planar conductor is a conductor connected to ground;
    The coil component according to claim 1 or 2.
  4. 　前記積層体の前記平面導体に近接する主面に、実装電極が形成される、
    　請求項１～３のいずれかに記載のコイル部品。     A mounting electrode is formed on a main surface of the laminate that is close to the planar conductor.
    The coil component according to any one of claims 1 to 3.
  5. 　請求項１～４のいずれかに記載のコイル部品と、前記コイル部品を配置する対象物と、を備え、
    　前記対象物は、前記平面導体を有する、電子機器。     A coil component according to any one of claims 1 to 4, and an object on which the coil component is arranged,
    The object is an electronic device having the planar conductor.
PCT/JP2013/082927 2013-01-22 2013-12-09 Coil component and electronic device WO2014115433A1 (en)

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US10796837B2 (en) 2016-06-07 2020-10-06 Murata Manufacturing Co., Ltd. Electronic component, diaphragm, and electronic device
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US10515753B2 (en) * 2016-07-14 2019-12-24 Samsung Electro-Mechanics Co., Ltd. Coil component and method of manufacturing the same
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