WO2014115433A1 - Composant de bobine et dispositif électronique - Google Patents

Composant de bobine et dispositif électronique Download PDF

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Publication number
WO2014115433A1
WO2014115433A1 PCT/JP2013/082927 JP2013082927W WO2014115433A1 WO 2014115433 A1 WO2014115433 A1 WO 2014115433A1 JP 2013082927 W JP2013082927 W JP 2013082927W WO 2014115433 A1 WO2014115433 A1 WO 2014115433A1
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WO
WIPO (PCT)
Prior art keywords
coil
conductor
coil component
sheet
main surface
Prior art date
Application number
PCT/JP2013/082927
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English (en)
Japanese (ja)
Inventor
用水邦明
Original Assignee
株式会社村田製作所
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Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN201390000873.1U priority Critical patent/CN204808996U/zh
Publication of WO2014115433A1 publication Critical patent/WO2014115433A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices

Definitions

  • the present invention relates to a coil component configured by providing a coil conductor pattern inside a substrate and an electronic device to which the coil component is attached.
  • Some coil parts are configured by providing a coil conductor pattern between layers of a resin multilayer substrate (see Patent Document 1).
  • a coil component is formed by etching a metal film on a resin sheet having a metal film affixed on one side to form a coil conductor pattern, and laminating a plurality of sheets and thermocompression bonding. Can be manufactured.
  • one main surface attached to the sheet is a rough surface having a large surface roughness and the other main surface is a smooth surface having a small surface roughness.
  • the bonding strength of the metal film to the sheet is high.
  • an object of the present invention is to provide a coil component that can prevent loss of current flowing through the coil conductor pattern and has excellent high-frequency characteristics, and an electronic device to which the coil component is attached.
  • the coil component of the present invention is a laminated body having a configuration in which an insulating layer and a wiring layer are laminated, and a coil shape having the lamination direction of the laminated body as an axis, and at least one provided in the wiring layer
  • the surface roughness of the interface closest to the planar conductor is smaller than the average surface roughness of all the interfaces.
  • the surface roughness of the interface closest to the planar conductor is smaller than the average surface roughness of all the interfaces.
  • the laminate is formed by laminating a plurality of sheets including a sheet to which a metal film is bonded, the coil conductor pattern is formed by patterning the metal film, It is preferable that the surface roughness of the interface bonded to the sheet is larger than the interface opposite to the interface bonded to the sheet.
  • one of the two interfaces of the metal film is a rough surface and the other interface is a smooth surface. Since the metal film is bonded to the sheet on the rough surface side, the bonding strength of the metal film in the sheet bonded with the metal film is improved.
  • the planar conductor may be a conductor connected to the ground.
  • a mounting electrode may be formed on a main surface of the multilayer body that is close to the planar conductor.
  • the electronic device of the present invention may include the above-described coil component and an object on which the coil component is disposed, and the object may include the planar conductor.
  • the surface roughness of the interface closest to the planar conductor is smaller than the average surface roughness of all the interfaces. To do. That is, since the interface closest to the planar conductor among all the interfaces parallel to the planar conductor of the coil conductor pattern is configured as a smooth surface, loss of current flowing through the coil conductor pattern can be reduced, and good high frequency The characteristics can be realized.
  • first main surface (Z1) the surface of the coil component that faces the external substrate
  • second main surface (Z2) the surface opposite to the first main surface (Z1) of the coil component
  • FIG. 1A is a perspective view of the coil component 1 according to the first embodiment, showing a state in which the coil component 1 is arranged with the first main surface (Z1) side facing up.
  • the coil component 1 includes a laminated body 2 and a pattern coil 3.
  • the laminate 2 is a hexahedron, and is made of a highly thermoplastic resin such as a liquid crystal polymer, another thermoplastic resin, a low-temperature sintered ceramic, or the like.
  • mounting electrodes 31A and 31B are formed on the first main surface (Z1), and the coil component 1 has a surface mounting type configuration.
  • the pattern coil 3 is configured as a laminated coil and is provided inside the laminated body 2.
  • FIG. 1 (B) is an exploded perspective view of the coil component 1 and shows a state where the coil component 1 is arranged with the first main surface (Z1) side facing up.
  • the laminate 2 includes sheets 11, 12, 13, 14, and 15.
  • the laminate 2 is configured by laminating sheets 11 to 15 in order from the first main surface (Z1) to the second main surface (Z2).
  • the sheet 11 includes an insulating layer 21, a wiring layer 31, and a via-hole conductor 41.
  • the insulating layer 21 is made of an insulator such as resin, and has an outer shape that is rectangular when viewed in plan from the stacking direction.
  • the wiring layer 31 is stacked on the first main surface (Z1) side of the insulating layer 21.
  • the via-hole conductor 41 penetrates the insulating layer 21 in the stacking direction.
  • mounting electrodes 31A and 31B are provided on the wiring layer 31, mounting electrodes 31A and 31B are provided. The mounting electrodes 31A and 31B are connected to electrodes on an external substrate (not shown).
  • the sheet 12 includes an insulating layer 22, a wiring layer 32, and a via hole conductor 42.
  • the insulating layer 22 is made of an insulator such as a resin, and has a rectangular outer shape in plan view from the stacking direction.
  • the wiring layer 32 is stacked on the first main surface (Z1) side of the insulating layer 22.
  • the via-hole conductor 42 penetrates the insulating layer 22 in the stacking direction.
  • the sheet 13 includes an insulating layer 23, a wiring layer 33, and a via-hole conductor 43.
  • the insulating layer 23 is made of an insulator such as resin, and has a rectangular outer shape in plan view from the stacking direction.
  • the wiring layer 33 is stacked on the first main surface (Z1) side of the insulating layer 23.
  • the via-hole conductor 43 penetrates the insulating layer 23 in the stacking direction.
  • the sheet 14 includes an insulating layer 24, a wiring layer 34, and a via hole conductor 44.
  • the insulating layer 24 is made of an insulator such as resin, and has an outer shape that is rectangular when viewed in plan from the stacking direction.
  • the wiring layer 34 is stacked on the first main surface (Z1) side of the insulating layer 24.
  • the via-hole conductor 44 penetrates the insulating layer 24 in the stacking direction.
  • the sheet 15 includes an insulating layer 25 and a wiring layer 35.
  • the insulating layer 25 is made of an insulator such as a resin, and has a rectangular outer shape in plan view from the stacking direction.
  • the wiring layer 35 is stacked on the first main surface (Z1) side of the insulating layer 25.
  • the pattern coil 3 includes a coil conductor 33A, a coil conductor 34A, and a coil conductor 35A, and has an inductance.
  • the coil conductor 33 ⁇ / b> A is provided in the wiring layer 33 of the sheet 13 and extends so as to rotate along the outer edge of the sheet 13.
  • the coil conductor 34 ⁇ / b> A is provided in the wiring layer 34 of the sheet 14 and extends so as to rotate along the outer edge of the sheet 14.
  • the coil conductor 35 ⁇ / b> A is provided in the wiring layer 35 of the sheet 15 and extends so as to rotate along the outer edge of the sheet 15.
  • the coil conductor 33 ⁇ / b> A, the coil conductor 34 ⁇ / b> A, and the coil conductor 35 ⁇ / b> A are connected via via-hole conductors 43 and 44 so as to have a coil shape with the stacking direction of the multilayer body 2 as an axis.
  • the coil conductor 33 ⁇ / b> A, the coil conductor 34 ⁇ / b> A, and the coil conductor 35 ⁇ / b> A are provided so as to overlap each other in a loop shape when viewed from the stacking direction of the multilayer body 2.
  • the coil conductor 33A of the pattern coil 3 is connected to the mounting electrode 31A of the sheet 11 via the via-hole conductors 41 and 42.
  • connection conductor 32 ⁇ / b> A is provided on the wiring layer 32 of the sheet 12.
  • a connection conductor 35 ⁇ / b> B is provided on the wiring layer 35 of the sheet 15.
  • the connection conductors 32A, 35B are connected via via-hole conductors 42, 43, 44.
  • the connection conductor 32A is connected to the mounting electrode 31B of the sheet 11 via the via-hole conductor 41.
  • the connection conductor 35B is connected to the coil conductor 35A of the pattern coil 3. Therefore, the mounting electrode 31B and the pattern coil 3 are connected via the connection conductors 32A and 35B.
  • the coil component 1 has a surface mount type (LGA type) configuration in which the mounting electrodes 31A and 31B are provided on the first main surface (Z1) of the multilayer body 2. Therefore, the area occupied by the external substrate for mounting the coil component 1 is as small as the area of the coil component 1. Further, when a shield case is provided so as to cover the coil component 1, even if there is not enough clearance between the coil component 1 and the shield case, a short circuit occurs in the mounting electrodes 31A and 31B due to contact with the shield case. There is no.
  • LGA type surface mount type
  • FIG. 2 is a side cross-sectional view for explaining an example of the manufacturing method of the coil component 1 and shows a state in which the respective parts are arranged with the surface on the second main surface (Z2) side facing up.
  • the coil component 1 is manufactured by providing a large number of parts to be the coil components 1 on a large sheet, forming the plurality of coil components 1 at a time, and then cutting out each coil component 1.
  • sheets 11 to 15 are prepared in the first step shown in FIG.
  • Each of the sheets 11 to 15 includes the insulating layers 21 to 25 and the wiring layers 31 to 35 as described above.
  • the wiring layers 31 to 35 are in the state of a metal film such as a copper foil that is previously attached to the entire surface of one side of the insulating layers 21 to 25.
  • the interfaces of the wiring layers 31 to 35 configured as metal films are configured as a smooth surface 30A and a rough surface 30B.
  • the smooth surface 30A is a surface having a surface roughness of about 1 ⁇ m, for example.
  • the rough surface 30B is a surface having a surface roughness of about 3 to 5 ⁇ m, for example.
  • As the surface roughness the arithmetic average roughness defined by [JIS B 0601-2001] is adopted.
  • the wiring layers 31 to 35 are bonded to the insulating layers 21 to 25 through the rough surface 30B, respectively. As a result, the wiring layers 31 to 35 and the insulating layers 21 to 25 are bonded with stronger bonding strength than when the wiring layers 31 to 25 are bonded via the smooth surface 30A.
  • the metal films constituting the wiring layers 31 to 35 of the sheets 11 to 15 are patterned by etching or the like.
  • the mounting electrodes 31A and 31B, the coil conductors 33A to 35A, and the connection conductors 32A and 35B are formed.
  • a metal film is not penetrated through the insulating layers 21 to 25 of the sheets 11 to 14 by a laser or the like but a through hole is formed through the insulating layer, and then a conductive material such as a conductive paste is provided inside the through hole.
  • the via-hole conductors 41 to 44 are formed.
  • the sheets 11 to 15 are overlapped with the wiring layers 31 to 35 facing the first main surface (Z1) side. That is, the sheets 11 to 15 are overlapped with the smooth surfaces 30A of the wiring layers 31 to 35 facing the first main surface (Z1). Then, the sheets 11 to 15 are thermocompression bonded, and thereby the sheets 11 to 15 are joined to each other. In this way, as shown in FIG. 2C, the coil component 1 in which the pattern coil 3 is provided in the laminated body 2 is manufactured.
  • the external substrate 9 is a printed wiring board and includes a built-in ground electrode 91 and a component mounting electrode 92.
  • the external substrate 9 corresponds to an object in the electronic device described in the claims.
  • the component mounting electrode 92 is formed on the component mounting surface of the external substrate 9.
  • the built-in ground electrode 91 is formed inside the external substrate 9 so as to be parallel to the component mounting surface of the external substrate 9, and corresponds to the planar conductor described in the claims.
  • the coil component 1 is mounted on the external substrate 9 by bonding the mounting electrodes 31 ⁇ / b> A and 31 ⁇ / b> B to the component mounting electrode 92 of the external substrate 9 via the solder 93.
  • the pattern coil 3 of the coil component 1 faces the built-in ground electrode 91.
  • the coil conductors 33A to 35A each have the smooth surface 30A facing the external substrate 9 side.
  • the surface roughness of the interface on the first main surface (Z1) side of the coil conductor 33A closest in parallel to the built-in ground electrode 91 is the surface roughness of all the interfaces parallel to the built-in ground electrode 91 of the coil conductors 33A to 35A. It becomes smaller than the average of the surface roughness.
  • the [average surface roughness of all interfaces parallel to the built-in ground electrode 91 of the coil conductors 33A to 35A] can be determined as follows, for example. That is, the arithmetic mean roughness of the first principal surface (Z1) side surfaces of the coil conductors 33A to 35A is Ra11, Ra21, Ra31, and the arithmetic average of the surfaces of the coil conductors 33A to 35A on the second principal surface (Z2) side.
  • the roughness is Ra12, Ra22, Ra32, the areas of the coil conductors 33A to 35A are A1, A2, and A3, and [average surface roughness of all interfaces parallel to the built-in ground electrode 91 of the coil conductors 33A to 35A] If Ra ′, it is expressed by the following equation.
  • Ra ′ (Ra11 ⁇ A1 + Ra12 ⁇ A1 + Ra21 ⁇ A2 + Ra22 ⁇ A2 + Ra31 ⁇ A3 + Ra32 ⁇ A3) / (A1 + A1 + A2 + A2 + A3 + A3) Therefore, the [surface roughness of the interface on the first main surface (Z1) side of the coil conductor 33A closest to the built-in ground electrode 91 in parallel] is [all of the surface parallel to the built-in ground electrode 91 of the coil conductors 33A to 35A]. Smaller than the average of the surface roughness of the interface] means that the following equation holds.
  • the coil conductors 33A to 35A, the mounting electrodes 31A and 31B, and the connection conductors 32A and 35B all have a smooth surface 30A on the external substrate 9, that is, on the first main surface (Z1) side.
  • the other electrode of the coil conductor 33A for example, one or both of the coil conductor 34A and the coil conductor 35A may be configured such that the rough surface 30B faces the external substrate 9 side.
  • the mounting electrodes 31A and 31B and the connection conductors 32A and 35B may be configured such that the rough surface 30B faces the external substrate 9 side.
  • the surface facing the second main surface (Z2) side of the coil conductor 33A is configured as the rough surface 30B, but is the same as the surface facing the first main surface (Z1) side of the coil conductor 33A.
  • the surface facing the second main surface (Z2) may also be configured as the smooth surface 30A.
  • FIG. 3A is a plan view of the coil component 51 according to the second embodiment as viewed from the first main surface (Z1) side.
  • FIG. 3B is a side sectional view of the coil component 51 mounted on the external substrate.
  • the coil component 51 includes a laminated body 52 and a pattern coil 53.
  • the pattern coil 53 is provided as a planar coil and is provided inside the stacked body 52.
  • the laminate 52 includes an insulating layer 71, a wiring layer 81, and a resist layer 72.
  • the insulating layer 71 is made of an insulator such as a resin, and has a rectangular outer shape in plan view from the stacking direction.
  • the wiring layer 81 is stacked on the first main surface (Z1) side.
  • the resist layer 72 is laminated on the first main surface (Z1) side of the insulating layer 71 and the wiring layer 81.
  • the pattern coil 53 is configured in the wiring layer 81 as a coil conductor extending in a spiral shape when viewed from the stacking direction of the stacked body 52, and has an inductance.
  • the aforementioned resist layer 72 is provided with openings at positions overlapping with both ends of the pattern coil 53 when viewed from the stacking direction of the stacked body 52, and the resist coil 72 has the pattern coil 53 on the first main surface (Z1) side. Both ends are exposed. Both ends of the pattern coil 53 exposed from the resist layer 72 to the first main surface (Z1) side are configured as mounting electrodes 81A and 81B.
  • the interface on the first main surface (Z1) side of the pattern coil 53 is configured as a smooth surface 80A.
  • the interface on the second main surface (Z2) side of the pattern coil 53 is configured as a rough surface 80B.
  • the smooth surface 80A is a surface having a surface roughness of about 1 ⁇ m, for example.
  • the rough surface 80B is a surface having a surface roughness of about 3 to 5 ⁇ m, for example.
  • As the surface roughness the arithmetic average roughness defined by [JIS B 0601-2001] is adopted.
  • the pattern coil 53 is bonded to the insulating layer 71 through the rough surface 80B. Thereby, the pattern coil 53 and the insulating layer 71 are joined with stronger joining strength than the case where they are joined via the smooth surface 80A.
  • the coil component 51 is mounted on the external substrate 9 and used as shown in FIG.
  • the external substrate 9 is a printed wiring board and includes a built-in ground electrode 91 and a component mounting electrode 92.
  • the external substrate 9 corresponds to the object described in the claims.
  • the component mounting electrode 92 is formed on the component mounting surface of the external substrate 9.
  • the built-in ground electrode 91 is formed inside the external substrate 9 so as to be parallel to the component mounting surface of the external substrate 9, and corresponds to the planar conductor described in the claims.
  • the coil component 51 is mounted on the external substrate 9 by bonding the mounting electrodes 81A and 81B to the component mounting electrode 92 of the external substrate 9 via the solder 93.
  • the pattern coil 53 of the coil component 51 faces the built-in ground electrode 91 and the smooth surface 80A faces the external substrate 9 side. Accordingly, the surface roughness of the interface on the first main surface (Z1) side of the pattern coil 53 is the surface roughness of both interfaces of the first main surface (Z1) side and the second main surface (Z2) side of the pattern coil 53. It is smaller than the average.
  • the pattern coil 53 of the coil component 51 is configured as a planar coil, the entire surface of the pattern coil 53 facing the built-in ground electrode 91 becomes the smooth surface 80A, and the conductor loss of the current flowing through the pattern coil 53 is small. Become. And the high frequency characteristic with few dispersion
  • FIG. 4A is a perspective view of the coil component 101 according to the third embodiment, showing a state in which the coil component 101 is arranged with the second main surface (Z2) facing upward.
  • the coil component 101 includes a laminated body 102 and a pattern coil 103.
  • the stacked body 102 is provided with mounting electrodes 136A and 136B so as to cover the outer surfaces near both ends in the direction orthogonal to the stacking direction, and the coil component 101 is configured as a chip type.
  • a marker 137 is provided on the second main surface (Z2) of the stacked body 102 so that the mounting direction can be determined.
  • the pattern coil 103 is configured as a laminated coil, and is provided inside the laminated body 102.
  • FIG. 4B is an exploded perspective view of the coil component 101.
  • the laminate 102 includes sheets 111, 112, 113, 114, and 115.
  • the laminate 102 is configured by laminating sheets 111 to 115 in order from the first main surface (Z1) to the second main surface (Z2).
  • the sheet 111 includes an insulating layer 121.
  • the insulating layer 121 is made of an insulator such as resin, and has an outer shape that is rectangular when viewed in plan from the stacking direction.
  • the sheet 112 includes an insulating layer 122, a wiring layer 132, and a via-hole conductor 142.
  • the insulating layer 122 is made of an insulator such as resin, and has a rectangular outer shape in plan view from the stacking direction.
  • the wiring layer 132 is stacked on the first main surface (Z1) side of the insulating layer 122.
  • the via-hole conductor 142 penetrates the insulating layer 122 in the stacking direction.
  • the sheet 113 includes an insulating layer 123, a wiring layer 133, and a via-hole conductor 143.
  • the insulating layer 123 is made of an insulator such as resin, and has a rectangular outer shape in plan view from the stacking direction.
  • the wiring layer 133 is stacked on the first main surface (Z1) side of the insulating layer 123.
  • the via-hole conductor 143 passes through the insulating layer 123 in the stacking direction.
  • the sheet 114 includes an insulating layer 124, a wiring layer 134, and a via hole conductor 144.
  • the insulating layer 124 is made of an insulator such as resin, and has a rectangular outer shape in plan view from the stacking direction.
  • the wiring layer 134 is stacked on the first main surface (Z1) side of the insulating layer 124.
  • the via-hole conductor 144 penetrates the insulating layer 124 in the stacking direction.
  • the sheet 115 includes an insulating layer 125 and a wiring layer 135.
  • the insulating layer 125 is made of an insulator such as resin, and has a rectangular outer shape in plan view from the stacking direction.
  • the wiring layer 135 is stacked on the first main surface (Z1) side of the insulating layer 125.
  • the pattern coil 103 includes a coil conductor 132A, a coil conductor 133A, and a coil conductor 134A, and has an inductance.
  • the coil conductor 132 ⁇ / b> A is provided in the wiring layer 132 of the sheet 112 and extends so as to rotate along the outer edge of the sheet 112.
  • the coil conductor 133 ⁇ / b> A is provided on the wiring layer 133 of the sheet 113 and extends so as to rotate along the outer edge of the sheet 113.
  • the coil conductor 134 ⁇ / b> A is provided in the wiring layer 134 of the sheet 114 and extends so as to rotate along the outer edge of the sheet 114.
  • the coil conductor 132 ⁇ / b> A, the coil conductor 133 ⁇ / b> A, and the coil conductor 134 ⁇ / b> A are connected via via-hole conductors 142 and 143 so as to have a coil shape with the stacking direction of the multilayer body 102 as an axis.
  • the coil conductor 132A, the coil conductor 133A, and the coil conductor 134A are provided so as to overlap each other in a loop shape when viewed from the stacking direction of the stacked body 102.
  • the coil conductor 132A is drawn out to the edge of the sheet 112 and connected to the mounting electrode 136A.
  • the coil conductor 134A is drawn to the sheet 115 via the via-hole conductor 144, and is drawn to the edge of the sheet 115 by the connection conductor 135A provided on the sheet 115 and connected to the mounting electrode 136B.
  • FIG. 4C is a side sectional view of the coil component 101 mounted on the external substrate 9.
  • the coil component 101 is used by being mounted on the external substrate 9.
  • the external substrate 9 is a printed wiring board and includes a built-in ground electrode 91 and a component mounting electrode 92.
  • the external substrate 9 corresponds to the object described in the claims.
  • the component mounting electrode 92 is formed on the component mounting surface of the external substrate 9.
  • the built-in ground electrode 91 is formed inside the external substrate 9 so as to be parallel to the component mounting surface of the external substrate 9, and corresponds to the planar conductor described in the claims.
  • the coil component 101 is mounted on the external substrate 9 by bonding the mounting electrodes 136A and 136B to the component mounting electrode 92 of the external substrate 9 via the solder 93.
  • the coil conductors 132A, 133A, 134A and the connection conductor 135A of the pattern coil 103 are configured such that the interface on the first main surface (Z1) side is a smooth surface 130A. Further, the coil conductors 132A, 133A, 134A and the connection conductor 135A of the pattern coil 103 are configured such that the interface on the second main surface (Z2) side is a rough surface 130B.
  • the smooth surface 130A is a surface having a surface roughness of about 1 ⁇ m, for example.
  • the rough surface 130B is a surface having a surface roughness of about 3 to 5 ⁇ m, for example.
  • the pattern coil 103 of the coil component 101 faces the built-in ground electrode 91, and the smooth surface 130A of the coil conductors 132A, 133A, 134A is the external substrate. It faces 9 side. Therefore, the surface roughness of the interface on the first main surface (Z1) side of the coil conductor 132A of the pattern coil 103 is smaller than the average of the surface roughness of all the interfaces of the pattern coil 103.
  • the pattern coil 103 of the coil component 101 is configured, even if the pattern coil 103 is opposed to the built-in ground electrode 91, the conductor loss of the current flowing through the pattern coil 103 is small and varies as the coil component 101. It is possible to realize excellent high-frequency characteristics with little.
  • the coil conductors 132A to 134A are all configured such that the smooth surface 130A faces the external substrate 9, but other electrodes such as the coil conductor 133A and the coil conductor One or both of the conductors 134A may be configured such that the rough surface 130B faces the external substrate 9 side.
  • the surface facing the second main surface (Z2) side of the coil conductor 132A is configured as the rough surface 130B, but is the same as the surface facing the first main surface (Z1) side of the coil conductor 132A.
  • the surface facing the second main surface (Z2) may be configured as the smooth surface 130A.
  • FIG. 5A is a perspective view of a coil component 151 according to the fourth embodiment
  • FIG. 5B is an exploded perspective view showing an enlarged main part of the coil component 151 according to the fourth embodiment.
  • FIG. Each figure shows a state in which the coil component 151 is arranged with the first main surface (Z1) facing upward.
  • the coil component 151 is configured as a flat cable.
  • the coil component 151 includes a laminated body 152, a pattern coil 153, a transmission line 154, and connectors 155A and 155B.
  • the laminated body 152 is configured by extending a direction perpendicular to the stacking direction as a longitudinal direction, and connectors 155A and 155B are provided on the first main surface (Z1) at both ends in the extending direction.
  • the transmission line 154 is provided in the laminated body 152 so as to connect between the connector 155A and the connector 155B.
  • the pattern coil 153 is provided so as to be inserted into the intermediate portion of the transmission line 154 inside the multilayer body 152.
  • the stacked body 152 includes a resist layer 161, a sheet 162, a sheet 163, a sheet 164, and a resist layer 165.
  • the laminated body 152 is configured by laminating a resist layer 161, a sheet 162, a sheet 163, a sheet 164, and a resist layer 165 in order from the first main surface (Z1) to the second main surface (Z2).
  • the resist layer 161 is laminated on the first main surface (Z1) side of the sheet 162.
  • the sheet 162 includes an insulating layer 172 and a wiring layer 182.
  • the insulating layer 172 is made of an insulator such as resin.
  • the wiring layer 182 is stacked on the first main surface (Z1) side of the insulating layer 172.
  • the wiring layer 182 is covered with the resist layer 161 on the first main surface (Z1) side.
  • the sheet 163 includes an insulating layer 173, a wiring layer 183, and a via-hole conductor 193.
  • the insulating layer 173 is made of an insulator such as resin.
  • the wiring layer 183 is stacked on the first main surface (Z1) side of the insulating layer 173.
  • the wiring layer 183 is covered with the sheet 162 on the first main surface (Z1) side.
  • the sheet 164 includes an insulating layer 174, a wiring layer 184, and a via hole conductor 194.
  • the insulating layer 174 is made of an insulator such as resin.
  • the wiring layer 184 is stacked on the second main surface (Z2) side of the insulating layer 174.
  • the resist layer 165 is laminated on the second main surface (Z2) side of the sheet 164 and covers the second main surface (Z2) side of the wiring layer 184.
  • the pattern coil 153 has inductance and is provided so as to extend spirally in the wiring layer 183.
  • the transmission line 154 is a take-up plate type transmission line including signal lines 183A and 183B, planar ground electrodes 182A and 182B, and a grid-like ground electrode 184A.
  • the signal lines 183A and 183B are provided in the wiring layer 183.
  • the planar ground electrodes 182A and 182B are provided on the wiring layer 182.
  • the grid-like ground electrode 184A is provided on the wiring layer 184.
  • the signal line 183A and the planar ground electrode 182A are opposed to each other via the insulating layer 172, and the signal line 183A and the grid-like ground electrode 184A are opposed to each other via the insulating layers 173 and 174.
  • the signal line 183B and the planar ground electrode 182B are opposed to each other via the insulating layer 172, and the signal line 183B and the grid-like ground electrode 184A are opposed to each other via the insulating layers 173 and 174.
  • One end of the signal line 183A is connected to one end of the pattern coil 153.
  • One end of the signal line 183B is connected to a connection conductor 184B provided in the wiring layer 184 via a via-hole conductor 193.
  • the connection conductor 184B is connected to the other end of the pattern coil 153 via the via-hole conductor 193.
  • FIG. 6A is a side view of the electronic device 150 having the coil component 151.
  • the electronic device 150 includes a first external substrate 191, a second external substrate 192, and a battery pack 195.
  • the electronic device 150 is an electronic device that further includes a housing (not shown) and other components, such as a mobile phone or a tablet terminal.
  • the first external substrate 191 and the second external substrate 192 are arranged at an interval so that the principal surface normal directions thereof are parallel to each other.
  • the battery pack 195 has a metal case and is disposed between the first external substrate 191 and the second external substrate 192.
  • the first external substrate 191 has a receptacle 191A.
  • the second external substrate 192 has a receptacle 192A.
  • the coil component 151 is attached to the electronic device 150 by connecting the connector 155A to the receptacle 191A of the first external substrate 191 and connecting the connector 155B to the receptacle 192A of the second external substrate 192.
  • the coil component 151 passes through the top surface side of the battery pack 195 while being bent so as to bypass the battery pack 195.
  • FIG. 6B is a side cross-sectional view showing an enlarged main part of the electronic device 150.
  • the interface on the first main surface (Z1) side is configured as the smooth surface 180A, and on the second main surface (Z2) side.
  • the interface is configured as a rough surface 180B.
  • the interface on the second main surface (Z2) side is configured as a smooth surface 180A
  • the interface on the first main surface (Z1) side is configured as a rough surface 180B.
  • the smooth surface 180A is a surface having a surface roughness of about 1 ⁇ m, for example.
  • the rough surface 180B is a surface having a surface roughness of about 3 to 5 ⁇ m, for example.
  • the pattern coil 153 of the coil component 151 faces the metal case of the battery pack 195, and the smooth surface 180A of the pattern coil 153 faces the metal case side of the battery pack 195. Yes. Therefore, the battery pack 195 corresponds to the object described in the claims, and the metal case of the battery pack 195 corresponds to the planar conductor described in the claims.
  • the surface roughness of the interface on the first main surface (Z1) side of the pattern coil 153 is smaller than the surface roughness of the interface on the second main surface (Z2) side of the pattern coil 153. For this reason, even if the pattern coil 153 is opposed to the metal case of the battery pack 195, the conductor loss of the current flowing through the pattern coil 153 is small. Therefore, excellent high frequency characteristics with little variation can be realized as the coil component 151.
  • mounting electrodes 32A , 35B, 135A, 184B ... connecting conductors 33A, 34A, 35A, 132A, 133A, 134A ... coil conductor 41, 2, 43, 44, 142, 143, 144, 193, 194 ... via-hole conductors 9, 191, 192 ... external substrate 91 ... built-in ground electrode 92 ... component mounting electrodes 10, 50, 100, 150 ... electronic devices 72, 161, 165... Resist layer 137.
  • Marker 154 Transmission line 155 A, 155 B.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

Cette invention concerne un composant de bobine (1) doté d'un corps stratifié et de conducteurs de bobine (33A, 34A, 35A). Ledit corps stratifié (2) est formé par stratification de couches isolantes (21 à 25) et de couches de câblage (31 à 35). Les conducteurs de bobine (33A, 34A, 35A) présentent une forme bobinée, le sens de la stratification du corps stratifié (2) formant leur axe, et ils sont disposés dans les couches de câblage (33 à 35). Ledit composant de bobine (1) est utilisé avec le conducteur de bobine (33A) orienté vers l'électrode de référence intégrée (91) d'un substrat externe (9). La rugosité de surface de l'interface du conducteur de bobine le plus proche (33A) parallèle à l'électrode de référence intégrée (91) est inférieure à la rugosité de surface de toutes les interfaces des conducteurs de bobine (33A, 34A, 25A) parallèles à l'électrode de référence intégrée.
PCT/JP2013/082927 2013-01-22 2013-12-09 Composant de bobine et dispositif électronique WO2014115433A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201390000873.1U CN204808996U (zh) 2013-01-22 2013-12-09 线圈元器件及电子设备

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JP2013009030 2013-01-22
JP2013-009030 2013-01-22

Publications (1)

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WO2014115433A1 true WO2014115433A1 (fr) 2014-07-31

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CN (1) CN204808996U (fr)
WO (1) WO2014115433A1 (fr)

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Publication number Priority date Publication date Assignee Title
US10515753B2 (en) * 2016-07-14 2019-12-24 Samsung Electro-Mechanics Co., Ltd. Coil component and method of manufacturing the same
US10770215B2 (en) 2016-06-17 2020-09-08 Murata Manufacturing Co., Ltd. Electronic component, diaphragm, electronic device, and electronic component manufacturing method
US10796837B2 (en) 2016-06-07 2020-10-06 Murata Manufacturing Co., Ltd. Electronic component, diaphragm, and electronic device
EP3764371A4 (fr) * 2018-03-05 2021-11-10 Mitsubishi Materials Corporation Conducteur rectangulaire plat isolé, bobine et procédé de fabrication de conducteur rectangulaire plat isolé
WO2021261416A1 (fr) * 2020-06-24 2021-12-30 株式会社村田製作所 Substrat de résine à couches multiples et son procédé de production
US20220084736A1 (en) * 2020-09-14 2022-03-17 Intel Corporation Tandem magnetics in package
WO2023238562A1 (fr) * 2022-06-09 2023-12-14 株式会社村田製作所 Substrat multicouche

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KR20180017629A (ko) * 2016-08-10 2018-02-21 삼성전기주식회사 코일 조립체

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JPH0935939A (ja) * 1995-07-25 1997-02-07 Tdk Corp 高周波コイルおよびその製造法
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WO2010106839A1 (fr) * 2009-03-19 2010-09-23 株式会社村田製作所 Circuit imprimé et corps mère laminé

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JPH0774023A (ja) * 1993-09-01 1995-03-17 Hitachi Ltd 集積化インダクタおよびそれを用いた弾性表面波装置
JPH0935939A (ja) * 1995-07-25 1997-02-07 Tdk Corp 高周波コイルおよびその製造法
JPH11329845A (ja) * 1998-05-19 1999-11-30 Tdk Corp 電子部品及びその製造方法
JP2006324566A (ja) * 2005-05-20 2006-11-30 Matsushita Electric Ind Co Ltd チップ部品
WO2010106839A1 (fr) * 2009-03-19 2010-09-23 株式会社村田製作所 Circuit imprimé et corps mère laminé

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10796837B2 (en) 2016-06-07 2020-10-06 Murata Manufacturing Co., Ltd. Electronic component, diaphragm, and electronic device
US10770215B2 (en) 2016-06-17 2020-09-08 Murata Manufacturing Co., Ltd. Electronic component, diaphragm, electronic device, and electronic component manufacturing method
US10515753B2 (en) * 2016-07-14 2019-12-24 Samsung Electro-Mechanics Co., Ltd. Coil component and method of manufacturing the same
EP3764371A4 (fr) * 2018-03-05 2021-11-10 Mitsubishi Materials Corporation Conducteur rectangulaire plat isolé, bobine et procédé de fabrication de conducteur rectangulaire plat isolé
US11450452B2 (en) 2018-03-05 2022-09-20 Mitsubishi Materials Corporation Insulated flat rectangular conductor, coil, and method of producing insulated flat rectangular conductor
WO2021261416A1 (fr) * 2020-06-24 2021-12-30 株式会社村田製作所 Substrat de résine à couches multiples et son procédé de production
JPWO2021261416A1 (fr) * 2020-06-24 2021-12-30
JP7315102B2 (ja) 2020-06-24 2023-07-26 株式会社村田製作所 樹脂多層基板
US20220084736A1 (en) * 2020-09-14 2022-03-17 Intel Corporation Tandem magnetics in package
WO2023238562A1 (fr) * 2022-06-09 2023-12-14 株式会社村田製作所 Substrat multicouche

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