CN204808996U - Coil components and parts and electronic equipment - Google Patents
Coil components and parts and electronic equipment Download PDFInfo
- Publication number
- CN204808996U CN204808996U CN201390000873.1U CN201390000873U CN204808996U CN 204808996 U CN204808996 U CN 204808996U CN 201390000873 U CN201390000873 U CN 201390000873U CN 204808996 U CN204808996 U CN 204808996U
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- coil
- conductor
- sheet material
- coil component
- interarea
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- 239000004020 conductor Substances 0.000 claims abstract description 159
- 239000000463 material Substances 0.000 claims description 75
- 230000004888 barrier function Effects 0.000 claims description 63
- 230000003746 surface roughness Effects 0.000 claims description 35
- 239000002184 metal Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 230000005611 electricity Effects 0.000 abstract 3
- 239000010410 layer Substances 0.000 description 69
- 239000000758 substrate Substances 0.000 description 56
- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- 239000012212 insulator Substances 0.000 description 14
- 230000005540 biological transmission Effects 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The utility model relates to a coil components and parts and electronic equipment. Coil components and parts (1) is including stack (2) and coil conductor (33A, 34A, 35A). Stack (2) are the range upon range of structures that has insulating layer (21-25) and wiring layer (31-35). Coil conductor (33A, 34A, 35A) is the coiled type that take the range upon range of direction of stack (2) as the axle, and sets up on wiring layer (33-35). Coil components and parts (1) is through making coil conductor (33A) and built -in telluric electricity field (91) of outside base plate (9) use relatively. With built -in telluric electricity field (91) is parallel and the roughness interface of close coil conductor (33A) the most is littleer than the average roughness with all interfaces that built -in telluric electricity field (91) is parallel of coil conductor (33A, 34A, 35A).
Description
Technical field
The utility model relates to and arranges coil conductor pattern and the coil component that forms and the electronic equipment being provided with coil component in substrate inside.
Background technology
As coil component, have by arranging coil conductor pattern to form at the interlayer of resin multilayer substrate (with reference to patent documentation 1).This coil component manufactures by such as under type: carry out the etching of metal film to form coil conductor pattern to the resinous sheet material having attached metal film on one face, and carry out stacked to multiple sheet material and make its thermo-compressed.
As the metal film be attached on sheet material, sometimes make the interarea being attached at sheet material be the matsurface that surface roughness is larger, and make another interarea be the even surface that surface roughness is less.The bond strength attached for metal film sheet material in the sheet material of this metal film is higher.
Prior art document
Patent documentation
Patent documentation 1: International Publication No. 2010/016345 publication
Utility model content
Utility model technical problem to be solved
When by when utilizing the coil component that is made of sheet material having attached metal film to be installed on external substrate, electronic equipment, if coil component and Earth Phase pair, then according to coil component towards difference, high frequency characteristics may be deteriorated.
This is considered because, the surface roughness of two interareas of coil conductor pattern is different, therefore, if the Earth Phase pair of the matsurface side of coil conductor pattern and external substrate, external component, then the current loss (conductor losses) flowing through coil conductor pattern can become large.The signal frequency flowing through coil conductor pattern is higher, and the loss of this electric current produces more remarkable.
Therefore, the purpose of this utility model is to provide a kind of and can prevents the loss of the electric current flowing through coil conductor pattern and the coil component of high frequency characteristics excellence and installed the electronic equipment of this coil component.
The technical scheme that technical solution problem adopts
Coil component of the present utility model comprises: duplexer insulating barrier and wiring layer are laminated; And the coiled type that to be rendered as with the stacked direction of described duplexer be axle, and be arranged at least more than one coil conductor pattern of described wiring layer, make that described coil conductor pattern is relative with planar conductor to be used, the feature of this coil component is, in all interfaces parallel with described planar conductor of the described coil conductor pattern that described duplexer comprises, less than the average surface roughness at described all interfaces closest to the surface roughness at interface of described planar conductor.
In this structure, in all interfaces parallel with described planar conductor of the coil conductor pattern comprised by making duplexer, less than the average surface roughness at all interfaces closest to the surface roughness at the interface of planar conductor, thus the loss of the electric current flowing through coil conductor pattern can be reduced.
In above-mentioned coil component, preferred described duplexer is by being laminated multiple sheet material, the plurality of sheet material comprises the sheet material being bonded to metal film, described coil conductor pattern is formed by making described metal film form pattern, and the surface roughness at the interface engaged with described sheet material of described metal film is larger than the interface of the opposition side at the interface engaged with described sheet material.
In this structure, one of them interface at two interfaces of metal film is matsurface, and another interface is even surface.Further, metal film engages with sheet material in matsurface side, and the bond strength therefore engaging the metal film on the sheet material of metal film is improved.
In above-mentioned coil component, described planar conductor can be the conductor with grounding connection.
In above-mentioned coil component, also can form installing electrodes on the interarea close to described planar conductor of described duplexer.
Electronic equipment of the present utility model comprises described coil component and configures the object of described coil component, and described object can have described planar conductor.
The effect of utility model
In coil component of the present utility model and electronic equipment, to make in all interfaces parallel with planar conductor of coil conductor pattern, be less than closest to the surface roughness at the interface of planar conductor the average surface roughness at all interfaces.That is, because the interface closest to planar conductor in all interfaces parallel with planar conductor of coil conductor pattern is configured to even surface, therefore can reduce the loss of the electric current flowing through coil conductor pattern, good high frequency characteristics can be realized.
Accompanying drawing explanation
Figure 1A-B is the stereogram Sum decomposition stereogram of the coil component of execution mode 1 of the present utility model.
Fig. 2 A-D is the side sectional view of the manufacture method of the coil component representing execution mode 1 of the present utility model.
Fig. 3 A-B is vertical view and the side sectional view of the coil component of execution mode 2 of the present utility model.
Fig. 4 A-C is the stereogram of the coil component of execution mode 3 of the present utility model, exploded perspective view and side sectional view.
Fig. 5 A-B is the stereogram Sum decomposition stereogram of the coil component of execution mode 4 of the present utility model.
Fig. 6 A-B is the side sectional view under the installment state of the coil component of execution mode 4 of the present utility model.
Embodiment
Below, the coil component of execution mode 1 and electronic equipment are described.
In the following description, by when coil component being installed to external substrate, call the first interarea (Z1) with the face relative with external substrate of coil component.The face of the first interarea (Z1) opposition side of coil component is called the second interarea (Z2).
Fig. 1 (A) is the stereogram of the coil component 1 of execution mode 1, shows the state making the first interarea (Z1) side towards the layout line circle components and parts 1 that come up.
Coil component 1 comprises duplexer 2 and pattern coil 3.Duplexer 2 is hexahedron, is made up of the high resin of the thermoplasticity such as liquid crystal polymer, other thermoplastic resin, low-temperature sintered ceramics etc.First interarea (Z1) of duplexer 2 is formed with installing electrodes 31A, 31B, and coil component 1 adopts surface mounting structure.Pattern coil 3 is configured to multilayer coil, is arranged on the inside of duplexer 2.
Fig. 1 (B) is the exploded perspective view of coil component 1, shows the state making the first interarea (Z1) side towards the layout line circle components and parts 1 that come up.
Duplexer 2 comprises sheet material 11,12,13,14,15.Duplexer 2 is formed by stacking gradually sheet material 11 ~ 15 from the first interarea (Z1) to the second interarea (Z2).
Sheet material 11 comprises insulating barrier 21, wiring layer 31 and via hole conductor 41.Insulating barrier 21 is made up of insulators such as resins, and profile when overlooking from stacked direction is rectangle.Wiring layer 31 is layered in the first interarea (Z1) side of insulating barrier 21.Via hole conductor 41 runs through insulating barrier 21 in the stacking direction.Wiring layer 31 is provided with installing electrodes 31A, 31B.Installing electrodes 31A, 31B are connected with the electrode of not shown external substrate.
Sheet material 12 comprises insulating barrier 22, wiring layer 32 and via hole conductor 42.Insulating barrier 22 is made up of insulators such as resins, and profile when overlooking from stacked direction is rectangle.Wiring layer 32 is layered in the first interarea (Z1) side of insulating barrier 22.Via hole conductor 42 runs through insulating barrier 22 in the stacking direction.
Sheet material 13 comprises insulating barrier 23, wiring layer 33 and via hole conductor 43.Insulating barrier 23 is made up of insulators such as resins, and profile when overlooking from stacked direction is rectangle.Wiring layer 33 is layered in the first interarea (Z1) side of insulating barrier 23.Via hole conductor 43 runs through insulating barrier 23 in the stacking direction.
Sheet material 14 comprises insulating barrier 24, wiring layer 34 and via hole conductor 44.Insulating barrier 24 is made up of insulators such as resins, and profile when overlooking from stacked direction is rectangle.Wiring layer 34 is layered in the first interarea (Z1) side of insulating barrier 24.Via hole conductor 44 runs through insulating barrier 24 in the stacking direction.
Sheet material 15 comprises insulating barrier 25 and wiring layer 35.Insulating barrier 25 is made up of insulators such as resins, and profile when overlooking from stacked direction is rectangle.Wiring layer 35 is layered in the first interarea (Z1) side of insulating barrier 25.
Pattern coil 3 comprises coil-conductor 33A, coil-conductor 34A and coil-conductor 35A, and has inductance.Coil-conductor 33A is arranged at the wiring layer 33 of sheet material 13, and with along sheet material 13 outward flange around mode extend.Coil-conductor 34A is arranged at the wiring layer 34 of sheet material 14, and with along sheet material 14 outward flange around mode extend.Coil-conductor 35A is arranged at the wiring layer 35 of sheet material 15, and with along sheet material 15 outward flange around mode extend.Coil-conductor 33A, coil-conductor 34A, coil-conductor 35A are connected via via hole conductor 43,44, and the coiled type that to become with the stacked direction of duplexer 2 be axle.When coil-conductor 33A, coil-conductor 34A, coil-conductor 35A are arranged to observe from the stacked direction of duplexer 2, annularly overlapping each other.
In addition, the coil-conductor 33A of pattern coil 3 is connected with the installing electrodes 31A of sheet material 11 via via hole conductor 41,42.
The wiring layer 32 of sheet material 12 is provided with bonding conductor 32A.The wiring layer 35 of sheet material 15 is provided with bonding conductor 35B.Bonding conductor 32A, 35B are connected via via hole conductor 42,43,44.Bonding conductor 32A is connected via the installing electrodes 31B of via hole conductor 41 with sheet material 11.Bonding conductor 35B is connected with the coil-conductor 35A of pattern coil 3.Therefore, installing electrodes 31B is connected via bonding conductor 32A, 35B with pattern coil 3.
Thus, coil component 1 arranges installing electrodes 31A, 31B and becomes the structure of surface attaching type (LGA type) on first interarea (Z1) of duplexer 2.Therefore, occupied area external substrate needed to install coil component 1 is reduced to the degree identical with the area of coil component 1.In addition, when arranging shield shell in the mode covering coil component 1, even if completely very close to each other between coil component 1 and shield shell, also short circuit can not be produced due to the contact with shielded conductor on installing electrodes 31A, 31B.
Fig. 2 is the side sectional view be described for an example of the manufacture method to coil component 1, shows and makes to face as the second interarea (Z2) side the state configuring each several part.In addition, the single part becoming coil component 1 is only shown in the drawings here.But, in fact, large-scale sheet material arranging multiple part becoming coil component 1, after the multiple coil component 1 of disposable formation, by being cut by each coil component 1, producing coil component 1.
First, in the first operation shown in Fig. 2 (A), sheet material 11 ~ 15 is prepared.Sheet material 11 ~ 15 as mentioned above, comprises insulating barrier 21 ~ 25 and wiring layer 31 ~ 35 respectively.In the first operation, wiring layer 31 ~ 35 is in the state of the metal films such as the Copper Foil be attached in advance on the whole one side of insulating barrier 21 ~ 25.The interface being configured to the wiring layer 31 ~ 35 of metal film is configured to even surface 30A and matsurface 30B.Even surface 30A to be such as surface roughness the be face of about 1 μm.Matsurface 30B to be such as surface roughness the be face of about 3 ~ 5 μm.Surface roughness adopts the arithmetic average roughness determining standard with [JISB0601-2001].
In addition, wiring layer 31 ~ 35 engages with insulating barrier 21 ~ 25 via matsurface 30B respectively.Thus, situation about engaging via even surface 30A with wiring layer 31 ~ 35 and insulating barrier 21 ~ 25 is compared, and can engage with stronger bond strength.
Then, in the second operation shown in Fig. 2 (B), the metal film of the wiring layer 31 ~ 35 of formation sheet material 11 ~ 15 is made to form pattern by etching etc.Form installing electrodes 31A, 31B, coil-conductor 33A ~ 35A and bonding conductor 32A, 35B thus.In addition, utilize laser etc. to be formed on the insulating barrier 21 ~ 25 of sheet material 11 ~ 14 not run through metal film but after running through the through hole of insulating barrier, the electric conducting materials such as conductive paste be set in the inside of through hole.Form via hole conductor 41 ~ 44 thus.
Then, in the 3rd operation, under the state of wiring layer 31 ~ 35 towards the first interarea (Z1) side, sheet material 11 ~ 15 is overlapped respectively.Then, at the even surface 30A of each wiring layer 31 ~ 35 towards under the state of the first interarea (Z1) side, sheet material 11 ~ 15 is overlapped.Then, make sheet material 11 ~ 15 thermo-compressed, thus sheet material 11 ~ 15 is bonded with each other.Thus, as shown in Fig. 2 (C), produce the coil component 1 being provided with pattern coil 3 in the inside of duplexer 2.
Afterwards, coil component 1, as shown in Fig. 2 (D), substrate 9 mounted externally uses.External substrate 9 is printed circuit board, comprises built-in grounding electrode 91 and components and parts lift-launch electrode 92.External substrate 9 is equivalent to the object of the electronic equipment recorded in claim.Components and parts carry electrode 92 and are formed in the components and parts mounting surface of external substrate 9.Built-in grounding electrode 91 is formed in the inside of external substrate 9 in the mode that the components and parts mounting surface with external substrate 9 is parallel, be equivalent to the planar conductor described in claim.Make installing electrodes 31A, 31B carry electrode 92 with the components and parts of external substrate 9 by utilizing solder 93 to engage, thus by substrate 9 mounted externally for coil component 1.
As described above by the electronic equipment 10 on substrate 9 mounted externally for coil component 1, the pattern coil 3 of coil component 1 is relative with built-in grounding electrode 91.In addition, coil-conductor 33A ~ 35A even surface 30A separately substrate 9 side towards the outside.
Therefore, parallel with built-in grounding electrode 91 and the surface roughness at the first interarea (Z1) interface, side of immediate coil-conductor 33A is less than the average surface roughness at all interfaces parallel with built-in grounding electrode 91 of coil-conductor 33A ~ 35A.
In addition, " average surface roughness at all interfaces parallel with built-in grounding electrode 91 of coil-conductor 33A ~ 35A " are such as by deciding with under type.Namely, if the arithmetic average roughness on the surface of the first interarea (Z1) side of coil-conductor 33A ~ 35A is set to Ra11, Ra21, Ra31, the arithmetic average roughness on the surface of the second interarea (Z2) side of coil-conductor 33A ~ 35A is set to Ra12, Ra22, Ra32, the area of coil-conductor 33A ~ 35A is set to A1, A2, A3, " average surface roughness at all interfaces parallel with built-in grounding electrode 91 of coil-conductor 33A ~ 35A " are set to Ra', then Ra' is expressed from the next.
Ra’＝(Ra11×A1+Ra12×A1+Ra21×A2+Ra22×A2+Ra31×A3+Ra32×A3)/(A1+A1+A2+A2+A3+A3)
Therefore, " parallel with built-in grounding electrode 91 and the surface roughness at the first interarea (Z1) interface, side of immediate coil-conductor 33A " wants the little following formula that shows as to set up than " average surface roughness at all interfaces parallel with built-in grounding electrode 91 of coil-conductor 33A ~ 35A ".
Ra11＜Ra’
Form the pattern coil 3 of coil component 1 thus, therefore, even if make pattern coil 3 relative with built-in grounding electrode 91, the conductor losses flowing through the electric current of pattern coil 3 is also less, can realize the less and coil component 1 of high frequency characteristics excellence of deviation.
In addition, in present embodiment, except the interface of the first interarea (Z1) side of parallel with built-in grounding electrode 91 and immediate coil-conductor 33A, the interface of the first interarea (Z1) side of the coil-conductor 33B right with built-in grounding electrode 91 Local Phase is also even surface 80A, therefore, the conductor losses flowing through the electric current of pattern coil 3 is less.
In addition, in present embodiment, coil-conductor 33A ~ 35A, installing electrodes 31A, 31B and bonding conductor 32A, 35B are all configured to even surface 30A substrate 9 side, i.e. the first interarea (Z1) side towards the outside, but also can by other electrode beyond coil-conductor 33A, such as coil-conductor 34A and coil-conductor 35A wherein one or both is configured to matsurface 30B substrate 9 side towards the outside.Installing electrodes 31A, 31B can also be made, bonding conductor 32A, 35B be configured to matsurface 30B substrate 9 side towards the outside.
In addition, in present embodiment, the face towards the second interarea (Z2) side of coil-conductor 33A is configured to matsurface 30B, but also can be same with the face towards the first interarea (Z1) side of coil-conductor 33A, make also to be configured to even surface 30A towards the face of the second interarea (Z2) side.
Then, the coil component of execution mode 2 of the present utility model and electronic equipment are described.
Fig. 3 (A) is the vertical view obtained from the coil component 51 of the first interarea (Z1) unilateral observation execution mode 2.Fig. 3 (B) is the side sectional view under the state that coil component 51 is installed on external substrate.
Coil component 51 comprises duplexer 52 and pattern coil 53.Pattern coil 53 is set to planar coil, is arranged on the inside of duplexer 52.
Duplexer 52 comprises insulating barrier 71, wiring layer 81 and resist layer 72.Insulating barrier 71 is made up of insulators such as resins, and profile when overlooking from stacked direction is rectangle, and is laminated with wiring layer 81 in the first interarea (Z1) side.Resist layer 72 is layered in the first interarea (Z1) side of insulating barrier 71 and wiring layer 81.
When pattern coil 53 is configured to observe from the stacked direction of duplexer 52, is formed on wiring layer 81 as the coil-conductor extended in the shape of a spiral, and there is inductance.Above-mentioned resist layer 72, when observing from the stacked direction of duplexer 52, be provided with opening, and the two ends of pattern coil 53 is exposed in the position overlapping with the two ends of pattern coil 53 to the first interarea (Z1) side from resist layer 72.The two ends of the pattern coil 53 exposed to the first interarea (Z1) side from resist layer 72 are configured to installing electrodes 81A, 81B.
In addition, the interface of the first interarea (Z1) side of pattern coil 53 is configured to even surface 80A.The interface of the second interarea (Z2) side of pattern coil 53 is configured to matsurface 80B.Even surface 80A to be such as surface roughness the be face of about 1 μm.Matsurface 80B to be such as surface roughness the be face of about 3 ~ 5 μm.Surface roughness adopts the arithmetic average roughness determining standard with [JISB0601-2001].
Pattern coil 53 engages with insulating barrier 71 via matsurface 80B.Thus, situation about engaging via even surface 80A with pattern coil 53 and insulating barrier 71 is compared, and can engage with stronger bond strength.
Coil component 51, as shown in Fig. 3 (B), substrate 9 mounted externally uses.External substrate 9 is printed circuit board, comprises built-in grounding electrode 91 and components and parts lift-launch electrode 92.External substrate 9 is equivalent to the object recorded in claim.Components and parts carry electrode 92 and are formed in the components and parts mounting surface of external substrate 9.Built-in grounding electrode 91 is formed in the inside of external substrate 9 in the mode that the components and parts mounting surface with external substrate 9 is parallel, be equivalent to the planar conductor described in claim.Make installing electrodes 81A, 81B carry electrode 92 with the components and parts of external substrate 9 by utilizing solder 93 to engage, thus by substrate 9 mounted externally for coil component 51.
Be installed in the electronic equipment 50 of external substrate 9 by coil component 51 as described above, the pattern coil 53 of coil component 51 is relative with built-in grounding electrode 91, and even surface 80A substrate 9 side towards the outside.Therefore, the surface roughness at the first interarea (Z1) interface, side of pattern coil 53 is less than the average surface roughness at the first interarea (Z1) side of pattern coil 53 and two interfaces of the second interarea (Z2) side.
Thus the pattern coil 53 of coil component 51 is configured to planar coil, whole of therefore relative with built-in grounding electrode 91 pattern coil 53 is even surface 80A, and the conductor losses flowing through the electric current of pattern coil 53 diminishes.Further, the less and coil component 51 of high frequency characteristics excellence of deviation can be realized.
Then, the coil component of execution mode 3 of the present utility model and electronic equipment are described.
Fig. 4 (A) is the stereogram of the coil component 101 of execution mode 3, shows the state making the second interarea (Z2) side towards the layout line circle components and parts 101 that come up.
Coil component 101 comprises duplexer 102 and pattern coil 103.Duplexer 102 is provided with installing electrodes 136A, 136B in the mode of the outer surface near the both ends covering the direction orthogonal with stacked direction, and coil component 101 is configured to patch-type.In addition, second interarea (Z2) of duplexer 102 is provided with mark 137 to differentiate installation direction.Pattern coil 103 is configured to multilayer coil, is arranged on the inside of duplexer 102.
Fig. 4 (B) is the exploded perspective view of coil component 101.
Duplexer 102 comprises sheet material 111,112,113,114,115.Duplexer 102 is formed by stacking gradually sheet material 111 ~ 115 from the first interarea (Z1) to the second interarea (Z2).
Sheet material 111 comprises insulating barrier 121.Insulating barrier 121 is made up of insulators such as resins, and profile when overlooking from stacked direction is rectangle.
Sheet material 112 comprises insulating barrier 122, wiring layer 132 and via hole conductor 142.Insulating barrier 122 is made up of insulators such as resins, and profile when overlooking from stacked direction is rectangle.Wiring layer 132 is layered in the first interarea (Z1) side of insulating barrier 122.Via hole conductor 142 runs through insulating barrier 122 in the stacking direction.
Sheet material 113 comprises insulating barrier 123, wiring layer 133 and via hole conductor 143.Insulating barrier 123 is made up of insulators such as resins, and profile when overlooking from stacked direction is rectangle.Wiring layer 133 is layered in the first interarea (Z1) side of insulating barrier 123.Via hole conductor 143 runs through insulating barrier 123 in the stacking direction.
Sheet material 114 comprises insulating barrier 124, wiring layer 134 and via hole conductor 144.Insulating barrier 124 is made up of insulators such as resins, and profile when overlooking from stacked direction is rectangle.Wiring layer 134 is layered in the first interarea (Z1) side of insulating barrier 124.Via hole conductor 144 runs through insulating barrier 124 in the stacking direction.
Sheet material 115 comprises insulating barrier 125 and wiring layer 135.Insulating barrier 125 is made up of insulators such as resins, and profile when overlooking from stacked direction is rectangle.Wiring layer 135 is layered in the first interarea (Z1) side of insulating barrier 125.
Pattern coil 103 comprises coil-conductor 132A, coil-conductor 133A and coil-conductor 134A, and has inductance.Coil-conductor 132A is arranged at the wiring layer 132 of sheet material 112, and with along sheet material 112 outward flange around mode extend.Coil-conductor 133A is arranged at the wiring layer 133 of sheet material 113, and with along sheet material 113 outward flange around mode extend.Coil-conductor 134A is arranged at the wiring layer 134 of sheet material 114, and with along sheet material 114 outward flange around mode extend.Coil-conductor 132A, coil-conductor 133A, coil-conductor 134A are connected via via hole conductor 142,143, and the coiled type that to become with the stacked direction of duplexer 102 be axle.When coil-conductor 132A, coil-conductor 133A, coil-conductor 134A are arranged to observe from the stacked direction of duplexer 102, annularly overlapping each other.
In addition, coil-conductor 132A is drawn out to the edge of sheet material 112 and is connected with installing electrodes 136A.Coil-conductor 134A is drawn out to sheet material 115 via via hole conductor 144, and is drawn out to the edge of sheet material 115 by the bonding conductor 135A be arranged on sheet material 115 and is connected with installing electrodes 136B.
Fig. 4 (C) is the side sectional view under the state that coil component 101 is installed on external substrate 9.
Coil component 101 substrate 9 mounted externally uses.External substrate 9 is printed circuit board, comprises built-in grounding electrode 91 and components and parts lift-launch electrode 92.External substrate 9 is equivalent to the object recorded in claim.Components and parts carry electrode 92 and are formed in the components and parts mounting surface of external substrate 9.Built-in grounding electrode 91 is formed in the inside of external substrate 9 in the mode that the components and parts mounting surface with external substrate 9 is parallel, be equivalent to the planar conductor described in claim.Make installing electrodes 136A, 136B carry electrode 92 with the components and parts of external substrate 9 by utilizing solder 93 to engage, thus by substrate 9 mounted externally for coil component 101.
Here, the interface of coil-conductor 132A, 133A, 134A of pattern coil 103 and the first interarea (Z1) side of bonding conductor 135A is configured to even surface 130A.In addition, the interface of coil-conductor 132A, 133A, 134A of pattern coil 103 and the second interarea (Z2) side of bonding conductor 135A is configured to matsurface 130B.Even surface 130A to be such as surface roughness the be face of about 1 μm.Matsurface 130B to be such as surface roughness the be face of about 3 ~ 5 μm.
As described above coil component 101 is installed in the electronic equipment 100 of external substrate 9, the pattern coil 103 of coil component 101 is relative with built-in grounding electrode 91, and the even surface 130A of coil-conductor 132A, 133A, 134A substrate 9 side towards the outside.Therefore, the surface roughness at the first interarea (Z1) interface, side of the coil-conductor 132A of pattern coil 103 is less than the average surface roughness at all interfaces of pattern coil 103.
Form the pattern coil 103 of coil component 101 thus, therefore, even if make pattern coil 103 relative with built-in grounding electrode 91, the conductor losses flowing through the electric current of pattern coil 103 is also less, can realize the less and coil component 101 of high frequency characteristics excellence of deviation.
In addition, in present embodiment, coil-conductor 132A ~ 134A is all configured to even surface 130A substrate 9 side towards the outside, but also can make other electrode beyond coil-conductor 132A, such as coil-conductor 133A and coil-conductor 134A wherein one or both is configured to matsurface 130B substrate 9 side towards the outside.
In addition, in present embodiment, the face towards the second interarea (Z2) side of coil-conductor 132A is configured to matsurface 130B, but also can be same with the face towards the first interarea (Z1) side of coil-conductor 132A, make also to be configured to even surface 130A towards the face of the second interarea (Z2) side.
Then, the coil component of the utility model execution mode 4 and electronic equipment are described.
Fig. 5 (A) is the stereogram of the coil component 151 of execution mode 4, and the major part of the coil component 151 of execution mode 4 is amplified the exploded perspective view represented by Fig. 5 (B).Each figure all illustrates the state making the first interarea (Z1) towards the layout line circle components and parts 151 that come up.
Coil component 151 is configured to flat cable.In addition, coil component 151 comprises duplexer 152, pattern coil 153, transmission line 154 and connector 155A, 155B.Duplexer 152 is configured to extend for long side direction with the direction orthogonal with stacked direction, and is provided with connector 155A, 155B on first interarea (Z1) at the both ends of bearing of trend.Transmission line 154 is arranged on the inside of duplexer 152, connects between connector 155A and connector 155B.The inside that pattern coil 153 is arranged in duplexer 152 is inserted into the pars intermedia of transmission line 154.
As being shown specifically in Fig. 5 (B), duplexer 152 comprises resist layer 161, sheet material 162, sheet material 163, sheet material 164 and resist layer 165.Duplexer 152 is formed by stacking gradually resist layer 161, sheet material 162, sheet material 163, sheet material 164 and resist layer 165 from the first interarea (Z1) to the second interarea (Z2).
Resist layer dip stratum is stacked in the first interarea (Z1) side of sheet material 162.
Sheet material 162 comprises insulating barrier 172 and wiring layer 182.Insulating barrier 172 is made up of insulators such as resins.Wiring layer 182 is layered in the first interarea (Z1) side of insulating barrier 172.Wiring layer 182 in the first interarea (Z1) side cover by resist layer 161.
Sheet material 163 comprises insulating barrier 173, wiring layer 183 and via hole conductor 193.Insulating barrier 173 is made up of insulators such as resins.Wiring layer 183 is layered in the first interarea (Z1) side of insulating barrier 173.Wiring layer 183 in the first interarea (Z1) side cover by sheet material 162.
Sheet material 164 comprises insulating barrier 174, wiring layer 184 and via hole conductor 194.Insulating barrier 174 is made up of insulators such as resins.Wiring layer 184 is layered in the second interarea (Z2) side of insulating barrier 174.
Resist layer 165 is layered in the second interarea (Z2) side of sheet material 164, and covers the second interarea (Z2) side of wiring layer 184.
Pattern coil 153 has inductance, and wiring layer 183 is arranged in the mode extended in the shape of a spiral.
Transmission line 154 is the triplate strip line type transmission lines comprising holding wire 183A, 183B, planar ground electrode 182A, 182B and lattice-shaped grounding electrode 184A.Holding wire 183A, 183B are arranged on wiring layer 183.Planar ground electrode 182A, 182B are arranged on wiring layer 182.Lattice-shaped grounding electrode 184A is arranged on wiring layer 184.Holding wire 183A is relative across insulating barrier 172 with plane grounding electrode 182A, and holding wire 183A and lattice-shaped grounding electrode 184A are across insulating barrier 173,174 relative.In addition, holding wire 183B is relative across insulating barrier 172 with plane grounding electrode 182B, and holding wire 183B and lattice-shaped grounding electrode 184A are across insulating barrier 173,174 relative.
One end of holding wire 183A is connected with one end of pattern coil 153.One end of holding wire 183B is connected with the bonding conductor 184B be arranged on wiring layer 184 via via hole conductor 193.Bonding conductor 184B is connected via the other end of via hole conductor 193 with pattern coil 153.
Fig. 6 (A) is the end view of the electronic equipment 150 with coil component 151.
Electronic equipment 150 comprises the first external substrate 191, second external substrate 192 and battery pack 195.Electronic equipment 150 also comprises not shown housing, the electronic equipment of other inscape, such as, be mobile phone, panel type terminal etc.First external substrate 191 and the second external substrate 192 are with the parallel mode configuration spaced apart of interarea normal direction each other.Battery pack 195 has metal shell, and is configured between the first external substrate 191 and the second external substrate 192.
First external substrate 191 has socket 191A.Second external substrate 192 has socket 192A.Coil component 151 is installed on electronic equipment 150 by making connector 155A be connected with the socket 191A of the first external substrate 191 and making connector 155B be connected with the socket 192A of the second external substrate 192.Coil component 151 under the state bending in the mode around battery pack 195, by the top surface side of battery pack 195.
The major part of electronic equipment 150 is amplified the side sectional view represented by Fig. 6 (B).
Here, the interface of the first interarea (Z1) side of pattern coil 153, holding wire 183A, 183B and planar ground electrode 182A, 182B is configured to even surface 180A, and the interface of the second interarea (Z2) side is configured to matsurface 180B.The interface of the second interarea (Z2) side of lattice-shaped grounding electrode 184A and bonding conductor 184B is configured to even surface 180A, and the interface of the first interarea (Z1) side is configured to matsurface 180B.Even surface 180A to be such as surface roughness the be face of about 1 μm.Matsurface 180B to be such as surface roughness the be face of about 3 ~ 5 μm.
Owing to installing coil component 151 as described above, therefore the pattern coil 153 of coil component 151 is relative with the metal shell of battery pack 195, and the even surface 180A of pattern coil 153 is towards the metal shell side of battery pack 195.Therefore, battery pack 195 is equivalent to the object that claim is recorded, and the metal shell of battery pack 195 is equivalent to the planar conductor of claim record.
The surface roughness at the first interarea (Z1) interface, side of pattern coil 153 is less than the surface roughness at the second interarea (Z2) interface, side of pattern coil 153.Therefore, even if make pattern coil 153 relative with the metal shell of battery pack 195, the conductor losses flowing through the electric current of pattern coil 153 is also less.Therefore, the less and coil component 151 of high frequency characteristics excellence of deviation can be realized.
Label declaration
1,51,101,151 ... coil component
2,52,102,152 ... duplexer
3,53,103,153 ... pattern coil
11,12,13,14,15,111,112,113,114,115,162,163,164 ... sheet material
21,22,23,24,25,71,121,122,123,124,125,172,173,174 ... insulating barrier
31,32,33,34,35,81,132,133,134,135,182,183,184 ... wiring layer
30A, 80A, 130A, 180A ... even surface
30B, 80B, 130B, 180B ... matsurface
31A, 31B, 81A, 81B, 136A, 136B ... installing electrodes
32A, 35B, 135A, 184B ... bonding conductor
33A, 34A, 35A, 132A, 133A, 134A ... coil-conductor
41,42,43,44,142,143,144,193,194 ... via hole conductor
9,191,192 ... external substrate
91 ... built-in grounding electrode
92 ... components and parts carry electrode
10,50,100,150 ... electronic equipment
72,161,165 ... resist layer
137 ... mark
154 ... transmission line
155A, 155B ... connector
182A, 182B ... planar ground electrode
183A, 183B ... holding wire
184A ... lattice-shaped grounding electrode
191A, 192A ... socket
195 ... battery pack
Claims (5)
1. a coil component, comprising:
Insulating barrier and wiring layer are carried out the duplexer be laminated; And
The coiled type that to be rendered as with the stacked direction of described duplexer be axle, and be arranged at least more than one coil conductor pattern of described wiring layer,
Make that described coil conductor pattern is relative with planar conductor to be used, it is characterized in that,
In all interfaces parallel with described planar conductor of the described coil conductor pattern that described duplexer comprises, less than the average surface roughness at described all interfaces closest to the surface roughness at interface of described planar conductor.
2. coil component as claimed in claim 1, is characterized in that,
Described duplexer is by being laminated multiple sheet material, and the plurality of sheet material comprises the sheet material being bonded to metal film,
Described coil conductor pattern is formed by making described metal film form pattern,
The surface roughness at the interface engaged with described sheet material of described metal film is larger than the interface of the opposition side at the interface engaged with described sheet material.
3. coil component as claimed in claim 1 or 2, is characterized in that,
Described planar conductor is the conductor be connected with ground connection.
4. coil component as claimed in claim 1 or 2, is characterized in that,
The interarea close to described planar conductor of described duplexer is formed with installing electrodes.
5. an electronic equipment, comprising:
Coil component described in any one of Claims 1-4; And
Configure the object of described coil component,
Described object has described planar conductor.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013009030 | 2013-01-22 | ||
| JP2013-009030 | 2013-01-22 | ||
| PCT/JP2013/082927 WO2014115433A1 (en) | 2013-01-22 | 2013-12-09 | Coil component and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204808996U true CN204808996U (en) | 2015-11-25 |
Family
ID=51227236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201390000873.1U Expired - Lifetime CN204808996U (en) | 2013-01-22 | 2013-12-09 | Coil components and parts and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN204808996U (en) |
| WO (1) | WO2014115433A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107733094A (en) * | 2016-08-10 | 2018-02-23 | 三星电机株式会社 | Coil block |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017212990A1 (en) | 2016-06-07 | 2017-12-14 | 株式会社村田製作所 | Electronic component, diaphragm, electronic device and method for producing electronic component |
| CN209729659U (en) | 2016-06-17 | 2019-12-03 | 株式会社村田制作所 | Electronic component, oscillating plate and electronic equipment |
| KR20180007874A (en) * | 2016-07-14 | 2018-01-24 | 삼성전기주식회사 | Coil component and method of fabricating the same |
| JP7031377B2 (en) | 2018-03-05 | 2022-03-08 | 三菱マテリアル株式会社 | coil |
| JP7315102B2 (en) * | 2020-06-24 | 2023-07-26 | 株式会社村田製作所 | Resin multilayer substrate |
| US20220084736A1 (en) * | 2020-09-14 | 2022-03-17 | Intel Corporation | Tandem magnetics in package |
| WO2023238562A1 (en) * | 2022-06-09 | 2023-12-14 | 株式会社村田製作所 | Multilayered substrate |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0774023A (en) * | 1993-09-01 | 1995-03-17 | Hitachi Ltd | Integrated inductor and surface acoustic wave device using it |
| JPH0935939A (en) * | 1995-07-25 | 1997-02-07 | Tdk Corp | High-frequency coil and manufacture thereof |
| JPH11329845A (en) * | 1998-05-19 | 1999-11-30 | Tdk Corp | Electronic component and manufacture thereof |
| JP2006324566A (en) * | 2005-05-20 | 2006-11-30 | Matsushita Electric Ind Co Ltd | Chip |
| EP2410827B1 (en) * | 2009-03-19 | 2018-09-19 | Murata Manufacturing Co., Ltd. | Circuit board and mother laminated body |
-
2013
- 2013-12-09 WO PCT/JP2013/082927 patent/WO2014115433A1/en active Application Filing
- 2013-12-09 CN CN201390000873.1U patent/CN204808996U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107733094A (en) * | 2016-08-10 | 2018-02-23 | 三星电机株式会社 | Coil block |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014115433A1 (en) | 2014-07-31 |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20151125 |