CN102362320A - Electronic part and manufacturing method therefor - Google Patents
Electronic part and manufacturing method therefor Download PDFInfo
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- CN102362320A CN102362320A CN2010800129722A CN201080012972A CN102362320A CN 102362320 A CN102362320 A CN 102362320A CN 2010800129722 A CN2010800129722 A CN 2010800129722A CN 201080012972 A CN201080012972 A CN 201080012972A CN 102362320 A CN102362320 A CN 102362320A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 239000004020 conductor Substances 0.000 claims abstract description 263
- 239000012212 insulator Substances 0.000 claims description 32
- 238000013459 approach Methods 0.000 claims description 20
- BGOFCVIGEYGEOF-UJPOAAIJSA-N helicin Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1OC1=CC=CC=C1C=O BGOFCVIGEYGEOF-UJPOAAIJSA-N 0.000 claims description 7
- 238000000605 extraction Methods 0.000 abstract 4
- 239000000919 ceramic Substances 0.000 description 23
- 238000002788 crimping Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 6
- 229910000859 α-Fe Inorganic materials 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- QQONPFPTGQHPMA-UHFFFAOYSA-N Propene Chemical compound CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 229960004643 cupric oxide Drugs 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910000480 nickel oxide Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- -1 18d Substances 0.000 description 1
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- 206010021143 Hypoxia Diseases 0.000 description 1
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- DQMUQFUTDWISTM-UHFFFAOYSA-N O.[O-2].[Fe+2].[Fe+2].[O-2] Chemical compound O.[O-2].[Fe+2].[Fe+2].[O-2] DQMUQFUTDWISTM-UHFFFAOYSA-N 0.000 description 1
- 208000004350 Strabismus Diseases 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 229910007565 Zn—Cu Inorganic materials 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 230000001146 hypoxic effect Effects 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/002—Details of via holes for interconnecting the layers
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
Provided are an electronic part for which it is not necessary to change the shapes of extraction conductors or the positions of via hole conductors when the number of coil turns is changed, and a manufacturing method therefor. A coil (L) is incorporated in a layered body (12a) and is provided with coil conductors (18a-18d), extraction conductors (16a, 16b), and via hole conductors (b1-b5). The coil conductors (18) are provided in magnetic layers (14e-14h) and mutually overlap at a point (A). The via hole conductor (b1) is provided in a magnetic layer (14d) and overlaps the coil conductors (18a-18d) at the point (A), and is also connected to the extraction conductor (16a). The extraction conductor (16a) is connected to an external electrode which is not shown. The via hole conductor (b1) is connected to the coil conductor (18a) at a position other than a terminal of the coil conductor (18a).
Description
Technical field
The present invention relates to electronic unit and manufacturing approach thereof, say more definitely, relate to the electronic unit and the manufacturing approach thereof that in duplexer, are built-in with coil.
Background technology
As electronic unit in the past, the known range upon range of chip inductor (chip inductor) that has patent documentation 1 to be put down in writing.Followingly this range upon range of chip inductor is described with reference to accompanying drawing.Fig. 8 is the exploded perspective view of the duplexer 112 of range upon range of chip inductor.
(114a～114k) constitutes the duplexer 112 of range upon range of chip inductor, and is built-in with coil L by magnetic layer 114.Magnetic layer 114 is the rectangular layer that is made up of Ni-Cu-Zn based ferrite equimagnetic elastomer material, and is range upon range of with the mode of arranging in order from the upside of stacked direction.
(118a～118c) and through hole (via hole) conductor b11～b14 constitute coil L by conductor introduction 116 (116a, 116b), coil-conductor 118.One side coil-conductor 118a～118c is the number of turns and the rectangular linear conductor that is cut off with 3/4 circle, is arranged at magnetic layer 114e～114g.Conductor introduction 116a, 116b are separately positioned on than coil-conductor 118a～118c more near the position of the upside or the downside of stacked direction, specifically, are arranged at magnetic layer 114d, 114h.This conductor introduction 116 plays the effect of connecting coil L and outer electrode (not shown) respectively.Via conductors b11～b14 is arranged to respectively connect magnetic layer 114d～114g along stacked direction, is connected the conductor introduction 116 and the coil-conductor 118 of adjacency on the stacked direction.Thus, constitute spiral helicine coil L.
Yet, in the range upon range of chip inductor that patent documentation 1 is put down in writing, can not change the design of coil-conductor 118 and change the number of turns of coil L.In more detail, append the magnetic layer 114 that is provided with coil-conductor 118, thus, can increase the number of turns of coil L through downside at the stacked direction of magnetic layer 114d.And the magnetic layer 114 of the downside through removing the stacked direction that is positioned at magnetic layer 114d can reduce the number of turns of coil L.Below, be that example describes with the situation of the number of turns that reduces coil L.
Coil L shown in Figure 8 has the number of turns of 13/4 circle.Wanting the number of turns to change under the situation of 9/4 circle with this coil L, as shown in Figure 8, replace magnetic layer 114d, 114e, be inserted between magnetic layer 114c and the magnetic layer 114f as long as will be provided with the magnetic layer 114l of conductor introduction 116c.And, change in the number of turns under the situation of 5/4 circle coil L, as shown in Figure 8, replace magnetic layer 114d～114f, be inserted between magnetic layer 114c and the magnetic layer 114g as long as will be provided with the magnetic layer 114m of conductor introduction 116d.
Yet, in the range upon range of chip inductor that patent documentation 1 is put down in writing, under the situation of the number of turns that changes coil L, need to prepare 3 kinds of conductor introduction 116a, 116c, 116d.Correspondingly, also need prepare the position of 3 kinds of via conductors b11, b15, b16.
Patent documentation 1: real the opening of Japan put down the 5-57816 communique
Summary of the invention
Therefore, the object of the present invention is to provide when changing the number of turns of coil, need not to change the electronic unit and the manufacturing approach thereof of the shape of conductor introduction, the position of via conductors etc.
The electronic unit that this present invention's one side is related is characterized in that, above-mentioned electronic unit possesses: through the range upon range of duplexer that forms of a plurality of insulator layers; Be built in the spiral helicine coil in the above-mentioned duplexer; And the outer electrode that is arranged at the surface of above-mentioned duplexer; Above-mentioned coil comprises: a plurality of coil-conductors; Said a plurality of coil-conductor is arranged at the interarea of upside of the stacked direction of above-mentioned insulator layer, overlooks from stacked direction when observing, and the specified point on this insulator layer is overlapped; And first via conductors; This first via conductors is arranged at above-mentioned insulator layer; Overlooking from stacked direction when observing, overlapping at above-mentioned specified point and above-mentioned a plurality of coil-conductor, and be connected with the said external electrode electricity; Be provided with the above-mentioned insulator layer of above-mentioned first via conductors; Be arranged at than the above-mentioned a plurality of insulator layers that are provided with above-mentioned coil-conductor more near the position of the upside of stacked direction, above-mentioned first via conductors is overlooked from stacked direction when observing, and the position beyond the end of above-mentioned coil-conductor is connected with this coil-conductor.
The manufacturing approach of the electronic unit that one side of the present invention is related; It is characterized in that; Above-mentioned electronic unit is made up of duplexer that is built-in with spiral helicine coil and the outer electrode that is arranged at the surface of this duplexer, and the manufacturing approach of above-mentioned electronic unit possesses: the operation of preparing a plurality of insulator layers; Will from stacked direction overlook when observing and above-mentioned a plurality of insulator layer on the overlapping coil-conductor of specified point be formed at the operation of above-mentioned a plurality of insulator layers; To be connected with the said external electrode electricity and overlook when observing and the first overlapping via conductors of above-mentioned specified point is formed at the operation of above-mentioned insulator layer from stacked direction; Adjustment is formed with the number of above-mentioned a plurality of insulator layers of above-mentioned coil-conductor; So that above-mentioned coil has the desirable number of turns; Range upon range of said a plurality of insulator layers; And than the said a plurality of insulator layers that are formed with this coil-conductor more near the position of the upside or the downside of stacked direction, the range upon range of operation that is formed with the above-mentioned insulator layer of above-mentioned first via conductors; And the operation that forms the said external electrode.
According to the present invention, when changing the number of turns of coil, need not to change the shape of conductor introduction, the position of via conductors etc.
Description of drawings
Fig. 1 is the stereoscopic figure of the related electronic unit of an execution mode of the present invention.
Fig. 2 is the exploded perspective view of duplexer of the electronic unit of Fig. 1.
Fig. 3 is the exploded perspective view of the duplexer of the related electronic unit of reference example.
Fig. 4 is the exploded perspective view of duplexer of the electronic unit of Fig. 1.
Fig. 5 is the exploded perspective view of the duplexer of the related electronic unit of variation.
Fig. 6 is the stereoscopic figure of the related electronic unit of other execution mode.
Fig. 7 is the exploded perspective view of duplexer of the electronic unit of Fig. 6.
Fig. 8 is the exploded perspective view of the duplexer of the range upon range of chip inductor put down in writing of patent documentation 1.
Embodiment
Below, electronic unit and the manufacturing approach thereof related to an execution mode of the present invention describe.
(formation of electronic unit)
Fig. 1 is the stereoscopic figure of electronic unit 10a, 10b.Fig. 2 and Fig. 4 are the exploded perspective views of the duplexer 12a of electronic unit 10a.Fig. 3 is the exploded perspective view of the duplexer 12a ' of the related electronic unit 10a ' of reference example.Below, the stacked direction of electronic unit 10a is defined as the z direction of principal axis, will be defined as the x direction of principal axis along the direction on the long limit of electronic unit 10a, will be defined as the y direction of principal axis along the direction of the minor face of electronic unit 10a.
As shown in Figure 1, electronic unit 10a possesses rectangular-shaped duplexer 12a and is positioned at the axial two ends of x and is formed at 2 outer electrodes 13 (13a, 13b) of the side (surface) of duplexer 12a.
As shown in Figure 2, (14a～14l) constitute along the z direction of principal axis is range upon range of in order is built-in with spiral helicine coil L to duplexer 12a through magnetic layer 14.Magnetic layer 14 is the rectangular insulator layers that are made up of the ferrite with magnetic (for example Ni-Zn-Cu ferrite or Ni-Zn ferrite etc.).
Coil L comprises conductor introduction (inner conductor) 16 (16a, 16b), coil-conductor (inner conductor) 18 (18a～18d) and via conductors b1～b5.Conductor introduction 16, coil-conductor 18 and via conductors b1～b5 are made up of the conductive material that for example with Ag is principal component.
Coil-conductor 18a～18d is separately positioned on the interarea of the axial positive direction side of z of magnetic layer 14e～14h.Shape after the part that coil-conductor 18 has the linear conductor of ring-type respectively is cut off has the number of turns (being 3/4 circle) (n is a natural number) of (n/n+1) circle in this execution mode.Specifically, coil-conductor 18a has " コ " word shape that the long limit that is positioned at the axial negative direction side of y is cut off.Coil-conductor 18b has " コ " word shape after the minor face that is positioned at the axial positive direction side of x is cut off.Coil-conductor 18c has " コ " word shape after the long limit that is positioned at the axial positive direction side of y is cut off.Coil-conductor 18d has " コ " word shape after the minor face that is positioned at the axial negative direction side of x is cut off.
In addition, as shown in Figure 2, coil-conductor 18 respectively in bight or end through the some A～D on the magnetic layer 14.Specifically, the two ends of coil-conductor 18a are positioned at a B, C, and the bight of coil-conductor 18a is positioned at an A, D.The two ends of coil-conductor 18b are positioned at an A, B, and the bight of coil-conductor 18b is positioned at a C, D.The two ends of coil-conductor 18c are positioned at an A, D, and the bight of coil-conductor 18c is positioned at a B, C.The two ends of coil-conductor 18d are positioned at a C, D, and the bight of coil-conductor 18d is positioned at an A, B.Therefore, when overlooking observation from the z direction of principal axis, coil-conductor 18a～18d overlaps at an A～D.Coil-conductor 18 with above formation overlaps when overlooking observation from the z direction of principal axis, forms the track of ring-type (rectangle).And then some A～D is positioned at each bight of this track.
Conductor introduction 16a is arranged on than coil-conductor 18 more near the axial positive direction side of z, and is arranged at the interarea of the axial positive direction side of z of magnetic layer 14d.This conductor introduction 16a is led to the side of the axial negative direction side of x of duplexer 12a, and 13a is connected with outer electrode.And conductor introduction 16a is overlapping with the annular orbit that is formed by coil-conductor 18 when overlooking observation from the z direction of principal axis.Therefore, conductor introduction 16a is when overlooking observation from the z direction of principal axis, overlapping at an A and coil-conductor 18a～18d.
Via conductors b2～b4 is arranged to connect magnetic layer 14e～14g along the z direction of principal axis, is connected with the coil-conductor 18 of adjacency on the z direction of principal axis.Specifically, coil-conductor 18 is overlapping with the coil-conductor 18 of adjacency on the z direction of principal axis at the some A～D that is positioned at the end.And then via conductors b2～b4 is connected with the coil-conductor 18 of adjacency on the z direction of principal axis.That is, coil-conductor 18a is overlapping at some B that is positioned at the end and coil-conductor 18b.The point B of via conductors b2 connecting coil conductor 18a, 18b.Coil-conductor 18b is overlapping at some A that is positioned at the end and coil-conductor 18c.The point A of via conductors b3 connecting coil conductor 18b, 18c.Coil-conductor 18c is overlapping at some D that is positioned at the end and coil-conductor 18d.The point D of via conductors b4 connecting coil conductor 18c, 18d.
And hole conductor b1 is arranged to connect magnetic layer 14d along the z direction of principal axis, and this magnetic layer 14d is arranged at than is provided with the magnetic layer 14e～14h of coil-conductor 18 more near the axial positive direction side of z.And then via conductors b1 is when overlooking observation from the z direction of principal axis, overlapping at an A and coil-conductor 18, and is electrically connected with outer electrode 13a via conductor introduction 16a.Thus, via conductors b1 connects conductor introduction 16a and coil-conductor 18a at an A.At this, the two ends of coil-conductor 18a are positioned at a B, C.Therefore, via conductors b1 is when overlooking observation from the z direction of principal axis, and the position beyond the end of coil-conductor 18a is connected with this coil-conductor 18a.That is, via conductors b1 is connected with this coil-conductor 18a under the state of the end of vacant coil-conductor 18a.
And via conductors b5 is arranged to connect magnetic layer 14h along the z direction of principal axis.And then via conductors b5 is positioned at a C when overlooking observation from the z direction of principal axis.Thus, via conductors b5 connects conductor introduction 16b and coil-conductor 18d at a C.Utilize above such conductor introduction 16, coil-conductor 18 and via conductors b1～b5 to constitute spiral helicine coil L.
(manufacturing approach of electronic unit)
Followingly the manufacturing approach of electronic unit 10a is described with reference to Fig. 1 and Fig. 2.
At first, preparation will become the ceramic green sheet (green sheet) of magnetic layer 14.Specifically, will be with the ratio weighing di-iron trioxide (Fe of regulation
2O
3), each material of zinc oxide (ZnO), nickel oxide (NiO) and cupric oxide (CuO) drops into ball mill as raw material, carries out wet mixed.With the mixture crushed after being dried that obtains, the powder that obtains carried out one hour preroast under 800 ℃.After in ball mill, the powders calcined that obtains being carried out case of wet attrition, drying is broken then, obtains the ferrite ceramics powder.
Add bond (vinyl acetate resin, water soluble propene etc.) and plasticizer, wetted material, dispersant to this ferrite ceramics powder, in ball mill, mix, carry out deaeration through decompression then.Utilize the scraping blade method that the ceramic slurry that obtains is formed sheet and makes its drying on slide glass, thus, process the ceramic green sheet that will become magnetic layer 14.
Next, form via conductors b1～b5 respectively at the ceramic green sheet that will become magnetic layer 14d～14h.Specifically, to the ceramic green sheet illuminating laser beam that will become magnetic layer 14d～14h, form through hole.Next, utilize methods such as printing coating to fill the conductive paste of Ag, Pd, Cu, Au or their alloy etc. to these through holes.At this moment, to form and put A, B, A, D, C when observing respectively overlapping overlooking from the z direction of principal axis for via conductors b1～b5.
Next; On the ceramic green sheet that will become magnetic layer 14d～14i; Utilize methods such as silk screen printing, photoetching process to apply, form coil-conductor 18a～18d and conductor introduction 16a, 16b thus with the conductive paste as principal component such as Ag, Pd, Cu, Au or their alloy.At this moment, form when overlooking observation from the z direction of principal axis coil-conductor 18a～18d and conductor introduction 16a overlapping with some A.In addition, form the operation of coil-conductor 18a～18d and conductor introduction 16a, 16b and also can in same operation, carry out to the operation of through hole filled conductive property cream.And, also can be through alternately printing conductive paste and the magnetic layer is processed female duplexer.
Next, range upon range of each ceramic green sheet.Specifically, for being formed with coil-conductor 18 and will becoming the ceramic green sheet of magnetic layer 14e～14h, adjustment will become magnetic layer 14e～14h ceramic green sheet number and carry out range upon range of so that coil L has the desirable number of turns.At this moment, so that the interarea that is provided with coil-conductor 18 and will becomes the ceramic green sheet of magnetic layer 14 is positioned at the mode of the axial positive direction side of z, the range upon range of ceramic green sheet that will become magnetic layer 14.
Specifically, configuration will become the ceramic green sheet of magnetic layer 14l.Next, on the ceramic green sheet that will become magnetic layer 14l, dispose the ceramic green sheet that will become magnetic layer 14k.Afterwards, with respect to the ceramic green sheet of magnetic layer 14l crimping will becoming magnetic layer 14k.The crimping condition is 100 tons～120 tons pressure and the time about 3～30 seconds.Afterwards, the ceramic green sheet that will become magnetic layer 14j, 14i, 14h, 14g, 14f, 14e is carried out range upon range of and crimping by this similarly in proper order.Next, than the ceramic green sheet that is formed with coil-conductor 18 and will becomes magnetic layer 14 more near the axial positive direction side of z, the range upon range of ceramic green sheet that is formed with via conductors b1 and will becomes magnetic layer 14d.At last, will become the ceramic green sheet of magnetic layer 14c, 14b, 14a by this sequential cascade and crimping.Thus, form the coil L of the number of turns with 13/4 circle.In addition, have in formation under the situation of coil L of the number of turns of 9/4 circle, as shown in Figure 3, range upon range of and crimping will become the ceramic green sheet of magnetic layer 14a～14d, 14g～14l.And, have in formation under the situation of coil L of the number of turns of 5/4 circle, as shown in Figure 4, range upon range of and crimping will become the ceramic green sheet of magnetic layer 14a～14d, 14h～14l.So, according to the number of turns of coil L, adjustment is formed with the number of the magnetic layer 14 of coil-conductor 18.Utilize above operation to form female duplexer.Utilize hydrostatic extruding etc. that this mother's duplexer is implemented formal crimping.
Next, utilize cutting edge female duplexer to be cut into the duplexer 12a of given size.Thus, the duplexer 12a that is not fired.This duplexer 12a that does not fire is gone adhesive treatment and fires.Go adhesive treatment for example in hypoxic atmosphere, under the condition of 500 ℃ and 2 hours, to carry out.Fire under the condition of for example 800 ℃～900 ℃ and 2.5 hours and carry out.
At last, through the surface of silver electrode being implemented plating Ni/ plating Sn, form outer electrode 13a, 13b.Via above operation, accomplish electronic unit 10a shown in Figure 1.
(effect)
According to above electronic unit 10a and manufacturing approach thereof, as following explanation, can not change conductor introduction 16a shape and via conductors b1 the position and change the number of turns of coil L.In more detail, under the situation of the number of turns that increases and decreases coil L,, can increase the number of turns of coil L through appending the magnetic layer 14 that is provided with coil-conductor 18 in the axial negative direction side of the z of magnetic layer 14d.And,, can reduce the number of turns of coil L through removing the magnetic layer 14 of the axial negative direction side of z that is positioned at magnetic layer 14d.Below, be that example describes with the situation of the number of turns that reduces coil L.
Coil L shown in Figure 2 has the number of turns of 13/4 circle.Change in the number of turns under the situation of 9/4 circle this coil L, as shown in Figure 3, as long as remove magnetic layer 14e, 14f.And, change in the number of turns under the situation of 5/4 circle coil L, as shown in Figure 4, as long as remove magnetic layer 14e～14g.
At this, as shown in Figure 2, conductor introduction 16a and via conductors b1 are when overlooking observation from the z direction of principal axis, overlapping at an A and coil-conductor 18a～18d.Thus, for the coil-conductor 18 of any one shape among coil-conductor 18a～18d, conductor introduction 16a can both be connected with it by via conductors b1.That is, like Fig. 3 and shown in Figure 4, for coil-conductor 18c, 18d, conductor introduction 16a also can be connected with it by via conductors b1.Therefore, according to electronic unit 10a and manufacturing approach thereof, can not change conductor introduction 16a shape and via conductors b1 the position and change the number of turns of coil L.
And in Fig. 2 and electronic unit 10a shown in Figure 4, via conductors b1 is connected with this coil-conductor 18a, 18d under the state of the end of vacant coil-conductor 18a, 18d.This means, be not that the mode of connecting through hole conductor designs conductor introduction with the end of not vacant coil-conductor 18a, 18d, but can design conductor introduction 16a with any ways of connecting among coil-conductor 18a～18d with via conductors b1.That is, when observing electronic unit 10a, like Fig. 2 and shown in Figure 4, if under the state of the end of vacant coil-conductor 18a, 18d connecting through hole conductor b1, can judge that then the application invents related electronic unit.In addition, with electronic unit 10a ' shown in Figure 3 example as a reference, be whether be cause that the application invent related electronic unit because only depend on if observing that electronic unit 10a ' can't differentiate.
And like Fig. 2 and shown in Figure 4, via conductors b1 is connected with this coil-conductor 18a, 18d under the state of the end of vacant coil-conductor 18a, 18d.Therefore, even the magnetic layer 14d of Fig. 2 and Fig. 4 moves to the axial negative direction lateral deviation of x when range upon range of, via conductors b1 and coil-conductor 18a, 18d can not open circuit yet.
And coil-conductor 18a～18d overlaps, and overlooks observation from the z direction of principal axis, forms rectangular track, and then conductor introduction 16a is when overlooking observation, with this rectangular Orbital Overlap from the z direction of principal axis.Thus, when overlooking observation from the z direction of principal axis, the situation that conductor introduction 16a crosses the inside of coil L can not take place.Consequently, keep the high inductance value of coil L.
And coil-conductor 18a～18d has the number of turns of 3/4 circle, and overlaps, and when overlooking observation from the z direction of principal axis, forms rectangular track.The part that in such coil-conductor 18, is cut off is the long limit and the minor face of the rectangular track between the position that connects at via conductors.That is, in coil-conductor 18, some A～D that via conductors connected is not cut off.Therefore, in electronic unit 10a, via conductors b1 overlooks from the z direction of principal axis when observing, if with some A～D in any one overlapping.Therefore, the degree of freedom in the design of conductor introduction 16a uprises.
(variation)
Below, describe with reference to the variation of accompanying drawing electronic unit 10a.Fig. 5 is the exploded perspective view of the duplexer 12b of the related electronic unit 10b of variation.
The difference of electronic unit 10a, 10b is the shape of conductor introduction 16a and the position of via conductors b1.In more detail, as shown in Figure 2 in electronic unit 10a, conductor introduction 16a and via conductors b1 are overlapping at an A and coil-conductor 18a～18d.On the other hand, as shown in Figure 4 in electronic unit 10b, conductor introduction 16a and via conductors b1 are overlapping at a D and coil-conductor 18a～18d.According to this electronic unit 10b, also can not change conductor introduction 16a shape and via conductors b1 the position and change the number of turns of coil L.
In addition, as stated, coil-conductor 18a～18d is at an A, beyond the D, and is also overlapping at a B, C.Therefore, conductor introduction 16a also can be in that for example to put B, C and coil-conductor 18a～18d overlapping.
(other execution mode)
Electronic unit involved in the present invention is not limited to electronic unit 10a, the 10b shown in the above-mentioned execution mode, in the scope of its purport, can change.
Fig. 6 is the stereoscopic figure of the related electronic unit 10c of other execution mode.Fig. 7 is the exploded perspective view of the duplexer 12c of this electronic unit 10c.Below, the stacked direction of electronic unit 10c is defined as the z direction of principal axis, will be defined as the x direction of principal axis along the direction on the limit of electronic unit 10c, will be defined as the y direction of principal axis with the direction of x direction of principal axis and z direction of principal axis quadrature.In addition, the difference with above-mentioned electronic unit 10c and electronic unit 10a below is that the center describes.
As shown in Figure 6, electronic unit 10c the upper surface of the duplexer 12c that is positioned at the axial two ends of z and below have outer electrode 13a, 13b.And as shown in Figure 7, electronic unit 10c does not have conductor introduction 16a, 16b.Replace above-mentioned conductor introduction 16a, 16b, possess via conductors b21～b23, b27～b29 and bonding conductor 19a～19f.
Via conductors b21～b23 is overlapping with some B when overlooking observation from the z direction of principal axis, and is arranged to connect magnetic layer 14m～14o along the z direction of principal axis.Thus, via conductors b21～b23 is connected at a B with coil-conductor 18e, and coil-conductor 18e is electrically connected with outer electrode 13a.
And via conductors b27～b29 is overlapping with some B when overlooking observation from the z direction of principal axis, and is arranged to connect magnetic layer 14s～14u along the z direction of principal axis.Thus, via conductors b27～b29 is connected at a B with coil-conductor 18g via via conductors b26, and coil-conductor 18g is electrically connected with outer electrode 13b.
And bonding conductor 19a～19f is arranged in magnetic layer 14m～14o, 14s～14u and via conductors b21～b23 respectively, b27～b29 is overlapping.Owing to be the state of the end of vacant coil-conductor 18e, therefore, even magnetic layer 14o squints to the axial positive direction of y when range upon range of, via conductors b23 and coil-conductor 18e can not open circuit yet.
As electronic unit 10c, coil L also can be electrically connected with outer electrode 13a, 13b via via conductors b21～b23, b27～b29.In this case, if via conductors b23 is arranged to and put among A～D any one overlapping, then can not change via conductors b21～b23 the position and the length of adjustment coil L.
In addition, in the manufacturing approach of electronic unit 10a, range upon range of from downside to upside according to the order of magnetic layer 14l, 14k, 14j, 14i, 14h, 14g, 14f, 14e, 14d, 14c, 14b, 14a.But the lamination order of magnetic layer 14 is not limited thereto.For example, also can be according to the sequential cascade of magnetic layer 14a～14l.In this case, magnetic layer 14 is range upon range of towards the mode of downside with the interarea that is provided with coil-conductor 18.And then magnetic layer 14d is disposed at than magnetic layer 14e～14l more near the position of the downside of stacked direction.
Utilize possibility on the industry
The present invention is useful for electronic unit and manufacturing approach thereof, and particularly the aspects such as position at the shape that when changing the number of turns of coil, need not to change conductor introduction, via conductors are excellent.
Symbol description:
A～D: point; L: coil; B1～b5, b21～b29: via conductors; 10a, 10b, 10c: electronic unit; 12a～12c: duplexer; 13a, 13b: outer electrode; 14a～14u: magnetic layer; 16a, 16b: conductor introduction; 18a～18g: coil-conductor; 19a～19f: bonding conductor.
Claims (8)
1. an electronic unit is characterized in that,
Said electronic unit possesses:
The duplexer that forms through range upon range of a plurality of insulator layers;
Be built in the spiral helicine coil in the said duplexer; And
Be arranged at the outer electrode on the surface of said duplexer,
Said coil comprises:
A plurality of coil-conductors, said a plurality of coil-conductors are arranged at the interarea of upside of the stacked direction of said insulator layer, overlook from stacked direction when observing, and the specified point on this insulator layer is overlapped; And
First via conductors, this first via conductors is arranged at said insulator layer, and is overlapping at said specified point and said a plurality of coil-conductor when overlooking observation from stacked direction, and is electrically connected with said outer electrode,
Be provided with the said insulator layer of said first via conductors, the said a plurality of insulator layers that are arranged at than are provided with said coil-conductor are more near the position of the upside of stacked direction,
Said first via conductors is when overlooking observation from stacked direction, the position beyond the end of said coil-conductor is connected with this coil-conductor.
2. electronic unit according to claim 1 is characterized in that,
Said coil also comprises inner conductor, and this inner conductor is arranged on the interarea of upside of the stacked direction of said insulator layer, and is connected with said first via conductors and said outer electrode.
3. electronic unit according to claim 2 is characterized in that,
Said a plurality of coil-conductor is overlapped and form the track of ring-type,
The Orbital Overlap of said inner conductor and said ring-type.
4. according to each described electronic unit in the claim 1～3, it is characterized in that,
Said a plurality of coil-conductor has the number of turns of (n/n+1) circle during for natural number at n, and overlapping with the said coil-conductor of adjacency on stacked direction at the said specified point place that is positioned at the end,
Said coil also comprises a plurality of second via conductors, and said a plurality of second via conductors are connected the said coil-conductor of adjacency on the stacked direction at said specified point place.
5. the manufacturing approach of an electronic unit is characterized in that,
Said electronic unit is made up of duplexer that is built-in with spiral helicine coil and the outer electrode that is arranged at the surface of this duplexer,
The manufacturing approach of said electronic unit possesses:
Prepare the operation of a plurality of insulator layers;
Will from stacked direction overlook when observing and said a plurality of insulator layer on the overlapping coil-conductor of specified point be formed at the operation of said a plurality of insulator layers;
To be electrically connected with said outer electrode and overlook when observing and the first overlapping via conductors of said specified point is formed at the operation of said insulator layer from stacked direction;
Adjustment is formed with the number of said a plurality of insulator layers of said coil-conductor; So that said coil has the desirable number of turns; Range upon range of said a plurality of insulator layers; And than the said a plurality of insulator layers that are formed with this coil-conductor more near the position of the upside or the downside of stacked direction, the range upon range of operation that is formed with the said insulator layer of said first via conductors; And
Form the operation of said outer electrode.
6. the manufacturing approach of electronic unit according to claim 5 is characterized in that,
The manufacturing approach of this electronic unit also possesses the operation that is formed for being connected said coil-conductor a plurality of second via conductors each other of adjacency on the stacked direction at the said specified point place of the said a plurality of insulator layers that are formed with said coil-conductor,
In the operation that forms said coil-conductor, form said coil-conductor as follows, that is, when n is natural number, have the number of turns of (n/n+1) circle, and be positioned at the said specified point of end, the said coil-conductor of adjacency overlaps each other on stacked direction.
7. according to the manufacturing approach of claim 5 or 6 described electronic units, it is characterized in that,
The manufacturing approach of this electronic unit also possesses the operation that forms the inner conductor that is connected with this first via conductors and said outer electrode at the said insulator layer that is formed with said first via conductors.
8. the manufacturing approach of electronic unit according to claim 7 is characterized in that,
In forming the operation of said coil-conductor, overlap and the mode that forms the track of ring-type forms said a plurality of coil-conductor with said a plurality of coil-conductors,
In the operation that forms said inner conductor, to form this inner conductor with the overlapping mode of said annular orbit.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
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| JP2009077123 | 2009-03-26 | ||
| JP2009-077123 | 2009-03-26 | ||
| PCT/JP2010/050718 WO2010109936A1 (en) | 2009-03-26 | 2010-01-21 | Electronic part and manufacturing method therefor |
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| CN102362320A true CN102362320A (en) | 2012-02-22 |
| CN102362320B CN102362320B (en) | 2014-07-30 |
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| CN201080012972.2A Active CN102362320B (en) | 2009-03-26 | 2010-01-21 | Electronic part and manufacturing method therefor |
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| JP (1) | JP5365689B2 (en) |
| CN (1) | CN102362320B (en) |
| WO (1) | WO2010109936A1 (en) |
Cited By (2)
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| CN105098300A (en) * | 2015-09-11 | 2015-11-25 | 禾邦电子（中国）有限公司 | Common-mode filter and manufacturing method therefor |
| CN106876089A (en) * | 2015-12-14 | 2017-06-20 | 株式会社村田制作所 | Electronic unit and its manufacture method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016139742A (en) * | 2015-01-28 | 2016-08-04 | 株式会社村田製作所 | Coil component |
| CN107968247B (en) * | 2017-11-28 | 2020-01-10 | 上海坤锐电子科技有限公司 | Antenna structure, reader and intelligent vending equipment |
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| CN1191376A (en) * | 1996-11-21 | 1998-08-26 | Tdk株式会社 | Multilayer electronic part and method for producing the same |
| JPH11317308A (en) * | 1998-05-01 | 1999-11-16 | Taiyo Yuden Co Ltd | Stacked inductor and manufacture of the same |
| CN1624826A (en) * | 2003-12-05 | 2005-06-08 | 株式会社村田制作所 | Method of manufacturing multilayered electronic component and multilayered component |
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| JP4973996B2 (en) * | 2007-08-10 | 2012-07-11 | 日立金属株式会社 | Laminated electronic components |
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- 2010-01-21 CN CN201080012972.2A patent/CN102362320B/en active Active
- 2010-01-21 JP JP2011505908A patent/JP5365689B2/en active Active
- 2010-01-21 WO PCT/JP2010/050718 patent/WO2010109936A1/en active Application Filing
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| JPH0354808A (en) * | 1989-07-21 | 1991-03-08 | Murata Mfg Co Ltd | Laminated inductance component |
| CN1191376A (en) * | 1996-11-21 | 1998-08-26 | Tdk株式会社 | Multilayer electronic part and method for producing the same |
| JPH11317308A (en) * | 1998-05-01 | 1999-11-16 | Taiyo Yuden Co Ltd | Stacked inductor and manufacture of the same |
| CN1624826A (en) * | 2003-12-05 | 2005-06-08 | 株式会社村田制作所 | Method of manufacturing multilayered electronic component and multilayered component |
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| CN105098300A (en) * | 2015-09-11 | 2015-11-25 | 禾邦电子（中国）有限公司 | Common-mode filter and manufacturing method therefor |
| CN106876089A (en) * | 2015-12-14 | 2017-06-20 | 株式会社村田制作所 | Electronic unit and its manufacture method |
| CN106876089B (en) * | 2015-12-14 | 2019-05-28 | 株式会社村田制作所 | Electronic component and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102362320B (en) | 2014-07-30 |
| WO2010109936A1 (en) | 2010-09-30 |
| JPWO2010109936A1 (en) | 2012-09-27 |
| JP5365689B2 (en) | 2013-12-11 |
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