JP2010123879A5 - - Google Patents

Claims (7)

A coil structure formed on an electronic circuit board in which a plurality of wiring layers and insulating layers are alternately laminated on a base material,
The insulating layer covers the wiring layer;
The wiring layer is
A coil comprising a wiring pattern;
A magnetic core disposed at the center of the coil and divided by a plurality of columnar portions extending in a direction perpendicular to the wiring layer;
Including
The coil structure according to claim 1, wherein the magnetic core and the magnetic core of the other layer are formed in the same position in the in-plane direction of each layer . 2. The coil structure according to claim 1, wherein an insulating layer and an adhesion layer are formed between the magnetic core on the lower layer side and the magnetic core on the upper layer side .   The coil structure according to claim 1 or 2, wherein a cross section of the columnar portion parallel to the wiring layer is a polygonal shape.   The coil structure according to claim 1 or 2, wherein the magnetic core is made of Ni or an alloy containing Ni.   3. The coil structure according to claim 2, wherein the stacked coils are connected in series and the directions of currents flowing through the coils are the same. A method of manufacturing a coil structure formed inside an electronic circuit board in which wiring layers and insulating layers are alternately laminated on a substrate,
Forming a seed layer on one surface above the substrate;
Forming a first plating resist layer having a coil-shaped opening on the seed layer;
Depositing a conductive material in the opening of the first plating resist layer to form a coil;
After removing the first plating resist layer, covering the seed layer and the coil, and forming a second plating resist layer having a plurality of openings on the center side of the coil;
Depositing a magnetic material in a plurality of openings of the second plating resist layer to form a magnetic core divided by a plurality of columnar parts ;
Removing the exposed seed layer after removing the second plating resist layer;
Forming an insulating film covering the coil and the magnetic core after removing the seed layer;
The manufacturing method of the coil structure characterized by having.   Furthermore, the adhesion layer is formed on the said magnetic body core, The manufacturing method of the coil structure of Claim 6 characterized by the above-mentioned.