JP6562363B2 - Multilayer conductive pattern inductor and manufacturing method thereof - Google Patents

Description

  The present invention relates to a multilayer conductive pattern inductor and a manufacturing method thereof.

  An inductor, which is one of chip electronic components, is a typical passive element that forms an electronic circuit together with a resistor and a capacitor to remove noise.

  The thin-film inductor is formed by forming an internal coil portion by plating, and then curing a magnetic powder-resin composite in which magnetic powder and resin are mixed to manufacture a magnetic body, and external electrodes are provided outside the magnetic body. Is manufactured.

JP 2006-278479 A JP 1998-241983

  An object of the present invention is to provide a multilayer conductive pattern inductor in which a cross-sectional area of an internal coil portion is increased and a direct current resistance (Rdc) is decreased, and a manufacturing method thereof.

  According to an embodiment of the present invention, the coil conductor includes an internal coil portion embedded in the magnetic body and formed by connecting coil conductors disposed on one surface and the other surface of the insulating substrate. There is provided a multilayer conductive pattern inductor including a conductive pattern formed of layers or more, a surface plating layer covering the conductive pattern, and an upper plating layer formed on an upper surface of the surface plating layer.

  According to the present invention, the cross-sectional area of the internal coil portion can be increased and the direct current resistance (Rdc) characteristics can be improved.

It is a schematic perspective view which shows the internal coil part of the multilayer conductive pattern inductor by one Embodiment of this invention. It is sectional drawing which follows the II 'line | wire of FIG. It is the schematic which expands and shows one Embodiment of the "A" part of FIG. It is the schematic which expands and shows other embodiment of the "A" part of FIG. (A)-(h) is a figure which shows sequentially the manufacturing method of the multilayer conductive pattern inductor by one Embodiment of this invention. It is a figure which shows the process of forming the electroconductive pattern by one Embodiment of this invention sequentially. It is a figure which shows the process of forming the electroconductive pattern by one Embodiment of this invention sequentially. It is a figure which shows the process of forming the electroconductive pattern by one Embodiment of this invention sequentially. It is a figure which shows the process of forming the electroconductive pattern by one Embodiment of this invention sequentially. It is a figure which shows the process of forming the electroconductive pattern by one Embodiment of this invention sequentially. It is a figure which shows the process of forming the electroconductive pattern by one Embodiment of this invention sequentially. It is a figure which shows the process of forming the surface plating layer by one Embodiment of this invention. It is a figure which shows the process of forming the upper plating layer by one Embodiment of this invention.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below. In addition, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shape and size of elements in the drawings may be exaggerated for a clearer description.

Multilayer Conductive Pattern Inductor FIG. 1 is a schematic perspective view showing an internal coil portion of a multilayer conductive pattern inductor according to an embodiment of the present invention.

  Referring to FIG. 1, a thin film inductor used as a power supply line of a power supply circuit is disclosed as an example of a multilayer conductive pattern inductor 100.

  A multilayer conductive pattern inductor 100 according to an embodiment of the present invention includes a magnetic body 50, an internal coil unit 40 embedded in the magnetic body 50, and an outer side of the magnetic body 50. First and second external electrodes 81 and 82 electrically connected to the coil unit 40 are included.

  In the multilayer conductive pattern inductor 100 according to an embodiment of the present invention, the “length” direction is the “L” direction in FIG. 1, the “width” direction is the “W” direction, and the “thickness” direction is the “T” direction. Define.

  The magnetic body 50 is not particularly limited as long as it is a material that has the appearance of the multilayer conductive pattern inductor 100 and exhibits magnetic characteristics, and may be formed by being filled with ferrite or metal magnetic powder, for example.

  The ferrite may be, for example, Mn—Zn ferrite, Ni—Zn ferrite, Ni—Zn—Cu ferrite, Mn—Mg ferrite, Ba ferrite or Li ferrite.

  The metal magnetic powder includes any one or more selected from the group consisting of Fe, Si, Cr, Al, and Ni, and may be, for example, an Fe—Si—B—Cr-based amorphous metal. However, it is not necessarily limited to this.

  The metal magnetic powder has a particle size of 0.1 μm to 30 μm, and may be included in a form dispersed in a thermosetting resin such as an epoxy resin or a polyimide.

  The internal coil unit 40 disposed inside the magnetic body 50 includes a first coil conductor 41 formed on one surface of the insulating substrate 20 and a first surface formed on the other surface facing the one surface of the insulating substrate 20. Two coil conductors 42 are connected to each other.

  The first and second coil conductors 41 and 42 can be formed by electroplating, but are not necessarily limited thereto.

  The first and second coil conductors 41 and 42 are covered with an insulating film (not shown) and do not directly contact the magnetic material forming the magnetic body 50.

  The insulating substrate 20 is formed of, for example, a polypropylene glycol (PPG) substrate, a ferrite substrate, or a metal soft magnetic substrate.

  A central portion of the insulating substrate 20 is penetrated to form a hole, and the hole is filled with a magnetic material to form a core portion 55. By forming the core portion 55 filled with the magnetic material, the inductance (Ls) can be improved.

  Each of the first and second coil conductors 41 and 42 may be a planar coil formed on the same plane of the insulating substrate 20.

  The first and second coil conductors 41 and 42 are formed in a spiral shape, and the first and second coil conductors 41 and 42 formed on one surface and the other surface of the insulating substrate 20 are formed as described above. They are electrically connected via vias (not shown) formed through the insulating substrate 20.

  The first and second coil conductors 41 and 42 and the via are formed to include a metal having excellent electrical conductivity. For example, silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni) , Titanium (Ti), gold (Au), copper (Cu), platinum (Pt), or an alloy thereof.

  The DC resistance (Rdc), which is one of the main characteristics of the inductor, decreases as the cross-sectional area of the coil conductor forming the internal coil portion increases. Further, the inductance of the inductor increases as the area of the magnetic material through which the magnetic flux passes increases.

  Therefore, in order to reduce the direct current resistance (Rdc) and improve the inductance, it is necessary to increase the cross-sectional area of the coil conductor forming the internal coil portion and increase the volume occupied by the magnetic material.

  As a method for increasing the cross-sectional area of the coil conductor, there are a method for increasing the width of the coil and a method for increasing the thickness of the coil.

  However, when the width of the coil is increased, the possibility of occurrence of a short between adjacent coils becomes very large, and the limit of the number of turns of the coil that can be realized is generated, and the volume of the magnetic material is reduced. The efficiency is reduced and there is a limit to realizing a high-capacity product.

  Therefore, there is a demand for a coil conductor having a structure having a high aspect ratio (Aspect Ratio, AR) by increasing the thickness of the coil with respect to the width of the coil.

  The aspect ratio (AR) of the coil conductor is a value obtained by dividing the coil thickness by the coil width. A higher aspect ratio (AR) can be realized as the increase in the coil thickness is larger than the increase in the coil width.

  However, when the coil conductor is formed by pattern plating, in which the plating resist is patterned and plated through the exposure and development processes as in the prior art, the thickness of the plating resist must be increased in order to increase the thickness of the coil. However, as the thickness of the plating resist is increased, there is a limitation in the exposure process that the exposure of the lower portion of the plating resist is not smooth, so that it is difficult to increase the thickness of the coil.

  Also, a thick plating resist must have a certain width or more in order to maintain its form, but after removing the plating resist, the width of the plating resist becomes an interval between adjacent coils. The space between the coils is widened, and there is a limit to improving the direct current resistance (Rdc) and inductance (Ls) characteristics.

  On the other hand, in Patent Document 2, in order to solve the limit of exposure due to the thickness of the resist film, the first resist pattern is formed by exposure and development, and then the first plating conductor pattern is formed. A process of forming a second plated conductor pattern after exposing and developing again on the resist pattern to form a second resist pattern is disclosed.

  However, when the internal coil part is formed by performing only the pattern plating method as in Patent Document 2, there is a limit in increasing the cross-sectional area of the internal coil part, and the interval between adjacent coils becomes wide. It is difficult to improve the direct current resistance (Rdc) and inductance (Ls) characteristics.

  Therefore, in one embodiment of the present invention, the conductive pattern is formed of two or more layers, a surface plating layer covering the conductive pattern is formed, and an upper plating layer is further formed on the upper surface of the surface plating layer. Thus, a coil conductor having a high aspect ratio (AR), an increased cross-sectional area, a narrow interval between adjacent coils, and a short circuit between adjacent coils can be prevented. To be able to.

  In addition, the specific structure and manufacturing method of the 1st and 2nd coil conductors 41 and 42 by one Embodiment of this invention are mentioned later.

  2 is a cross-sectional view taken along the line II ′ of FIG.

  Referring to FIG. 2, the first and second coil conductors 41 and 42 are formed on the first conductive pattern 61a formed on the insulating substrate 20 and on the upper surface of the first conductive pattern 61a. The second conductive pattern 61b, the surface plating layer 62 covering the first and second conductive patterns 61a and 61b, and the upper plating layer 63 formed on the upper surface of the surface plating layer.

  One end of the first coil conductor 41 formed on one surface of the insulating substrate 20 is exposed at one end surface of the magnetic body 50 in the length (L) direction, and is formed on the other surface of the insulating substrate 20. One end of the coil conductor 42 is exposed on the other end surface of the magnetic body 50 in the length (L) direction.

  However, the present invention is not necessarily limited thereto, and one end of each of the first and second coil conductors 41 and 42 may be exposed on at least one surface of the magnetic body 50.

  First and second external electrodes 81 and 82 are provided outside the magnetic body 50 so as to be connected to the first and second coil conductors 41 and 42 exposed on the end face of the magnetic body 50. It is formed.

  FIG. 3 is an enlarged schematic view showing an embodiment of the “A” portion of FIG.

  Referring to FIG. 3, a conductive pattern 61 according to an embodiment of the present invention includes a first conductive pattern 61a and a second conductive pattern 61b formed on the top surface of the first conductive pattern 61a. The conductive pattern 61 is covered with a surface plating layer 62, and an upper plating layer 63 is further formed on the upper surface of the surface plating layer 62.

  The conductive pattern 61 may be formed by pattern plating in which a plating resist patterned through exposure and development processes is formed on the insulating substrate 20, and the opening is filled by plating.

  The conductive pattern 61 according to an embodiment of the present invention is formed of at least two layers so as to include the first conductive pattern 61a and the second conductive pattern 61b.

  FIG. 3 shows that the conductive pattern 61 has a two-layer structure including the first and second conductive patterns 61a and 61b. However, the present invention is not necessarily limited to this and is utilized by those skilled in the art. The conductive pattern 61 may be formed of three or more layers within a range that can be achieved.

  The conductive pattern 61 may have a total thickness tSP of 100 μm or more.

  By forming the conductive pattern 61 with a structure of two or more layers, the limit of exposure due to the thickness of the plating resist can be overcome, and the total thickness tSP of the conductive pattern 61 can be 100 μm or more. By setting the total thickness tSP of the conductive pattern 61 to 100 μm or more, the thickness of the coil conductors 41 and 42 can be increased, and the coil conductors 41 and 42 having a high aspect ratio (AR) can be realized.

  The conductive pattern 61 may have a rectangular cross section in the thickness (T) direction.

  The conductive pattern 61 is formed by pattern plating as described above, and is a rectangle having a straight cross-sectional shape.

  The first and second coil conductors 41 and 42 further include a thin film conductor layer 25 disposed on the lower surface of the conductive pattern 61.

  The thin film conductor layer 25 may be formed by performing etching on the insulating substrate 20 after performing electroless plating or sputtering.

  A conductive pattern 61 is formed by electroplating the thin film conductor layer 25 using the thin film conductor layer 25 as a seed layer.

  The surface plating layer 62 covering the conductive pattern 61 may be formed by performing electroplating using the conductive pattern 61 as a seed layer.

  By forming the surface plating layer 62 that covers the conductive pattern 61, there is a limit to narrowing the width of the plating resist when forming only the conductive pattern by pattern plating, and the interval between adjacent coils is reduced. Can be solved, and the cross-sectional area of the coil conductor can be further increased to improve the DC resistance (Rdc) and inductance (Ls) characteristics.

  The surface plating layer 62 according to an embodiment of the present invention shown in FIG. 3 has a shape in which the degree of growth WP1 in the width direction and the degree of growth TP1 in the thickness direction are similar.

  In this way, the surface plating layer 62 covering the conductive pattern 61 is formed of an isotropic growth plating layer in which the degree of growth WP1 in the width direction and the degree of growth TP1 in the thickness direction are similar, so that adjacent coils are formed. It is possible to reduce the difference in thickness between them so as to have a uniform thickness, thereby reducing variations in DC resistance (Rdc).

  In addition, since the surface plating layer 62 is formed of an isotropically grown plating layer, the first and second coil conductors 41 and 42 are formed straight without being bent, so that a short between adjacent coils is prevented. It is possible to prevent the defect that the insulating film is not formed on a part of the first and second coil conductors 41 and 42.

  Although FIG. 3 shows that the surface plating layer 62 is one layer, the surface plating layer 62 is not necessarily limited to this, and two surface plating layers 62 are provided within a range that can be utilized by those skilled in the art. You may form by the above.

  The upper plating layer 63 formed on the upper surface of the surface plating layer 62 can be formed by electroplating.

  By further forming the upper plating layer 63 on the surface plating layer 62, the cross-sectional area of the coil conductor can be further increased to improve the DC resistance (Rdc) and inductance (Ls) characteristics.

  The upper plating layer 63 according to the embodiment of the present invention shown in FIG. 3 has a shape in which the growth in the width direction is suppressed and the degree of growth TP2 in the thickness direction is significantly large.

  As described above, the upper plating layer 63 formed on the surface plating layer 62 is formed of an anisotropic growth plating layer in which growth in the width direction is suppressed and the degree of growth TP2 in the thickness direction is remarkably large. Therefore, it is possible to prevent a short circuit between the coils and to further increase the cross-sectional area of the coil conductor.

  The upper plating layer 63, which is an anisotropic growth plating layer, is formed on the upper surface of the surface plating layer 62 and has a shape that does not cover all the side surfaces of the surface plating layer 62.

  The aspect ratio (AR) of the first and second coil conductors 41 and 42 thus formed according to an embodiment of the present invention may be 3.0 or more.

  FIG. 4 is an enlarged schematic view showing another embodiment of the “A” portion of FIG.

  Referring to FIG. 4, an upper plating layer 63 according to another embodiment of the present invention includes a first upper plating layer 63a formed on the upper surface of the surface plating layer 62, and the first upper plating layer 63a. A second upper plating layer 63b formed on the upper surface is included.

  The first and second upper plating layers 63a and 63b are different from each other in the growth direction TP2 in the thickness direction while suppressing the growth in the width direction, as in the embodiment shown in FIG. It is a direction growth plating layer and has a shape in which an anisotropic growth plating layer is formed of two layers.

  Thus, by forming the upper plating layer 63, which is an anisotropic growth plating layer, of two or more layers, the cross-sectional area of the coil conductor is further increased to improve the DC resistance (Rdc) and inductance (Ls) characteristics. Can do.

  FIG. 4 shows that the upper plating layer 63 has two layers. However, the upper plating layer 63 is not necessarily limited to this, and the upper plating layer 63 has two layers within a range that can be used by those skilled in the art. You may form by the above.

Method for Manufacturing Multilayer Conductive Pattern Inductor FIG. 5 is a diagram sequentially illustrating a method for manufacturing a multilayer conductive pattern inductor according to an embodiment of the present invention.

  Referring to FIG. 5A, an insulating substrate 20 is provided, and a via hole 45 ′ is formed in the insulating substrate 20.

  The via hole 45 ′ may be formed using a mechanical drill or a laser drill, but is not necessarily limited thereto.

  The laser drill may be, for example, a CO2 laser or a YAG laser.

  Referring to FIG. 5B, a thin film conductor layer 25 ′ is formed on the entire upper and lower surfaces of the insulating substrate 20, and a plating resist 71 having a conductive pattern forming opening is formed.

  The plating resist 71 may be a dry film resist or the like as a normal photosensitive resist film, but is not necessarily limited thereto.

  After applying the plating resist 71, an opening for forming a conductive pattern can be formed through exposure and development processes.

  Referring to FIG. 5C, the conductive pattern forming opening is filled with a conductive metal by plating to form a conductive pattern 61.

  Using the thin film conductor layer 25 ′ as a seed layer, the conductive pattern forming opening is filled with a conductive metal by electroplating to form a conductive pattern 61, and the via hole 45 ′ is filled with a conductive metal by electroplating. As a result, a via (not shown) is formed.

  At this time, in one embodiment of the present invention, the coil conductors 41 and 42 have a high aspect ratio (AR) by forming the conductive pattern 61 with two or more layers. A specific manufacturing method relating to this will be described later.

  Referring to FIG. 5D, the plating resist 71 is removed and the thin film conductor layer 25 ′ is etched so that the thin film conductor layer 25 is formed only on the lower surface of the conductive pattern 61.

  Referring to FIG. 5E, a surface plating layer 62 that covers the conductive pattern 61 and an upper plating layer 63 are formed on the upper surface of the surface plating layer 62.

  The surface plating layer 62 and the upper plating layer 63 are formed by electroplating.

  Referring to FIG. 5F, the insulating substrate 20 is excluded from the region where the first and second coil conductors 41 and 42 including the conductive pattern 61, the surface plating layer 62, and the upper plating layer 63 are formed. Remove the part.

  The central portion of the insulating substrate 20 is removed to form the core hole 55 ′.

  The insulating substrate 20 can be removed by mechanical drilling, laser drilling, sand blasting, punching, or the like.

  Referring to FIG. 5G, the insulating film 30 that covers the first and second coil conductors 41 and 42 is formed.

  The insulating film 30 may be formed by a known method such as a screen printing method, a photoresist (Photo Resist, PR) exposure and development step, or a spray coating step.

  Referring to FIG. 5 (h), the magnetic body 50 is formed by laminating, pressing and curing a magnetic sheet on the upper and lower portions of the first and second coil conductors 41 and 42.

  At this time, the core part hole 55 ′ is filled with a magnetic material to form the core part 55.

  Next, the first and second external electrodes are formed outside the magnetic body 50 so as to be connected to the ends of the first and second coil conductors 41 and 42 exposed on the end face of the magnetic body 50, respectively. 81 and 82 are formed.

  6a to 6f are diagrams sequentially illustrating a process of forming a conductive pattern according to an embodiment of the present invention.

  Referring to FIG. 6a, a first plating resist 71a having a first conductive pattern forming opening 71a 'is formed on the insulating substrate 20 on which the thin film conductor layer 25' is entirely formed.

  After applying the first plating resist 71a, a first conductive pattern forming opening 71a ′ can be formed through exposure and development processes.

  The thickness of the first plating resist 71a may be 40 μm to 60 μm.

  Referring to FIG. 6b, the first conductive pattern forming opening 71a ′ is filled with a conductive metal by plating to form a first conductive pattern 61a.

  Referring to FIG. 6C, a second plating resist 71b having a second conductive pattern forming opening 71b ′ is formed on the first plating resist 71a.

  After the second plating resist 71b is applied on the first plating resist 71a and the first conductive pattern 61a, the second conductive is used to expose the first conductive pattern 61a through exposure and development processes. A pattern forming opening 71b ′ can be formed.

  The thickness of the second plating resist 71b may be 40 μm to 60 μm.

  Referring to FIG. 6d, the second conductive pattern forming opening 71b ′ is filled with a conductive metal by plating, and the second conductive pattern 61b is formed on the upper surface of the first conductive pattern 61a. Form.

  Referring to FIG. 6e, the first and second plating resists 71a and 71b are removed.

  Referring to FIG. 6f, the thin film conductor layer 25 ′ is etched so that the thin film conductor layer 25 is formed only on the lower surfaces of the first and second conductive patterns 61a and 61b.

  The conductive pattern 61 thus formed has a two-layer structure.

  The cross section of the conductive pattern 61 in the thickness (T) direction has a rectangular shape, and the total thickness tSP of the conductive pattern 61 may be 100 μm or more.

  FIGS. 6a to 6f show only the process of forming the first and second conductive patterns 61a and 61b. However, the process is not necessarily limited thereto, and the processes of FIGS. 6c and 6d described above are performed. By repeatedly performing, a conductive pattern having a structure of two or more layers including at least one internal interface Sif may be formed.

  Further, the method of forming a conductive pattern having a structure of two or more layers is not necessarily limited to the above-described steps of FIGS. 6a to 6f. With the above, a conductive pattern having a structure of two or more layers may be formed.

  FIG. 7 is a diagram illustrating a process of forming a surface plating layer according to an embodiment of the present invention.

  Referring to FIG. 7, electroplating is performed based on the conductive pattern 61 to form a surface plating layer 62 that covers the conductive pattern 61.

  At this time, by adjusting the current density at the time of electroplating, the concentration of the plating solution, the plating speed, etc., as shown in FIG. 7, the surface plating layer 62 according to the embodiment of the present invention is grown in the width direction. It is possible to form an isotropically grown plating layer in which the degree of growth WP1 and the degree of growth TP1 in the thickness direction are similar.

  In this way, the surface plating layer 62 covering the conductive pattern 61 is formed of an isotropic growth plating layer in which the degree of growth WP1 in the width direction and the degree of growth TP1 in the thickness direction are similar, so that adjacent coils are formed. It is possible to reduce the difference in thickness between them so as to have a uniform thickness, thereby reducing variations in DC resistance (Rdc).

  In addition, since the surface plating layer 62 is formed of an isotropically grown plating layer, the first and second coil conductors 41 and 42 are formed straight without being bent, so that a short between adjacent coils is prevented. It is possible to prevent the defect that the insulating film 30 is not formed on a part of the first and second coil conductors 41 and 42.

  FIG. 8 is a diagram illustrating a process of forming an upper plating layer according to an embodiment of the present invention.

  Referring to FIG. 8, the upper plating layer 63 is further formed by performing electroplating on the surface plating layer 62.

  At this time, by adjusting the current density during electroplating, the concentration of the plating solution, the plating speed, etc., as shown in FIG. 8, the upper plating layer 63 according to the embodiment of the present invention is grown in the width direction. Can be formed by an anisotropic growth plating layer in which the degree of growth TP2 in the thickness direction is significantly suppressed.

  The upper plating layer 63 is formed by forming a first upper plating layer 63a on the upper surface of the surface plating layer 62 and forming a second upper plating layer 63b on the upper surface of the first upper plating layer 63a. Thus, it can be formed in two layers.

  Thus, by forming the upper plating layer 63, which is an anisotropic growth plating layer, of two or more layers, the cross-sectional area of the coil conductor is further increased to improve the DC resistance (Rdc) and inductance (Ls) characteristics. Can do.

  Except for the above description, the description overlapping the characteristics of the multilayer conductive pattern inductor according to the embodiment of the present invention described above is omitted.

  As mentioned above, although embodiment of this invention was described in detail, the scope of the present invention is not limited to this, and various correction and deformation | transformation are within the range which does not deviate from the technical idea of this invention described in the claim. It will be apparent to those having ordinary knowledge in the art.

100 multilayer conductive pattern inductor 20 insulating substrate 25 thin film conductor layer 30 insulating film 40 inner coil portions 41 and 42 first and second coil conductors 50 magnetic body 55 core portions 61, 61a and 61b conductive pattern 62 surface plating layer 63, 63a, 63b Upper plating layers 71, 71a, 71b Plating resist

Claims (20)

A magnetic body containing a magnetic material;
An internal coil portion embedded in the magnetic body and formed by connecting coil conductors disposed on one surface and the other surface of the insulating substrate;
Including
The coil conductor, conductive formed by two or more layers pattern, the conductive pattern surface plating layer covering, and the surface plating layer including an upper plating layer which is formed on the upper surface of the multilayer conductive pattern Inductor.   The upper plating layer includes a first upper plating layer formed on an upper surface of the surface plating layer and a second upper plating layer formed on an upper surface of the first upper plating layer. 2. The multilayer conductive pattern inductor according to 1.   The multilayer conductive pattern inductor according to claim 1, wherein the total thickness of the conductive pattern is 100 μm or more.   The multilayer conductive pattern inductor according to any one of claims 1 to 3, wherein a cross section in the thickness direction of the conductive pattern is a rectangle.   5. The multilayer conductive pattern inductor according to claim 1, wherein the surface plating layer has a shape grown in a width direction and a thickness direction. 6.   The multilayer conductive pattern inductor according to claim 1, wherein the upper plating layer has a shape grown in a thickness direction.   The multilayer conductive pattern inductor according to any one of claims 1 to 6, wherein the surface plating layer is an isotropically grown plating layer.   The multilayer conductive pattern inductor according to claim 1, wherein the upper plating layer is an anisotropic growth plating layer.   The multilayer conductive pattern inductor according to any one of claims 1 to 8, wherein a thin film conductor layer is disposed on a lower surface of the conductive pattern.   The multilayer conductive pattern inductor according to any one of claims 1 to 9, wherein the magnetic body includes a metal magnetic powder and a thermosetting resin. Forming a coil conductor on one surface and the other surface of the insulating substrate to form an internal coil portion;
Forming a magnetic body by laminating magnetic sheets on the upper and lower portions of the internal coil portion;
Including
Forming the coil conductor comprises:
Forming a conductive pattern formed of two or more layers on the insulating substrate; forming a surface plating layer covering the conductive pattern; and forming an upper plating layer on an upper surface of the surface plating layer. stage including, a method for manufacturing a multilayer conductive pattern inductor.   Forming the upper plating layer includes forming a first upper plating layer on the upper surface of the surface plating layer and forming a second upper plating layer on the upper surface of the first upper plating layer. The manufacturing method of the multilayer conductive pattern inductor of Claim 11 containing. Forming the conductive pattern comprises:
Forming a first plating resist having a first conductive pattern forming opening on the insulating substrate;
Filling the first conductive pattern forming opening by plating to form a first conductive pattern;
Forming a second plating resist having a second conductive pattern forming opening that exposes the first conductive pattern on the first plating resist and the first conductive pattern;
Filling the second conductive pattern forming opening by plating to form a second conductive pattern;
Removing the first and second plating resists;
The manufacturing method of the multilayer conductive pattern inductor of Claim 11 or 12 containing these.   The surface plating layer is formed by performing electroplating based on the conductive pattern, and is formed to grow in the width direction and the thickness direction on the surface of the conductive pattern. The manufacturing method of the multilayer conductive pattern inductor as described in any one of these.   The multilayer conductive film according to any one of claims 11 to 14, wherein the upper plating layer is formed by electroplating and is formed to grow in a thickness direction on an upper surface of the surface plating layer. Manufacturing method of a conductive pattern inductor. After forming the conductive pattern,
The method for manufacturing a multilayer conductive pattern inductor according to claim 11, further comprising etching a thin film conductor layer formed on a surface of the insulating substrate.   The method of manufacturing a multilayer conductive pattern inductor according to claim 11, wherein the conductive pattern has a total thickness of 100 μm or more. Forming a conductive pattern on an insulating substrate,
Forming a surface plating layer covering the conductive pattern;
Forming an upper plating layer on the upper surface of the surface plating layer;
Including
Forming a pre Kishirube conductive pattern,
Forming a first plating resist having a first conductive pattern forming opening on the insulating substrate;
Filling the first conductive pattern forming opening by plating to form a first conductive pattern;
Forming a second plating resist having a second conductive pattern forming opening that exposes the first conductive pattern on the first plating resist and the first conductive pattern;
Filling the second conductive pattern forming opening by plating to form a second conductive pattern;
Removing the first and second plating resists;
Including, a method for manufacturing a multilayer conductive pattern inductor. Forming a thin film conductor layer so as to cover the insulating substrate before forming the first plating resist;
The first plating resist and the first conductive pattern are formed on the thin film conductor layer, and the method further comprises etching the thin film conductor layer after removing the first and second plating resists. Item 19. A method for producing a multilayer conductive pattern inductor according to Item 18. Removing an insulating substrate portion excluding a region including the conductive pattern, the surface plating layer and the upper plating layer after the step of forming the upper plating layer;
Forming an insulating film so as to cover the upper plating layer;
Forming a magnetic body to cover the insulating substrate, the conductive pattern, the surface plating layer, the upper plating layer and the insulating film;
The method of manufacturing a multilayer conductive pattern inductor according to claim 18 or 19, further comprising:

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