KR102061510B1 - Inductor - Google Patents

Abstract

An inductor according to an example of the present disclosure is supported by a support member, the support member, the insulator including an opening of the first opening pattern, a coil including a coil pattern disposed inside the opening of the first opening pattern, And a body including a thin film conductor layer disposed between the coil pattern and the support member and including an opening of the second opening pattern, and an external electrode disposed on an outer surface of the body.

Description

Inductor {INDUCTOR}

The present disclosure relates to an inductor, and more particularly, to a thin film type power inductor which is advantageous for high capacity and miniaturization.

With the development of IT technology, miniaturization and thinning of devices are accelerating, and along with this, the market demand for small thin devices increases.

Patent Document 1 below provides a power inductor including a substrate having a via hole to be suitable for this technical trend, and coils disposed on both sides of the substrate and electrically connected through the via hole of the substrate, thereby providing a uniform and large aspect ratio of the coil. Try to provide an inductor with

Korean Patent Publication No. 10-1999-0066108

One of several problems to be solved by the inductor according to the present disclosure is to provide an inductor including a coil pattern having a high aspect ratio by miniaturizing the line width of a plurality of coil patterns.

An inductor according to an example of the present disclosure is supported by a support member, the support member, the insulator including an opening of the first opening pattern, a coil including a coil pattern disposed inside the opening of the first opening pattern, And a body including a thin film conductor layer disposed between the coil pattern and the support member and including an opening of the second opening pattern, and an external electrode disposed on an outer surface of the body. One end of both ends of the thin film conductor layer is disposed between the support member and the insulator, and in the first and second insulators adjacent to each other, the one side of the first insulator with respect to the average thickness of the coil pattern. The ratio of the difference between the thickness H1 at which the coil pattern extends and the thickness H2 at which the coil pattern extends on one side of the second insulator facing the one side of the first insulator is 15% or less.

An inductor according to another embodiment of the present disclosure includes a support member, an insulator supported by the support member, a coil pattern disposed inside the first opening pattern, and between the coil pattern and the support member. And a body including a thin film conductor layer including a second opening pattern, and an external electrode disposed on an outer surface of the body. Both ends of the thin film conductor layer are covered by the insulator, and are disposed between the support member and the insulator.

One of several effects of the present disclosure is to increase the aspect ratio of the coil pattern in the miniaturized inductor and to improve the electrical characteristics of the Rdc characteristic and the inductance characteristic.

1 is a schematic perspective view of an inductor according to a first embodiment of the present disclosure.
FIG. 2 is a cross-sectional view taken along line II ′ of FIG. 1.
3 is a cross-sectional view of the inductor according to the first modification of the inductor according to the first embodiment.
4 is a sectional view of an inductor according to a second modification of the inductor according to the first embodiment.
Fig. 5 is a sectional view of the inductor according to the third modification of the inductor according to the first embodiment.
6 is a sectional view of an inductor according to a fourth modification of the inductor according to the first embodiment.
7 is a schematic perspective view of an inductor according to a second embodiment of the present disclosure.
FIG. 8 is a cross-sectional view taken along the line II-II 'of FIG. 7.
9 is a sectional view of an inductor according to a first modification of the inductor according to the second embodiment.
10 is a sectional view of an inductor according to a second modification of the inductor according to the second embodiment.
11 is a sectional view of an inductor according to a third modification of the inductor according to the second embodiment.
12 is a sectional view of an inductor according to a fourth modification of the inductor according to the second embodiment.

DETAILED DESCRIPTION Hereinafter, embodiments of the present disclosure will be described with reference to specific embodiments and the accompanying drawings. However, embodiments of the present disclosure may be modified in various other forms, and the scope of the present disclosure is not limited to the embodiments described below. In addition, embodiments of the present disclosure are provided to more fully describe the present disclosure to those skilled in the art. Accordingly, the shape and size of elements in the drawings may be exaggerated for clarity, and the elements denoted by the same reference numerals in the drawings are the same elements.

In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present disclosure, and thicknesses are exaggerated to clearly express various layers and regions. It demonstrates using a sign.

Throughout the specification, when a part is said to "include" a certain component, it means that it can further include other components, without excluding other components unless specifically stated otherwise.

Hereinafter, an inductor according to an example of the present disclosure will be described, but is not necessarily limited thereto.

First Example

1 is a schematic perspective view of an inductor according to an example of the present disclosure, and FIG. 2 is a cross-sectional view taken along line II ′ of FIG. 1.

1 and 2, the inductor 100 includes a body 1 and an external electrode 2 on the outer surface of the body.

The external electrode 2 can be divided into first and second external electrodes 21 and 22. If the first external electrode is an input terminal, the second external electrode is configured as an output terminal. In FIG. 1, the first and second external electrodes may be formed of an alphabet C shape, but are not limited thereto. Those skilled in the art will appreciate that a person having ordinary skill in the art may have an appropriate cross-sectional shape, for example, an alphabet L shape or an alphabet I shape so as to be disposed only on one surface of a body. You can change it. The first and second external electrodes should include a conductive material, and may include a Cu preplating layer or an Ag-epoxy composite layer.

The body 1 forms an outer appearance of the inductor, and includes a first cross section and a second cross section facing in the length (L) direction, a first side surface and a second side face facing in the width (W) direction, and a thickness T direction. It consists of a substantially hexahedral shape including the upper and lower surfaces facing each other.

The body 1 includes a magnetic material 11, and the magnetic material may be a material having magnetic properties, for example, ferrite or magnetic metal particles may be filled in the resin, and the magnetic metal particles may be used. May include one or more of iron (Fe), silicon (Si), chromium (Cr), aluminum (Al), and nickel (Ni).

Since the magnetic material in the body functions as a passage through which the magnetic flux generated by the coil 12 flows, it is preferable that the coil is completely sealed except for the lead portion by the magnetic material.

The coil 12 is wound in a spiral shape as a whole, and the coil is connected to the first lead portion 121 and the second lead portion 122 connected to the first external electrode 21. ) In addition, the coil includes a plurality of coil patterns 12a and 12b as a main body of the coil wound in a spiral shape between the first and second lead portions.

The plurality of coil patterns 12a and 12b are supported by the support member 13. The support member 13 includes a through hole H at a central portion thereof, and since magnetic material is filled in the through hole, the magnetic flux generated from the coil may be strengthened. The supporting member includes a material having an insulating property and having a strength capable of appropriately supporting the coil pattern and the like. The shape of the support member is not particularly limited, but for the convenience of workability, it is preferable that the support member is formed in a plate shape having a predetermined thickness. It is preferable that the thickness does not exceed approximately 60 mu m, in view of the requirement of a low profile inductor. The support member may be, for example, a printed board, an ABF film, or a PF-EL material, but is not limited thereto. The support member may further include a via hole for forming a via for connecting the coil pattern supported by the upper surface of the support member to the coil pattern supported by the lower surface of the support member in the vicinity of the through hole. The via hole may be configured in plural, and the shape may be a tapered shape in which the diameter increases as the distance from the center of the support member increases, but the number or specific shapes of the via holes may be appropriately selected by those skilled in the art as needed. .

An insulator 14 is supported on at least one surface of the support member, that is, at least one of the upper surface 131 and the lower surface 132 of the support member. The insulator 14 includes a predetermined first opening 14h, by which the insulator is formed in a spiral shape similar to the shape of the cross section of the coil as a whole. The insulator 14 functions as a plating guideline for plating growth of the coil, and insulates the coil patterns adjacent to each other. Since the insulator 14 is configured to stably increase the aspect ratio of the coil, the insulator 14 is preferably configured to have a thickness larger than the thickness of the coil in consideration of the required thickness of the coil. If the thickness of the insulator is greater than the thickness of the coil, optionally, the step of changing the thickness of the insulator and the coil to the same level may be added. For example, after the formation of the coil is completed, at least a part of the portion of the insulator protruding from the upper surface of the coil is removed by mechanical polishing or chemical polishing.

The insulator 14 preferably comprises a permanent type photosensitive insulating material. For example, the photosensitive material may include a bisphenol-based epoxy resin as a main component, wherein the bisphenol-based epoxy resin is, for example, bisphenol A novolac epoxy resin, bisphenol A diglycidyl ether bisphenol A polymer resin, or the like. However, the present invention is not limited thereto, and any conventional resist material may be used as long as it is a permanent type.

Next, a thin film conductor layer 15 is formed on at least one of the upper surface 131 and the lower surface 132 of the support member. The thin film conductor layer is preferably composed of a shape corresponding to the shape of the cross section of the coil as a whole, since the thin film conductor layer functions as a seed pattern during plating growth of the coil. The thin film conductor layer 15 may have a spiral shape as a whole. In this case, when referring to the LT cross-section of the body, the thin film conductor layers may be formed of the first thin film conductor layer 151 and the first spaced apart from each other along the L direction. Two thin film conductor layers 152. When the first and second thin film conductor layers move along the winding direction of the thin film conductor layer, of course, they are electrically connected to each other. As such, since the thin film conductor layer includes the first and second thin film conductor layers 151 and 152 spaced apart from each other along the L direction with respect to the cross section, a predetermined gap is formed between the first and second thin film conductor layers. The second opening 15h is included.

1 and 2, when looking at the positional relationship between the insulator 14 and the thin film conductor layer 15 supported by the support member, both ends of the first thin film conductor layer 151, which is one of the thin film conductor layers, One end 151a of 151a, 151b is interposed between the said insulator and a support member with respect to the thickness direction. Since the insulator is formed after the thin film conductor layer is formed, one end 151a of the thin film conductor layer is a structure covered by the insulator. The line width at which the one end 151a is covered below the insulator can be appropriately selected by those skilled in the art. However, in order to prevent short circuits with other thin film conductor layers adjacent to the thin film conductor layer including the one end 151a, the insulator Is preferably covered by the insulator only to a degree shorter than half the line width of the bottom surface.

On the other hand, the opening 14h of the insulator 14 is filled by a combination of a thin film conductor layer and a coil pattern. The thin film conductor layer 15 is not located at the center of the opening 14h, but is oriented in one direction. Is placed. Nevertheless, the upper surface of the coil pattern filling the opening 14h is arranged to be substantially symmetrical.

The thin film conductor layer 15 may have a single layer or a laminated structure in which a plurality of layers are stacked.

In the case where the thin film conductor layer 15 has a laminated structure in which a plurality of layers are laminated, for example, the copper foil laminated layer is included in the entirety of one surface of the support member, and the Cu layer is formed through the chemical plating on the entire copper foil laminated layer. And to form a Cu layer again through an electrical method, but is not limited thereto. Of course, those skilled in the art may omit some metal layers in the laminate structure as necessary.

On the other hand, when the thin film conductor layer is a single layer, there is no limitation in a specific manner. For example, a metal layer may be coated on the entire surface of the support member using sputtering, and may be patterned using a laser, or may be electroless or electroless. After the conductive material is coated on the entire surface of the support member using chemical plating, it may be patterned by using a tenting method. When the thin film conductor layer is a single layer, there is no limitation on a specific material that can be used, but when forming the thin film conductor layer through a chemical method, it is preferable that the metal layer is copper, nickel, tin, gold, or the like, and the sputtering method When forming a thin film conductor layer through it may be to include a coated copper layer, to titanium, molybdenum. Moreover, although it can form through printing using a paste system, in this case, it is preferable that it is metal layers, such as copper and silver.

The thin film conductor layer is disposed in a direction other than the center of the opening 14h, and an inductor in which one end 151a of the thin film conductor layer is buried under the insulator will greatly increase the process freedom in patterning the insulator. Can be. When the line width of the opening of the insulator is narrowed, that is, when the line width of the coil pattern is narrowed, it is difficult to maintain the alignment so that the entirety of the thin film conductor layer can be arranged into the opening of the insulator. However, when one end of the thin film conductor layer is interposed between the insulator and the support member, if only the remaining portion of the thin film conductor layer except for the one end is arranged in the opening, the alignment can be maintained. The degree of freedom of the process can be maintained even at the line width of.

In addition, the deviation of the height (H1, H2) of the upper surface of the coil pattern filling the opening in contact with the side surface of the insulator adjacent to the left and right is preferably 15% or less than the average height of the upper surface of the coil pattern. The coil pattern 12a fills the inside of the opening 14h between the first insulator 141 near the center of the body and the second insulator 142 near the outside of the body, in which case the upper surface of the coil pattern The ratio R between the height H1 at which the upper surface of the coil pattern is in contact with the side surface of the first insulator and the height H2 at which the side surface of the second insulator is in contact with the average height is within 15%. It is preferable that it is the range of. When the range of R exceeds 15%, the inclination of the upper surface of the coil pattern is increased so that the risk of short circuit between the coil patterns may be increased by passing over the upper surface of the insulator, and deterioration of electrical characteristics, such as deterioration of breakdown voltage characteristics, may occur. Is concerned.

Table 1 below shows the difference between the height H1 of the upper surface of the coil pattern in contact with the side surface of the first insulator and the height H2 of the side of the second insulator in comparison to the average height of the upper surface of the coil pattern (H1-H2). The incidence of short defects according to the ratio is shown. In the comparative example, an asterisk was added to the upper right of the number.

Experimental Example No. R Short defective rate One 1.3% 0.03 2 1.8% 0 3 2.1% 0 4 2.2% 0.02 5 4.5% 0.03 6 4.6% 0.01 7 7.6% 0.02 8 8.5% 0 9 8.9% 0 10 12.5% 0.06 11 13.6% 0.03 12 14.5% 0.01 13 15.0% 0.03 14 * 15.1% 1.56 15 * 16.8% 1.43 16 * 16.9% 2.01 17 * 17.1% 2.21 18 * 18.5% 1.95 19 * 18.6% 2.65 20 * 19.5% 5.01 21 * 20.1% 4.95

The inductors of Examples 1 to 13 of Table 1 have a short sense of short failure rate, and the method of plating such coil patterns is not limited to the one described below. However, since the thin film conductor layer is inclined to one side rather than the center of the opening, the initial plating is excessively grown only on the side of the thin film conductor layer due to the plating growth characteristics, and thus the top surface of the coil pattern is inclined. Of course, you should use a workaround. As an example of the method to solve the problem, in the case of increasing the concentration of copper to sulfuric acid in the sulfuric acid and copper added to the plating solution and adding a solution having a plating function, the promoter component in the additive of the solution is grown by heterogeneous adsorption The speed can be reduced to reduce the thickness distribution. Alternatively, when a current is applied using a pulse / reverse rectifier, growth of the high current portion is suppressed, and growth of the low current portion is relatively increased, so that the shape of the overall coil pattern can be leveled.

2, an insulating layer 16 is further disposed on the upper surface of the coil pattern. Since the insulating layer 16 is for insulating between the coil pattern and the magnetic material, the insulating layer 16 includes a material having insulating properties. The insulating layer 16 may include a material different from an insulator for insulation between adjacent coil patterns. The insulating layer is disposed to coat the upper surface of the coil pattern, the side surface of the insulator, and the entire upper surface. Although there is no limitation in a specific coating method, in order to obtain a thin and uniform insulating layer, the perylene-containing insulating resin is chemically Coating may be by vapor deposition.

3 shows a cross-sectional view of the inductor 110 according to the first modification to the inductor 100 according to the first embodiment shown in FIGS. 1 and 2. For convenience of description, the components different from the inductor described with reference to FIGS. 1 and 2 will be described, and the same reference numerals will be used for the same components.

Referring to the inductor 110 shown in FIG. 3, the inner surface of the innermost coil pattern 112a does not contact the insulator, but directly contacts the insulating layer 116. The insulator supporting the inner surface of the innermost coil pattern is removed, and the insulating layer is formed at a position where the insulator is removed. The thickness of the insulating layer is approximately 10-20 μm, which is relatively thinner than the thickness of the insulator for insulating coil patterns adjacent to each other. As a result, as a core center of the coil, a space in which the magnetic material can be filled is largely secured, and the permeability of the inductor can be increased. There is no limitation in the manner of selectively removing the insulator in contact with the inner surface of the innermost coil pattern and arranging the insulating layer 116. For example, the insulator is removed through a laser and the insulating layer 116 is removed. The chemical vapor deposition (CVD) method of the insulating resin including the insulating material may be continuously arranged not only the top surface of the coil pattern but also the top surface of the insulator.

4 shows a cross-sectional view of the inductor 120 according to the second modification to the inductor 100 according to the first embodiment shown in FIGS. 1 and 2. For convenience of description, the components different from the inductor described with reference to FIGS. 1 and 2 will be described, and the same reference numerals will be used for the same components.

The inductor 120 of FIG. 4 is a case where the insulating layer 216 does not extend toward the supporting member to abut the supporting member, but is laminated on the upper surface of the coil pattern and the upper surface of the insulator. The insulating layer 216 insulates the coil pattern from the magnetic material by laminating a film-shaped insulating resin on the upper surface of the coil pattern and the upper surface of the insulator. Both ends of the insulating layer are preferably formed to be located in the same line as the outermost of the innermost and the outermost of the insulators disposed on the innermost side, the insulating function between the coil pattern and the magnetic material Since there is no deterioration, at least some of both ends of the insulating layer may be formed short in a direction close to the upper surface of the coil pattern.

5 shows a cross-sectional view of the inductor 130 according to a third modification to the inductor 100 according to the first embodiment shown in FIGS. 1 and 2. For convenience of description, the components different from the inductor described with reference to FIGS. 1 and 2 will be described, and the same reference numerals will be used for the same components.

Similar to the inductor 120 of FIG. 4, the inductor 130 of FIG. 5 is configured in such a manner that the insulating layer is laminated on the upper surface of the coil pattern, but at least one of both ends 316a and 316b of the insulating layer 316. The ends protrude further towards the center of the core or towards the outer surface of the body. The inductor 130 of FIG. 5 is expressed such that both of the end portions 316a and 316b protrude from the inner side surface of the innermost insulator and the outer side surface of the outermost insulator, but it is also possible that only one end of both ends protrudes. Do.

By protruding at least one end of both ends of the insulating layer, it is possible to enhance the insulating properties, the insulation failure occurs due to the delamination between the insulating layer and the insulator or between the insulating layer and the coil pattern during the use or production of the inductor. It is to increase the fixing force of the insulating layer by protruding the insulating layer 316 to prevent that.

6 shows a cross-sectional view of the inductor 140 according to the fourth modification to the inductor 100 according to the first embodiment shown in FIGS. 1 and 2. For convenience of description, the components different from the inductor described with reference to FIGS. 1 and 2 will be described, and the same reference numerals will be used for the same components.

Referring to the inductor 140 of FIG. 6, the insulator 414 has a shape in which the line width increases as it approaches the support member. When the line width of the insulator 414 becomes thin, there is an advantage that the number of windings of the coil pattern can be relatively increased in the miniaturized inductor. However, the thinner the line width of the insulator, the more difficult it is to control the thin film conductor layer to be disposed on at least a portion of the lower surface of the insulator. Thus, the inductor 140 increases the line width of the lower surface of the insulator, which should cover at least a portion of the end of the thin film conductor layer, compared to the line width of the upper surface, thereby allowing the thin film conductor layer to be interposed between the lower surface of the insulator and the supporting member. The overall width of the insulator can be controlled to a very thin level.

In the inductor, when the coil pattern having a fine line width is realized, the insulator for insulation between adjacent coil patterns and the thin film conductor layer, which is the seed pattern of the coil pattern, can be aligned and the degree of freedom of alignment can be realized within a limited chip size. The inductance can be remarkably improved by making the line width of the coil pattern narrower.

2nd Example

Next, FIG. 7 is a schematic perspective view of the inductor 200 according to the second embodiment of the present disclosure, and FIG. 8 is a cross-sectional view taken along the line II-II 'of FIG. 7. For convenience of description, descriptions overlapping with those described in the inductor according to the first embodiment and the inductor according to the modification will be omitted.

7 and 8, the inductor 200 includes a body 210 and an external electrode 220 disposed on an outer surface of the body. The external electrode includes a first external electrode 221 on a first cross section of the body and a second external electrode 222 on a second cross section.

An interior of the body 210 has a magnetic material 211, a coil 212 sealed by the magnetic material, a support member 213 for supporting the coil, and an insulator 214 for insulating the coil pattern in the coil. , And an insulating layer 216. The lower surface of the coil pattern is provided with a thin film conductor layer 215 which is the basis of plating growth.

Both ends 215a and 215b of the thin film conductor layer 215 are covered by the insulator. The entire inside of the opening 215h of the thin film conductor layer 215 is filled by the insulator 214.

The lengths L1 and L2 of which both ends are covered by the insulator are equal to each other, and are preferably symmetrical. However, the length L1 is not limited thereto. , L2) may be different from each other.

The insulator 214 is adjacent to each other and includes a first insulator 214a and a second insulator 214b facing each other in the LT cross section, the lower part of the opening 214h between the first insulator and the second insulator Is filled by the thin film conductor layer, and is filled by the coil pattern thereon. In this case, the edge portion E1 formed by the side surface of the first insulator 214a and the upper surface 213a of the support member is substantially completely filled by the thin film conductor layer and the coil pattern formed thereon, The side surface of the second insulator 214b and the corner portion E2 formed by the upper surface 213a of the support member are substantially completely filled by the thin film conductor layer and the coil pattern formed thereon. Here, the filling of the corresponding edge portion substantially completely means that no meaningful void is formed. The voids are a kind of plating failure, and due to the voids, it is difficult to realize a cross-sectional shape of a desired coil pattern, electrical characteristics such as loss of DC resistance characteristics are deteriorated, and the possibility of falling of the insulator or lifting of the insulator increases. However, in the case of the inductor 200, no void occurs in the corner portions E1 and E2, so that the problem of plating failure does not occur.

7 and 8, the opening 215h of the thin film conductor layer is filled only by the insulator 214, and specifically, forms a thin film conductor layer having an opening pattern, and insulates the insulating properties to form the insulator. The laminate has an insulating sheet laminated in a single layer or more, the width W1 of the opening 214h of the insulator is smaller than the line width W2 of the thin film conductor layer, and both ends of the thin film conductor layer are covered by the insulator. The insulator is patterned to be covered. In this case, the patterning method is not limited, and in consideration of the physical properties of the insulating sheet for forming an insulator, exposure and development may be applied or a laser process may be applied, but is not limited thereto.

In addition, the top surface of the insulator 214 and the top surface of the coil 212 are surrounded by the insulating layer 216, in which case the insulating layer overlaps with that described in the inductor 100 shown in Figs. Since descriptions are included, a separate description will be omitted.

9 is a cross-sectional view of the inductor 210 according to the first modification of the inductor according to the second embodiment of the present disclosure. In contrast to the inductors shown in FIGS. 7 and 8, the inductor shown in FIG. 9 removes the insulator contacting the inner surface of the innermost coil pattern of the insulator and immediately contacts the inner surface of the innermost coil pattern with the insulating layer. Is distinguished from the one. Since the first modification of the inductor according to the second embodiment includes the modification of the same components as the first modification of the inductor according to the first embodiment, a detailed description thereof is omitted here.

Likewise, inductor 220 of FIG. 10 includes variations of the same components as inductor 120 of FIG. 4, and inductor 230 of FIG. 11 includes variations of the same components as inductor 130 of FIG. 5. 12 includes variations of the same components as inductor 140 of FIG. Therefore, detailed descriptions of the inductors 220, 230, and 240 of FIGS. 10 to 12 are omitted here.

The present disclosure is not to be limited by the foregoing embodiments and the accompanying drawings, but is intended to be limited by the appended claims. Accordingly, various forms of substitution, modification, and alteration may be made by those skilled in the art without departing from the technical spirit of the present disclosure described in the claims, which also belong to the scope of the present disclosure. something to do.

On the other hand, the expression "one example" used in the present disclosure does not mean the same embodiment, but is provided to emphasize each different unique features. However, the examples presented above do not exclude the implementation in combination with other example features. For example, even if the matter described in one specific example is not described in another example, it may be understood as the description related to another example unless there is a description that is contradictory or contradictory to the matter in another example.

Meanwhile, the terminology used herein is for the purpose of describing one example only and is not intended to be limiting of the present disclosure. As used herein, the singular forms "a", "an" and "the" include plural forms unless the context clearly indicates otherwise.

100, 200: inductor
2: external electrode
1: body
11: magnetic material
12: coil
13: support member

Claims (16)

Support member,
An insulator supported by the support member and including an opening of the first opening pattern,
A coil including a coil pattern disposed inside the opening of the first opening pattern, and
A body including a thin film conductor layer disposed between the coil pattern and the support member and including an opening of a second opening pattern; And
An external electrode disposed on an outer surface of the body; Including,
One end of both ends of the thin film conductor layer is disposed between the support member and the insulator,
In the first and second insulators adjacent to each other, the thickness (H1) that extends the coil pattern to one side of the first insulator with respect to the average thickness of the coil pattern facing the one side of the first insulator The ratio of the deviation of the thickness H2 at which the coil pattern extends to one side of the second insulator is 15% or less,
One end of the thin film conductor layer is buried under the insulator.
The method of claim 1,
An opening of the second opening pattern is filled by the insulator and the coil pattern.
The method of claim 1,
And the thin film conductor layer consists of a single layer.
The method of claim 3,
And the thin film conductor layer comprises one of copper, nickel, tin, gold, titanium, molybdenum, and silver.
The method of claim 1,
The thin film conductor layer has a laminated structure of a plurality of layers.
The method of claim 5,
The line width of each of the plurality of layers is the same.
The method of claim 1,
At least a portion of the bottom surface of the coil pattern directly contacts the support member in the opening of the second opening pattern.
The method of claim 1,
And an insulating layer further disposed on an upper surface of the coil pattern.
The method of claim 8,
The insulator layer extends more inward than the innermost side of the insulator, or extends more outward than the outermost side.
Support member,
An insulator supported by the support member and including an opening of the first opening pattern,
A coil including a coil pattern disposed inside the opening of the first opening pattern, and
A body including a thin film conductor layer disposed between the coil pattern and the support member and including an opening of a second opening pattern; And
An external electrode disposed on an outer surface of the body; Including,
Both ends of the thin film conductor layer are disposed between the support member and the insulator and are covered by the insulator.
The method of claim 10,
The portion of the upper surface of the thin film conductor layer not covered by the insulator is covered by the coil pattern.
The method of claim 10,
An entirety of a lower portion of the opening of the first opening pattern is filled by the thin film conductor layer.
The method of claim 10,
An inductor each having a length covered by the insulator at both ends of the thin film conductor layer equal to each other.
The method of claim 10,
And the insulator has a thicker linewidth toward the support member.
The method of claim 10,
An edge formed between a side of the insulator and one surface of the support member supporting the insulator is completely filled by the thin film conductor layer and the coil pattern disposed thereon.
The method of claim 10,
The line width of the lower surface of the thin film conductor layer in contact with the support member is larger than the width of the opening of the first opening pattern in which the thin film conductor layer is disposed.

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