KR20190046590A - Inductor - Google Patents

Abstract

Provided is an inductor having a coil pattern with a high aspect ratio. To this end, according to an embodiment of the present invention, the inductor comprises: a body including a support member, an insulator supported by the support member and including an opening unit of a first opening pattern, a coil including a coil pattern arranged in the opening unit of the first opening pattern, and a thin film conductor layer between the coil pattern and the support member and including an opening unit of a second opening pattern; and an external electrode arranged on an external surface of the body.

Description

Inductor {INDUCTOR}

The present disclosure relates to an inductor, and more particularly, to a thin film power inductor that is advantageous in terms of high capacity and miniaturization.

Along with the development of IT technology, miniaturization and thinning of devices are accelerating, and at the same time, the market demand for small and thin devices increases.

The following Patent Document 1 proposes a power inductor comprising a substrate having a via hole adapted to such a technology trend and coils electrically connected to each other through the via hole of the substrate arranged on both sides of the substrate, RTI ID = 0.0 > inductor < / RTI >

Korean Patent Laid-Open Publication No. 10-1999-0066108

One of the problems to be solved by the inductor according to the present disclosure is to provide an inductor including a high-aspect-ratio coil pattern by miniaturizing the line width of a plurality of coil patterns.

An inductor according to an example of the present disclosure includes a support member, an insulator supported by the support member and including an opening of the first opening pattern, a coil including a coil pattern disposed inside the opening of the first opening pattern, And a thin film conductor layer disposed between the coil pattern and the support member, the thin film conductor layer including an opening of the second opening pattern, and an external electrode disposed on an outer surface of the body. Wherein one end of both ends of the thin film conductor layer is disposed between the support member and the insulator, and in the first and second insulators adjacent to each other, with respect to an average thickness of the coil pattern, The ratio of the thickness (H1) at which the coil pattern extends and the variation of the thickness (H2) at which the coil pattern extends from one side of the second insulator facing the one side of the first insulator is 15% or less.

An inductor according to another example of the present disclosure includes a support member, an insulator supported by the support member and including a first opening pattern, a coil pattern disposed inside the first opening pattern, and a coil pattern disposed between the coil pattern and the support member A body including a thin film conductor layer including a second opening pattern, and an external electrode disposed on the external surface of the body. Both ends of the thin film conductor layer are covered with the insulator and disposed between the support member and the insulator.

One of the effects of the present disclosure is to increase the aspect ratio of the coil pattern in a miniaturized inductor and to improve the electrical characteristics of the Rdc characteristic and the inductance characteristic.

1 is a schematic perspective view of an inductor according to a first embodiment of the present disclosure;
2 is a cross-sectional view taken along line I-I 'of FIG.
3 is a cross-sectional view of an inductor according to a first modification of the inductor according to the first embodiment.
4 is a cross-sectional view of an inductor according to a second modification of the inductor according to the first embodiment.
5 is a cross-sectional view of an inductor according to a third modification of the inductor according to the first embodiment.
6 is a cross-sectional view of an inductor according to a fourth modification of the inductor according to the first embodiment.
7 is a schematic perspective view of an inductor according to a second embodiment of the present disclosure;
8 is a cross-sectional view taken along line II-II 'of FIG.
9 is a sectional view of an inductor according to a first modification of the inductor according to the second embodiment.
10 is a sectional view of an inductor according to a second modification of the inductor according to the second embodiment.
11 is a sectional view of an inductor according to a third modification of the inductor according to the second embodiment.
12 is a sectional view of an inductor according to a fourth modification of the inductor according to the second embodiment.

Hereinafter, embodiments of the present disclosure will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present disclosure can be modified into various other forms, and the scope of the present disclosure is not limited to the embodiments described below. Furthermore, the embodiments of the present disclosure are provided to more fully describe the present disclosure to those skilled in the art. Accordingly, the shapes and sizes of the elements in the drawings may be exaggerated for clarity of description, and the elements denoted by the same reference numerals in the drawings are the same elements.

In order to clearly illustrate the present disclosure in the drawings, thicknesses have been enlarged for the purpose of clearly illustrating the layers and regions, and the same reference numerals are used for the same components. Will be described using the symbols.

Throughout the specification, when an element is referred to as " comprising ", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise.

Hereinafter, an inductor according to an example of the present disclosure will be described, but it is not necessarily limited thereto.

1st Example

FIG. 1 is a schematic perspective view of an inductor according to an example of the present disclosure, and FIG. 2 is a sectional view taken along a line I-I 'of FIG.

1 and 2, an inductor 100 includes a body 1 and an outer electrode 2 on the outer surface of the body.

The external electrode 2 may be divided into first and second external electrodes 21 and 22. If the first external electrode is an input terminal, the second external electrode may be an output terminal. In FIG. 1, the first and second external electrodes are formed of alphabet C, but are not limited thereto. Those skilled in the art will understand that the first and second external electrodes may have an appropriate cross-sectional shape, for example, an alphabet letter L or an alphabet letter I Can be changed. The first and second external electrodes should include a conductive material, and may include a Cu line plating layer or may include an Ag-epoxy composite layer.

The body 1 forms an outer surface of the inductor and has a first end face and a second end face facing each other in the length L direction, a first side face and a second side facing each other in the width W direction, The upper surface and the lower surface facing each other.

The body 1 may include a magnetic material 11, and the magnetic material may be a material having magnetic properties. For example, ferrite or metal magnetic particles may be filled in the resin, and the metal magnetic particles May include at least one of Fe, Si, Cr, Al, and Ni.

Since the magnetic substance in the body functions as a passage through which the magnetic flux generated by the coil 12 flows, it is preferable that the coil is completely sealed except for the lead portion by the magnetic material.

The coil 12 is wound in a spiral shape as a whole and the coil includes a first lead portion 121 connected to the first external electrode 21 and a second lead portion 122 connected to the second external electrode 22 ). In addition, the coil includes a plurality of coil patterns (12a, 12b) as a main body of a coil wound spirally between the first and second lead portions.

The plurality of coil patterns (12a, 12b) are supported by a support member (13). The support member 13 includes a through hole H at a central portion thereof, and magnetic material generated from the coil can be strengthened because magnetic material is filled in the through hole. The support member includes a material having an insulation property and a strength capable of appropriately supporting the coil pattern and the like. The shape of the support member is not particularly limited, but is preferably a plate-like shape having a predetermined thickness for convenience of workability. Considering the requirement of a low profile inductor, it is preferable that the thickness does not exceed about 60 占 퐉. The support member may be, for example, a printed board, an ABF film, or a PF-EL material, but is not limited thereto. The support member may further include a via hole for forming a via for connecting the coil pattern supported by the upper surface of the support member and the coil pattern supported by the lower surface of the support member in the vicinity of the through hole. It is needless to say that the number of the via holes and the specific shape can be appropriately selected by those skilled in the art, as required by the person skilled in the art, as long as the shape of the via hole becomes larger as the distance from the center of the support member increases .

An insulator 14 is supported on at least one side of the supporting member, that is, on at least one of the upper surface 131 and the lower surface 132 of the supporting member. The insulator 14 includes a predetermined first opening 14h, which, by means of the first opening, constitutes a spiral shape which is generally similar in shape to the cross-section of the coil. The insulator 14 functions as a plating guiding line for plating the coil, and functions to insulate the adjacent coil patterns. Since the insulator 14 is configured to stably increase the aspect ratio of the coil, it is preferable that the insulator 14 has a thickness greater than the thickness of the coil in consideration of the required thickness of the coil. If the thickness of the insulator is larger than the thickness of the coil, a step of selectively changing the thicknesses of the insulator and the coil to the same level may be added. For example, after the formation of the coil is completed, the insulator removes at least a part of the protruded portion from the upper surface of the coil through mechanical polishing or chemical polishing.

The insulator 14 preferably includes a permanent type photosensitive insulating material. For example, the photosensitive material may include a photosensitive material containing a bisphenol-based epoxy resin as a main component. The bisphenol-based epoxy resin may be, for example, bisphenol A novolak epoxy resin, bisphenol A diglycidyl ether bisphenol A polymer resin However, the present invention is not limited thereto, and any conventional resist material of the permanent type may be used.

Next, a thin film conductor layer 15 is formed on at least one of the upper surface 131 and the lower surface 132 of the support member. The thin film conductor layer preferably has a shape corresponding to the shape of the end face of the coil as a whole, because the thin film conductor layer functions as a seed pattern during the plating growth of the coil. The thin film conductor layer 15 may have a spiral shape as a whole. In this case, when the LT section of the body is referred to, the thin film conductor layer includes a first thin film conductor layer 151 spaced from the first thin film conductor layer 151 along the L direction, 2 thin film conductor layer 152. It goes without saying that the first and second thin film conductor layers are electrically connected to each other when they move along the winding direction of the thin film conductor layer. Since the thin film conductor layer includes the first thin film conductor layer 151 and the second thin film conductor layer 152 which are spaced apart from each other along the L direction with reference to a cross section, And the second opening 15h is included.

1 and 2, the positional relationship between the insulator 14 and the thin film conductor layer 15 supported by the support member is such that both end portions of the first thin film conductor layer 151, which is one of the thin film conductor layers, One end 151a of the first and second electrodes 151a and 151b is interposed between the insulator and the support member with respect to the thickness direction. Since the insulator is formed after the thin film conductor layer is formed, the one end 151a of the thin conductor layer is covered with the insulator. The line width at which the one end portion 151a is covered under the insulator can be appropriately selected by those skilled in the art. However, in order to prevent a short-circuit with another thin film conductor layer adjacent to the thin film conductor layer including the one end portion 151a, Is covered by the insulator only to the extent that it is shorter than half the line width of the lower surface of the insulator.

On the other hand, the opening 14h of the insulator 14 is filled with a combination of the thin film conductor layer and the coil pattern. The thin film conductor layer 15 is not located at the center of the opening 14h but biased in one direction . Nevertheless, the upper surface of the coil pattern filling the opening 14h is arranged to be substantially symmetrical.

The thin film conductor layer 15 may have a single layer or a stacked structure in which a plurality of layers are stacked.

In the case where the thin film conductor layer 15 has a laminated structure in which a plurality of layers are stacked, for example, a copper alloy laminated layer may be entirely formed on one surface of the supporting member, And the Cu layer may be formed again through an electrical method, but the present invention is not limited thereto. Of course, those skilled in the art can omit some metal layers in the laminate structure as needed.

In the case where the thin film conductor layer is a single layer, there is no specific limitation, but for example, a metal layer may be coated on one side of the support member by sputtering and patterned using a laser, A conductive material may be coated on the entire one surface of the supporting member by using a chemical plating, and then patterning may be performed by using a tenting method or the like. When the thin film conductor layer is a single layer, it is not limited to a specific material that can be used, but in the case of forming a thin film conductor layer by a chemical method, it is preferably a metal layer such as copper, nickel, tin or gold, When a thin film conductor layer is formed, it may include a coated copper layer, or titanium, or molybdenum. In addition, it can be formed by printing using a paste method. In this case, a metal layer such as copper or silver is preferable.

The inductor in which the thin film conductor layer is disposed at a position other than the center of the opening 14h and the one end 151a of the thin film conductor layer is buried under the insulator greatly increases the degree of freedom in the process of patterning the insulator . In other words, when the line width of the opening portion of the insulator is narrowed, that is, when the line width of the coil pattern is narrowed, it is difficult to maintain the alignment so that the entire thin film conductor layer can be arranged in the opening portion of the insulator. However, when one end of the thin film conductor layer is interposed between the insulator and the support member, alignment can be maintained by arranging only the remaining portion of the thin conductor layer except for the one end portion in the opening, The degree of freedom of the process can be maintained.

It is preferable that a deviation of the heights (H1, H2) of the upper surface of the coil pattern filling the opening portion with the side surface of the adjacent insulator is 15% or less of the average height of the upper surface of the coil pattern. The coil pattern 12a fills the opening 14h between the first insulator 141 near the center of the body and the second insulator 142 near the outer side of the body. In this case, The ratio R of the height (H1) of the upper surface of the coil pattern with respect to the average height to the side surface of the first insulator and the difference (1H1-H2l) of the height H2 contacting the side surface of the second insulator is within 15% . When the range of R is more than 15%, the inclination of the upper surface of the coil pattern becomes so severe that it rides over the upper surface of the insulator, which may increase the risk of short circuit between the coil patterns. .

Table 1 below shows the variation (H1-H2) between the average height of the top surface of the coil pattern and the height H1 of the top surface of the coil pattern in contact with the side surface of the first insulator and the height H2 in contact with the side surface of the second insulator, The ratio of the short-circuit failure is shown. In the case of the comparative example, an asterisk is added to the upper right of the number.

Experimental Example 1 R Shot defect occurrence rate One 1.3% 0.03 2 1.8% 0 3 2.1% 0 4 2.2% 0.02 5 4.5% 0.03 6 4.6% 0.01 7 7.6% 0.02 8 8.5% 0 9 8.9% 0 10 12.5% 0.06 11 13.6% 0.03 12 14.5% 0.01 13 15.0% 0.03 14 * 15.1% 1.56 15 * 16.8% 1.43 16 * 16.9% 2.01 17 * 17.1% 2.21 18 * 18.5% 1.95 19 * 18.6% 2.65 20 * 19.5% 5.01 21 * 20.1% 4.95

The inductors of Examples 1 to 13 of Table 1 have a substantially insignificant short circuit defect rate. The method of plating such a coil pattern is not limited to the one described below. However, since the thin film conductor layer is not in the center of the opening but on one side, there is a problem that the initial plating is excessively grown only on the side where the thin film conductor layer exists due to plating growth characteristics, Of course, you have to use a method that can be solved. As an example of a method capable of solving the above problem, when the concentration of copper relative to sulfuric acid in sulfuric acid and copper added to the plating solution is increased and a solution having a fill plating function is added, the promoter component in the additive of the solution becomes non- The speed can be reduced, and the thickness scattering can be reduced. Alternatively, when a current is applied using a pulse / reverse rectifier, the growth of the high current portion is suppressed and the growth of the low current portion is relatively increased, so that the shape of the entire coil pattern can be leveled.

Referring to FIG. 2, an insulating layer 16 is further disposed on the upper surface of the coil pattern. The insulating layer 16 is for insulation between the coil pattern and the magnetic material, and thus includes a material having an insulating property. The insulating layer 16 may include a material different from an insulator for insulation between neighboring coil patterns. The insulating layer is disposed to coat the entire upper surface of the coil pattern, the side surface of the insulator, and the upper surface. The coating method is not particularly limited. However, in order to obtain a thin and uniform insulating layer, It can be coated by a vapor deposition method.

3 is a cross-sectional view of the inductor 110 according to the first modification to the inductor 100 according to the first embodiment shown in Figs. 1 and 2. As shown in Fig. For convenience of explanation, components different from the inductor described with reference to FIGS. 1 and 2 will be mainly described, and the same reference numerals are used for the same components.

Referring to the inductor 110 shown in Fig. 3, the inner surface of the innermost coil pattern 112a is not in contact with the insulator, but is in contact with the insulating layer 116 immediately. The insulator supporting the inner surface of the innermost coil pattern is removed, and the insulating layer is formed at a position where the insulator is removed. The thickness of the insulating layer is approximately 10 to 20 占 퐉, which is relatively thinner than the thickness of the insulator for insulating adjacent coil patterns. As a result, a space in which the magnetic material can be filled as the center of the core of the coil is largely secured, and the magnetic permeability of the inductor can be increased. For example, the insulator may be removed through a laser, and the insulating layer 116 may be disposed on the insulating layer 116, Can be continuously arranged not only on the upper surface of the coil pattern but also on the upper surface of the insulator through chemical vapor deposition (CVD) of an insulating resin including an insulating material.

4 shows a cross-sectional view of an inductor 120 according to a second modification to the inductor 100 according to the first embodiment shown in Figs. For convenience of explanation, components different from the inductor described with reference to FIGS. 1 and 2 will be mainly described, and the same reference numerals are used for the same components.

The inductor 120 of Fig. 4 is a case in which the insulating layer 216 is not extended toward the support member so as to come in contact with the supporting member, but is laminated on the upper surface of the coil pattern and the upper surface of the insulator. The insulating layer 216 isolates the coil pattern and the magnetic material by laminating a film-shaped insulating resin on the upper surface of the coil pattern and the upper surface of the insulator. Preferably, both end portions of the insulating layer are formed so as to be located in the same line as the outermost side of the insulator disposed on the innermost and outermost sides of the insulator disposed on the innermost side. It is also possible that at least a part of both ends of the insulating layer is formed to be short in a direction close to the upper surface of the coil pattern.

5 is a cross-sectional view of an inductor 130 according to a third modification of the inductor 100 according to the first embodiment shown in FIGS. 1 and 2. As shown in FIG. For convenience of explanation, components different from the inductor described with reference to FIGS. 1 and 2 will be mainly described, and the same reference numerals are used for the same components.

The inductor 130 shown in FIG. 5 is configured such that the insulating layer is laminated on the upper surface of the coil pattern like the inductor 120 shown in FIG. 4. However, at least one of both ends 316a and 316b of the insulating layer 316 The end portion projects further toward the center of the core or the outer surface of the body. The inductor 130 of FIG. 5 is expressed such that both of the ends 316a and 316b protrude from the inner surface of the innermost insulator and the outer surface of the outermost insulator. However, only one end of each of the ends may protrude Do.

By protruding at least one end portion of both ends of the insulating layer, it is possible to enhance the insulating property. In the use or manufacturing process of the inductor, insulation failure occurs due to delamination between the insulating layer and the insulator or between the insulating layer and the coil pattern The insulating layer 316 is protruded to increase the fixing force of the insulating layer.

6 is a cross-sectional view of an inductor 140 according to a fourth modification of the inductor 100 according to the first embodiment shown in Figs. 1 and 2. As shown in Fig. For convenience of explanation, components different from the inductor described with reference to FIGS. 1 and 2 will be mainly described, and the same reference numerals are used for the same components.

Referring to the inductor 140 of FIG. 6, the insulator 414 has such a shape that its line width increases as it approaches the support member. If the line width of the insulator 414 is reduced, there is an advantage that the number of turns of the coil pattern can be relatively increased in the miniaturized inductor. However, the thinner the line width of the insulator, the more difficult it is to control so that the thin conductor layer can be disposed on at least a part of the lower surface of the insulator. The inductor 140 has a structure in which the thin film conductor layer is interposed between the lower surface of the insulator and the supporting member by making the line width of the lower surface of the insulator covering at least a part of the end portion of the thin film conductor layer larger than the line width of the upper surface, The overall insulator line width can be controlled to a considerably thin level.

When the coil pattern of the fine line width is formed, the degree of freedom of alignment between the insulator for insulation between coil patterns adjacent to each other and the thin film conductor layer as a seed pattern of the coil pattern can be increased, The inductance of the coil pattern can be remarkably improved by narrowing the line width of the coil pattern.

Second Example

Next, Fig. 7 is a schematic perspective view of the inductor 200 according to the second embodiment of the present disclosure, and Fig. 8 is a sectional view taken along the line II-II 'in Fig. The description of the inductor according to the first embodiment and the inductor according to the modified example of the inductor will be omitted.

7 and 8, the inductor 200 includes a body 210 and an external electrode 220 disposed on the external surface of the body. The external electrode includes a first external electrode 221 on the first end face of the body and a second external electrode 222 on the second end face.

The inside of the body 210 includes a magnetic material 211, a coil 212 which is sealed by the magnetic material, a support member 213 for supporting the coil, an insulator 214 for insulating the coil pattern in the coil, , And an insulating layer (216). The lower surface of the coil pattern is provided with a thin film conductor layer 215 serving as a base of plating growth.

Both ends 215a and 215b of the thin film conductor layer 215 are covered with the insulator. The entire inside of the opening 215h of the thin film conductor layer 215 is filled with the insulator 214. [

It is preferable that the lengths L1 and L2 covered by the insulators are equal to each other and are symmetrical. However, if the length L1 (L2) is not a short between adjacent thin film conductor layers, , L2 may be different from each other.

The insulator 214 includes a first insulator 214a and a second insulator 214b that are adjacent to each other and face each other at an end surface of the LT, and the lower portion of the opening 214h between the first insulator and the second insulator Is filled with a thin film conductor layer, and the upper portion is filled with a coil pattern. In this case, a corner E1 formed by the side surface of the first insulator 214a and the upper surface 213a of the support member is substantially completely filled with the thin film conductor layer and the coil pattern formed thereon, The side edge of the second insulator 214b and the corner E2 formed by the upper surface 213a of the supporting member are substantially completely filled with the thin film conductor layer and the coil pattern formed thereon. Here, the fact that the corner portion is substantially completely filled means that no significant void is formed. The voids are a kind of plating defects, the voids make it difficult to realize a desired cross-sectional shape of the coil pattern, deteriorate electrical characteristics such as loss of DC resistance characteristics, and increase the possibility of collapse of an insulator and lifting of an insulator. However, in the case of the inductor 200, voids do not occur in the corner portions E1 and E2, so that the problem of plating defects does not occur.

7 and 8, the opening 215h of the thin film conductor layer is filled only with the insulator 214, and specifically, a thin film conductor layer having an opening pattern is formed, (W1) of the opening (214h) of the insulator is smaller than a line width (W2) of the thin film conductor layer, and both ends of the thin film conductor layer are laminated by the insulator The insulator is patterned to be covered. In this case, the patterning method is not limited, and exposure and development can be applied or a laser process can be applied in consideration of the physical properties of the insulating sheet for forming the insulator, but the present invention is not limited thereto.

The upper surface of the insulator 214 and the upper surface of the coil 212 are surrounded by the insulating layer 216. In this case, the insulating layer may overlap with the inductor 100 illustrated in FIGS. Since the technical content is included, a separate explanation will be omitted.

9 is a cross-sectional view of the inductor 210 according to the first modification of the inductor according to the second embodiment of the present disclosure. The inductor shown in Fig. 9 is different from the inductor shown in Figs. 7 and 8 in that an insulator in contact with the inner surface of the innermost coil pattern of the insulator is removed, and the inner surface of the innermost coil pattern is immediately brought into contact with the insulating layer . The first modification of the inductor according to the second embodiment includes the same modifications as the first modification of the inductor according to the first embodiment, and a detailed description thereof will be omitted here.

Similarly, inductor 220 of FIG. 10 includes a variation of the same components as inductor 120 of FIG. 4, and inductor 230 of FIG. 11 includes variations of the same components as inductor 130 of FIG. And the inductor 240 of FIG. 12 includes a variation of the same components as the inductor 140 of FIG. Therefore, detailed description of the inductors 220, 230, and 240 of FIGS. 10 to 12 will be omitted here.

The present disclosure is not limited by the above-described embodiments and the accompanying drawings, but is intended to be limited by the appended claims. Accordingly, various modifications, substitutions, and alterations can be made by those skilled in the art without departing from the spirit of the present disclosure, which is also within the scope of the present disclosure something to do.

In the meantime, the expression " an example " used in this disclosure does not mean the same embodiment but is provided for emphasizing and explaining different unique features. However, the above-mentioned examples do not exclude that they are implemented in combination with the features of other examples. For example, although a matter described in a particular example is not described in another example, it may be understood as an explanation related to another example, unless otherwise stated or contradicted by that example in another example.

On the other hand, the terms used in this disclosure are used only to illustrate an example and are not intended to limit the present disclosure. Wherein the singular expressions include plural expressions unless the context clearly dictates otherwise.

100, 200: inductor
2: external electrode
1: Body
11: magnetic material
12: Coil
13: Support member

Claims (16)

The support member,
An insulator supported by the support member and including an opening of the first opening pattern,
A coil including a coil pattern disposed inside the opening of the first opening pattern, and
A body disposed between the coil pattern and the support member and including a thin film conductor layer including an opening in a second opening pattern; And
An outer electrode disposed on an outer surface of the body; / RTI >
Wherein one end of both ends of the thin film conductor layer is disposed between the support member and the insulator,
Wherein the first insulator has a thickness H1 at which the coil pattern extends to one side of the first insulator with respect to an average thickness of the coil pattern, And the ratio of the deviation of the thickness (H2) at which the coil pattern extends to one side of the second insulator is 15% or less.
The method according to claim 1,
And an opening of the second opening pattern is filled with the insulator and the coil pattern.
The method according to claim 1,
Wherein the thin film conductor layer is comprised of a single layer.
The method of claim 3,
Wherein the thin film conductor layer comprises one of copper, nickel, tin, gold, titanium, molybdenum, and silver.
The method according to claim 1,
Wherein the thin film conductor layer has a laminated structure of a plurality of layers.
6. The method of claim 5,
And each of the plurality of layers has the same line width.
The method according to claim 1,
And at least a part of the lower surface of the coil pattern in the opening of the second opening pattern is in direct contact with the supporting member.
The method according to claim 1,
And an insulating layer is further disposed on the upper surface of the coil pattern.
9. The method of claim 8,
Wherein the insulating layer extends further inward than the innermost side surface of the insulator or extends further outward than the outermost side surface.
The support member,
An insulator supported by the support member and including an opening of the first opening pattern,
A coil including a coil pattern disposed inside the opening of the first opening pattern, and
A body disposed between the coil pattern and the support member and including a thin film conductor layer including an opening in a second opening pattern; And
An outer electrode disposed on an outer surface of the body; / RTI >
Wherein both ends of the thin film conductor layer are disposed between the support member and the insulator, and are covered by the insulator.
11. The method of claim 10,
And a portion of the upper surface of the thin film conductor layer which is not covered with the insulator is covered by the coil pattern.
11. The method of claim 10,
And the entire lower portion of the opening portion of the first opening pattern is filled with the thin film conductor layer.
11. The method of claim 10,
Wherein lengths of both ends of the thin film conductor layer covered by the insulator are equal to each other.
11. The method of claim 10,
Wherein the insulator has a thicker line width toward the support member.
11. The method of claim 10,
Wherein an edge formed between a side surface of the insulator and a supporting member supporting the insulator is completely filled with the thin film conductor layer and the coil pattern disposed thereon.
11. The method of claim 10,
Wherein a width of a bottom surface of the thin film conductor layer in contact with the supporting member is larger than a width of an opening of the first opening pattern in which the thin film conductor layer is disposed.

Images