KR20200010150A - Coil component - Google Patents

Abstract

The present invention relates to a coil part. The coil part according to the present invention comprises: a body including a coil; and an external electrode disposed on an outer surface of the body and connected to the coil, wherein the body supports the coil and includes a through hole and a via hole spaced apart from the through hole, and the coil includes a coil body and a coil lead-out part connecting the coil and the external electrode and a first support layer and a second support layer disposed thereon are disposed between one surface of the support member and one surface of the coil lead-out part.

Description

Coil parts {COIL COMPONENT}

The present disclosure relates to coil components, and more particularly, to a thin film power inductor.

With the development of IT technology, miniaturization and thinning of various electronic devices are accelerated. Accordingly, the thin film inductors used in electronic devices are also required to be miniaturized and thinned. Although the size of the inductor is thinning, it is necessary to increase the number of turns of the coil pattern (fine patterning), to develop the material with high permeability, and to increase the pattern height in order to achieve miniaturization of the product without losing the electrical characteristics of the chip such as inductance and Rdc. have.

Korean Patent Publication No. 10-1999-0066108

One of the problems to be solved by the present disclosure is to increase the Rdc characteristics of coil components within a miniaturized chip size.

According to a coil component according to an example of the present disclosure, the coil component may include a body including a coil; An external electrode disposed on an outer surface of the body and connected to the coil; The body may include a support member including a through hole and a bi-hole spaced apart from the body, the coil supporting the coil, and the coil including a coil body and a coil lead-out unit connecting the coil and the external electrode to each other. A first support layer and a second support layer disposed thereon are disposed between one surface of the support member and one surface of the coil lead-out portion.

According to a coil component according to an example of the present disclosure, the coil component may include an upper coil for disposing a coil body on one surface of the support member and a lower coil for disposing the coil body on the other surface of the support member. .

According to a coil component according to an example of the present disclosure, the coil component is connected to the upper and lower coils through vias filling the via holes of the support member.

According to the coil component according to the example of the present disclosure, each of the coil component has the same cross-sectional shape.

According to the coil component according to an example of the present disclosure, the cross-sectional area in which the first and second support layers contact the support member is greater than the cross-sectional area in contact with the second support layer disposed below the coil lead-out portion.

According to the coil component according to the exemplary embodiment of the present disclosure, the coil component has a structure in which the strip of the coil is combined.

According to the coil component according to an example of the present disclosure, the coil component may have a thickness of 5 μm or more and 50 μm or less.

According to the coil component according to the exemplary embodiment of the present disclosure, the coil component may be directly connected to the external electrode by exposing the first and second support layers to the outer surface of the body.

According to the coil component according to the example of the present disclosure, in the coil component, the first support layer is a Cu metal layer.

According to the coil component according to an example of the present disclosure, in the coil component, the second support layer is an Invar alloy layer.

According to the coil component according to an example of the present disclosure, the coil component is the second support layer is a stainless steel layer.

According to the coil component according to an example of the present disclosure, the coil component is an insulating layer in which the support member is impregnated with glass.

According to the coil component according to an example of the present disclosure, in the coil component, the support member is an insulating film.

According to the coil component according to an example of the present disclosure, the coil component may include the insulation film made of polyimide.

According to the coil component according to an example of the present disclosure, the coil component includes a plurality of conductive layers.

According to the coil component according to an example of the present disclosure, the coil component includes a lowermost layer closest to the support member among the plurality of conductive layers, and includes one or more of Ni, Ti, Mo, Cu, and Nb.

One of several effects of the present disclosure provides a coil component that can prevent delamination between dissimilar materials while increasing the Rdc characteristic of the coil in the coil component by increasing the thickness of the coil pattern in the chip thickness of the limited coil component. It is.

1 is a schematic perspective view of a coil component according to an example of the present disclosure.
FIG. 2 is a plan view seen from the top of FIG. 1. FIG.
3 is a plan view seen from the direction I of FIG.

DETAILED DESCRIPTION Hereinafter, embodiments of the present disclosure will be described with reference to specific embodiments and the accompanying drawings. However, embodiments of the present disclosure may be modified in various other forms, and the scope of the present disclosure is not limited to the embodiments described below. In addition, embodiments of the present disclosure are provided to more completely describe the present disclosure to those skilled in the art. Accordingly, the shape and size of elements in the drawings may be exaggerated for clarity, and the elements denoted by the same reference numerals in the drawings are the same elements.

In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present disclosure, and thicknesses are exaggerated in order to clearly express various layers and regions. It demonstrates using a sign.

Throughout the specification, when a part is said to "include" a certain component, it means that it can further include other components, except to exclude other components unless specifically stated otherwise.

Hereinafter, a coil component according to an example of the present disclosure will be described, but is not necessarily limited thereto.

1 is a schematic perspective view of a coil component 100 according to an example of the present disclosure, FIG. 2 is a plan view as seen from the top of FIG. 1, and FIG. 3 is a side view as seen in the direction I of FIG. 1.

1 to 3, the coil component 100 includes a body 1 and an external electrode 2.

The external electrode 2 includes a first external electrode 21 and a second external electrode 22 facing each other in the longitudinal direction on the outer surface of the body 1. The external electrode may have a shape extending from one surface of the body to four surfaces adjacent thereto, but is not limited thereto. Those skilled in the art may change the shape to various shapes as necessary. For example, it may be L-shaped or I-shaped. Since the external electrode is configured to be connected to the lead portion of the internal coil, the external electrode should include a material having excellent electrical conductivity.

The body 1 has a first end face and a second end face which face each other in the length L direction, a first side face and a second side face which face each other in the width W direction, and an upper face which face each other in the thickness T direction. It has a substantially hexahedral shape including a lower surface.

In the interior of the body 1 includes a support member 11 comprising a through hole and a via hole, the support member having a function of mechanically supporting the coil 12 formed thereon and facilitating coil formation. Do it.

The through hole of the support member 11 is filled with a suture 14, which will be described later, and the permeability of the coil part increases due to the suture filled in the through hole. A via hole is disposed to be spaced apart from the through hole, and the via hole is a space for forming a via connecting the upper coil and the lower coil to each other.

The support member 11 includes a material having insulation properties. It may be a magnetic insulator having magnetic properties along with insulating properties. For example, the support member may include a resin and a glass filler impregnated with the resin, but may also be a pure insulating layer composed of resin only and free of glass fillers and the like. The support member may be a thin film insulating film, wherein the material of the insulating film is polyimide, and may be an insulating layer of films applied to FCCL or the like. In addition, the insulating film may be commercially available Ajimoto Build-up Film (ABF) or PID resin.

The thickness of the support member 11 may be appropriately selected by those skilled in the art in consideration of the process environment and required characteristics, but it is preferable to minimize the thickness of the support member in order to meet the requirements of low profile and high aspect ratio. Do. The thickness of the support member may be, for example, a level of 5 μm or more and 50 μm or less, but when it is thinner than 5 μm, there is a limit in securing the mechanical strength necessary for the support member to properly exhibit the function of supporting the coil. If it is thicker than 50 mu m, there may be a limit in reducing the coil component.

A coil 12 is supported on the support member, and an upper coil 12a including a coil body on one surface of the support member and a lower coil including a coil body on the other surface facing the one surface of the support member. 12b). The upper and lower coils 12a and 12b are connected to each other VE through vias filling the via holes V formed in the supporting member to form one coil.

The coil 12 includes a coil body 121 wound in a spiral shape and a coil lead-out unit 122 connected to both ends of the coil body, respectively. The coil lead-out unit 122 includes a first lead-out unit 122a connected to the first external electrode 21 and a second lead-out unit 122b connected to the second external electrode 22.

First and second support layers 131 and 132 are further disposed between the first and second lead portions 122a and 122b and the support member 11. The second support layer is formed on the first support layer. The first support layer and the second support layer have the same cross-sectional shape when viewed from above based on the thickness direction.

The first and second support layers are sequentially stacked, but are made of different materials from each other. Since the first and second support layers include heterogeneous metals, the first and second support layers may be resistant to stress on the support members, thereby preventing defects in substrate processes and lowering of yields. In this case, the heterogeneous metals of the first and second support layers are preferably metals having the same etching property. However, when the etching properties are the same, the cross-sectional shapes of the first and second support layers may be secured even if only a single process is applied. Because it can.

The materials of the first and second support layers may be appropriately combined with a metal applicable to those skilled in the art, but it is preferable to use a copper (Cu) metal layer in consideration of the fact that the first support layer is a metal layer directly contacting the support member. Meanwhile, the second support layer may be an Invar alloy layer or a stainless steel layer. Invar is an iron-nickel alloy and has a very low coefficient of thermal expansion (CTE), so that the support member is suitable for preventing process defects such as warping and yield reduction during thin substrate processing.

Since the first and second support layers form a double layer made of different metals from each other, even when the support member is thin, the support force of the support member during stress may be excellent.

The thickness of the first and second support layers may be appropriately selected by those skilled in the art. However, since the first and second support layers are not all disposed under the seed layer of the coil body, when the first and second support layers are excessively thick. It should be noted that the plating deviation may be excessive between the plating process of the coil body and the plating process of the coil lead-out. Regarding the thicknesses of the first and second support layers, the thicknesses of the first and second support layers disposed on one surface of the support member, the thickness of the support members, and the first and second support layers disposed on the other surface of the support members, respectively. It is desirable that the sum of the thicknesses be enough to utilize the existing equipment as it is. For example, it is preferable that the total thickness has a deviation within 10 μm on the basis of 60 μm.

The cross-sectional shape of the first and second support layers is not particularly limited, but one side of the first and second support layers contacting the external electrode may be longer than the other side facing the external electrode and may have a trapezoidal shape as a whole. Since the first and second support layers are exposed to the outer surface of the body and are directly connected to the external electrodes, when the first and second support layers make one side of the contact with the external electrodes longer, the adhesion between the external electrodes and the coils is increased. The result is that the area is increased. However, since the cross-sectional shape of the first and second support layers is not limited to a trapezoid, and a cross-sectional shape capable of appropriately supporting the coil lead-out portion is sufficient, the cross-sectional shape including a rectangle, strip, or curve may be used. have.

First and second lead portions 122a and 122b are disposed on the first and second support layers. The first lead-out unit 122a connects the first external electrode and the coil body, and the second lead-out unit 122b connects the second external electrode and the coil body. Each of the first and second lead-out portions may have the same cross-sectional shape as the first and second support layers, but may include a plurality of strip shapes having a thin line width in order to prevent excessive plating defects that may be a concern in the coil lead-out portion. Can be. When the first and second lead portions 122a and 122b have a plurality of strip shapes having a thin line width, the plating thickness variation between the coil lead portion and the coil body can be reduced. However, the shape of the coil lead-out portion may be appropriately changed by those skilled in the art as necessary, and the cross-section of the coil lead-out portion may be increased while the cross-section is smaller than the cross-sections of the first and second support layers supporting the coil lead-out portion. It is also possible to reduce the thickness relatively. In this case, in order to adjust the plating growth rate of a coil main body and a coil lead-out part, a plating liquid type and plating liquid concentration can be changed suitably.

Referring to Fig. 3, the coil 12 including the first and second lead portions is composed of a plurality of conductive layers. The coil 12 includes a coil body and a coil lead-out portion, and since the coil body and coil lead-out portion are formed integrally with each other, the combination of the plurality of conductive layers of the coil body is substantially the same as the combination of the plurality of conductive layers of the coil lead-out portion. same. However, since the first and second support layers are interposed between the coil lead-out portion 121 and the support member, the lowest layer among the plurality of conductive layers of the coil lead-out portion is disposed at the lowest layer among the plurality of conductive layers of the coil body. Higher than the position. To this end, a process is required in which each of the first and second support layers is coated on the one side and the other side of the support member by sputtering or the like on the support member and removed by etching or the like except for the peripheral region of the position where the coil lead-out is formed. Do. During the etching process for determining the appearance of the first and second support layers, the degree of etching may be appropriately set by those skilled in the art, but may not extend into the through hole H of the support member to sufficiently secure the permeability of the coil core. It is desirable to. In other words, the entire through hole has a structure filled by the encapsulant, not the first and second support layers.

Reference is made to FIG. 3 to describe in detail the plurality of conductive layers constituting the coil. 3 shows a first lead portion 122a in contact with a first external electrode of the coil lead portion 122. The first lead portion 122a may include a plurality of conductive layers, and the lowermost layer 1221 disposed at the bottom thereof and closest to the support member may be a seed layer. Although there is no limitation on the manner of forming the seed layer, in the present invention, it is preferable to apply a sputtering process. In general, in the case of forming the seed layer through the sputtering process, the metal layer of the thin film can be uniformly obtained, while the intimacy between the insulating material constituting the support member and the metal material applied to the sputtering is reduced, resulting in the dilamination of the coil. It may occur. However, in the case of the present invention, by interposing the first and the second support layer between the support member and the coil lead-out portion, it is possible to improve the intimacy of the material to prevent the delamination of the coil or the like.

The lowermost layer 1221 may include one or more of Ni, Ti, Mo, Cu, and Nb. The lowermost layer 1221 may be composed of a plurality of layers instead of a single layer. For example, the lower layer 1221 may be a Ni-Mo layer or a Ni-Cu layer. A material having good adhesion with the metal of the second support layer in contact with the lower surface of the lowermost layer is disposed at the bottom of the lowermost layer, and a material having good adhesion with the metal of the plating layer in contact with the upper surface of the lowermost layer is disposed above the lowermost layer. As a result, it is possible to sufficiently secure the adhesion in both of the lowermost layers.

On the lowermost layer 1221, a plating layer 1222 is disposed which substantially determines the final thickness of the coil. There is no restriction on the method of forming the plating layer, and the lowermost layer may be formed by plating using the seed layer. The cross-sectional shape of the plating layer may be rectangular. For this purpose, an insulating wall 15 including a patterned opening that functions as a plating growth guide may be disposed on the lowermost layer, and the plating layer may be filled into the opening. . The aspect ratio AR of the coil can be stably increased by the insulating wall. 3 shows a structure in which the insulating wall 15 is not removed but remains, but the insulating wall can be removed after completing the plating layer (not shown). In this case, it is a matter of course that a separate insulating film must be formed for insulation between adjacent coils.

The present disclosure is not to be limited by the foregoing embodiments and the accompanying drawings, but is intended to be limited by the appended claims. Accordingly, various forms of substitution, modification, and alteration may be made by those skilled in the art without departing from the technical spirit of the present disclosure described in the claims, which also belong to the scope of the present disclosure. something to do.

On the other hand, the expression "one example" used in the present disclosure does not mean the same embodiment, but is provided to emphasize each different unique features. However, the examples presented above do not exclude the implementation in combination with other example features. For example, although the matter described in one specific example is not described in another example, it may be understood as the description related to another example unless there is a description that is contradictory or contradictory to the matter in another example.

Meanwhile, the terminology used herein is for the purpose of describing one example only and is not intended to be limiting of the present disclosure. As used herein, the singular forms "a", "an" and "the" include plural forms unless the context clearly indicates otherwise.

100: coil parts
1: body
2: external electrode
11: support member
12: coil
121: coil body
122: coil outlet
122a, 122b: first and second lead-out portions
First and Second Support Layers: 131, 132
14: suture

Claims (17)

body;
A support member embedded in the body;
A coil disposed on one surface of the support member, the coil including a coil body and a coil drawing part extending from the coil body;
A support layer disposed between the support member and the coil lead-out part and exposed to the outer surface of the body together with the coil lead-out part; And
An external electrode disposed on an outer surface of the body and connected to the coil outlet; Including,
Coil parts.
The method of claim 1,
The coil component includes an upper coil for disposing a coil body on one surface of the support member and a lower coil for disposing a coil body on the other surface of the support member.
The method of claim 2,
And the upper and lower coils are connected through vias filling the via holes of the support member.
The method of claim 1,
The support layer includes a first support layer disposed on one surface of the support substrate and a second support layer disposed on the first support layer.
The method of claim 4, wherein
Wherein said first and second support layers have the same cross-sectional shape.
The method of claim 4, wherein
The cross-sectional area where the first support layer is in contact with the support member is greater than the cross-sectional area where the coil lead-out is in contact with the second support layer.
The method of claim 1,
The coil outlet has a structure in which a plurality of strips are combined.
The method of claim 1,
The thickness of the said support member is a coil component of 5 micrometers or more and 50 micrometers or less.
The method of claim 1,
The support layer is exposed to the outer surface of the body, the coil component directly connected to the external electrode.
The method of claim 4, wherein
And the first support layer is a Cu metal layer.
The method of claim 4, wherein
And the second support layer is an Invar alloy layer.
The method of claim 4, wherein
Wherein said second support layer is a stainless steel layer.
The method of claim 1,
The support member is a coil component, which is an insulating layer impregnated with glass.
The method of claim 1,
The support member is an insulation film.
The method of claim 14,
Wherein said insulating film is comprised of polyimide.
The method of claim 1,
The coil component comprising a plurality of conductive layers.
The method of claim 16,
The lowest layer closest to the support member of the plurality of conductive layers comprises one or more of Ni, Ti, Mo, Cu, and Nb.

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