JP2005513758A5 - - Google Patents
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- Publication number
- JP2005513758A5 JP2005513758A5 JP2003514571A JP2003514571A JP2005513758A5 JP 2005513758 A5 JP2005513758 A5 JP 2005513758A5 JP 2003514571 A JP2003514571 A JP 2003514571A JP 2003514571 A JP2003514571 A JP 2003514571A JP 2005513758 A5 JP2005513758 A5 JP 2005513758A5
- Authority
- JP
- Japan
- Prior art keywords
- gas
- substrate
- deposit
- support
- absorbing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ITMI2001A001557 | 2001-07-20 | ||
| IT2001MI001557A ITMI20011557A1 (it) | 2001-07-20 | 2001-07-20 | Supporto per la produzione di dispositivi microelettronici microoptoelettronici o micromeccanici con deposito integrato di materiale getter |
| ITMI2002A000689 | 2002-04-03 | ||
| IT2002MI000689A ITMI20020689A1 (it) | 2002-04-03 | 2002-04-03 | Supporto per la produzione di dispositivi microeletronici microoptoelettronici o micromeccanici con deposito integrato di materiale assorbit |
| PCT/IT2002/000465 WO2003009317A2 (en) | 2001-07-20 | 2002-07-16 | Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005513758A JP2005513758A (ja) | 2005-05-12 |
| JP2005513758A5 true JP2005513758A5 (enExample) | 2006-01-05 |
| JP4831931B2 JP4831931B2 (ja) | 2011-12-07 |
Family
ID=26332782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003514571A Expired - Lifetime JP4831931B2 (ja) | 2001-07-20 | 2002-07-16 | マイクロエレクトロニクス、マイクロオプトエレクトロニクスまたはマイクロメカニクスのデバイスを製造するための気体吸収物質の集積堆積物を有する支持体 |
Country Status (14)
| Country | Link |
|---|---|
| US (3) | US7180163B2 (enExample) |
| EP (1) | EP1410433B1 (enExample) |
| JP (1) | JP4831931B2 (enExample) |
| KR (1) | KR100554492B1 (enExample) |
| CN (1) | CN100355045C (enExample) |
| AT (1) | ATE291777T1 (enExample) |
| AU (1) | AU2002334385A1 (enExample) |
| CA (1) | CA2447282C (enExample) |
| DE (1) | DE60203394T2 (enExample) |
| DK (1) | DK1410433T3 (enExample) |
| ES (1) | ES2238062T3 (enExample) |
| MY (1) | MY128708A (enExample) |
| TW (1) | TW583049B (enExample) |
| WO (1) | WO2003009317A2 (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW533188B (en) * | 2001-07-20 | 2003-05-21 | Getters Spa | Support for microelectronic, microoptoelectronic or micromechanical devices |
| TW583049B (en) * | 2001-07-20 | 2004-04-11 | Getters Spa | Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices |
| US6867543B2 (en) * | 2003-03-31 | 2005-03-15 | Motorola, Inc. | Microdevice assembly having a fine grain getter layer for maintaining vacuum |
| US7164520B2 (en) | 2004-05-12 | 2007-01-16 | Idc, Llc | Packaging for an interferometric modulator |
| US7184202B2 (en) * | 2004-09-27 | 2007-02-27 | Idc, Llc | Method and system for packaging a MEMS device |
| US7710629B2 (en) | 2004-09-27 | 2010-05-04 | Qualcomm Mems Technologies, Inc. | System and method for display device with reinforcing substance |
| US20060076632A1 (en) * | 2004-09-27 | 2006-04-13 | Lauren Palmateer | System and method for display device with activated desiccant |
| US7551246B2 (en) | 2004-09-27 | 2009-06-23 | Idc, Llc. | System and method for display device with integrated desiccant |
| WO2007136706A1 (en) | 2006-05-17 | 2007-11-29 | Qualcomm Mems Technologies Inc. | Desiccant in a mems device |
| US7816164B2 (en) | 2006-12-01 | 2010-10-19 | Qualcomm Mems Technologies, Inc. | MEMS processing |
| US8093698B2 (en) * | 2006-12-05 | 2012-01-10 | Spansion Llc | Gettering/stop layer for prevention of reduction of insulating oxide in metal-insulator-metal device |
| EP2126155B1 (en) | 2006-12-15 | 2019-03-13 | BAE Systems PLC | Improvements relating to thin film getter devices |
| EP2064148A1 (en) | 2007-09-28 | 2009-06-03 | Qualcomm Mems Technologies, Inc | Optimization of desiccant usage in a mems package |
| ITMI20090410A1 (it) | 2009-03-18 | 2010-09-19 | Getters Spa | Leghe getter non evaporabili adatte particolarmente per l'assorbimento di idrogeno |
| FR2967150A1 (fr) | 2010-11-09 | 2012-05-11 | Commissariat Energie Atomique | Procédé de réalisation de substrat a couches enfouies de matériau getter |
| US8628996B2 (en) | 2011-06-15 | 2014-01-14 | International Business Machines Corporation | Uniformly distributed self-assembled cone-shaped pillars for high efficiency solar cells |
| US20130049143A1 (en) * | 2011-08-26 | 2013-02-28 | Qualcomm Mems Technologies, Inc. | Release activated thin film getter |
| US9102511B2 (en) * | 2012-06-08 | 2015-08-11 | Texas Instruments Incorporated | Hermetic plastic molded MEMS device package and method of fabrication |
| US8889456B2 (en) | 2012-08-29 | 2014-11-18 | International Business Machines Corporation | Method of fabricating uniformly distributed self-assembled solder dot formation for high efficiency solar cells |
| US10160638B2 (en) | 2013-01-04 | 2018-12-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for a semiconductor structure |
| DE102017210459A1 (de) | 2017-06-22 | 2018-12-27 | Robert Bosch Gmbh | Mikromechanische Vorrichtung mit einer ersten Kaverne und einer zweiten Kaverne |
| US20250214830A1 (en) * | 2022-04-01 | 2025-07-03 | Saes Getters S.P.A. | Substrate comprising a base and an integrated getter film for manufacturing microelectronic devices |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3214381A (en) * | 1962-12-05 | 1965-10-26 | Bell Telephone Labor Inc | Barium oxide moisture getter preparation |
| JPS56137658A (en) * | 1980-03-31 | 1981-10-27 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Semiconductor device |
| JPS63198320A (ja) * | 1987-02-13 | 1988-08-17 | Mitsubishi Electric Corp | 結晶成長方法 |
| US5229306A (en) * | 1989-12-27 | 1993-07-20 | Texas Instruments Incorporated | Backside gettering method employing a monocrystalline germanium-silicon layer |
| KR0139489B1 (ko) * | 1993-07-08 | 1998-06-01 | 호소야 레이지 | 전계방출형 표시장치 |
| JPH09506712A (ja) * | 1993-12-13 | 1997-06-30 | ハネウエル・インコーポレーテッド | 赤外線デバイス用集積シリコン真空マイクロパッケージ |
| US5453659A (en) * | 1994-06-10 | 1995-09-26 | Texas Instruments Incorporated | Anode plate for flat panel display having integrated getter |
| JP2806277B2 (ja) * | 1994-10-13 | 1998-09-30 | 日本電気株式会社 | 半導体装置及びその製造方法 |
| US5599749A (en) * | 1994-10-21 | 1997-02-04 | Yamaha Corporation | Manufacture of micro electron emitter |
| CA2162095A1 (en) | 1994-12-27 | 1996-06-28 | Jeffery Alan Demeritt | Getter housing for electronic packages |
| US5610438A (en) * | 1995-03-08 | 1997-03-11 | Texas Instruments Incorporated | Micro-mechanical device with non-evaporable getter |
| US5668018A (en) * | 1995-06-07 | 1997-09-16 | International Business Machines Corporation | Method for defining a region on a wall of a semiconductor structure |
| US5614785A (en) * | 1995-09-28 | 1997-03-25 | Texas Instruments Incorporated | Anode plate for flat panel display having silicon getter |
| JP3324395B2 (ja) * | 1995-10-31 | 2002-09-17 | 富士電機株式会社 | 電界型真空管とそれを用いた圧力センサ、加速度センサおよびそれらの製造方法 |
| US5837935A (en) * | 1996-02-26 | 1998-11-17 | Ford Motor Company | Hermetic seal for an electronic component having a secondary chamber |
| JPH09306920A (ja) * | 1996-05-20 | 1997-11-28 | Hitachi Ltd | 半導体集積回路装置およびその製造方法 |
| US5760433A (en) * | 1996-05-31 | 1998-06-02 | Hughes Electronics | In situ reactive layers for protection of ferroelectric integrated circuits |
| IT1283484B1 (it) * | 1996-07-23 | 1998-04-21 | Getters Spa | Metodo per la produzione di strati sottili supportati di materiale getter non-evaporabile e dispositivi getter cosi' prodotti |
| CN1180239A (zh) * | 1996-08-01 | 1998-04-29 | 西门子公司 | 掺杂硅基片 |
| US6673400B1 (en) * | 1996-10-15 | 2004-01-06 | Texas Instruments Incorporated | Hydrogen gettering system |
| JPH10176768A (ja) * | 1996-11-27 | 1998-06-30 | Xerox Corp | マイクロデバイス支持システム及びマイクロデバイスのアレイ |
| JPH10188460A (ja) | 1996-12-25 | 1998-07-21 | Sony Corp | 光ディスク装置及び光ディスク記録媒体 |
| IT1290451B1 (it) * | 1997-04-03 | 1998-12-03 | Getters Spa | Leghe getter non evaporabili |
| US5921461A (en) * | 1997-06-11 | 1999-07-13 | Raytheon Company | Vacuum package having vacuum-deposited local getter and its preparation |
| US5951750A (en) * | 1997-06-19 | 1999-09-14 | Engelhard Corporation | Anti-yellowing polyolefin compositions containing pearlescent pigment to prevent yellowing and method therefore |
| US5961362A (en) * | 1997-09-09 | 1999-10-05 | Motorola, Inc. | Method for in situ cleaning of electron emitters in a field emission device |
| US5866978A (en) * | 1997-09-30 | 1999-02-02 | Fed Corporation | Matrix getter for residual gas in vacuum sealed panels |
| JP4137230B2 (ja) | 1998-04-18 | 2008-08-20 | 東洋電装株式会社 | ウォッシャスイッチの可動接点取付構造 |
| US6499354B1 (en) * | 1998-05-04 | 2002-12-31 | Integrated Sensing Systems (Issys), Inc. | Methods for prevention, reduction, and elimination of outgassing and trapped gases in micromachined devices |
| JP2000019044A (ja) * | 1998-07-03 | 2000-01-21 | Teijin Seiki Co Ltd | 真空圧力センサ |
| US6843936B1 (en) * | 1998-10-22 | 2005-01-18 | Texas Instruments Incorporated | Getter for enhanced micromechanical device performance |
| IT1312248B1 (it) * | 1999-04-12 | 2002-04-09 | Getters Spa | Metodo per aumentare la produttivita' di processi di deposizione distrati sottili su un substrato e dispositivi getter per la |
| US6534850B2 (en) * | 2001-04-16 | 2003-03-18 | Hewlett-Packard Company | Electronic device sealed under vacuum containing a getter and method of operation |
| TW533188B (en) * | 2001-07-20 | 2003-05-21 | Getters Spa | Support for microelectronic, microoptoelectronic or micromechanical devices |
| TW583049B (en) * | 2001-07-20 | 2004-04-11 | Getters Spa | Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices |
| EP1310380A1 (en) | 2001-11-07 | 2003-05-14 | SensoNor asa | A micro-mechanical device and method for producing the same |
| US6923625B2 (en) | 2002-01-07 | 2005-08-02 | Integrated Sensing Systems, Inc. | Method of forming a reactive material and article formed thereby |
-
2002
- 2002-07-12 TW TW091115739A patent/TW583049B/zh not_active IP Right Cessation
- 2002-07-16 CN CNB028120701A patent/CN100355045C/zh not_active Expired - Lifetime
- 2002-07-16 DK DK02787170T patent/DK1410433T3/da active
- 2002-07-16 CA CA002447282A patent/CA2447282C/en not_active Expired - Lifetime
- 2002-07-16 WO PCT/IT2002/000465 patent/WO2003009317A2/en not_active Ceased
- 2002-07-16 JP JP2003514571A patent/JP4831931B2/ja not_active Expired - Lifetime
- 2002-07-16 DE DE60203394T patent/DE60203394T2/de not_active Expired - Lifetime
- 2002-07-16 AT AT02787170T patent/ATE291777T1/de active
- 2002-07-16 KR KR1020037016721A patent/KR100554492B1/ko not_active Expired - Lifetime
- 2002-07-16 EP EP02787170A patent/EP1410433B1/en not_active Expired - Lifetime
- 2002-07-16 AU AU2002334385A patent/AU2002334385A1/en not_active Abandoned
- 2002-07-16 ES ES02787170T patent/ES2238062T3/es not_active Expired - Lifetime
- 2002-07-18 MY MYPI20022727A patent/MY128708A/en unknown
- 2002-07-19 US US10/211,426 patent/US7180163B2/en not_active Expired - Lifetime
-
2007
- 2007-01-23 US US11/657,703 patent/US8193623B2/en not_active Expired - Fee Related
- 2007-01-23 US US11/657,706 patent/US8105860B2/en not_active Expired - Fee Related
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