ATE539180T1 - Sioc:h-beschichtete substrate und herstellungsverfahren dafür - Google Patents
Sioc:h-beschichtete substrate und herstellungsverfahren dafürInfo
- Publication number
- ATE539180T1 ATE539180T1 AT05786627T AT05786627T ATE539180T1 AT E539180 T1 ATE539180 T1 AT E539180T1 AT 05786627 T AT05786627 T AT 05786627T AT 05786627 T AT05786627 T AT 05786627T AT E539180 T1 ATE539180 T1 AT E539180T1
- Authority
- AT
- Austria
- Prior art keywords
- coated substrates
- sioc
- production process
- coated
- preparing
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 230000004888 barrier function Effects 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/022—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being a laminate, i.e. composed of sublayers, e.g. stacks of alternating high-k metal oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02211—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen
- H01L21/02216—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31604—Deposition from a gas or vapour
- H01L21/31633—Deposition of carbon doped silicon oxide, e.g. SiOC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02167—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon carbide not containing oxygen, e.g. SiC, SiC:H or silicon carbonitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/312—Organic layers, e.g. photoresist
- H01L21/3121—Layers comprising organo-silicon compounds
- H01L21/3122—Layers comprising organo-silicon compounds layers comprising polysiloxane compounds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/24992—Density or compression of components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Plasma & Fusion (AREA)
- Chemical Vapour Deposition (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US60240404P | 2004-08-18 | 2004-08-18 | |
PCT/US2005/028955 WO2006023437A2 (en) | 2004-08-18 | 2005-08-12 | Sioc:h coated substrates and methods for their preparation |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE539180T1 true ATE539180T1 (de) | 2012-01-15 |
Family
ID=35448182
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT05786627T ATE539180T1 (de) | 2004-08-18 | 2005-08-12 | Sioc:h-beschichtete substrate und herstellungsverfahren dafür |
Country Status (6)
Country | Link |
---|---|
US (1) | US7622193B2 (de) |
EP (1) | EP1799877B2 (de) |
JP (1) | JP4987716B2 (de) |
KR (1) | KR101154215B1 (de) |
AT (1) | ATE539180T1 (de) |
WO (1) | WO2006023437A2 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007001337A2 (en) * | 2004-08-18 | 2007-01-04 | Dow Corning Corporation | Coated substrates and methods for their preparation |
JP2010522828A (ja) * | 2007-03-28 | 2010-07-08 | ダウ コ−ニング コ−ポレ−ション | ケイ素及び炭素を含むバリヤー層のロールツーロールプラズマ強化化学蒸着法 |
TWI531276B (zh) * | 2010-10-21 | 2016-04-21 | 行政院原子能委員會核能研究所 | 有機電激發光元件之封裝方法及其結構 |
JP5838744B2 (ja) * | 2010-12-15 | 2016-01-06 | 東ソー株式会社 | 炭素含有酸化ケイ素膜、封止膜及びその用途 |
JP5684288B2 (ja) * | 2010-12-28 | 2015-03-11 | 麒麟麦酒株式会社 | ガスバリア性プラスチック成形体及びその製造方法 |
JP2012179762A (ja) * | 2011-02-28 | 2012-09-20 | Nitto Denko Corp | 透明ガスバリアフィルム、透明ガスバリアフィルムの製造方法、有機エレクトロルミネッセンス素子、太陽電池および薄膜電池 |
DE102011104730A1 (de) * | 2011-06-16 | 2012-12-20 | Khs Corpoplast Gmbh | Verfahren zur Plasmabehandlung von Werkstücken sowie Werkstück mit Gasbarriereschicht |
KR101382997B1 (ko) | 2012-02-08 | 2014-04-08 | 현대자동차주식회사 | 코팅층 표면 처리 방법 |
US9214577B2 (en) | 2012-02-28 | 2015-12-15 | International Business Machines Corporation | Reduced light degradation due to low power deposition of buffer layer |
US20140217408A1 (en) * | 2013-02-06 | 2014-08-07 | International Business Machines Corporaton | Buffer layer for high performing and low light degraded solar cells |
US10134566B2 (en) | 2013-07-24 | 2018-11-20 | 3M Innovative Properties Company | Method of making a nanostructure and nanostructured articles |
KR20160037961A (ko) | 2013-07-26 | 2016-04-06 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 나노구조체의 제조 방법 및 나노구조화 물품 |
US20170125241A1 (en) * | 2015-10-30 | 2017-05-04 | Applied Materials, Inc. | Low temp single precursor arc hard mask for multilayer patterning application |
JP6430982B2 (ja) * | 2016-03-18 | 2018-11-28 | 株式会社麗光 | 透明ハイバリアフイルム |
CN108878363B (zh) | 2017-05-12 | 2021-07-13 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构及其形成方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MX9303141A (es) | 1992-05-28 | 1994-04-29 | Polar Materials Inc | Metodos y aparatos para depositar recubrimientos de barrera. |
DE4404690A1 (de) * | 1994-02-15 | 1995-08-17 | Leybold Ag | Verfahren zur Erzeugung von Sperrschichten für Gase und Dämpfe auf Kunststoff-Substraten |
DK0854891T3 (da) | 1995-10-13 | 2003-09-22 | Dow Global Technologies Inc | Fremgangsmåde til fremstilling af belagte plastoverflader |
US6159871A (en) | 1998-05-29 | 2000-12-12 | Dow Corning Corporation | Method for producing hydrogenated silicon oxycarbide films having low dielectric constant |
US6667553B2 (en) | 1998-05-29 | 2003-12-23 | Dow Corning Corporation | H:SiOC coated substrates |
JP3545364B2 (ja) † | 2000-12-19 | 2004-07-21 | キヤノン販売株式会社 | 半導体装置及びその製造方法 |
CN1524291A (zh) | 2001-01-03 | 2004-08-25 | 金属离子扩散阻挡层 | |
JP2004526318A (ja) * | 2001-03-23 | 2004-08-26 | ダウ・コーニング・コーポレイション | 水素化シリコンオキシカーバイド膜を生産するための方法 |
WO2003015129A2 (en) * | 2001-08-06 | 2003-02-20 | Advanced Technology Material, Inc. | Low-k dielectric thin films and chemical vapor deposition method of making same |
JP4338495B2 (ja) * | 2002-10-30 | 2009-10-07 | 富士通マイクロエレクトロニクス株式会社 | シリコンオキシカーバイド、半導体装置、および半導体装置の製造方法 |
US20040197474A1 (en) * | 2003-04-01 | 2004-10-07 | Vrtis Raymond Nicholas | Method for enhancing deposition rate of chemical vapor deposition films |
JP4864307B2 (ja) * | 2003-09-30 | 2012-02-01 | アイメック | エアーギャップを選択的に形成する方法及び当該方法により得られる装置 |
US6878616B1 (en) * | 2003-11-21 | 2005-04-12 | International Business Machines Corporation | Low-k dielectric material system for IC application |
-
2005
- 2005-08-12 JP JP2007527908A patent/JP4987716B2/ja not_active Expired - Fee Related
- 2005-08-12 KR KR1020077003838A patent/KR101154215B1/ko active IP Right Grant
- 2005-08-12 EP EP05786627.9A patent/EP1799877B2/de not_active Not-in-force
- 2005-08-12 AT AT05786627T patent/ATE539180T1/de active
- 2005-08-12 WO PCT/US2005/028955 patent/WO2006023437A2/en active Application Filing
- 2005-08-12 US US11/631,579 patent/US7622193B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR101154215B1 (ko) | 2012-06-18 |
US20070248768A1 (en) | 2007-10-25 |
EP1799877B1 (de) | 2011-12-28 |
WO2006023437A3 (en) | 2006-04-13 |
EP1799877A2 (de) | 2007-06-27 |
JP2008510074A (ja) | 2008-04-03 |
JP4987716B2 (ja) | 2012-07-25 |
KR20070051278A (ko) | 2007-05-17 |
EP1799877B2 (de) | 2016-04-20 |
WO2006023437A2 (en) | 2006-03-02 |
US7622193B2 (en) | 2009-11-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE539180T1 (de) | Sioc:h-beschichtete substrate und herstellungsverfahren dafür | |
TW200721312A (en) | Semiconductor on glass insulator with deposited barrier layer | |
EP1635396A4 (de) | Laminiertes halbleitersubstrat und prozess zu seiner herstellung | |
AU2002315652A1 (en) | Functional ceramic layers based on a support layer produced with crystalline nanoparticles | |
TW200721327A (en) | Semiconductor device and method of manufacturing the same | |
TW200703461A (en) | Glass-based semiconductor on insulator structures and methods of making same | |
WO2008063337A3 (en) | Semiconductor-on-diamond devices and associated methods | |
BR0214907B1 (pt) | método para fluoração de um artigo poroso, e, aparelho para fluoração de um substrato. | |
SG131872A1 (en) | Layer arrangement for the formation of a coating on a surface of a substrate,coating method,and substrate with a layer arrangement | |
SG116648A1 (en) | Surface protecting film for semiconductor wafer and method of protecting semiconductor wafer using the same. | |
GB2427309A (en) | System and method for direct-bonding of substrates | |
ATE540960T1 (de) | Organosilane und damit gebundenes substrat | |
FR2872343B1 (fr) | Substrat semi-conducteur et son procede de preparation | |
HK1048971A1 (en) | Tableware, process for surface treatment thereof, substrate having hard decorative coating film, process for producing the substrate, and cutlery | |
TW200746265A (en) | Methods and apparatus for epitaxial film formation | |
SG116564A1 (en) | Substrate contact and method of forming the same. | |
JP2005513758A5 (de) | ||
HK1113859A1 (en) | Method of producing group 3 nitride substrate wafers and group 3 nitride substrate wafers | |
TW200720734A (en) | Optical film and fabrication method thereof | |
TW200603270A (en) | Method to form a film | |
DE60209064D1 (de) | Siliziumhalbleitersubstrat und Vefahren zu seiner Herstellung | |
CA2356229A1 (en) | A method for fabricating a sic film and a method for fabricating a sic multi-layered film structure | |
ATE467903T1 (de) | Substrate zur elektronischen anwendung mit einem flexiblen träger und herstellungsverfahren dafür | |
TW200729499A (en) | Method of forming a semiconductor device | |
TW200500207A (en) | Sheet material and method of manufacture thereof |