JP5120017B2 - プローブ装置 - Google Patents

プローブ装置 Download PDF

Info

Publication number
JP5120017B2
JP5120017B2 JP2008088213A JP2008088213A JP5120017B2 JP 5120017 B2 JP5120017 B2 JP 5120017B2 JP 2008088213 A JP2008088213 A JP 2008088213A JP 2008088213 A JP2008088213 A JP 2008088213A JP 5120017 B2 JP5120017 B2 JP 5120017B2
Authority
JP
Japan
Prior art keywords
wafer
probe
substrate
inspection
inspection unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008088213A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008311618A (ja
Inventor
正 帯金
収司 秋山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2008088213A priority Critical patent/JP5120017B2/ja
Priority to KR1020080044662A priority patent/KR100960412B1/ko
Priority to US12/120,569 priority patent/US7741837B2/en
Priority to TW097117692A priority patent/TWI424520B/zh
Priority to CN2008100990449A priority patent/CN101308193B/zh
Publication of JP2008311618A publication Critical patent/JP2008311618A/ja
Application granted granted Critical
Publication of JP5120017B2 publication Critical patent/JP5120017B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2008088213A 2007-05-15 2008-03-28 プローブ装置 Active JP5120017B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2008088213A JP5120017B2 (ja) 2007-05-15 2008-03-28 プローブ装置
KR1020080044662A KR100960412B1 (ko) 2007-05-15 2008-05-14 프로브 장치
US12/120,569 US7741837B2 (en) 2007-05-15 2008-05-14 Probe apparatus
TW097117692A TWI424520B (zh) 2007-05-15 2008-05-14 Detection device
CN2008100990449A CN101308193B (zh) 2007-05-15 2008-05-15 探测装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007128694 2007-05-15
JP2007128694 2007-05-15
JP2008088213A JP5120017B2 (ja) 2007-05-15 2008-03-28 プローブ装置

Publications (2)

Publication Number Publication Date
JP2008311618A JP2008311618A (ja) 2008-12-25
JP5120017B2 true JP5120017B2 (ja) 2013-01-16

Family

ID=40124746

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008088213A Active JP5120017B2 (ja) 2007-05-15 2008-03-28 プローブ装置

Country Status (4)

Country Link
JP (1) JP5120017B2 (zh)
KR (1) KR100960412B1 (zh)
CN (2) CN101308194B (zh)
TW (1) TWI424520B (zh)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4725650B2 (ja) * 2009-01-07 2011-07-13 東京エレクトロン株式会社 プローブ装置
JP5381118B2 (ja) * 2009-01-21 2014-01-08 東京エレクトロン株式会社 プローブ装置
US9121901B2 (en) * 2009-02-12 2015-09-01 Advantest Corporation Semiconductor wafer test apparatus
CN101968518B (zh) * 2009-07-27 2012-08-08 京元电子股份有限公司 具同心圆探针座的半导体测试设备
CN102116835B (zh) * 2009-11-06 2014-12-03 东京毅力科创株式会社 探测装置以及衬底运送方法
JP4913201B2 (ja) * 2009-11-06 2012-04-11 東京エレクトロン株式会社 基板搬送方法
JP2011220691A (ja) * 2010-04-02 2011-11-04 Micronics Japan Co Ltd プローブカードの検査装置
JP5524139B2 (ja) * 2010-09-28 2014-06-18 東京エレクトロン株式会社 基板位置検出装置、これを備える成膜装置、および基板位置検出方法
JP2013033809A (ja) * 2011-08-01 2013-02-14 Tokyo Electron Ltd ウエハ搬送装置
JP2013053991A (ja) * 2011-09-06 2013-03-21 Seiko Epson Corp ハンドラー及び部品検査装置
KR101286250B1 (ko) * 2011-11-23 2013-07-12 양 전자시스템 주식회사 다수의 헤드 유니트를 갖는 어레이 테스트 장치
JP6121418B2 (ja) * 2012-07-12 2017-04-26 株式会社ヒューモラボラトリー チップ電子部品の検査選別装置
CN104280650A (zh) * 2013-07-08 2015-01-14 全研科技有限公司 导电玻璃检测系统
CN104515914A (zh) * 2013-10-08 2015-04-15 全研科技有限公司 床台式光学元件对位与导电性的检测机构及检测方法
KR101504502B1 (ko) 2013-11-29 2015-03-20 주식회사 아이비기술 접속판 교환이 가능한 연성회로기판 테스트 장치
KR101929590B1 (ko) * 2013-12-05 2019-03-13 매그나칩 반도체 유한회사 3차원 구조로 배치된 복수의 홀 센서를 이용한 센싱 시스템 및 이를 이용한 장치
JP6273178B2 (ja) * 2014-08-13 2018-01-31 東京エレクトロン株式会社 基板処理装置および基板処理方法
CN110023773B (zh) * 2017-02-22 2022-03-01 新东工业株式会社 测试系统
US10714364B2 (en) * 2017-08-31 2020-07-14 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for inspecting wafer carriers
KR101930456B1 (ko) 2018-05-03 2018-12-18 주식회사 유진테크 기판 처리 시스템
JP7175735B2 (ja) * 2018-12-11 2022-11-21 平田機工株式会社 基板搬送装置
CN111486787A (zh) * 2019-01-28 2020-08-04 苏州能讯高能半导体有限公司 一种测试定位方法以及测试定位系统
JP7274350B2 (ja) * 2019-05-28 2023-05-16 東京エレクトロン株式会社 搬送システム、検査システム及び検査方法
CN110133470A (zh) * 2019-06-06 2019-08-16 德淮半导体有限公司 晶圆验收处理方法及装置
TWI797461B (zh) * 2019-07-26 2023-04-01 日商新川股份有限公司 封裝裝置
CN110494036A (zh) * 2019-09-29 2019-11-22 格力电器（武汉）有限公司 机芯测试装置及机芯测试方法
CN115267503B (zh) * 2022-08-01 2023-06-27 镭神技术（深圳）有限公司 芯片自动测试设备
JP7393595B1 (ja) 2023-04-12 2023-12-06 株式会社東光高岳 ワーク位置決め機構及びワーク検査装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0666365B2 (ja) * 1986-11-20 1994-08-24 東京エレクトロン株式会社 プロ−ブ装置
JP3418411B2 (ja) * 1991-09-06 2003-06-23 Ｓｍｃ株式会社 真空ユニット
JP2963603B2 (ja) * 1993-05-31 1999-10-18 東京エレクトロン株式会社 プローブ装置のアライメント方法
JP3563108B2 (ja) * 1994-05-27 2004-09-08 株式会社アドバンテスト Ｉｃテストハンドラのデバイス搬送機構
US5742173A (en) * 1995-03-18 1998-04-21 Tokyo Electron Limited Method and apparatus for probe testing substrate
JPH10340937A (ja) * 1997-06-10 1998-12-22 Advantest Corp 複合ｉｃテストシステム
US6476629B1 (en) * 2000-02-23 2002-11-05 Micron Technology, Inc. In-tray burn-in board for testing integrated circuit devices in situ on processing trays
JP4054159B2 (ja) * 2000-03-08 2008-02-27 東京エレクトロン株式会社 基板処理方法及びその装置
JP2002057196A (ja) * 2000-08-07 2002-02-22 Plum Five Co Ltd プローブ方法及びプローブ装置
EP1357589A4 (en) * 2000-12-27 2005-04-20 Tokyo Electron Ltd "WORKPIECE TRANSFER SYSTEM, TRANSFER METHOD, VACUUM CHUCK AND WAFER CENTERING METHOD"
US7053393B2 (en) * 2002-06-04 2006-05-30 Olympus Corporation Alignment apparatus for object on stage
JP4376116B2 (ja) * 2003-06-03 2009-12-02 東京エレクトロン株式会社 基板受け渡し位置の調整方法

Also Published As

Publication number Publication date
CN101308193A (zh) 2008-11-19
TWI424520B (zh) 2014-01-21
CN101308194B (zh) 2011-03-09
JP2008311618A (ja) 2008-12-25
KR20080101709A (ko) 2008-11-21
KR100960412B1 (ko) 2010-05-28
TW200903696A (en) 2009-01-16
CN101308193B (zh) 2011-05-11
CN101308194A (zh) 2008-11-19

Similar Documents

Publication Publication Date Title
JP5120017B2 (ja) プローブ装置
JP5120018B2 (ja) プローブ装置
US7741837B2 (en) Probe apparatus
KR101079017B1 (ko) 프로브 장치, 프로빙 방법 및 기억 매체
TWI442509B (zh) Check the device
US7724007B2 (en) Probe apparatus and probing method
JP5381118B2 (ja) プローブ装置
JP5120027B2 (ja) プローブ装置及びプロービング方法
CN111742399B (zh) 接触精度保证方法、接触精度保证机构和检查装置
TW201816873A (zh) 加工裝置
JP4216263B2 (ja) 製造検査解析システム、および製造検査解析方法
US20130249581A1 (en) Probe apparatus
JP3303968B2 (ja) ウエハと接触子の位置合わせ装置
KR101218507B1 (ko) 프로브 장치

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110124

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20111219

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120522

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120723

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120925

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20121008

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20151102

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 5120017

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250