JP5043676B2 - 二軸延伸コポリエステルフィルム及び銅を含むその積層体 - Google Patents

二軸延伸コポリエステルフィルム及び銅を含むその積層体 Download PDF

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Publication number
JP5043676B2
JP5043676B2 JP2007546914A JP2007546914A JP5043676B2 JP 5043676 B2 JP5043676 B2 JP 5043676B2 JP 2007546914 A JP2007546914 A JP 2007546914A JP 2007546914 A JP2007546914 A JP 2007546914A JP 5043676 B2 JP5043676 B2 JP 5043676B2
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JP
Japan
Prior art keywords
film
mol
polyester
biaxially stretched
polyester film
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Expired - Fee Related
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JP2007546914A
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English (en)
Japanese (ja)
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JP2008524396A5 (https=
JP2008524396A (ja
Inventor
ジョセフ ペコリーニ，トーマス
スティーブンス マクウィリアムズ，ダグラス
アレン ギリアム，スペンサー
エリオット ティンチャー，マーク
ミシェル タナー，キャンディス
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Eastman Chemical Co
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Eastman Chemical Co
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Publication of JP2008524396A5 publication Critical patent/JP2008524396A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/06—Substrate layer characterised by chemical composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31507—Of polycarbonate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31786—Of polyester [e.g., alkyd, etc.]

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
JP2007546914A 2004-12-16 2005-12-14 二軸延伸コポリエステルフィルム及び銅を含むその積層体 Expired - Fee Related JP5043676B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US63671304P 2004-12-16 2004-12-16
US60/636,713 2004-12-16
US11/170,508 US7524920B2 (en) 2004-12-16 2005-06-29 Biaxially oriented copolyester film and laminates thereof
US11/170,508 2005-06-29
PCT/US2005/045501 WO2006066040A1 (en) 2004-12-16 2005-12-14 Biaxially oriented copolyester film and laminates thereof with copper

Publications (3)

Publication Number Publication Date
JP2008524396A JP2008524396A (ja) 2008-07-10
JP2008524396A5 JP2008524396A5 (https=) 2008-12-25
JP5043676B2 true JP5043676B2 (ja) 2012-10-10

Family

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JP2007546914A Expired - Fee Related JP5043676B2 (ja) 2004-12-16 2005-12-14 二軸延伸コポリエステルフィルム及び銅を含むその積層体

Country Status (9)

Country Link
US (1) US7524920B2 (https=)
EP (1) EP1824911B1 (https=)
JP (1) JP5043676B2 (https=)
KR (1) KR101239995B1 (https=)
CN (1) CN101080441B (https=)
AT (1) ATE404618T1 (https=)
DE (1) DE602005009019D1 (https=)
TW (1) TWI381941B (https=)
WO (1) WO2006066040A1 (https=)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050023098A1 (en) * 2003-07-01 2005-02-03 Imad Mahawili Energy recovery system
US20090057084A1 (en) * 2004-06-30 2009-03-05 Energy Recovery Technology, Llc Energy recovery system
US20060275558A1 (en) * 2005-05-17 2006-12-07 Pecorini Thomas J Conductively coated substrates derived from biaxially-oriented and heat-set polyester film
GB0602678D0 (en) * 2006-02-09 2006-03-22 Dupont Teijin Films Us Ltd Polyester film and manufacturing process
US20080048817A1 (en) * 2006-07-26 2008-02-28 Energy Recovery Technology, Llc Circuit module
US20090142981A1 (en) * 2007-12-03 2009-06-04 Velsicol Chemical Corporation Novel Compositions Comprising Structural Isomers Of 1,4-Cyclohexanedimethanol Dibenzoate and Polymer Compositions Containing Same
US20090153099A1 (en) * 2007-12-17 2009-06-18 Energy Recovery Technology, Llc Method of electric energy transfer between a vehicle and a stationary collector
JP4838827B2 (ja) * 2008-07-02 2011-12-14 シャープ株式会社 太陽電池モジュールおよびその製造方法
KR101468937B1 (ko) * 2008-09-05 2014-12-11 코오롱인더스트리 주식회사 폴리에스테르 필름 및 이의 제조방법
US20100072943A1 (en) * 2008-09-25 2010-03-25 Energy Recovery Technology, Llc Vehicle energy recovery system
US20110011854A1 (en) * 2009-02-23 2011-01-20 Middleton Scott W Low crystallinity susceptor films
JP5636380B2 (ja) * 2009-02-23 2014-12-03 グラフィック パッケージング インターナショナル インコーポレイテッド 低結晶度サセプタフィルム
US9284108B2 (en) 2009-02-23 2016-03-15 Graphic Packaging International, Inc. Plasma treated susceptor films
WO2010140575A1 (ja) * 2009-06-05 2010-12-09 東洋紡績株式会社 容器の胴巻ラベル用二軸配向ポリエステルフィルム及び容器の胴巻用ラベル
WO2012029499A1 (ja) * 2010-08-30 2012-03-08 長瀬産業株式会社 １，４－シクロヘキシレンジメチレンテレフタレートと１，４－シクロヘキシレンジメチレンイソフタレートとの共重合体フィルム、太陽電池モジュール用保護シート、及び、太陽電池モジュール
KR101474630B1 (ko) * 2012-01-06 2014-12-19 주식회사 엘지화학 봉지용 필름
US20130217830A1 (en) * 2012-02-16 2013-08-22 Eastman Chemical Company Clear Semi-Crystalline Articles with Improved Heat Resistance
CN102665375B (zh) * 2012-05-31 2014-12-17 昆山市线路板厂 一种聚酯材料挠性电路板低温焊接系统及焊接方法
WO2014172336A1 (en) * 2013-04-17 2014-10-23 Saint-Gobain Performance Plastics Corporation Multilayer laminate for photovoltaic applications
CN105683286B (zh) * 2013-10-28 2017-07-21 帝人杜邦薄膜日本有限公司 阻燃性双轴取向聚酯膜、由其形成的阻燃性聚酯膜层合体和柔性电路基板
US10121760B2 (en) * 2013-11-01 2018-11-06 Nikon Corporation Wafer bonding system and method
TWI495680B (zh) * 2013-11-07 2015-08-11 Ind Tech Res Inst 聚酯組成物、電子裝置、與薄膜的形成方法
KR101647470B1 (ko) * 2014-01-14 2016-08-10 에스케이씨 주식회사 고내열성을 가지는 폴리에스테르 필름
KR101594542B1 (ko) * 2013-12-30 2016-02-16 에스케이씨 주식회사 투명 이축연신 폴리에스테르 필름 및 이의 제조방법
WO2015102339A1 (ko) * 2013-12-30 2015-07-09 에스케이씨 주식회사 고내열성을 가지는 폴리에스테르 필름
KR101647475B1 (ko) * 2014-12-26 2016-08-10 에스케이씨 주식회사 고내열성을 가지는 폴리에스테르 필름
US20160007473A1 (en) * 2014-07-07 2016-01-07 Hamilton Sundstrand Corporation Method for fabricating printed electronics
US10767041B2 (en) * 2015-11-24 2020-09-08 Eastman Chemical Company Polymer compositions and substrates for high temperature transparent conductive film applications
JP2018104496A (ja) * 2016-12-22 2018-07-05 三菱ケミカル株式会社 ポリエステル樹脂組成物
CN110997767A (zh) * 2017-08-07 2020-04-10 3M创新有限公司 取向的导热介电膜
KR102369349B1 (ko) * 2019-10-02 2022-03-02 에스케이씨 주식회사 전자기판용 필름 및 적층체, 및 이를 포함하는 전자기판
KR102334251B1 (ko) * 2019-10-02 2021-12-03 에스케이씨 주식회사 전자기판용 필름 및 적층체, 및 이를 포함하는 전자기판
JP7439001B2 (ja) 2021-02-19 2024-02-27 矢崎総業株式会社 フレキシブルプリント基板、フレキシブルプリント基板の製造方法
KR102595432B1 (ko) 2021-09-16 2023-10-31 에스케이마이크로웍스 주식회사 폴리에스테르 필름, 플렉서블 플랫 케이블 및 와이어 하네스
KR102922084B1 (ko) * 2023-03-03 2026-02-03 마이크로웍스 주식회사 폴리에스테르 필름 및 이의 제조방법

Family Cites Families (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US517680A (en) * 1894-04-03 chase
BE592181A (https=) * 1955-12-22
US3284223A (en) * 1965-05-19 1966-11-08 Eastman Kodak Co Magnetic recording tape supported on terephthalate polyesters of 1, 4-cyclohexanedimethanol
US3461199A (en) 1966-05-03 1969-08-12 Du Pont Process for improving dimensional stability of tensilized polyester film
UST876001I4 (en) * 1969-07-29 1970-07-28 Defensive publication
JPS556317B2 (https=) * 1973-06-20 1980-02-15
DE2428532C3 (de) * 1973-06-20 1984-02-23 Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka Zusammensetzungen für einen Hochtemperatur-Heißleiter
US3907754A (en) * 1974-06-19 1975-09-23 Eastman Kodak Co Process and catalyst-inhibitor system for preparing synthetic linear polyester
US3962189A (en) * 1974-11-01 1976-06-08 Eastman Kodak Company Process and catalyst-inhibitor systems for preparing synthetic linear polyesters
US4010145A (en) * 1975-05-12 1977-03-01 Eastman Kodak Company Process and catalyst inhibitor systems for preparing synthetic linear polyesters
JPS60215B2 (ja) 1979-04-18 1985-01-07 東洋製罐株式会社 二軸延伸ブロ−成形容器の製造法
JPS5610451A (en) * 1979-07-05 1981-02-02 Toray Industries Resin coated metallic plate for vessel
US4356299A (en) * 1982-02-04 1982-10-26 Rohm And Haas Company Catalyst system for a polyethylene terephthalate polycondensation
JPS58214208A (ja) 1982-06-04 1983-12-13 東洋紡績株式会社 電気絶縁用フイルム
US4557982A (en) * 1983-04-07 1985-12-10 Teijin Limited Magnetic recording flexible disc
JPS6069133A (ja) 1983-09-27 1985-04-19 Teijin Ltd ２軸配向ポリエステルフイルム
JPS6085437A (ja) 1983-10-18 1985-05-14 Teijin Ltd 磁気記録フレキシブルデイスク
JPH01299019A (ja) 1988-05-26 1989-12-01 Unitika Ltd ポリエステル２軸配向フィルム
JP2519300B2 (ja) * 1988-08-09 1996-07-31 ダイアホイルヘキスト株式会社 コンデンサ用二軸配向ポリエステルフィルム
DE3831179A1 (de) 1988-09-13 1990-03-22 Gerhard Rumpp Reinigungsvorrichtung zum einbau in kraftfahrzeugen
JP2679174B2 (ja) 1988-11-14 1997-11-19 三菱化学株式会社 フレキシブルプリント配線基板用ベースフィルム
JPH02191638A (ja) 1989-01-19 1990-07-27 Unitika Ltd ポリエステル２軸配向フイルム
JPH02196833A (ja) 1989-01-24 1990-08-03 Toray Ind Inc 電気絶縁材料及び金属蒸着用フィルム
JP2718172B2 (ja) * 1989-04-27 1998-02-25 東レ株式会社 白色ポリエステルフイルム
JPH02301419A (ja) 1989-05-17 1990-12-13 Unitika Ltd 耐熱性ポリエステル２軸配向フィルム及びその製造方法
JPH0367630A (ja) * 1989-08-08 1991-03-22 Diafoil Co Ltd 二軸配向ポリエステルフィルム
JPH03197180A (ja) * 1989-12-27 1991-08-28 Diafoil Co Ltd オーバーヘッドプロジェクター用二軸配向ポリエステルフィルム
KR910016825A (ko) * 1990-03-26 1991-11-05 최준식 농업 하우스용 피복재료
US5017680A (en) * 1990-07-03 1991-05-21 Eastman Kodak Company Process and catalyst-inhibitor systems for preparing poly(ethylene terephthalate)
JPH0659686B2 (ja) 1990-10-29 1994-08-10 ダイアホイルヘキスト株式会社 コンデンサー用二軸配向ポリエステルフィルム
JPH0646450B2 (ja) 1990-11-01 1994-06-15 帝人株式会社 磁気記録フレキシブルディスク
JPH04214757A (ja) 1990-12-12 1992-08-05 Diafoil Co Ltd ポリ−１，４−シクロヘキサンジメチレンテレフタレートフィルム
WO1992014771A1 (en) 1991-02-20 1992-09-03 Eastman Kodak Company Polyester film base for motion picture film
JPH05170961A (ja) 1991-12-25 1993-07-09 Toray Ind Inc コンデンサ用ポリエステルフイルム
JPH05274719A (ja) 1992-03-27 1993-10-22 Diafoil Co Ltd 光テープ
JP3242739B2 (ja) 1993-04-12 2001-12-25 帝人株式会社 写真感光材料用フィルム
JP3727033B2 (ja) * 1994-06-20 2005-12-14 三菱化学ポリエステルフィルム株式会社 昇華型感熱転写用ポリエステルフィルム
WO1996006125A1 (en) 1994-08-22 1996-02-29 Eastman Chemical Company Biaxially oriented, heat-set polyester film having improved thermal shrinkage resistance
JPH08295014A (ja) 1995-04-26 1996-11-12 Citizen Watch Co Ltd インクジェットプリンタの記録ヘッドの駆動方法
US5608031A (en) * 1995-11-30 1997-03-04 Eastman Chemical Company Polyesters modified with 1,4-cyclohexaned imethanol having high clarity prepared utilizing an antimony containing catalyst/stabilizer system
TW381104B (en) * 1996-02-20 2000-02-01 Eastman Chem Co Process for preparing copolyesters of terephthalic acid, ethylene glycol, and 1,4-cyclohexanedimethanol
WO1999031168A1 (en) 1997-12-18 1999-06-24 Teijin Limited Biaxially oriented polyester film for laminating metal sheets
KR100544562B1 (ko) * 1998-05-15 2006-01-23 도요 보세키 가부시키가이샤 투명도전성 필름 및 터치판넬
US6583935B1 (en) * 1998-05-28 2003-06-24 Cpfilms Inc. Low reflection, high transmission, touch-panel membrane
JP3859108B2 (ja) 1998-08-19 2006-12-20 東レ株式会社 金属板貼合わせ成形加工用ポリエステルフィルム
AU4951399A (en) 1999-07-09 2001-01-30 Institute Of Materials Research And Engineering Mechanical patterning of a device layer
US6362306B1 (en) * 1999-08-17 2002-03-26 Eastman Chemical Company Reactor grade copolyesters for shrink film applications
JP2001212877A (ja) 2000-02-03 2001-08-07 Toray Ind Inc 二軸配向ポリエステルフィルムの製造方法および二軸配向ポリエステルフィルム
US20020018883A1 (en) * 2000-07-05 2002-02-14 Iwao Okazaki Thermoplastic resin film and production process thereof, and optical film
DE10045602A1 (de) * 2000-09-15 2002-03-28 Mitsubishi Polyester Film Gmbh Magnetbandträgerfolie mit niedrigem Skew
US20020110673A1 (en) 2001-02-14 2002-08-15 Ramin Heydarpour Multilayered electrode/substrate structures and display devices incorporating the same
US6743488B2 (en) * 2001-05-09 2004-06-01 Cpfilms Inc. Transparent conductive stratiform coating of indium tin oxide
KR100852373B1 (ko) * 2001-08-07 2008-08-14 데이진 듀폰 필름 가부시키가이샤 이축 배향 적층 폴리에스테르필름 및 하드코팅 적층필름
CN100421926C (zh) 2001-09-11 2008-10-01 美国杜邦泰津胶片合伙人有限公司 用于柔性电子器件和光电子器件的热稳定聚萘二甲酸乙二醇酯膜
US7147927B2 (en) * 2002-06-26 2006-12-12 Eastman Chemical Company Biaxially oriented polyester film and laminates thereof with copper
US7015640B2 (en) * 2002-09-11 2006-03-21 General Electric Company Diffusion barrier coatings having graded compositions and devices incorporating the same
KR100509763B1 (ko) * 2003-03-11 2005-08-25 엘지전자 주식회사 플라즈마 디스플레이 패널의 전면필터
US7029819B2 (en) * 2003-11-12 2006-04-18 Eastman Kodak Company Phosphor screen and imaging assembly
US7005226B2 (en) * 2003-11-12 2006-02-28 Eastman Kodak Company High speed imaging assembly for radiography
US6967071B2 (en) * 2003-11-12 2005-11-22 Eastman Kodak Company High speed radiographic imaging assembly
US20060275558A1 (en) * 2005-05-17 2006-12-07 Pecorini Thomas J Conductively coated substrates derived from biaxially-oriented and heat-set polyester film

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ATE404618T1 (de) 2008-08-15
US20060134409A1 (en) 2006-06-22
CN101080441B (zh) 2011-01-19
EP1824911A1 (en) 2007-08-29
WO2006066040A1 (en) 2006-06-22
CN101080441A (zh) 2007-11-28
US7524920B2 (en) 2009-04-28
JP2008524396A (ja) 2008-07-10
EP1824911B1 (en) 2008-08-13
TW200631781A (en) 2006-09-16
DE602005009019D1 (de) 2008-09-25
TWI381941B (zh) 2013-01-11

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