TWI381941B - 雙軸定向之共聚酯膜及其與銅之層壓物 - Google Patents
雙軸定向之共聚酯膜及其與銅之層壓物 Download PDFInfo
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- TWI381941B TWI381941B TW94144471A TW94144471A TWI381941B TW I381941 B TWI381941 B TW I381941B TW 94144471 A TW94144471 A TW 94144471A TW 94144471 A TW94144471 A TW 94144471A TW I381941 B TWI381941 B TW I381941B
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- Prior art keywords
- film
- mole
- polyester
- residue
- biaxially oriented
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/06—Substrate layer characterised by chemical composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31507—Of polycarbonate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US63671304P | 2004-12-16 | 2004-12-16 | |
| US11/170,508 US7524920B2 (en) | 2004-12-16 | 2005-06-29 | Biaxially oriented copolyester film and laminates thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200631781A TW200631781A (en) | 2006-09-16 |
| TWI381941B true TWI381941B (zh) | 2013-01-11 |
Family
ID=36144173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW94144471A TWI381941B (zh) | 2004-12-16 | 2005-12-15 | 雙軸定向之共聚酯膜及其與銅之層壓物 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US7524920B2 (https=) |
| EP (1) | EP1824911B1 (https=) |
| JP (1) | JP5043676B2 (https=) |
| KR (1) | KR101239995B1 (https=) |
| CN (1) | CN101080441B (https=) |
| AT (1) | ATE404618T1 (https=) |
| DE (1) | DE602005009019D1 (https=) |
| TW (1) | TWI381941B (https=) |
| WO (1) | WO2006066040A1 (https=) |
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| US20060275558A1 (en) * | 2005-05-17 | 2006-12-07 | Pecorini Thomas J | Conductively coated substrates derived from biaxially-oriented and heat-set polyester film |
| GB0602678D0 (en) * | 2006-02-09 | 2006-03-22 | Dupont Teijin Films Us Ltd | Polyester film and manufacturing process |
| US20080048817A1 (en) * | 2006-07-26 | 2008-02-28 | Energy Recovery Technology, Llc | Circuit module |
| US20090142981A1 (en) * | 2007-12-03 | 2009-06-04 | Velsicol Chemical Corporation | Novel Compositions Comprising Structural Isomers Of 1,4-Cyclohexanedimethanol Dibenzoate and Polymer Compositions Containing Same |
| US20090153099A1 (en) * | 2007-12-17 | 2009-06-18 | Energy Recovery Technology, Llc | Method of electric energy transfer between a vehicle and a stationary collector |
| JP4838827B2 (ja) * | 2008-07-02 | 2011-12-14 | シャープ株式会社 | 太陽電池モジュールおよびその製造方法 |
| KR101468937B1 (ko) * | 2008-09-05 | 2014-12-11 | 코오롱인더스트리 주식회사 | 폴리에스테르 필름 및 이의 제조방법 |
| US20100072943A1 (en) * | 2008-09-25 | 2010-03-25 | Energy Recovery Technology, Llc | Vehicle energy recovery system |
| US20110011854A1 (en) * | 2009-02-23 | 2011-01-20 | Middleton Scott W | Low crystallinity susceptor films |
| JP5636380B2 (ja) * | 2009-02-23 | 2014-12-03 | グラフィック パッケージング インターナショナル インコーポレイテッド | 低結晶度サセプタフィルム |
| US9284108B2 (en) | 2009-02-23 | 2016-03-15 | Graphic Packaging International, Inc. | Plasma treated susceptor films |
| WO2010140575A1 (ja) * | 2009-06-05 | 2010-12-09 | 東洋紡績株式会社 | 容器の胴巻ラベル用二軸配向ポリエステルフィルム及び容器の胴巻用ラベル |
| WO2012029499A1 (ja) * | 2010-08-30 | 2012-03-08 | 長瀬産業株式会社 | １，４－シクロヘキシレンジメチレンテレフタレートと１，４－シクロヘキシレンジメチレンイソフタレートとの共重合体フィルム、太陽電池モジュール用保護シート、及び、太陽電池モジュール |
| KR101474630B1 (ko) * | 2012-01-06 | 2014-12-19 | 주식회사 엘지화학 | 봉지용 필름 |
| US20130217830A1 (en) * | 2012-02-16 | 2013-08-22 | Eastman Chemical Company | Clear Semi-Crystalline Articles with Improved Heat Resistance |
| CN102665375B (zh) * | 2012-05-31 | 2014-12-17 | 昆山市线路板厂 | 一种聚酯材料挠性电路板低温焊接系统及焊接方法 |
| WO2014172336A1 (en) * | 2013-04-17 | 2014-10-23 | Saint-Gobain Performance Plastics Corporation | Multilayer laminate for photovoltaic applications |
| CN105683286B (zh) * | 2013-10-28 | 2017-07-21 | 帝人杜邦薄膜日本有限公司 | 阻燃性双轴取向聚酯膜、由其形成的阻燃性聚酯膜层合体和柔性电路基板 |
| US10121760B2 (en) * | 2013-11-01 | 2018-11-06 | Nikon Corporation | Wafer bonding system and method |
| TWI495680B (zh) * | 2013-11-07 | 2015-08-11 | Ind Tech Res Inst | 聚酯組成物、電子裝置、與薄膜的形成方法 |
| KR101647470B1 (ko) * | 2014-01-14 | 2016-08-10 | 에스케이씨 주식회사 | 고내열성을 가지는 폴리에스테르 필름 |
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| US10767041B2 (en) * | 2015-11-24 | 2020-09-08 | Eastman Chemical Company | Polymer compositions and substrates for high temperature transparent conductive film applications |
| JP2018104496A (ja) * | 2016-12-22 | 2018-07-05 | 三菱ケミカル株式会社 | ポリエステル樹脂組成物 |
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| JP7439001B2 (ja) | 2021-02-19 | 2024-02-27 | 矢崎総業株式会社 | フレキシブルプリント基板、フレキシブルプリント基板の製造方法 |
| KR102595432B1 (ko) | 2021-09-16 | 2023-10-31 | 에스케이마이크로웍스 주식회사 | 폴리에스테르 필름, 플렉서블 플랫 케이블 및 와이어 하네스 |
| KR102922084B1 (ko) * | 2023-03-03 | 2026-02-03 | 마이크로웍스 주식회사 | 폴리에스테르 필름 및 이의 제조방법 |
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2005
- 2005-06-29 US US11/170,508 patent/US7524920B2/en not_active Expired - Fee Related
- 2005-12-14 EP EP20050854264 patent/EP1824911B1/en not_active Expired - Lifetime
- 2005-12-14 AT AT05854264T patent/ATE404618T1/de not_active IP Right Cessation
- 2005-12-14 WO PCT/US2005/045501 patent/WO2006066040A1/en not_active Ceased
- 2005-12-14 KR KR1020077013398A patent/KR101239995B1/ko not_active Expired - Fee Related
- 2005-12-14 DE DE200560009019 patent/DE602005009019D1/de not_active Expired - Lifetime
- 2005-12-14 JP JP2007546914A patent/JP5043676B2/ja not_active Expired - Fee Related
- 2005-12-14 CN CN2005800432771A patent/CN101080441B/zh not_active Expired - Fee Related
- 2005-12-15 TW TW94144471A patent/TWI381941B/zh not_active IP Right Cessation
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| EP0483757A2 (en) * | 1990-10-29 | 1992-05-06 | Diafoil Company, Limited | Polyester film for capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101239995B1 (ko) | 2013-03-06 |
| KR20070086172A (ko) | 2007-08-27 |
| ATE404618T1 (de) | 2008-08-15 |
| US20060134409A1 (en) | 2006-06-22 |
| CN101080441B (zh) | 2011-01-19 |
| EP1824911A1 (en) | 2007-08-29 |
| WO2006066040A1 (en) | 2006-06-22 |
| CN101080441A (zh) | 2007-11-28 |
| US7524920B2 (en) | 2009-04-28 |
| JP2008524396A (ja) | 2008-07-10 |
| EP1824911B1 (en) | 2008-08-13 |
| TW200631781A (en) | 2006-09-16 |
| JP5043676B2 (ja) | 2012-10-10 |
| DE602005009019D1 (de) | 2008-09-25 |
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