JP5036954B2 - 半導体用途のための電着銅における欠陥の減少 - Google Patents

半導体用途のための電着銅における欠陥の減少 Download PDF

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Publication number
JP5036954B2
JP5036954B2 JP2003058866A JP2003058866A JP5036954B2 JP 5036954 B2 JP5036954 B2 JP 5036954B2 JP 2003058866 A JP2003058866 A JP 2003058866A JP 2003058866 A JP2003058866 A JP 2003058866A JP 5036954 B2 JP5036954 B2 JP 5036954B2
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JP
Japan
Prior art keywords
copper
electroplating
integrated circuit
semiconductor integrated
circuit device
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2003058866A
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English (en)
Japanese (ja)
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JP2004043957A (ja
JP2004043957A5 (https=
Inventor
コマンダー ジョン
ハーテュバイス リチャード
パネカッシオ ビンセント
リン ズアン
ジレージ カシャマ
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エンソン インコーポレイテッド
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2003058866A 2002-03-05 2003-03-05 半導体用途のための電着銅における欠陥の減少 Expired - Lifetime JP5036954B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/091,106 US7316772B2 (en) 2002-03-05 2002-03-05 Defect reduction in electrodeposited copper for semiconductor applications
US10/091.106 2002-03-05

Publications (3)

Publication Number Publication Date
JP2004043957A JP2004043957A (ja) 2004-02-12
JP2004043957A5 JP2004043957A5 (https=) 2006-04-20
JP5036954B2 true JP5036954B2 (ja) 2012-09-26

Family

ID=27787669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003058866A Expired - Lifetime JP5036954B2 (ja) 2002-03-05 2003-03-05 半導体用途のための電着銅における欠陥の減少

Country Status (5)

Country Link
US (2) US7316772B2 (https=)
JP (1) JP5036954B2 (https=)
CN (1) CN100416777C (https=)
DE (1) DE10309085A1 (https=)
TW (1) TWI316976B (https=)

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JP7039601B2 (ja) 2016-09-22 2022-03-22 マクダーミッド エンソン インコーポレイテッド マイクロエレクトロニクスにおける銅電着
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Also Published As

Publication number Publication date
JP2004043957A (ja) 2004-02-12
US9222188B2 (en) 2015-12-29
CN100416777C (zh) 2008-09-03
US7316772B2 (en) 2008-01-08
US20080121527A1 (en) 2008-05-29
CN1444258A (zh) 2003-09-24
TWI316976B (en) 2009-11-11
US20030168343A1 (en) 2003-09-11
DE10309085A1 (de) 2003-12-11
TW200304966A (https=) 2003-10-16

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