JP2004043957A5 - - Google Patents

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Publication number
JP2004043957A5
JP2004043957A5 JP2003058866A JP2003058866A JP2004043957A5 JP 2004043957 A5 JP2004043957 A5 JP 2004043957A5 JP 2003058866 A JP2003058866 A JP 2003058866A JP 2003058866 A JP2003058866 A JP 2003058866A JP 2004043957 A5 JP2004043957 A5 JP 2004043957A5
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JP
Japan
Prior art keywords
reducing agent
defect reducing
copper
reaction product
polyethyleneimine
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Application number
JP2003058866A
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English (en)
Japanese (ja)
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JP2004043957A (ja
JP5036954B2 (ja
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Priority claimed from US10/091,106 external-priority patent/US7316772B2/en
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Publication of JP2004043957A publication Critical patent/JP2004043957A/ja
Publication of JP2004043957A5 publication Critical patent/JP2004043957A5/ja
Application granted granted Critical
Publication of JP5036954B2 publication Critical patent/JP5036954B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2003058866A 2002-03-05 2003-03-05 半導体用途のための電着銅における欠陥の減少 Expired - Lifetime JP5036954B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/091,106 US7316772B2 (en) 2002-03-05 2002-03-05 Defect reduction in electrodeposited copper for semiconductor applications
US10/091.106 2002-03-05

Publications (3)

Publication Number Publication Date
JP2004043957A JP2004043957A (ja) 2004-02-12
JP2004043957A5 true JP2004043957A5 (https=) 2006-04-20
JP5036954B2 JP5036954B2 (ja) 2012-09-26

Family

ID=27787669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003058866A Expired - Lifetime JP5036954B2 (ja) 2002-03-05 2003-03-05 半導体用途のための電着銅における欠陥の減少

Country Status (5)

Country Link
US (2) US7316772B2 (https=)
JP (1) JP5036954B2 (https=)
CN (1) CN100416777C (https=)
DE (1) DE10309085A1 (https=)
TW (1) TWI316976B (https=)

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