JP5036890B2 - 感光性樹脂組成物、これを用いたフォトレジストフィルム、レジストパターンの形成方法及びプリント配線板の製造方法 - Google Patents

感光性樹脂組成物、これを用いたフォトレジストフィルム、レジストパターンの形成方法及びプリント配線板の製造方法 Download PDF

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Publication number
JP5036890B2
JP5036890B2 JP2011085062A JP2011085062A JP5036890B2 JP 5036890 B2 JP5036890 B2 JP 5036890B2 JP 2011085062 A JP2011085062 A JP 2011085062A JP 2011085062 A JP2011085062 A JP 2011085062A JP 5036890 B2 JP5036890 B2 JP 5036890B2
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Prior art keywords
photosensitive resin
resin composition
meth
wavelength
resist pattern
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JP2011085062A
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English (en)
Japanese (ja)
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JP2011237780A5 (enExample
JP2011237780A (ja
Inventor
剛 寺田
大貴 豊田
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Nichigo Morton Co Ltd
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Nichigo Morton Co Ltd
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2011085062A 2010-04-15 2011-04-07 感光性樹脂組成物、これを用いたフォトレジストフィルム、レジストパターンの形成方法及びプリント配線板の製造方法 Active JP5036890B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011085062A JP5036890B2 (ja) 2010-04-15 2011-04-07 感光性樹脂組成物、これを用いたフォトレジストフィルム、レジストパターンの形成方法及びプリント配線板の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010093694 2010-04-15
JP2010093694 2010-04-15
JP2011085062A JP5036890B2 (ja) 2010-04-15 2011-04-07 感光性樹脂組成物、これを用いたフォトレジストフィルム、レジストパターンの形成方法及びプリント配線板の製造方法

Publications (3)

Publication Number Publication Date
JP2011237780A JP2011237780A (ja) 2011-11-24
JP2011237780A5 JP2011237780A5 (enExample) 2012-07-19
JP5036890B2 true JP5036890B2 (ja) 2012-09-26

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JP2011085062A Active JP5036890B2 (ja) 2010-04-15 2011-04-07 感光性樹脂組成物、これを用いたフォトレジストフィルム、レジストパターンの形成方法及びプリント配線板の製造方法

Country Status (5)

Country Link
JP (1) JP5036890B2 (enExample)
KR (1) KR101719025B1 (enExample)
CN (1) CN102844709B (enExample)
TW (1) TWI470348B (enExample)
WO (1) WO2011129186A1 (enExample)

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ES2743760T3 (es) * 2013-10-15 2020-02-20 Agfa Nv Procedimiento para proporcionar planchas de impresión litográfica
KR102279715B1 (ko) 2014-05-09 2021-07-22 삼성전자주식회사 반도체 장치의 제조 방법 및 이에 의해 제조된 반도체 장치
KR20250011249A (ko) * 2014-05-13 2025-01-21 가부시끼가이샤 레조낙 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법
CN108121159B (zh) * 2016-11-29 2021-04-20 常州强力电子新材料股份有限公司 一种感光性树脂组合物及其应用
CN110357989B (zh) * 2018-04-11 2022-04-22 常州强力电子新材料股份有限公司 叔胺光敏剂、其制备方法、包含其的感光性树脂组合物及感光性树脂组合物的应用
CN110531583B (zh) * 2019-09-14 2023-09-29 浙江福斯特新材料研究院有限公司 感光性树脂组合物、干膜抗蚀层
WO2022044831A1 (ja) * 2020-08-25 2022-03-03 富士フイルム株式会社 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法
KR20240134854A (ko) * 2022-01-17 2024-09-10 가부시끼가이샤 레조낙 감광성 수지 조성물, 감광성 엘리먼트, 및, 적층체의 제조 방법

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JP4652516B2 (ja) * 1999-03-09 2011-03-16 株式会社林原生物化学研究所 ピラン誘導体
JP4556531B2 (ja) 2003-09-09 2010-10-06 三菱化学株式会社 青紫色レーザー感光性組成物、並びにそれを用いた画像形成材料、感光性画像形成材及び画像形成方法
EP1668417B1 (en) * 2003-09-22 2009-05-13 Agfa Graphics N.V. Photopolymerizable composition.
JP4446779B2 (ja) * 2004-03-31 2010-04-07 ニチゴー・モートン株式会社 フォトレジストフィルム
JP2006154740A (ja) 2004-07-14 2006-06-15 Fuji Photo Film Co Ltd 感光性組成物、パターン形成材料、感光性積層体、並びにパターン形成装置及びパターン形成方法
JP2006091488A (ja) * 2004-09-24 2006-04-06 Kyocera Mita Corp 画像形成装置
JP4461005B2 (ja) * 2004-12-06 2010-05-12 日本合成化学工業株式会社 感光性樹脂組成物及びそれを用いたフォトレジストフィルム、レジストパターン形成方法
WO2006126480A1 (ja) * 2005-05-23 2006-11-30 Hitachi Chemical Company, Ltd. 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2007114364A (ja) * 2005-10-19 2007-05-10 Kyocera Mita Corp 電子写真感光体及び画像形成装置
JP4550718B2 (ja) * 2005-10-28 2010-09-22 京セラミタ株式会社 電子写真感光体
EP1793275B1 (en) * 2005-12-02 2013-07-03 Fujifilm Corporation Method for preparation of lithographic printing plate and lithographic printing plate precursor
JP4911457B2 (ja) * 2005-12-02 2012-04-04 富士フイルム株式会社 平版印刷版の作製方法および平版印刷版原版
JP2007156111A (ja) * 2005-12-05 2007-06-21 Fujifilm Corp 感光性組成物、パターン形成材料、感光性積層体、及びパターン形成方法
JP4874659B2 (ja) * 2006-01-24 2012-02-15 富士フイルム株式会社 アニリン化合物及びその製造方法、並びに、感光性組成物
JP4924230B2 (ja) * 2007-06-21 2012-04-25 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP4941182B2 (ja) 2007-08-29 2012-05-30 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2009145613A (ja) * 2007-12-13 2009-07-02 Nippon Synthetic Chem Ind Co Ltd:The フォトレジストフィルム、感光性樹脂組成物層およびレジストパターンの形成方法

Also Published As

Publication number Publication date
KR101719025B1 (ko) 2017-03-22
TW201205187A (en) 2012-02-01
CN102844709B (zh) 2014-08-20
CN102844709A (zh) 2012-12-26
KR20130095640A (ko) 2013-08-28
TWI470348B (zh) 2015-01-21
JP2011237780A (ja) 2011-11-24
WO2011129186A1 (ja) 2011-10-20

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