CN102844709B - 感光性树脂组合物、使用其的光致抗蚀膜、抗蚀图案的形成方法及印刷电路板的制造方法 - Google Patents

感光性树脂组合物、使用其的光致抗蚀膜、抗蚀图案的形成方法及印刷电路板的制造方法 Download PDF

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Publication number
CN102844709B
CN102844709B CN201180019201.0A CN201180019201A CN102844709B CN 102844709 B CN102844709 B CN 102844709B CN 201180019201 A CN201180019201 A CN 201180019201A CN 102844709 B CN102844709 B CN 102844709B
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photosensitive resin
resin composition
wavelength
meth
acrylate
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CN102844709A (zh
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寺田刚
丰田大贵
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Changxing Materials Industry Co ltd
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Nichigo Morton Co Ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN201180019201.0A 2010-04-15 2011-03-24 感光性树脂组合物、使用其的光致抗蚀膜、抗蚀图案的形成方法及印刷电路板的制造方法 Active CN102844709B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010093694 2010-04-15
JP2010-093694 2010-04-15
PCT/JP2011/057120 WO2011129186A1 (ja) 2010-04-15 2011-03-24 感光性樹脂組成物、これを用いたフォトレジストフィルム、レジストパターンの形成方法及びプリント配線板の製造方法

Publications (2)

Publication Number Publication Date
CN102844709A CN102844709A (zh) 2012-12-26
CN102844709B true CN102844709B (zh) 2014-08-20

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CN201180019201.0A Active CN102844709B (zh) 2010-04-15 2011-03-24 感光性树脂组合物、使用其的光致抗蚀膜、抗蚀图案的形成方法及印刷电路板的制造方法

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Country Link
JP (1) JP5036890B2 (enExample)
KR (1) KR101719025B1 (enExample)
CN (1) CN102844709B (enExample)
TW (1) TWI470348B (enExample)
WO (1) WO2011129186A1 (enExample)

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ES2743760T3 (es) * 2013-10-15 2020-02-20 Agfa Nv Procedimiento para proporcionar planchas de impresión litográfica
KR102279715B1 (ko) 2014-05-09 2021-07-22 삼성전자주식회사 반도체 장치의 제조 방법 및 이에 의해 제조된 반도체 장치
KR20250011249A (ko) * 2014-05-13 2025-01-21 가부시끼가이샤 레조낙 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법
CN108121159B (zh) * 2016-11-29 2021-04-20 常州强力电子新材料股份有限公司 一种感光性树脂组合物及其应用
CN110357989B (zh) * 2018-04-11 2022-04-22 常州强力电子新材料股份有限公司 叔胺光敏剂、其制备方法、包含其的感光性树脂组合物及感光性树脂组合物的应用
CN110531583B (zh) * 2019-09-14 2023-09-29 浙江福斯特新材料研究院有限公司 感光性树脂组合物、干膜抗蚀层
WO2022044831A1 (ja) * 2020-08-25 2022-03-03 富士フイルム株式会社 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法
KR20240134854A (ko) * 2022-01-17 2024-09-10 가부시끼가이샤 레조낙 감광성 수지 조성물, 감광성 엘리먼트, 및, 적층체의 제조 방법

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US20070128550A1 (en) * 2005-12-02 2007-06-07 Fujifilm Corporation Method for preparation of lithographic printing plate and lithographic printing plate precursor
JP2007156111A (ja) * 2005-12-05 2007-06-21 Fujifilm Corp 感光性組成物、パターン形成材料、感光性積層体、及びパターン形成方法

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JP4556531B2 (ja) 2003-09-09 2010-10-06 三菱化学株式会社 青紫色レーザー感光性組成物、並びにそれを用いた画像形成材料、感光性画像形成材及び画像形成方法
JP4446779B2 (ja) * 2004-03-31 2010-04-07 ニチゴー・モートン株式会社 フォトレジストフィルム
JP2006154740A (ja) 2004-07-14 2006-06-15 Fuji Photo Film Co Ltd 感光性組成物、パターン形成材料、感光性積層体、並びにパターン形成装置及びパターン形成方法
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WO2006126480A1 (ja) * 2005-05-23 2006-11-30 Hitachi Chemical Company, Ltd. 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2007114364A (ja) * 2005-10-19 2007-05-10 Kyocera Mita Corp 電子写真感光体及び画像形成装置
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JP4941182B2 (ja) 2007-08-29 2012-05-30 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2009145613A (ja) * 2007-12-13 2009-07-02 Nippon Synthetic Chem Ind Co Ltd:The フォトレジストフィルム、感光性樹脂組成物層およびレジストパターンの形成方法

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CN1882879A (zh) * 2003-09-22 2006-12-20 爱克发-格法特公司 可光聚合的组合物
JP2006162858A (ja) * 2004-12-06 2006-06-22 Nippon Synthetic Chem Ind Co Ltd:The 感光性樹脂組成物及びそれを用いたフォトレジストフィルム、レジストパターン形成方法
US20070128550A1 (en) * 2005-12-02 2007-06-07 Fujifilm Corporation Method for preparation of lithographic printing plate and lithographic printing plate precursor
JP2007156111A (ja) * 2005-12-05 2007-06-21 Fujifilm Corp 感光性組成物、パターン形成材料、感光性積層体、及びパターン形成方法

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JP特开2006-91488A 2006.04.06
JP特开2007-156111A 2007.06.21
JP特开2009-3177A 2009.01.08

Also Published As

Publication number Publication date
KR101719025B1 (ko) 2017-03-22
TW201205187A (en) 2012-02-01
CN102844709A (zh) 2012-12-26
JP5036890B2 (ja) 2012-09-26
KR20130095640A (ko) 2013-08-28
TWI470348B (zh) 2015-01-21
JP2011237780A (ja) 2011-11-24
WO2011129186A1 (ja) 2011-10-20

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Address after: Tokyo, Japan

Applicant after: Nichigo-Morton Co.,Ltd.

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Effective date of registration: 20231229

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Patentee after: Changxing Materials Industry Co.,Ltd.

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