KR101719025B1 - 감광성 수지 조성물, 이를 이용한 포토레지스트 필름, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법 - Google Patents

감광성 수지 조성물, 이를 이용한 포토레지스트 필름, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법 Download PDF

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KR101719025B1
KR101719025B1 KR1020127029836A KR20127029836A KR101719025B1 KR 101719025 B1 KR101719025 B1 KR 101719025B1 KR 1020127029836 A KR1020127029836 A KR 1020127029836A KR 20127029836 A KR20127029836 A KR 20127029836A KR 101719025 B1 KR101719025 B1 KR 101719025B1
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South Korea
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photosensitive resin
resin composition
wavelength
carbon atoms
resist pattern
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Korean (ko)
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KR20130095640A (ko
Inventor
츠요시 테라다
히로키 토요타
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닛코-매터리얼즈 가부시키가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020127029836A 2010-04-15 2011-03-24 감광성 수지 조성물, 이를 이용한 포토레지스트 필름, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법 Active KR101719025B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010093694 2010-04-15
JPJP-P-2010-093694 2010-04-15
PCT/JP2011/057120 WO2011129186A1 (ja) 2010-04-15 2011-03-24 感光性樹脂組成物、これを用いたフォトレジストフィルム、レジストパターンの形成方法及びプリント配線板の製造方法

Publications (2)

Publication Number Publication Date
KR20130095640A KR20130095640A (ko) 2013-08-28
KR101719025B1 true KR101719025B1 (ko) 2017-03-22

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KR1020127029836A Active KR101719025B1 (ko) 2010-04-15 2011-03-24 감광성 수지 조성물, 이를 이용한 포토레지스트 필름, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법

Country Status (5)

Country Link
JP (1) JP5036890B2 (enExample)
KR (1) KR101719025B1 (enExample)
CN (1) CN102844709B (enExample)
TW (1) TWI470348B (enExample)
WO (1) WO2011129186A1 (enExample)

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* Cited by examiner, † Cited by third party
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ES2743760T3 (es) * 2013-10-15 2020-02-20 Agfa Nv Procedimiento para proporcionar planchas de impresión litográfica
KR102279715B1 (ko) 2014-05-09 2021-07-22 삼성전자주식회사 반도체 장치의 제조 방법 및 이에 의해 제조된 반도체 장치
KR20250011249A (ko) * 2014-05-13 2025-01-21 가부시끼가이샤 레조낙 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법
CN108121159B (zh) * 2016-11-29 2021-04-20 常州强力电子新材料股份有限公司 一种感光性树脂组合物及其应用
CN110357989B (zh) * 2018-04-11 2022-04-22 常州强力电子新材料股份有限公司 叔胺光敏剂、其制备方法、包含其的感光性树脂组合物及感光性树脂组合物的应用
CN110531583B (zh) * 2019-09-14 2023-09-29 浙江福斯特新材料研究院有限公司 感光性树脂组合物、干膜抗蚀层
WO2022044831A1 (ja) * 2020-08-25 2022-03-03 富士フイルム株式会社 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法
KR20240134854A (ko) * 2022-01-17 2024-09-10 가부시끼가이샤 레조낙 감광성 수지 조성물, 감광성 엘리먼트, 및, 적층체의 제조 방법

Citations (3)

* Cited by examiner, † Cited by third party
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JP2001081090A (ja) 1999-03-09 2001-03-27 Hayashibara Biochem Lab Inc ピラン誘導体
JP2005292289A (ja) 2004-03-31 2005-10-20 Nichigo Morton Co Ltd フォトレジストフィルム
JP2007197340A (ja) 2006-01-24 2007-08-09 Fujifilm Corp アニリン化合物及びその製造方法、並びに、感光性組成物

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JP4556531B2 (ja) 2003-09-09 2010-10-06 三菱化学株式会社 青紫色レーザー感光性組成物、並びにそれを用いた画像形成材料、感光性画像形成材及び画像形成方法
EP1668417B1 (en) * 2003-09-22 2009-05-13 Agfa Graphics N.V. Photopolymerizable composition.
JP2006154740A (ja) 2004-07-14 2006-06-15 Fuji Photo Film Co Ltd 感光性組成物、パターン形成材料、感光性積層体、並びにパターン形成装置及びパターン形成方法
JP2006091488A (ja) * 2004-09-24 2006-04-06 Kyocera Mita Corp 画像形成装置
JP4461005B2 (ja) * 2004-12-06 2010-05-12 日本合成化学工業株式会社 感光性樹脂組成物及びそれを用いたフォトレジストフィルム、レジストパターン形成方法
WO2006126480A1 (ja) * 2005-05-23 2006-11-30 Hitachi Chemical Company, Ltd. 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2007114364A (ja) * 2005-10-19 2007-05-10 Kyocera Mita Corp 電子写真感光体及び画像形成装置
JP4550718B2 (ja) * 2005-10-28 2010-09-22 京セラミタ株式会社 電子写真感光体
EP1793275B1 (en) * 2005-12-02 2013-07-03 Fujifilm Corporation Method for preparation of lithographic printing plate and lithographic printing plate precursor
JP4911457B2 (ja) * 2005-12-02 2012-04-04 富士フイルム株式会社 平版印刷版の作製方法および平版印刷版原版
JP2007156111A (ja) * 2005-12-05 2007-06-21 Fujifilm Corp 感光性組成物、パターン形成材料、感光性積層体、及びパターン形成方法
JP4924230B2 (ja) * 2007-06-21 2012-04-25 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP4941182B2 (ja) 2007-08-29 2012-05-30 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2009145613A (ja) * 2007-12-13 2009-07-02 Nippon Synthetic Chem Ind Co Ltd:The フォトレジストフィルム、感光性樹脂組成物層およびレジストパターンの形成方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001081090A (ja) 1999-03-09 2001-03-27 Hayashibara Biochem Lab Inc ピラン誘導体
JP2005292289A (ja) 2004-03-31 2005-10-20 Nichigo Morton Co Ltd フォトレジストフィルム
JP2007197340A (ja) 2006-01-24 2007-08-09 Fujifilm Corp アニリン化合物及びその製造方法、並びに、感光性組成物

Also Published As

Publication number Publication date
TW201205187A (en) 2012-02-01
CN102844709B (zh) 2014-08-20
CN102844709A (zh) 2012-12-26
JP5036890B2 (ja) 2012-09-26
KR20130095640A (ko) 2013-08-28
TWI470348B (zh) 2015-01-21
JP2011237780A (ja) 2011-11-24
WO2011129186A1 (ja) 2011-10-20

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