JP5009085B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5009085B2
JP5009085B2 JP2007207962A JP2007207962A JP5009085B2 JP 5009085 B2 JP5009085 B2 JP 5009085B2 JP 2007207962 A JP2007207962 A JP 2007207962A JP 2007207962 A JP2007207962 A JP 2007207962A JP 5009085 B2 JP5009085 B2 JP 5009085B2
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JP
Japan
Prior art keywords
heat
cooling
semiconductor
flow path
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007207962A
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English (en)
Japanese (ja)
Other versions
JP2009043978A (ja
JP2009043978A5 (https=
Inventor
昌宏 春原
光敏 東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2007207962A priority Critical patent/JP5009085B2/ja
Priority to EP08161413.3A priority patent/EP2023390B1/en
Priority to US12/187,636 priority patent/US7952191B2/en
Publication of JP2009043978A publication Critical patent/JP2009043978A/ja
Publication of JP2009043978A5 publication Critical patent/JP2009043978A5/ja
Application granted granted Critical
Publication of JP5009085B2 publication Critical patent/JP5009085B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2007207962A 2007-08-09 2007-08-09 半導体装置 Expired - Fee Related JP5009085B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007207962A JP5009085B2 (ja) 2007-08-09 2007-08-09 半導体装置
EP08161413.3A EP2023390B1 (en) 2007-08-09 2008-07-30 Semiconductor device
US12/187,636 US7952191B2 (en) 2007-08-09 2008-08-07 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007207962A JP5009085B2 (ja) 2007-08-09 2007-08-09 半導体装置

Publications (3)

Publication Number Publication Date
JP2009043978A JP2009043978A (ja) 2009-02-26
JP2009043978A5 JP2009043978A5 (https=) 2010-05-13
JP5009085B2 true JP5009085B2 (ja) 2012-08-22

Family

ID=40032686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007207962A Expired - Fee Related JP5009085B2 (ja) 2007-08-09 2007-08-09 半導体装置

Country Status (3)

Country Link
US (1) US7952191B2 (https=)
EP (1) EP2023390B1 (https=)
JP (1) JP5009085B2 (https=)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009143330A2 (en) * 2008-05-21 2009-11-26 Asetek A/S Graphics card thermal interposer
JP2011222818A (ja) * 2010-04-12 2011-11-04 Yokogawa Electric Corp 半導体デバイスの冷却構造
JP5440440B2 (ja) * 2010-08-06 2014-03-12 株式会社デンソー 電子装置
JP5776340B2 (ja) * 2011-06-06 2015-09-09 富士通株式会社 液体搬送装置及び該搬送装置を用いた半導体冷却装置
JP5779042B2 (ja) 2011-08-18 2015-09-16 新光電気工業株式会社 半導体装置
WO2013035337A1 (ja) * 2011-09-09 2013-03-14 日本特殊陶業株式会社 半導体モジュール、回路基板
US9082633B2 (en) * 2011-10-13 2015-07-14 Xilinx, Inc. Multi-die integrated circuit structure with heat sink
JP5891707B2 (ja) * 2011-10-28 2016-03-23 富士通株式会社 半導体装置とその製造方法
JP5898919B2 (ja) 2011-10-31 2016-04-06 新光電気工業株式会社 半導体装置
CN103946043B (zh) * 2011-11-16 2016-06-01 丰田自动车株式会社 电气设备的冷却装置
US9490190B2 (en) 2012-09-21 2016-11-08 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal dissipation through seal rings in 3DIC structure
US8796829B2 (en) 2012-09-21 2014-08-05 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal dissipation through seal rings in 3DIC structure
JP6196815B2 (ja) 2013-06-05 2017-09-13 新光電気工業株式会社 冷却装置及び半導体装置
JP2015065335A (ja) * 2013-09-25 2015-04-09 Ｎｅｃプラットフォームズ株式会社 電子装置
US9425125B2 (en) * 2014-02-20 2016-08-23 Altera Corporation Silicon-glass hybrid interposer circuitry
CN106604618B (zh) * 2017-01-05 2024-01-09 中国科学院广州能源研究所 一种用于数据中心的液冷、风冷复合冷却装置
US10128199B1 (en) * 2017-07-17 2018-11-13 International Business Machines Corporation Interchip backside connection
CN109950250B (zh) 2017-12-20 2022-03-01 晟碟信息科技（上海）有限公司 具有矩阵冷却的数据中心3d固态驱动
JP7172471B2 (ja) * 2018-11-09 2022-11-16 住友電装株式会社 基板構造体
US10763186B2 (en) * 2018-12-31 2020-09-01 Micron Technology, Inc. Package cooling by coil cavity
US10966338B1 (en) 2020-03-11 2021-03-30 Peter C. Salmon Densely packed electronic systems
US11393807B2 (en) 2020-03-11 2022-07-19 Peter C. Salmon Densely packed electronic systems
US11546991B2 (en) 2020-03-11 2023-01-03 Peter C. Salmon Densely packed electronic systems
US12302497B2 (en) 2020-03-11 2025-05-13 Peter C. Salmon Densely packed electronic systems
US11523543B1 (en) 2022-02-25 2022-12-06 Peter C. Salmon Water cooled server
US11445640B1 (en) 2022-02-25 2022-09-13 Peter C. Salmon Water cooled server
US12376254B2 (en) 2022-02-25 2025-07-29 Peter C. Salmon Water cooled server
US12136576B1 (en) 2023-06-22 2024-11-05 Peter C. Salmon Microelectronic module
US12469754B2 (en) 2023-09-07 2025-11-11 Peter C. Salmon Hermetic microelectronic module using a sheath
US12255122B1 (en) 2023-12-13 2025-03-18 Peter C. Salmon Water-cooled electronic system

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US4649990A (en) * 1985-05-06 1987-03-17 Hitachi, Ltd. Heat-conducting cooling module
JPH05136305A (ja) * 1991-11-08 1993-06-01 Hitachi Ltd 発熱体の冷却装置
US6213195B1 (en) * 1998-12-23 2001-04-10 Hamilton Sundstrand Corporation Modular coolant manifold for use with power electronics devices having integrated coolers
JP2001015675A (ja) * 1999-06-29 2001-01-19 Hitachi Ltd マルチチップモジュール
JP3518434B2 (ja) * 1999-08-11 2004-04-12 株式会社日立製作所 マルチチップモジュールの冷却装置
US6366462B1 (en) * 2000-07-18 2002-04-02 International Business Machines Corporation Electronic module with integral refrigerant evaporator assembly and control system therefore
US6822170B2 (en) * 2000-12-26 2004-11-23 Ngk Spark Plug Co., Ltd. Embedding resin and wiring substrate using the same
JPWO2002057921A1 (ja) * 2001-01-19 2004-07-22 株式会社日立製作所 電子回路装置
JP3815239B2 (ja) * 2001-03-13 2006-08-30 日本電気株式会社 半導体素子の実装構造及びプリント配線基板
JP4604398B2 (ja) * 2001-06-11 2011-01-05 ソニー株式会社 高周波モジュール用基板装置、高周波モジュール装置及びこれらの製造方法
US6433413B1 (en) * 2001-08-17 2002-08-13 Micron Technology, Inc. Three-dimensional multichip module
JP2004228521A (ja) * 2003-01-27 2004-08-12 Ngk Spark Plug Co Ltd 配線基板およびその製造方法
US7019971B2 (en) * 2003-09-30 2006-03-28 Intel Corporation Thermal management systems for micro-components
JP2005228237A (ja) * 2004-02-16 2005-08-25 Hitachi Ltd 液冷システム及びそれを備えた電子機器
JP2007073668A (ja) * 2005-09-06 2007-03-22 Fujitsu Ltd 熱を伝える熱伝熱装置、及びこの伝熱装置を実装した電子装置
US7675163B2 (en) * 2007-03-21 2010-03-09 Sun Microsystems, Inc. Carbon nanotubes for active direct and indirect cooling of electronics device

Also Published As

Publication number Publication date
US7952191B2 (en) 2011-05-31
EP2023390A1 (en) 2009-02-11
EP2023390B1 (en) 2015-09-23
JP2009043978A (ja) 2009-02-26
US20090040715A1 (en) 2009-02-12

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