JP2009043978A5 - - Google Patents

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Publication number
JP2009043978A5
JP2009043978A5 JP2007207962A JP2007207962A JP2009043978A5 JP 2009043978 A5 JP2009043978 A5 JP 2009043978A5 JP 2007207962 A JP2007207962 A JP 2007207962A JP 2007207962 A JP2007207962 A JP 2007207962A JP 2009043978 A5 JP2009043978 A5 JP 2009043978A5
Authority
JP
Japan
Prior art keywords
flow path
cooling flow
semiconductor
semiconductor device
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007207962A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009043978A (ja
JP5009085B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007207962A priority Critical patent/JP5009085B2/ja
Priority claimed from JP2007207962A external-priority patent/JP5009085B2/ja
Priority to EP08161413.3A priority patent/EP2023390B1/en
Priority to US12/187,636 priority patent/US7952191B2/en
Publication of JP2009043978A publication Critical patent/JP2009043978A/ja
Publication of JP2009043978A5 publication Critical patent/JP2009043978A5/ja
Application granted granted Critical
Publication of JP5009085B2 publication Critical patent/JP5009085B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007207962A 2007-08-09 2007-08-09 半導体装置 Expired - Fee Related JP5009085B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007207962A JP5009085B2 (ja) 2007-08-09 2007-08-09 半導体装置
EP08161413.3A EP2023390B1 (en) 2007-08-09 2008-07-30 Semiconductor device
US12/187,636 US7952191B2 (en) 2007-08-09 2008-08-07 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007207962A JP5009085B2 (ja) 2007-08-09 2007-08-09 半導体装置

Publications (3)

Publication Number Publication Date
JP2009043978A JP2009043978A (ja) 2009-02-26
JP2009043978A5 true JP2009043978A5 (https=) 2010-05-13
JP5009085B2 JP5009085B2 (ja) 2012-08-22

Family

ID=40032686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007207962A Expired - Fee Related JP5009085B2 (ja) 2007-08-09 2007-08-09 半導体装置

Country Status (3)

Country Link
US (1) US7952191B2 (https=)
EP (1) EP2023390B1 (https=)
JP (1) JP5009085B2 (https=)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009143330A2 (en) * 2008-05-21 2009-11-26 Asetek A/S Graphics card thermal interposer
JP2011222818A (ja) * 2010-04-12 2011-11-04 Yokogawa Electric Corp 半導体デバイスの冷却構造
JP5440440B2 (ja) * 2010-08-06 2014-03-12 株式会社デンソー 電子装置
JP5776340B2 (ja) * 2011-06-06 2015-09-09 富士通株式会社 液体搬送装置及び該搬送装置を用いた半導体冷却装置
JP5779042B2 (ja) 2011-08-18 2015-09-16 新光電気工業株式会社 半導体装置
WO2013035337A1 (ja) * 2011-09-09 2013-03-14 日本特殊陶業株式会社 半導体モジュール、回路基板
US9082633B2 (en) * 2011-10-13 2015-07-14 Xilinx, Inc. Multi-die integrated circuit structure with heat sink
JP5891707B2 (ja) * 2011-10-28 2016-03-23 富士通株式会社 半導体装置とその製造方法
JP5898919B2 (ja) 2011-10-31 2016-04-06 新光電気工業株式会社 半導体装置
CN103946043B (zh) * 2011-11-16 2016-06-01 丰田自动车株式会社 电气设备的冷却装置
US9490190B2 (en) 2012-09-21 2016-11-08 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal dissipation through seal rings in 3DIC structure
US8796829B2 (en) 2012-09-21 2014-08-05 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal dissipation through seal rings in 3DIC structure
JP6196815B2 (ja) 2013-06-05 2017-09-13 新光電気工業株式会社 冷却装置及び半導体装置
JP2015065335A (ja) * 2013-09-25 2015-04-09 Ｎｅｃプラットフォームズ株式会社 電子装置
US9425125B2 (en) * 2014-02-20 2016-08-23 Altera Corporation Silicon-glass hybrid interposer circuitry
CN106604618B (zh) * 2017-01-05 2024-01-09 中国科学院广州能源研究所 一种用于数据中心的液冷、风冷复合冷却装置
US10128199B1 (en) * 2017-07-17 2018-11-13 International Business Machines Corporation Interchip backside connection
CN109950250B (zh) 2017-12-20 2022-03-01 晟碟信息科技（上海）有限公司 具有矩阵冷却的数据中心3d固态驱动
JP7172471B2 (ja) * 2018-11-09 2022-11-16 住友電装株式会社 基板構造体
US10763186B2 (en) * 2018-12-31 2020-09-01 Micron Technology, Inc. Package cooling by coil cavity
US10966338B1 (en) 2020-03-11 2021-03-30 Peter C. Salmon Densely packed electronic systems
US11393807B2 (en) 2020-03-11 2022-07-19 Peter C. Salmon Densely packed electronic systems
US11546991B2 (en) 2020-03-11 2023-01-03 Peter C. Salmon Densely packed electronic systems
US12302497B2 (en) 2020-03-11 2025-05-13 Peter C. Salmon Densely packed electronic systems
US11523543B1 (en) 2022-02-25 2022-12-06 Peter C. Salmon Water cooled server
US11445640B1 (en) 2022-02-25 2022-09-13 Peter C. Salmon Water cooled server
US12376254B2 (en) 2022-02-25 2025-07-29 Peter C. Salmon Water cooled server
US12136576B1 (en) 2023-06-22 2024-11-05 Peter C. Salmon Microelectronic module
US12469754B2 (en) 2023-09-07 2025-11-11 Peter C. Salmon Hermetic microelectronic module using a sheath
US12255122B1 (en) 2023-12-13 2025-03-18 Peter C. Salmon Water-cooled electronic system

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JP3815239B2 (ja) * 2001-03-13 2006-08-30 日本電気株式会社 半導体素子の実装構造及びプリント配線基板
JP4604398B2 (ja) * 2001-06-11 2011-01-05 ソニー株式会社 高周波モジュール用基板装置、高周波モジュール装置及びこれらの製造方法
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JP2007073668A (ja) * 2005-09-06 2007-03-22 Fujitsu Ltd 熱を伝える熱伝熱装置、及びこの伝熱装置を実装した電子装置
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