JP2015500569A5 - - Google Patents
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- Publication number
- JP2015500569A5 JP2015500569A5 JP2014545898A JP2014545898A JP2015500569A5 JP 2015500569 A5 JP2015500569 A5 JP 2015500569A5 JP 2014545898 A JP2014545898 A JP 2014545898A JP 2014545898 A JP2014545898 A JP 2014545898A JP 2015500569 A5 JP2015500569 A5 JP 2015500569A5
- Authority
- JP
- Japan
- Prior art keywords
- die
- plates
- heat dissipating
- beams
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012790 adhesive layer Substances 0.000 claims 9
- 239000002826 coolant Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 4
- 238000000034 method Methods 0.000 claims 3
- 230000005855 radiation Effects 0.000 claims 3
- 238000001816 cooling Methods 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/314,995 US9184108B2 (en) | 2011-12-08 | 2011-12-08 | Heat dissipation structure for an integrated circuit (IC) chip |
| US13/314,995 | 2011-12-08 | ||
| PCT/US2012/059819 WO2013085618A1 (en) | 2011-12-08 | 2012-10-11 | Design of a heat dissipation structure for an integrated circuit (ic) chip |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015500569A JP2015500569A (ja) | 2015-01-05 |
| JP2015500569A5 true JP2015500569A5 (https=) | 2015-11-26 |
| JP6027133B2 JP6027133B2 (ja) | 2016-11-16 |
Family
ID=47221534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014545898A Active JP6027133B2 (ja) | 2011-12-08 | 2012-10-11 | 集積回路（ｉｃ）チップのための放熱構造の設計 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9184108B2 (https=) |
| EP (1) | EP2789009B1 (https=) |
| JP (1) | JP6027133B2 (https=) |
| CN (1) | CN103959462B (https=) |
| TW (1) | TWI557858B (https=) |
| WO (1) | WO2013085618A1 (https=) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2914071A1 (en) * | 2014-02-28 | 2015-09-02 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Heat spreader in multilayer build ups |
| US9818669B2 (en) * | 2014-08-06 | 2017-11-14 | Honeywell International Inc. | Printed circuit board assembly including conductive heat transfer |
| JP6409556B2 (ja) * | 2014-12-19 | 2018-10-24 | 富士通株式会社 | 冷却機構付き基板及び電子機器 |
| US9622380B1 (en) * | 2015-09-30 | 2017-04-11 | Toyota Motor Engineering & Manufacturing North America, Inc. | Two-phase jet impingement cooling devices and electronic device assemblies incorporating the same |
| US10085362B2 (en) * | 2016-09-30 | 2018-09-25 | International Business Machines Corporation | Cold plate device for a two-phase cooling system |
| JP6735664B2 (ja) * | 2016-12-28 | 2020-08-05 | 昭和電工株式会社 | 液冷式冷却装置用放熱器およびその製造方法 |
| CN109950250B (zh) | 2017-12-20 | 2022-03-01 | 晟碟信息科技（上海）有限公司 | 具有矩阵冷却的数据中心3d固态驱动 |
| US10840167B2 (en) * | 2018-11-19 | 2020-11-17 | Advanced Micro Devices, Inc. | Integrated heat spreader with configurable heat fins |
| US11640930B2 (en) | 2019-09-05 | 2023-05-02 | Mediatek Inc. | Semiconductor package having liquid-cooling lid |
| CN111341741A (zh) * | 2020-03-17 | 2020-06-26 | 中国科学院微电子研究所 | 一种提高散热能力的功率器件封装结构及封装方法 |
| US12315782B2 (en) | 2020-05-20 | 2025-05-27 | Google Llc | Spring loaded compliant coolant distribution manifold for direct liquid cooled modules |
| CN215956917U (zh) * | 2020-10-29 | 2022-03-04 | 春鸿电子科技(重庆)有限公司 | 液冷散热装置 |
| TWI822094B (zh) * | 2022-06-08 | 2023-11-11 | 力晶積成電子製造股份有限公司 | 半導體結構的製造方法 |
| US12191233B2 (en) | 2022-07-28 | 2025-01-07 | Adeia Semiconductor Bonding Technologies Inc. | Embedded cooling systems and methods of manufacturing embedded cooling systems |
| CN115274588B (zh) * | 2022-08-01 | 2025-08-08 | 九识(苏州)智能科技有限公司 | 一种半导体器件及其制作方法 |
| US20240128149A1 (en) * | 2022-10-13 | 2024-04-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cooling interface region for a semiconductor die package |
| KR20240097562A (ko) * | 2022-12-20 | 2024-06-27 | 삼성전자주식회사 | 냉각 구조를 갖는 반도체 장치 |
| US12261099B2 (en) | 2022-12-23 | 2025-03-25 | Adeia Semiconductor Bonding Technologies Inc. | Embedded cooling systems with coolant channel for device packaging |
| CN120457540A (zh) | 2022-12-29 | 2025-08-08 | 美商艾德亚半导体接合科技有限公司 | 用于先进设备封装体的嵌入式冷却组件及其制造方法 |
| CN120513517A (zh) | 2022-12-31 | 2025-08-19 | 美商艾德亚半导体接合科技有限公司 | 嵌入式液体冷却 |
| US12341083B2 (en) | 2023-02-08 | 2025-06-24 | Adeia Semiconductor Bonding Technologies Inc. | Electronic device cooling structures bonded to semiconductor elements |
| US12176263B2 (en) | 2023-03-31 | 2024-12-24 | Adeia Semiconductor Bonding Technologies Inc. | Integrated cooling assembly including coolant channel on the backside semiconductor device |
| US12191234B2 (en) | 2023-05-17 | 2025-01-07 | Adeia Semiconductor Bonding Technologies Inc. | Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same |
| US12191235B2 (en) | 2023-05-17 | 2025-01-07 | Adeia Semiconductor Bonding Technologies Inc. | Integrated cooling assemblies including signal redistribution and methods of manufacturing the same |
| WO2024245523A1 (en) * | 2023-05-26 | 2024-12-05 | Huawei Digital Power Technologies Co., Ltd. | Mold free electric power module with heat conductive electrically insulating coating |
| TWI896188B (zh) * | 2023-07-24 | 2025-09-01 | 智惠創富股份有限公司 | 液冷散熱器 |
| US12610819B2 (en) | 2023-12-21 | 2026-04-21 | Adeia Semiconductor Bonding Technologies Inc. | Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same |
| US12283490B1 (en) | 2023-12-21 | 2025-04-22 | Adeia Semiconductor Bonding Technologies Inc. | Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same |
| US12368087B2 (en) * | 2023-12-26 | 2025-07-22 | Adeia Semiconductor Bonding Technologies Inc. | Embedded cooling systems for advanced device packaging and methods of manufacturing the same |
| US12525506B2 (en) | 2024-02-07 | 2026-01-13 | Adeia Semiconductor Bonding Technologies Inc. | Embedded cooling systems for advanced device packaging and methods of manufacturing the same |
| US12322677B1 (en) | 2024-02-07 | 2025-06-03 | Adeia Semiconductor Bonding Technologies Inc. | Fluid channel geometry optimizations to improve cooling efficiency |
| US12336141B1 (en) | 2024-03-29 | 2025-06-17 | Adeia Semiconductor Bonding Technologies Inc. | Cold plate cavity designs for improved thermal performance |
| US12532432B2 (en) | 2024-03-29 | 2026-01-20 | Adeia Semiconductor Bonding Technologies Inc. | Hotspot mitigation in fluid cooling |
| US12176264B1 (en) | 2024-03-29 | 2024-12-24 | Adeia Semiconductor Bonding Technologies Inc. | Manifold designs for embedded liquid cooling in a package |
| US12500138B2 (en) | 2024-04-17 | 2025-12-16 | Adeia Semiconductor Bonding Technologies Inc. | Cooling channel shape with substantially constant cross sectional area |
| US12266545B1 (en) | 2024-05-24 | 2025-04-01 | Adeia Semiconductor Bonding Technologies Inc. | Structures and methods for integrated cold plate in XPUs and memory |
| US12412808B1 (en) | 2024-12-20 | 2025-09-09 | Adeia Semiconductor Bonding Technologies Inc. | Cold plate and manifold integration for high reliability |
| US12513855B1 (en) | 2025-03-07 | 2025-12-30 | Adeia Semiconductor Bonding Technologies Inc. | Integrated cooling assembly with upper and lower channels |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4450472A (en) * | 1981-03-02 | 1984-05-22 | The Board Of Trustees Of The Leland Stanford Junior University | Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing coolant chambers and microscopic channels |
| US4620216A (en) * | 1983-04-29 | 1986-10-28 | International Business Machines Corporation | Unitary slotted heat sink for semiconductor packages |
| US4765397A (en) * | 1986-11-28 | 1988-08-23 | International Business Machines Corp. | Immersion cooled circuit module with improved fins |
| US5077601A (en) | 1988-09-09 | 1991-12-31 | Hitachi, Ltd. | Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system |
| US5224538A (en) | 1991-11-01 | 1993-07-06 | Jacoby John H | Dimpled heat transfer surface and method of making same |
| JPH06252300A (ja) * | 1992-12-28 | 1994-09-09 | Hitachi Ltd | 冷却装置を備えた集積回路チップ及びその製造方法 |
| JPH06244328A (ja) * | 1993-02-19 | 1994-09-02 | Fujitsu Ltd | ヒートシンク |
| JP3236137B2 (ja) * | 1993-07-30 | 2001-12-10 | 富士通株式会社 | 半導体素子冷却装置 |
| GB2296132B (en) | 1994-12-12 | 1999-02-24 | Siemens Plessey Electronic | Improvements in or relating to cooling systems |
| US5957194A (en) * | 1996-06-27 | 1999-09-28 | Advanced Thermal Solutions, Inc. | Plate fin heat exchanger having fluid control means |
| US6026895A (en) | 1998-02-06 | 2000-02-22 | Fujitsu Limited | Flexible foil finned heatsink structure and method of making same |
| GB2358243B (en) | 1999-11-24 | 2004-03-31 | 3Com Corp | Thermally conductive moulded heat sink |
| JP4043986B2 (ja) * | 2003-03-31 | 2008-02-06 | 古河電気工業株式会社 | 放熱フィンを備えたヒートシンクおよび放熱フィンの固定方法 |
| GB2407375B (en) * | 2003-10-22 | 2006-06-28 | Motorola Inc | Heat sinks |
| US7271034B2 (en) * | 2004-06-15 | 2007-09-18 | International Business Machines Corporation | Semiconductor device with a high thermal dissipation efficiency |
| US7442882B2 (en) * | 2006-05-08 | 2008-10-28 | International Business Machines Corporation | 3D checkerboard perforation pattern for increased shielding effectiveness |
| US7755185B2 (en) * | 2006-09-29 | 2010-07-13 | Infineon Technologies Ag | Arrangement for cooling a power semiconductor module |
| CN101368713B (zh) * | 2007-08-17 | 2010-11-10 | 富准精密工业(深圳)有限公司 | 散热器 |
| JP2009099740A (ja) * | 2007-10-16 | 2009-05-07 | Furukawa Electric Co Ltd:The | 筐体の冷却装置 |
| US7731079B2 (en) * | 2008-06-20 | 2010-06-08 | International Business Machines Corporation | Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled |
| US20100002392A1 (en) * | 2008-07-07 | 2010-01-07 | I-Ming Liu | Assembled Heat Sink Structure |
| US8054629B2 (en) * | 2008-09-30 | 2011-11-08 | Intel Corporation | Microfins for cooling an ultramobile device |
| US7961469B2 (en) | 2009-03-31 | 2011-06-14 | Apple Inc. | Method and apparatus for distributing a thermal interface material |
| JP5718814B2 (ja) * | 2009-08-07 | 2015-05-13 | 株式会社Uacj | ヒートシンク |
-
2011
- 2011-12-08 US US13/314,995 patent/US9184108B2/en active Active
-
2012
- 2012-10-11 WO PCT/US2012/059819 patent/WO2013085618A1/en not_active Ceased
- 2012-10-11 JP JP2014545898A patent/JP6027133B2/ja active Active
- 2012-10-11 EP EP12790708.7A patent/EP2789009B1/en active Active
- 2012-10-11 CN CN201280058629.0A patent/CN103959462B/zh active Active
- 2012-10-30 TW TW101140154A patent/TWI557858B/zh active
-
2015
- 2015-08-17 US US14/828,411 patent/US9355932B2/en active Active
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