TWI557858B - 用於積體電路（ｉｃ）晶片之散熱結構 - Google Patents

用於積體電路（ｉｃ）晶片之散熱結構 Download PDF

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Publication number
TWI557858B
TWI557858B TW101140154A TW101140154A TWI557858B TW I557858 B TWI557858 B TW I557858B TW 101140154 A TW101140154 A TW 101140154A TW 101140154 A TW101140154 A TW 101140154A TW I557858 B TWI557858 B TW I557858B
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TW
Taiwan
Prior art keywords
heat
heat dissipation
die
heat dissipating
beams
Prior art date
Application number
TW101140154A
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English (en)
Chinese (zh)
Other versions
TW201334131A (zh
Inventor
西夏沙雅 安奇瑞迪
大衛 柯普藍
Original Assignee
奧瑞可國際公司
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Filing date
Publication date
Application filed by 奧瑞可國際公司 filed Critical 奧瑞可國際公司
Publication of TW201334131A publication Critical patent/TW201334131A/zh
Application granted granted Critical
Publication of TWI557858B publication Critical patent/TWI557858B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/30—Arrangements for thermal protection or thermal control wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW101140154A 2011-12-08 2012-10-30 用於積體電路（ｉｃ）晶片之散熱結構 TWI557858B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/314,995 US9184108B2 (en) 2011-12-08 2011-12-08 Heat dissipation structure for an integrated circuit (IC) chip

Publications (2)

Publication Number Publication Date
TW201334131A TW201334131A (zh) 2013-08-16
TWI557858B true TWI557858B (zh) 2016-11-11

Family

ID=47221534

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101140154A TWI557858B (zh) 2011-12-08 2012-10-30 用於積體電路（ｉｃ）晶片之散熱結構

Country Status (6)

Country Link
US (2) US9184108B2 (https=)
EP (1) EP2789009B1 (https=)
JP (1) JP6027133B2 (https=)
CN (1) CN103959462B (https=)
TW (1) TWI557858B (https=)
WO (1) WO2013085618A1 (https=)

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US10085362B2 (en) * 2016-09-30 2018-09-25 International Business Machines Corporation Cold plate device for a two-phase cooling system
JP6735664B2 (ja) * 2016-12-28 2020-08-05 昭和電工株式会社 液冷式冷却装置用放熱器およびその製造方法
CN109950250B (zh) 2017-12-20 2022-03-01 晟碟信息科技（上海）有限公司 具有矩阵冷却的数据中心3d固态驱动
US10840167B2 (en) * 2018-11-19 2020-11-17 Advanced Micro Devices, Inc. Integrated heat spreader with configurable heat fins
US11640930B2 (en) 2019-09-05 2023-05-02 Mediatek Inc. Semiconductor package having liquid-cooling lid
CN111341741A (zh) * 2020-03-17 2020-06-26 中国科学院微电子研究所 一种提高散热能力的功率器件封装结构及封装方法
US12315782B2 (en) 2020-05-20 2025-05-27 Google Llc Spring loaded compliant coolant distribution manifold for direct liquid cooled modules
CN215956917U (zh) * 2020-10-29 2022-03-04 春鸿电子科技(重庆)有限公司 液冷散热装置
TWI822094B (zh) * 2022-06-08 2023-11-11 力晶積成電子製造股份有限公司 半導體結構的製造方法
US12191233B2 (en) 2022-07-28 2025-01-07 Adeia Semiconductor Bonding Technologies Inc. Embedded cooling systems and methods of manufacturing embedded cooling systems
CN115274588B (zh) * 2022-08-01 2025-08-08 九识(苏州)智能科技有限公司 一种半导体器件及其制作方法
US20240128149A1 (en) * 2022-10-13 2024-04-18 Taiwan Semiconductor Manufacturing Company, Ltd. Cooling interface region for a semiconductor die package
KR20240097562A (ko) * 2022-12-20 2024-06-27 삼성전자주식회사 냉각 구조를 갖는 반도체 장치
US12261099B2 (en) 2022-12-23 2025-03-25 Adeia Semiconductor Bonding Technologies Inc. Embedded cooling systems with coolant channel for device packaging
CN120457540A (zh) 2022-12-29 2025-08-08 美商艾德亚半导体接合科技有限公司 用于先进设备封装体的嵌入式冷却组件及其制造方法
CN120513517A (zh) 2022-12-31 2025-08-19 美商艾德亚半导体接合科技有限公司 嵌入式液体冷却
US12341083B2 (en) 2023-02-08 2025-06-24 Adeia Semiconductor Bonding Technologies Inc. Electronic device cooling structures bonded to semiconductor elements
US12176263B2 (en) 2023-03-31 2024-12-24 Adeia Semiconductor Bonding Technologies Inc. Integrated cooling assembly including coolant channel on the backside semiconductor device
US12191234B2 (en) 2023-05-17 2025-01-07 Adeia Semiconductor Bonding Technologies Inc. Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same
US12191235B2 (en) 2023-05-17 2025-01-07 Adeia Semiconductor Bonding Technologies Inc. Integrated cooling assemblies including signal redistribution and methods of manufacturing the same
WO2024245523A1 (en) * 2023-05-26 2024-12-05 Huawei Digital Power Technologies Co., Ltd. Mold free electric power module with heat conductive electrically insulating coating
TWI896188B (zh) * 2023-07-24 2025-09-01 智惠創富股份有限公司 液冷散熱器
US12610819B2 (en) 2023-12-21 2026-04-21 Adeia Semiconductor Bonding Technologies Inc. Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same
US12283490B1 (en) 2023-12-21 2025-04-22 Adeia Semiconductor Bonding Technologies Inc. Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same
US12368087B2 (en) * 2023-12-26 2025-07-22 Adeia Semiconductor Bonding Technologies Inc. Embedded cooling systems for advanced device packaging and methods of manufacturing the same
US12525506B2 (en) 2024-02-07 2026-01-13 Adeia Semiconductor Bonding Technologies Inc. Embedded cooling systems for advanced device packaging and methods of manufacturing the same
US12322677B1 (en) 2024-02-07 2025-06-03 Adeia Semiconductor Bonding Technologies Inc. Fluid channel geometry optimizations to improve cooling efficiency
US12336141B1 (en) 2024-03-29 2025-06-17 Adeia Semiconductor Bonding Technologies Inc. Cold plate cavity designs for improved thermal performance
US12532432B2 (en) 2024-03-29 2026-01-20 Adeia Semiconductor Bonding Technologies Inc. Hotspot mitigation in fluid cooling
US12176264B1 (en) 2024-03-29 2024-12-24 Adeia Semiconductor Bonding Technologies Inc. Manifold designs for embedded liquid cooling in a package
US12500138B2 (en) 2024-04-17 2025-12-16 Adeia Semiconductor Bonding Technologies Inc. Cooling channel shape with substantially constant cross sectional area
US12266545B1 (en) 2024-05-24 2025-04-01 Adeia Semiconductor Bonding Technologies Inc. Structures and methods for integrated cold plate in XPUs and memory
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Also Published As

Publication number Publication date
US20130148305A1 (en) 2013-06-13
JP2015500569A (ja) 2015-01-05
WO2013085618A1 (en) 2013-06-13
CN103959462B (zh) 2018-01-19
US9355932B2 (en) 2016-05-31
EP2789009A1 (en) 2014-10-15
EP2789009B1 (en) 2017-03-22
TW201334131A (zh) 2013-08-16
US20150357260A1 (en) 2015-12-10
CN103959462A (zh) 2014-07-30
JP6027133B2 (ja) 2016-11-16
US9184108B2 (en) 2015-11-10

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