JP6027133B2 - 集積回路（ｉｃ）チップのための放熱構造の設計 - Google Patents

集積回路（ｉｃ）チップのための放熱構造の設計 Download PDF

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JP6027133B2
JP6027133B2 JP2014545898A JP2014545898A JP6027133B2 JP 6027133 B2 JP6027133 B2 JP 6027133B2 JP 2014545898 A JP2014545898 A JP 2014545898A JP 2014545898 A JP2014545898 A JP 2014545898A JP 6027133 B2 JP6027133 B2 JP 6027133B2
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die
plates
beams
heat dissipating
heat
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JP2015500569A (ja
JP2015500569A5 (https=
Inventor
アンキレッディ，セシャサイー・エス
コープランド，デビッド・ダブリュ
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オラクル・インターナショナル・コーポレイション
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/30—Arrangements for thermal protection or thermal control wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2014545898A 2011-12-08 2012-10-11 集積回路（ｉｃ）チップのための放熱構造の設計 Active JP6027133B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/314,995 US9184108B2 (en) 2011-12-08 2011-12-08 Heat dissipation structure for an integrated circuit (IC) chip
US13/314,995 2011-12-08
PCT/US2012/059819 WO2013085618A1 (en) 2011-12-08 2012-10-11 Design of a heat dissipation structure for an integrated circuit (ic) chip

Publications (3)

Publication Number Publication Date
JP2015500569A JP2015500569A (ja) 2015-01-05
JP2015500569A5 JP2015500569A5 (https=) 2015-11-26
JP6027133B2 true JP6027133B2 (ja) 2016-11-16

Family

ID=47221534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014545898A Active JP6027133B2 (ja) 2011-12-08 2012-10-11 集積回路（ｉｃ）チップのための放熱構造の設計

Country Status (6)

Country Link
US (2) US9184108B2 (https=)
EP (1) EP2789009B1 (https=)
JP (1) JP6027133B2 (https=)
CN (1) CN103959462B (https=)
TW (1) TWI557858B (https=)
WO (1) WO2013085618A1 (https=)

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US9622380B1 (en) * 2015-09-30 2017-04-11 Toyota Motor Engineering & Manufacturing North America, Inc. Two-phase jet impingement cooling devices and electronic device assemblies incorporating the same
US10085362B2 (en) * 2016-09-30 2018-09-25 International Business Machines Corporation Cold plate device for a two-phase cooling system
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CN109950250B (zh) 2017-12-20 2022-03-01 晟碟信息科技（上海）有限公司 具有矩阵冷却的数据中心3d固态驱动
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US12368087B2 (en) * 2023-12-26 2025-07-22 Adeia Semiconductor Bonding Technologies Inc. Embedded cooling systems for advanced device packaging and methods of manufacturing the same
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Also Published As

Publication number Publication date
US20130148305A1 (en) 2013-06-13
JP2015500569A (ja) 2015-01-05
WO2013085618A1 (en) 2013-06-13
CN103959462B (zh) 2018-01-19
US9355932B2 (en) 2016-05-31
EP2789009A1 (en) 2014-10-15
EP2789009B1 (en) 2017-03-22
TW201334131A (zh) 2013-08-16
US20150357260A1 (en) 2015-12-10
CN103959462A (zh) 2014-07-30
TWI557858B (zh) 2016-11-11
US9184108B2 (en) 2015-11-10

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