JP4993754B2 - Ｐｇａ型配線基板及びその製造方法 - Google Patents

Ｐｇａ型配線基板及びその製造方法 Download PDF

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Publication number
JP4993754B2
JP4993754B2 JP2008041441A JP2008041441A JP4993754B2 JP 4993754 B2 JP4993754 B2 JP 4993754B2 JP 2008041441 A JP2008041441 A JP 2008041441A JP 2008041441 A JP2008041441 A JP 2008041441A JP 4993754 B2 JP4993754 B2 JP 4993754B2
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JP
Japan
Prior art keywords
wiring board
pin
fixing plate
hole
pin fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008041441A
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English (en)
Japanese (ja)
Other versions
JP2009200313A (ja
JP2009200313A5 (enExample
Inventor
章夫 堀内
良和 平林
徳孝 松下
一宏 大島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2008041441A priority Critical patent/JP4993754B2/ja
Priority to US12/372,870 priority patent/US20090211798A1/en
Priority to KR1020090014481A priority patent/KR101521485B1/ko
Publication of JP2009200313A publication Critical patent/JP2009200313A/ja
Publication of JP2009200313A5 publication Critical patent/JP2009200313A5/ja
Application granted granted Critical
Publication of JP4993754B2 publication Critical patent/JP4993754B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H05K2201/10318—Surface mounted metallic pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2008041441A 2008-02-22 2008-02-22 Ｐｇａ型配線基板及びその製造方法 Active JP4993754B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008041441A JP4993754B2 (ja) 2008-02-22 2008-02-22 Ｐｇａ型配線基板及びその製造方法
US12/372,870 US20090211798A1 (en) 2008-02-22 2009-02-18 Pga type wiring board and method of manufacturing the same
KR1020090014481A KR101521485B1 (ko) 2008-02-22 2009-02-20 Ｐｇａ형 배선 기판 및 그 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008041441A JP4993754B2 (ja) 2008-02-22 2008-02-22 Ｐｇａ型配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2009200313A JP2009200313A (ja) 2009-09-03
JP2009200313A5 JP2009200313A5 (enExample) 2011-03-31
JP4993754B2 true JP4993754B2 (ja) 2012-08-08

Family

ID=40997206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008041441A Active JP4993754B2 (ja) 2008-02-22 2008-02-22 Ｐｇａ型配線基板及びその製造方法

Country Status (3)

Country Link
US (1) US20090211798A1 (enExample)
JP (1) JP4993754B2 (enExample)
KR (1) KR101521485B1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5290017B2 (ja) * 2008-03-28 2013-09-18 日本特殊陶業株式会社 多層配線基板及びその製造方法
JP5079646B2 (ja) * 2008-08-26 2012-11-21 新光電気工業株式会社 半導体パッケージ及びその製造方法と半導体装置
US20110147069A1 (en) * 2009-12-18 2011-06-23 International Business Machines Corporation Multi-tiered Circuit Board and Method of Manufacture
JP2012164965A (ja) * 2011-01-21 2012-08-30 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
JP2012169591A (ja) * 2011-01-24 2012-09-06 Ngk Spark Plug Co Ltd 多層配線基板
JP6008582B2 (ja) * 2012-05-28 2016-10-19 新光電気工業株式会社 半導体パッケージ、放熱板及びその製造方法
TW201432961A (zh) * 2013-02-05 2014-08-16 Lextar Electronics Corp 基板結構
CN106211629B (zh) * 2016-08-30 2018-10-02 无锡市同步电子制造有限公司 印刷电路板加工中进行高温焊接的方法
US11808787B2 (en) * 2020-08-28 2023-11-07 Unimicron Technology Corp. Probe card testing device

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01313969A (ja) * 1988-06-13 1989-12-19 Hitachi Ltd 半導体装置
US5103292A (en) * 1989-11-29 1992-04-07 Olin Corporation Metal pin grid array package
US5261157A (en) * 1991-01-22 1993-11-16 Olin Corporation Assembly of electronic packages by vacuum lamination
JP2658672B2 (ja) * 1991-10-11 1997-09-30 日本電気株式会社 Ｉ／ｏピンの修理構造および修理方法
JPH05183019A (ja) * 1991-12-27 1993-07-23 Hitachi Ltd 半導体装置およびその製造方法
US6835898B2 (en) * 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
JPH09102560A (ja) * 1995-10-05 1997-04-15 Sumitomo Kinzoku Electro Device:Kk 低温焼成セラミック基板の外部リードピン接合構造
JP3037885B2 (ja) * 1995-10-31 2000-05-08 日本特殊陶業株式会社 Ｐｇａ型電子部品用基板
JPH09213836A (ja) * 1996-02-07 1997-08-15 Sumitomo Kinzoku Electro Device:Kk 低温焼成セラミックパッケージ
US5952716A (en) * 1997-04-16 1999-09-14 International Business Machines Corporation Pin attach structure for an electronic package
JP4046854B2 (ja) * 1998-06-29 2008-02-13 イビデン株式会社 ピン付きプリント配線板の製造方法
JP2000058736A (ja) * 1998-08-07 2000-02-25 Sumitomo Kinzoku Electro Device:Kk 樹脂基板へのピン接続方法
US8035214B1 (en) * 1998-12-16 2011-10-11 Ibiden Co., Ltd. Conductive connecting pin for package substance
US20020019168A1 (en) * 1999-01-12 2002-02-14 Robert W. Hooley Pin array header with floating surface mount interconnects
US6217346B1 (en) * 1999-05-11 2001-04-17 Illinois Tool Works Inc. Solderless pin connection
US6830460B1 (en) * 1999-08-02 2004-12-14 Gryphics, Inc. Controlled compliance fine pitch interconnect
US6974765B2 (en) * 2001-09-27 2005-12-13 Intel Corporation Encapsulation of pin solder for maintaining accuracy in pin position
EP1486105B1 (en) * 2002-03-20 2009-09-30 Andrew LLC Interconnection pin/socket components for electrically connecting two circuit boards and method for mounting said components in a circuit board
JP4054269B2 (ja) * 2003-03-20 2008-02-27 Ｔｄｋ株式会社 電子部品の製造方法および電子部品
US7887899B2 (en) * 2005-08-25 2011-02-15 Sumitomo Electric Industries, Ltd. Anisotropic conductive sheet, production method thereof, connection method and inspection method
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Also Published As

Publication number Publication date
JP2009200313A (ja) 2009-09-03
US20090211798A1 (en) 2009-08-27
KR101521485B1 (ko) 2015-05-20
KR20090091070A (ko) 2009-08-26

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