JP4939184B2 - 液体吐出ヘッドの製造方法 - Google Patents

液体吐出ヘッドの製造方法 Download PDF

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Publication number
JP4939184B2
JP4939184B2 JP2006318358A JP2006318358A JP4939184B2 JP 4939184 B2 JP4939184 B2 JP 4939184B2 JP 2006318358 A JP2006318358 A JP 2006318358A JP 2006318358 A JP2006318358 A JP 2006318358A JP 4939184 B2 JP4939184 B2 JP 4939184B2
Authority
JP
Japan
Prior art keywords
sealing resin
film
element substrate
electrical connection
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006318358A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008120056A5 (enExample
JP2008120056A (ja
Inventor
淳司 安田
勝彦 高野
学 末岡
勝正 西川
成夫 竹中
稔明 広沢
健太 宇田川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2006318358A priority Critical patent/JP4939184B2/ja
Priority to US11/567,987 priority patent/US7533960B2/en
Priority to TW095146451A priority patent/TWI311526B/zh
Priority to KR1020060127902A priority patent/KR100872212B1/ko
Priority to CN2006101672904A priority patent/CN1982066B/zh
Publication of JP2008120056A publication Critical patent/JP2008120056A/ja
Publication of JP2008120056A5 publication Critical patent/JP2008120056A5/ja
Application granted granted Critical
Publication of JP4939184B2 publication Critical patent/JP4939184B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/20—Modules
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
JP2006318358A 2005-12-15 2006-11-27 液体吐出ヘッドの製造方法 Expired - Fee Related JP4939184B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006318358A JP4939184B2 (ja) 2005-12-15 2006-11-27 液体吐出ヘッドの製造方法
US11/567,987 US7533960B2 (en) 2005-12-15 2006-12-07 Liquid discharge head, and method of manufacturing liquid discharge head
TW095146451A TWI311526B (en) 2005-12-15 2006-12-12 Liquid discharge head, and method of manufacturing liquid discharge head
KR1020060127902A KR100872212B1 (ko) 2005-12-15 2006-12-14 액체 토출 헤드 및 액체 토출 헤드의 제조 방법
CN2006101672904A CN1982066B (zh) 2005-12-15 2006-12-15 液体排出头以及该液体排出头的制造方法

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2005361183 2005-12-15
JP2005361183 2005-12-15
JP2006066322 2006-03-10
JP2006066322 2006-03-10
JP2006283800 2006-10-18
JP2006283800 2006-10-18
JP2006318358A JP4939184B2 (ja) 2005-12-15 2006-11-27 液体吐出ヘッドの製造方法

Publications (3)

Publication Number Publication Date
JP2008120056A JP2008120056A (ja) 2008-05-29
JP2008120056A5 JP2008120056A5 (enExample) 2010-01-14
JP4939184B2 true JP4939184B2 (ja) 2012-05-23

Family

ID=38172929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006318358A Expired - Fee Related JP4939184B2 (ja) 2005-12-15 2006-11-27 液体吐出ヘッドの製造方法

Country Status (5)

Country Link
US (1) US7533960B2 (enExample)
JP (1) JP4939184B2 (enExample)
KR (1) KR100872212B1 (enExample)
CN (1) CN1982066B (enExample)
TW (1) TWI311526B (enExample)

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WO2006009235A1 (en) * 2004-07-22 2006-01-26 Canon Kabushiki Kaisha Ink jet recording head and recording apparatus
JP2009006552A (ja) * 2007-06-27 2009-01-15 Canon Inc インクジェット記録ヘッドおよびインクジェット記録装置
US8382231B2 (en) * 2007-11-30 2013-02-26 Canon Kabushiki Kaisha Inkjet print head and inkjet printing apparatus
US8579412B2 (en) * 2008-05-22 2013-11-12 Fujifilm Corporation Actuatable device with die and integrated circuit element
JP5197175B2 (ja) * 2008-06-16 2013-05-15 キヤノン株式会社 インクジェット記録ヘッドおよびその製造方法
JP2010023341A (ja) * 2008-07-18 2010-02-04 Canon Inc インクジェット記録ヘッド
JP5341497B2 (ja) * 2008-12-19 2013-11-13 キヤノン株式会社 液体吐出ヘッドおよびそれを用いた記録装置
JP5225132B2 (ja) 2009-02-06 2013-07-03 キヤノン株式会社 液体吐出ヘッドおよびインクジェット記録装置
DE102009013710A1 (de) * 2009-03-20 2010-09-23 Merck Patent Gmbh Polymere aus Mischungen mit Vinylether-Monomeren
JP5366659B2 (ja) * 2009-05-28 2013-12-11 キヤノン株式会社 液体吐出記録ヘッド
JP4841010B2 (ja) 2009-06-09 2011-12-21 キヤノン株式会社 インクジェット記録ヘッド
US8376518B2 (en) * 2009-06-16 2013-02-19 Canon Kabushiki Kaisha Liquid discharge head and method for manufacturing the same
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JP5631054B2 (ja) * 2010-05-12 2014-11-26 キヤノン株式会社 液体吐出ヘッドおよびその製造方法
JP5641788B2 (ja) * 2010-05-31 2014-12-17 キヤノン株式会社 液体吐出ヘッドおよび液体吐出ヘッドの製造方法
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JP5911264B2 (ja) * 2011-11-01 2016-04-27 キヤノン株式会社 液体吐出ヘッドの製造方法
CN105705336B (zh) 2013-10-28 2018-04-24 惠普发展公司，有限责任合伙企业 以低轮廓封装体封装键合线的方法
JP2015128852A (ja) 2014-01-07 2015-07-16 キヤノン株式会社 液体吐出ヘッドおよび液体吐出装置
JP6234255B2 (ja) * 2014-02-03 2017-11-22 キヤノン株式会社 液体吐出ヘッドの製造方法および液体吐出ヘッド
JP6614840B2 (ja) * 2015-07-23 2019-12-04 キヤノン株式会社 液体吐出ヘッドおよびその製造方法
JP6708392B2 (ja) * 2015-10-28 2020-06-10 キヤノン株式会社 記録ヘッド
JP6806464B2 (ja) 2016-05-30 2021-01-06 キヤノン株式会社 記録素子基板、液体吐出ヘッドおよび液体吐出装置
JP2018012199A (ja) * 2016-07-19 2018-01-25 エスアイアイ・プリンテック株式会社 液体噴射ヘッド及び液体噴射装置
JP6891033B2 (ja) * 2017-04-21 2021-06-18 キヤノン株式会社 液体吐出ヘッド
US10654269B2 (en) 2017-06-28 2020-05-19 Canon Kabushiki Kaisha Liquid ejection head
JP7053786B2 (ja) * 2017-07-26 2022-04-12 ヒューレット－パッカード デベロップメント カンパニー エル．ピー． ダイコンタクト形成物
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JP7191602B2 (ja) 2018-09-10 2022-12-19 キヤノン株式会社 液体吐出装置
WO2020117195A1 (en) 2018-12-03 2020-06-11 Hewlett-Packard Development Company, L.P. Logic circuitry
BR112021010044A2 (pt) 2018-12-03 2021-08-17 Hewlett-Packard Development Company, L.P. circuitos lógicos
CN113168457A (zh) 2018-12-03 2021-07-23 惠普发展公司，有限责任合伙企业 逻辑电路系统封装
US11338586B2 (en) 2018-12-03 2022-05-24 Hewlett-Packard Development Company, L.P. Logic circuitry
KR20210087978A (ko) 2018-12-03 2021-07-13 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 로직 회로
CN113165390A (zh) 2018-12-03 2021-07-23 惠普发展公司，有限责任合伙企业 逻辑电路系统封装
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JP2020116792A (ja) * 2019-01-22 2020-08-06 東芝テック株式会社 液体吐出ヘッド、及び液体吐出装置
JP7313884B2 (ja) * 2019-04-22 2023-07-25 キヤノン株式会社 液体吐出ヘッド及びその製造方法
JP7317627B2 (ja) * 2019-08-09 2023-07-31 キヤノン株式会社 液体吐出用ヘッド及び液体吐出装置
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JP7618503B2 (ja) * 2021-05-21 2025-01-21 キヤノン株式会社 液体吐出ヘッド
JP7769458B2 (ja) * 2021-11-11 2025-11-13 キヤノン株式会社 液体吐出ヘッドと液体吐出ヘッドの製造方法

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Also Published As

Publication number Publication date
TWI311526B (en) 2009-07-01
CN1982066B (zh) 2010-09-29
US7533960B2 (en) 2009-05-19
CN1982066A (zh) 2007-06-20
KR100872212B1 (ko) 2008-12-05
TW200730358A (en) 2007-08-16
JP2008120056A (ja) 2008-05-29
KR20070064278A (ko) 2007-06-20
US20070139469A1 (en) 2007-06-21

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