JP4939184B2 - 液体吐出ヘッドの製造方法 - Google Patents

液体吐出ヘッドの製造方法 Download PDF

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Publication number
JP4939184B2
JP4939184B2 JP2006318358A JP2006318358A JP4939184B2 JP 4939184 B2 JP4939184 B2 JP 4939184B2 JP 2006318358 A JP2006318358 A JP 2006318358A JP 2006318358 A JP2006318358 A JP 2006318358A JP 4939184 B2 JP4939184 B2 JP 4939184B2
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JP
Japan
Prior art keywords
sealing resin
film
element substrate
electrical connection
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006318358A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008120056A5 (enExample
JP2008120056A (ja
Inventor
淳司 安田
勝彦 高野
学 末岡
勝正 西川
成夫 竹中
稔明 広沢
健太 宇田川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2006318358A priority Critical patent/JP4939184B2/ja
Priority to US11/567,987 priority patent/US7533960B2/en
Priority to TW095146451A priority patent/TWI311526B/zh
Priority to KR1020060127902A priority patent/KR100872212B1/ko
Priority to CN2006101672904A priority patent/CN1982066B/zh
Publication of JP2008120056A publication Critical patent/JP2008120056A/ja
Publication of JP2008120056A5 publication Critical patent/JP2008120056A5/ja
Application granted granted Critical
Publication of JP4939184B2 publication Critical patent/JP4939184B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/20—Modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
JP2006318358A 2005-12-15 2006-11-27 液体吐出ヘッドの製造方法 Expired - Fee Related JP4939184B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006318358A JP4939184B2 (ja) 2005-12-15 2006-11-27 液体吐出ヘッドの製造方法
US11/567,987 US7533960B2 (en) 2005-12-15 2006-12-07 Liquid discharge head, and method of manufacturing liquid discharge head
TW095146451A TWI311526B (en) 2005-12-15 2006-12-12 Liquid discharge head, and method of manufacturing liquid discharge head
KR1020060127902A KR100872212B1 (ko) 2005-12-15 2006-12-14 액체 토출 헤드 및 액체 토출 헤드의 제조 방법
CN2006101672904A CN1982066B (zh) 2005-12-15 2006-12-15 液体排出头以及该液体排出头的制造方法

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2005361183 2005-12-15
JP2005361183 2005-12-15
JP2006066322 2006-03-10
JP2006066322 2006-03-10
JP2006283800 2006-10-18
JP2006283800 2006-10-18
JP2006318358A JP4939184B2 (ja) 2005-12-15 2006-11-27 液体吐出ヘッドの製造方法

Publications (3)

Publication Number Publication Date
JP2008120056A JP2008120056A (ja) 2008-05-29
JP2008120056A5 JP2008120056A5 (enExample) 2010-01-14
JP4939184B2 true JP4939184B2 (ja) 2012-05-23

Family

ID=38172929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006318358A Expired - Fee Related JP4939184B2 (ja) 2005-12-15 2006-11-27 液体吐出ヘッドの製造方法

Country Status (5)

Country Link
US (1) US7533960B2 (enExample)
JP (1) JP4939184B2 (enExample)
KR (1) KR100872212B1 (enExample)
CN (1) CN1982066B (enExample)
TW (1) TWI311526B (enExample)

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JP5341497B2 (ja) * 2008-12-19 2013-11-13 キヤノン株式会社 液体吐出ヘッドおよびそれを用いた記録装置
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JP7317627B2 (ja) * 2019-08-09 2023-07-31 キヤノン株式会社 液体吐出用ヘッド及び液体吐出装置
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Also Published As

Publication number Publication date
KR20070064278A (ko) 2007-06-20
TW200730358A (en) 2007-08-16
US7533960B2 (en) 2009-05-19
TWI311526B (en) 2009-07-01
US20070139469A1 (en) 2007-06-21
CN1982066B (zh) 2010-09-29
CN1982066A (zh) 2007-06-20
JP2008120056A (ja) 2008-05-29
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