CN1982066B - 液体排出头以及该液体排出头的制造方法 - Google Patents

液体排出头以及该液体排出头的制造方法 Download PDF

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Publication number
CN1982066B
CN1982066B CN2006101672904A CN200610167290A CN1982066B CN 1982066 B CN1982066 B CN 1982066B CN 2006101672904 A CN2006101672904 A CN 2006101672904A CN 200610167290 A CN200610167290 A CN 200610167290A CN 1982066 B CN1982066 B CN 1982066B
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CN
China
Prior art keywords
sealing resin
electrical connection
element substrate
recording element
recording
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006101672904A
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English (en)
Chinese (zh)
Other versions
CN1982066A (zh
Inventor
安田淳司
高野胜彦
末冈学
竹中成夫
西川胜正
宇田川健太
广泽稔明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN1982066A publication Critical patent/CN1982066A/zh
Application granted granted Critical
Publication of CN1982066B publication Critical patent/CN1982066B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/20—Modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
CN2006101672904A 2005-12-15 2006-12-15 液体排出头以及该液体排出头的制造方法 Expired - Fee Related CN1982066B (zh)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP2005361183 2005-12-15
JP2005-361183 2005-12-15
JP2005361183 2005-12-15
JP2006066322 2006-03-10
JP2006-066322 2006-03-10
JP2006066322 2006-03-10
JP2006283800 2006-10-18
JP2006-283800 2006-10-18
JP2006283800 2006-10-18
JP2006-318358 2006-11-27
JP2006318358 2006-11-27
JP2006318358A JP4939184B2 (ja) 2005-12-15 2006-11-27 液体吐出ヘッドの製造方法

Publications (2)

Publication Number Publication Date
CN1982066A CN1982066A (zh) 2007-06-20
CN1982066B true CN1982066B (zh) 2010-09-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006101672904A Expired - Fee Related CN1982066B (zh) 2005-12-15 2006-12-15 液体排出头以及该液体排出头的制造方法

Country Status (5)

Country Link
US (1) US7533960B2 (enExample)
JP (1) JP4939184B2 (enExample)
KR (1) KR100872212B1 (enExample)
CN (1) CN1982066B (enExample)
TW (1) TWI311526B (enExample)

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WO2006009235A1 (en) * 2004-07-22 2006-01-26 Canon Kabushiki Kaisha Ink jet recording head and recording apparatus
JP2009006552A (ja) * 2007-06-27 2009-01-15 Canon Inc インクジェット記録ヘッドおよびインクジェット記録装置
US8382231B2 (en) * 2007-11-30 2013-02-26 Canon Kabushiki Kaisha Inkjet print head and inkjet printing apparatus
EP2296897B1 (en) 2008-05-22 2022-05-04 FUJIFILM Corporation Actuatable device with die and integrated circuit element
JP5197175B2 (ja) * 2008-06-16 2013-05-15 キヤノン株式会社 インクジェット記録ヘッドおよびその製造方法
JP2010023341A (ja) * 2008-07-18 2010-02-04 Canon Inc インクジェット記録ヘッド
JP5341497B2 (ja) * 2008-12-19 2013-11-13 キヤノン株式会社 液体吐出ヘッドおよびそれを用いた記録装置
JP5225132B2 (ja) 2009-02-06 2013-07-03 キヤノン株式会社 液体吐出ヘッドおよびインクジェット記録装置
DE102009013710A1 (de) * 2009-03-20 2010-09-23 Merck Patent Gmbh Polymere aus Mischungen mit Vinylether-Monomeren
JP5366659B2 (ja) * 2009-05-28 2013-12-11 キヤノン株式会社 液体吐出記録ヘッド
JP4841010B2 (ja) 2009-06-09 2011-12-21 キヤノン株式会社 インクジェット記録ヘッド
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JP5451357B2 (ja) * 2009-12-14 2014-03-26 キヤノン株式会社 液体噴射記録ヘッドおよび液体噴射記録ヘッドの製造方法
JP5867985B2 (ja) * 2010-03-01 2016-02-24 キヤノン株式会社 記録ヘッド
JP5631054B2 (ja) * 2010-05-12 2014-11-26 キヤノン株式会社 液体吐出ヘッドおよびその製造方法
JP5641788B2 (ja) * 2010-05-31 2014-12-17 キヤノン株式会社 液体吐出ヘッドおよび液体吐出ヘッドの製造方法
JP5665385B2 (ja) * 2010-06-16 2015-02-04 キヤノン株式会社 インクジェット記録ヘッドおよびインクジェット記録ヘッドの製造方法
JP5679713B2 (ja) * 2010-07-07 2015-03-04 キヤノン株式会社 液体吐出ヘッド及び液体吐出ヘッドの製造方法
JP5858622B2 (ja) * 2011-02-10 2016-02-10 キヤノン株式会社 インクジェット記録装置
JP5911264B2 (ja) * 2011-11-01 2016-04-27 キヤノン株式会社 液体吐出ヘッドの製造方法
CN105705336B (zh) 2013-10-28 2018-04-24 惠普发展公司，有限责任合伙企业 以低轮廓封装体封装键合线的方法
JP2015128852A (ja) 2014-01-07 2015-07-16 キヤノン株式会社 液体吐出ヘッドおよび液体吐出装置
JP6234255B2 (ja) 2014-02-03 2017-11-22 キヤノン株式会社 液体吐出ヘッドの製造方法および液体吐出ヘッド
JP6614840B2 (ja) * 2015-07-23 2019-12-04 キヤノン株式会社 液体吐出ヘッドおよびその製造方法
JP6708392B2 (ja) * 2015-10-28 2020-06-10 キヤノン株式会社 記録ヘッド
JP6806464B2 (ja) 2016-05-30 2021-01-06 キヤノン株式会社 記録素子基板、液体吐出ヘッドおよび液体吐出装置
JP2018012199A (ja) * 2016-07-19 2018-01-25 エスアイアイ・プリンテック株式会社 液体噴射ヘッド及び液体噴射装置
JP6891033B2 (ja) * 2017-04-21 2021-06-18 キヤノン株式会社 液体吐出ヘッド
US10654269B2 (en) 2017-06-28 2020-05-19 Canon Kabushiki Kaisha Liquid ejection head
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SE543901C2 (en) * 2017-08-10 2021-09-21 Showa Denko Materials Co Ltd Semiconductor device and method for producing same
JP7191602B2 (ja) 2018-09-10 2022-12-19 キヤノン株式会社 液体吐出装置
JP6995252B1 (ja) 2018-12-03 2022-02-09 ヒューレット－パッカード デベロップメント カンパニー エル．ピー． 論理回路
CN113165385B (zh) 2018-12-03 2022-10-14 惠普发展公司，有限责任合伙企业 逻辑电路系统
EP3688667A1 (en) 2018-12-03 2020-08-05 Hewlett-Packard Development Company, L.P. Logic circuitry
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US11338586B2 (en) 2018-12-03 2022-05-24 Hewlett-Packard Development Company, L.P. Logic circuitry
KR20210086701A (ko) 2018-12-03 2021-07-08 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 로직 회로
DK3681723T3 (da) 2018-12-03 2021-08-30 Hewlett Packard Development Co Logisk kredsløb
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US10894423B2 (en) 2018-12-03 2021-01-19 Hewlett-Packard Development Company, L.P. Logic circuitry
US11331924B2 (en) 2018-12-03 2022-05-17 Hewlett-Packard Development Company, L.P. Logic circuitry package
JP2020116792A (ja) * 2019-01-22 2020-08-06 東芝テック株式会社 液体吐出ヘッド、及び液体吐出装置
JP7313884B2 (ja) * 2019-04-22 2023-07-25 キヤノン株式会社 液体吐出ヘッド及びその製造方法
JP7317627B2 (ja) * 2019-08-09 2023-07-31 キヤノン株式会社 液体吐出用ヘッド及び液体吐出装置
US11407229B2 (en) 2019-10-25 2022-08-09 Hewlett-Packard Development Company, L.P. Logic circuitry package
WO2021221678A1 (en) 2020-04-30 2021-11-04 Hewlett-Packard Development Company, L.P. Logic circuitry package for print apparatus
JP7614793B2 (ja) * 2020-11-06 2025-01-16 キヤノン株式会社 液体吐出ヘッド
JP7618503B2 (ja) * 2021-05-21 2025-01-21 キヤノン株式会社 液体吐出ヘッド
JP7769458B2 (ja) * 2021-11-11 2025-11-13 キヤノン株式会社 液体吐出ヘッドと液体吐出ヘッドの製造方法

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CN101001754A (zh) * 2004-08-06 2007-07-18 惠普开发有限公司 电接触密封

Also Published As

Publication number Publication date
JP2008120056A (ja) 2008-05-29
TWI311526B (en) 2009-07-01
KR20070064278A (ko) 2007-06-20
US7533960B2 (en) 2009-05-19
TW200730358A (en) 2007-08-16
US20070139469A1 (en) 2007-06-21
CN1982066A (zh) 2007-06-20
JP4939184B2 (ja) 2012-05-23
KR100872212B1 (ko) 2008-12-05

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