JP4936730B2 - 減圧容器および減圧処理装置 - Google Patents

減圧容器および減圧処理装置 Download PDF

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Publication number
JP4936730B2
JP4936730B2 JP2006007330A JP2006007330A JP4936730B2 JP 4936730 B2 JP4936730 B2 JP 4936730B2 JP 2006007330 A JP2006007330 A JP 2006007330A JP 2006007330 A JP2006007330 A JP 2006007330A JP 4936730 B2 JP4936730 B2 JP 4936730B2
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JP
Japan
Prior art keywords
decompression
substrate
container
vacuum
spacer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006007330A
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English (en)
Japanese (ja)
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JP2007187289A (ja
Inventor
洋平 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2006007330A priority Critical patent/JP4936730B2/ja
Priority to KR1020070004440A priority patent/KR100827859B1/ko
Priority to TW096101499A priority patent/TWI397958B/zh
Priority to CNB2007100042023A priority patent/CN100573817C/zh
Publication of JP2007187289A publication Critical patent/JP2007187289A/ja
Application granted granted Critical
Publication of JP4936730B2 publication Critical patent/JP4936730B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/022—Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube
    • H01J2237/0225—Detecting or monitoring foreign particles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
  • Gasket Seals (AREA)
  • Pressure Vessels And Lids Thereof (AREA)
  • Furnace Details (AREA)
JP2006007330A 2006-01-16 2006-01-16 減圧容器および減圧処理装置 Expired - Fee Related JP4936730B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006007330A JP4936730B2 (ja) 2006-01-16 2006-01-16 減圧容器および減圧処理装置
KR1020070004440A KR100827859B1 (ko) 2006-01-16 2007-01-15 감압 용기 및 감압 처리 장치
TW096101499A TWI397958B (zh) 2006-01-16 2007-01-15 Decompression vessel and decompression treatment device
CNB2007100042023A CN100573817C (zh) 2006-01-16 2007-01-16 减压容器和减压处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006007330A JP4936730B2 (ja) 2006-01-16 2006-01-16 減圧容器および減圧処理装置

Publications (2)

Publication Number Publication Date
JP2007187289A JP2007187289A (ja) 2007-07-26
JP4936730B2 true JP4936730B2 (ja) 2012-05-23

Family

ID=38342590

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006007330A Expired - Fee Related JP4936730B2 (ja) 2006-01-16 2006-01-16 減圧容器および減圧処理装置

Country Status (4)

Country Link
JP (1) JP4936730B2 (zh)
KR (1) KR100827859B1 (zh)
CN (1) CN100573817C (zh)
TW (1) TWI397958B (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007277667A (ja) * 2006-04-10 2007-10-25 Sumitomo Heavy Ind Ltd 真空チャンバ及び該真空チャンバを有する基板処理装置
JP4985973B2 (ja) * 2007-12-11 2012-07-25 Ｎｏｋ株式会社 密封構造
US8191933B2 (en) * 2008-07-16 2012-06-05 General Electric Company Extrusion resistant gasket face seal
JP5190387B2 (ja) * 2009-01-16 2013-04-24 東京エレクトロン株式会社 真空装置及び基板処理装置
JP2011084788A (ja) * 2009-10-16 2011-04-28 Sharp Corp ゲートバルブ、真空処理装置、及び半導体装置の製造方法
CN102753727A (zh) * 2010-03-31 2012-10-24 东京毅力科创株式会社 等离子体处理装置和等离子体处理方法
JP2012099517A (ja) 2010-10-29 2012-05-24 Sony Corp 半導体装置及び半導体装置の製造方法
JP2013197513A (ja) * 2012-03-22 2013-09-30 Tosoh Corp 電子材料の保管・運搬用ケース
KR101383668B1 (ko) * 2012-04-27 2014-04-10 주식회사 테라세미콘 실링부재 및 이를 사용한 기판 처리 장치
CN102854254A (zh) * 2012-10-11 2013-01-02 西安永电电气有限责任公司 一种igbt超声检测工装
CN102943879A (zh) * 2012-10-25 2013-02-27 无锡市欣田机械有限公司 一种化学原料反应锅的密封系统
KR101369404B1 (ko) * 2013-10-14 2014-03-06 주식회사 씰테크 반도체 설비용 실링부재
JP6734918B2 (ja) 2016-04-28 2020-08-05 ギガフォトン株式会社 タンク、ターゲット生成装置、及び、極端紫外光生成装置
KR102538114B1 (ko) * 2017-11-07 2023-05-31 삼성전자주식회사 기판 처리 장치
JP2021080889A (ja) * 2019-11-20 2021-05-27 愛三工業株式会社 Ｅｇｒバルブ装置
KR102480392B1 (ko) * 2019-12-30 2022-12-26 세메스 주식회사 기판 처리 장치 및 방법
WO2024019902A1 (en) * 2022-07-18 2024-01-25 Lam Research Corporation Wedge seal for efem frame and panel seams

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0357190U (zh) * 1989-10-06 1991-05-31
JPH0450555A (ja) * 1990-06-15 1992-02-19 Okawara Mfg Co Ltd 真空容器等の密封構造
JP2929340B2 (ja) * 1991-09-20 1999-08-03 日本ラインツ株式会社 ガスケット
FR2712059B1 (fr) * 1993-11-03 1996-02-02 Hutchinson Joint, son procédé de fabrication, et procédé de scellement hermétique mettant en Óoeuvre un tel joint.
JP3165322B2 (ja) * 1994-03-28 2001-05-14 東京エレクトロン株式会社 減圧容器
JP3319671B2 (ja) * 1995-03-17 2002-09-03 株式会社日阪製作所 気密性収容器のシール構造
JPH1047483A (ja) * 1996-08-06 1998-02-20 Haniyuuda Tekko:Kk 圧力容器のシール構造
JPH1163236A (ja) * 1997-08-11 1999-03-05 Advanced Display:Kk 真空装置およびこれを備えた成膜装置
JP2001227643A (ja) * 2000-02-14 2001-08-24 Tsukishima Kikai Co Ltd 真空容器のシール構造および真空容器シール用ガスケット
JP2002022019A (ja) * 2000-07-06 2002-01-23 Mitsubishi Cable Ind Ltd シール材料、それを用いたシール部材およびそれを用いたシール
JP2001355735A (ja) * 2000-06-14 2001-12-26 Mitsubishi Cable Ind Ltd スイベルジョイント用シール
JP3906753B2 (ja) 2002-07-01 2007-04-18 株式会社日立プラントテクノロジー 基板組立て装置
JP2004211845A (ja) * 2003-01-07 2004-07-29 Sumitomo Rubber Ind Ltd ガス用シール材
JP3694691B2 (ja) 2003-01-29 2005-09-14 株式会社 日立インダストリイズ 大型基板の組立装置及び組立方法
JP2004360717A (ja) * 2003-06-02 2004-12-24 Nok Corp ガスケット
JP2005048790A (ja) * 2003-07-29 2005-02-24 Tm T & D Kk 圧力容器
JP2005214276A (ja) * 2004-01-29 2005-08-11 Toyota Industries Corp シール装置
KR100640557B1 (ko) 2004-06-17 2006-10-31 주식회사 에이디피엔지니어링 평판표시소자 제조장치
JP4601993B2 (ja) * 2004-05-18 2010-12-22 三菱電線工業株式会社 シール材

Also Published As

Publication number Publication date
JP2007187289A (ja) 2007-07-26
CN100573817C (zh) 2009-12-23
TW200731401A (en) 2007-08-16
KR20070076491A (ko) 2007-07-24
TWI397958B (zh) 2013-06-01
CN101005013A (zh) 2007-07-25
KR100827859B1 (ko) 2008-05-07

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