TW200731401A - Pressure reduction vessel and pressure reduction processing apparatus - Google Patents

Pressure reduction vessel and pressure reduction processing apparatus

Info

Publication number
TW200731401A
TW200731401A TW096101499A TW96101499A TW200731401A TW 200731401 A TW200731401 A TW 200731401A TW 096101499 A TW096101499 A TW 096101499A TW 96101499 A TW96101499 A TW 96101499A TW 200731401 A TW200731401 A TW 200731401A
Authority
TW
Taiwan
Prior art keywords
vessel
pressure reduction
vessel body
processing apparatus
groove
Prior art date
Application number
TW096101499A
Other languages
Chinese (zh)
Other versions
TWI397958B (en
Inventor
Youhei Yamada
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200731401A publication Critical patent/TW200731401A/en
Application granted granted Critical
Publication of TWI397958B publication Critical patent/TWI397958B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/022—Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube
    • H01J2237/0225—Detecting or monitoring foreign particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
  • Gasket Seals (AREA)
  • Pressure Vessels And Lids Thereof (AREA)
  • Furnace Details (AREA)

Abstract

Problem to be solved: The invention provides a decompression vessel and decompression processing apparatus for certainly preventing particles generated by vessel deformation. Solution: plugging an O-shape ring for sealing in a groove 26 on the top surface of a vessel body 21, which is surrounding around inner space of a locking chamber 20. In the outside, one part of the interval piece 91 with L cross section is plugged into the groove 26 that inner side of L shape is placed closely to inner side of the groove 26 and the top surface 21a of the vessel body 21. Through the interval piece 91, the vessel body 21 is separately from the top plate 22 such that even the locking chamber is decompressed to a high vacuum status and the top plate 22 is bending, inner corner 21b of the vessel body 21 still not contacts the top plate 22.
TW096101499A 2006-01-16 2007-01-15 Decompression vessel and decompression treatment device TWI397958B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006007330A JP4936730B2 (en) 2006-01-16 2006-01-16 Vacuum container and vacuum processing apparatus

Publications (2)

Publication Number Publication Date
TW200731401A true TW200731401A (en) 2007-08-16
TWI397958B TWI397958B (en) 2013-06-01

Family

ID=38342590

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096101499A TWI397958B (en) 2006-01-16 2007-01-15 Decompression vessel and decompression treatment device

Country Status (4)

Country Link
JP (1) JP4936730B2 (en)
KR (1) KR100827859B1 (en)
CN (1) CN100573817C (en)
TW (1) TWI397958B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10373955B2 (en) 2010-10-29 2019-08-06 Sony Corporation Semiconductor device with FIN transistors and manufacturing method of such semiconductor device

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JP2007277667A (en) * 2006-04-10 2007-10-25 Sumitomo Heavy Ind Ltd Vacuum chamber, and substrate treatment apparatus having the same
JP4985973B2 (en) * 2007-12-11 2012-07-25 Ｎｏｋ株式会社 Sealing structure
US8191933B2 (en) * 2008-07-16 2012-06-05 General Electric Company Extrusion resistant gasket face seal
JP5190387B2 (en) * 2009-01-16 2013-04-24 東京エレクトロン株式会社 Vacuum apparatus and substrate processing apparatus
JP2011084788A (en) * 2009-10-16 2011-04-28 Sharp Corp Gate valve, vacuum treatment apparatus, and method for producing semiconductor device
KR101389247B1 (en) * 2010-03-31 2014-04-24 도쿄엘렉트론가부시키가이샤 Plasma processing device and plasma processing method
JP2013197513A (en) * 2012-03-22 2013-09-30 Tosoh Corp Storage and carriage case of electronic material
KR101383668B1 (en) * 2012-04-27 2014-04-10 주식회사 테라세미콘 Sealring member and apparatus for processing substrate using the same
CN102854254A (en) * 2012-10-11 2013-01-02 西安永电电气有限责任公司 Insulated gate bipolar translator (IGBT) ultrasonic detection tool
CN102943879A (en) * 2012-10-25 2013-02-27 无锡市欣田机械有限公司 Sealing system of chemical raw material reaction pot
KR101369404B1 (en) * 2013-10-14 2014-03-06 주식회사 씰테크 Sealing member for semiconductor equipment
JP6734918B2 (en) 2016-04-28 2020-08-05 ギガフォトン株式会社 Tank, target generator, and extreme ultraviolet light generator
KR102538114B1 (en) * 2017-11-07 2023-05-31 삼성전자주식회사 method for treating substrate
JP2021080889A (en) * 2019-11-20 2021-05-27 愛三工業株式会社 EGR valve device
KR102480392B1 (en) * 2019-12-30 2022-12-26 세메스 주식회사 Apparatus and method for treating substrate
WO2024019902A1 (en) * 2022-07-18 2024-01-25 Lam Research Corporation Wedge seal for efem frame and panel seams

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JPH0450555A (en) * 1990-06-15 1992-02-19 Okawara Mfg Co Ltd Sealing structure for vacuum vessel, etc.
JP2929340B2 (en) * 1991-09-20 1999-08-03 日本ラインツ株式会社 gasket
FR2712059B1 (en) * 1993-11-03 1996-02-02 Hutchinson Joint, its manufacturing process, and hermetic sealing method using such a joint.
JP3165322B2 (en) * 1994-03-28 2001-05-14 東京エレクトロン株式会社 Decompression container
JP3319671B2 (en) * 1995-03-17 2002-09-03 株式会社日阪製作所 Seal structure of airtight container
JPH1047483A (en) * 1996-08-06 1998-02-20 Haniyuuda Tekko:Kk Pressure-vessel seal structure
JPH1163236A (en) * 1997-08-11 1999-03-05 Advanced Display:Kk Vacuum device and film forming device provided with the same
JP2001227643A (en) * 2000-02-14 2001-08-24 Tsukishima Kikai Co Ltd Seal structure for vacuum container, and gasket for sealing vacuum container
JP2001355735A (en) * 2000-06-14 2001-12-26 Mitsubishi Cable Ind Ltd Seal for swivel joint
JP2002022019A (en) * 2000-07-06 2002-01-23 Mitsubishi Cable Ind Ltd Seal material, seal member using the same, and seal using the seal member
JP3906753B2 (en) 2002-07-01 2007-04-18 株式会社日立プラントテクノロジー Board assembly equipment
JP2004211845A (en) * 2003-01-07 2004-07-29 Sumitomo Rubber Ind Ltd Seal material for gas
JP3694691B2 (en) 2003-01-29 2005-09-14 株式会社 日立インダストリイズ Large substrate assembly apparatus and assembly method
JP2004360717A (en) * 2003-06-02 2004-12-24 Nok Corp Gasket
JP2005048790A (en) * 2003-07-29 2005-02-24 Tm T & D Kk Pressure vessel
JP2005214276A (en) * 2004-01-29 2005-08-11 Toyota Industries Corp Sealing device
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10373955B2 (en) 2010-10-29 2019-08-06 Sony Corporation Semiconductor device with FIN transistors and manufacturing method of such semiconductor device
US10811416B2 (en) 2010-10-29 2020-10-20 Sony Corporation Semiconductor device with fin transistors and manufacturing method of such semiconductor device
US11121133B2 (en) 2010-10-29 2021-09-14 Sony Corporation Semiconductor device with fin transistors and manufacturing method of such semiconductor device
US11824057B2 (en) 2010-10-29 2023-11-21 Sony Corporation Semiconductor device with fin-type field effect transistor

Also Published As

Publication number Publication date
KR100827859B1 (en) 2008-05-07
KR20070076491A (en) 2007-07-24
TWI397958B (en) 2013-06-01
CN100573817C (en) 2009-12-23
CN101005013A (en) 2007-07-25
JP2007187289A (en) 2007-07-26
JP4936730B2 (en) 2012-05-23

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees