JP5190387B2 - Vacuum apparatus and substrate processing apparatus - Google Patents

Vacuum apparatus and substrate processing apparatus Download PDF

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JP5190387B2
JP5190387B2 JP2009007719A JP2009007719A JP5190387B2 JP 5190387 B2 JP5190387 B2 JP 5190387B2 JP 2009007719 A JP2009007719 A JP 2009007719A JP 2009007719 A JP2009007719 A JP 2009007719A JP 5190387 B2 JP5190387 B2 JP 5190387B2
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valve body
substrate
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frame
opening
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JP2010165920A (en
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裕樹 鍋山
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Tokyo Electron Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers

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  • Power Engineering (AREA)
  • Sliding Valves (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)

Description

この発明は、真空装置及び基板処理装置に係わり、特に、真空装置の内部を気密にシールするシール部に関する。   The present invention relates to a vacuum apparatus and a substrate processing apparatus, and more particularly to a seal portion that hermetically seals the inside of the vacuum apparatus.

液晶ディスプレイ(LCD)に代表されるフラットパネルディスプレイ(FPD)の製造過程においては、FPD用基板にエッチング、あるいは成膜等の所定の処理を施す。このような処理を施す基板処理装置としては、複数の処理室を備えたマルチチャンバタイプの基板処理装置が知られている(例えば、特許文献1)。   In the manufacturing process of a flat panel display (FPD) typified by a liquid crystal display (LCD), a predetermined process such as etching or film formation is performed on the FPD substrate. As a substrate processing apparatus for performing such processing, a multi-chamber type substrate processing apparatus having a plurality of processing chambers is known (for example, Patent Document 1).

マルチチャンバタイプの基板処理装置は、FPD用基板(被処理基板)を搬送する搬送装置が設けられた搬送室を有し、この搬送室の周囲に、処理室や、未処理の基板と処理済の基板とを交換するロードロック室(基板交換室)等を備えている。これら搬送室、処理室、及びロードロック室は真空装置であり、これらの真空装置は、排気機構を用いて排気することで内部が所定の減圧状態下とされる。   A multi-chamber type substrate processing apparatus has a transfer chamber provided with a transfer device for transferring an FPD substrate (substrate to be processed), and a processing chamber and an unprocessed substrate are processed around the transfer chamber. A load lock chamber (substrate exchange chamber) for exchanging the substrate is provided. The transfer chamber, the processing chamber, and the load lock chamber are vacuum devices, and these vacuum devices are evacuated using an exhaust mechanism so that the inside is brought into a predetermined reduced pressure state.

真空装置は気密に構成された容器本体を備え、この容器本体には、被処理基板を出し入れするための開口部が設けられている。開口部はゲートバルブを用いて開閉される。開口部をゲートバルブにより閉じると、容器本体の内部は気密にシールされ、容器本体の内部の圧力を、所定の圧力まで減圧したり、大気状態と減圧状態との相互間で変換したりすることが可能となっている。ゲートバルブの構造例は、上記特許文献1に記載されている。   The vacuum apparatus includes an airtight container main body, and the container main body is provided with an opening for taking in and out the substrate to be processed. The opening is opened and closed using a gate valve. When the opening is closed by the gate valve, the inside of the container body is hermetically sealed, and the pressure inside the container body is reduced to a predetermined pressure or converted between the atmospheric state and the reduced pressure state. Is possible. An example of the structure of the gate valve is described in Patent Document 1 described above.

特許文献1にも記載されるように、ゲートバルブは弁体を有し、弁体が容器本体の開口部周囲に密着されることにより、開口部周囲がシールされる。シール部材としてはOリングが用いられる。Oリングは、容器本体の開口部周囲に形成されたOリング溝に嵌め込まれている。   As described in Patent Document 1, the gate valve includes a valve body, and the periphery of the opening is sealed by the valve body being in close contact with the periphery of the opening of the container body. An O-ring is used as the seal member. The O-ring is fitted in an O-ring groove formed around the opening of the container body.


特開平5−196150号公報JP-A-5-196150

弁体は、ゲートバルブを開閉するごとに容器本体の開口部周囲に接触する。   The valve body contacts the periphery of the opening of the container body every time the gate valve is opened and closed.

また、弁体には、容器本体の内部の圧力を、大気状態と減圧状態との相互間で変換するごとに、大気圧による応力が繰り返し掛かるため、多少の変形を繰り返す。このため、開口部周囲は、大気状態と真空状態とを繰り返すごとに弁体と擦れ、開口部周囲や弁体に傷が発生する可能性がある。   Further, every time the pressure inside the container body is converted between the atmospheric state and the decompressed state, the valve body is repeatedly subjected to some deformation because stress due to atmospheric pressure is repeatedly applied. For this reason, the surroundings of the opening may rub against the valve body every time the atmospheric state and the vacuum state are repeated, and the surroundings of the opening and the valve body may be damaged.

傷が開口部周囲に発生してしまうと、容器本体自体を交換する必要が生じる。このため、真空装置を用いた基板処理装置の保守維持費が増大しやすい、という事情がある。また、傷の発生は、パーティクルの発生の要因ともなり得る。   If scratches occur around the opening, the container body itself needs to be replaced. For this reason, there exists a situation that the maintenance maintenance cost of the substrate processing apparatus using a vacuum apparatus tends to increase. In addition, the occurrence of scratches can be a cause of generation of particles.

この発明は、保守維持費の増大を抑制することが可能な真空装置及びそれを用いた基板処理装置を提供することを目的とする。   An object of the present invention is to provide a vacuum apparatus capable of suppressing an increase in maintenance and maintenance costs and a substrate processing apparatus using the same.

この発明の第1の態様に係る真空装置は、被処理基板を真空状態下におくことが可能な、気密に構成された容器本体と、前記容器本体に設けられた、前記被処理基板を出し入れする開口部と、前記開口部を開閉する弁体と、前記開口部を囲むように枠状に形成され、容器本体側表面、及びこの容器本体側表面に相対する弁体側表面の双方に枠状シール部材を備えた、前記開口部の周囲に着脱自在に取り付けられるシール板と、を具備し、前記シール板の前記容器本体側表面に備えられた枠状シール部材の中心と、前記弁体側表面に備えられた枠状シール部材の中心とが、前記弁体の押圧方向と平行して一直線上に配置され、前記弁体側表面のうち、この弁体側表面に備えられた枠状シール部材よりも内側の表面が、この枠状シール部材よりも外側の表面よりも低くされているA vacuum apparatus according to a first aspect of the present invention is an airtight container body capable of placing a substrate to be processed in a vacuum state, and the substrate to be processed provided in the container body. And a valve body that opens and closes the opening, and is formed in a frame shape so as to surround the opening, and has a frame shape on both the container body side surface and the valve body side surface opposite to the container body side surface. A seal plate provided with a seal member, which is detachably attached around the opening, and a center of a frame-like seal member provided on the container body side surface of the seal plate, and the valve body side surface The center of the frame-shaped seal member provided in the valve body is arranged in a straight line parallel to the pressing direction of the valve body, and the frame-shaped seal member provided on the valve body-side surface of the valve body-side surface. The inner surface is more than this frame-shaped seal member It is lower than the surface of the side.

この発明の第2の態様に係る基板処理装置は、被処理基板を真空状態下におくことが可能な、前記被処理基板に処理を施す処理室と、前記被処理基板を大気状態下及び真空状態下の双方におくことが可能な、処理前及び処理済の被処理基板を交換するロードロック室と、前記被処理基板を真空状態下におくことが可能な、前記ロードロック室と前記処理室との間で前記被処理基板を搬送する搬送室と、を備えた基板処理装置であって、前記処理室、前記ロードロック室、及び前記搬送室の少なくともいずれか一つが、上記第1の態様に係る真空装置を用いて構成されている。   According to a second aspect of the present invention, there is provided a substrate processing apparatus capable of placing a substrate to be processed in a vacuum state, a processing chamber for processing the substrate to be processed, the substrate to be processed in an atmospheric state, and a vacuum. A load-lock chamber for exchanging pre-processed and processed substrates to be processed, and the load-lock chamber and the processing capable of placing the target substrates in a vacuum state. A substrate processing apparatus for transferring the substrate to be processed between the processing chamber, at least one of the processing chamber, the load lock chamber, and the transfer chamber. It is comprised using the vacuum apparatus which concerns on an aspect.

この発明によれば、保守維持費の増大を抑制することが可能な真空装置及びそれを用いた基板処理装置を提供できる。   According to the present invention, it is possible to provide a vacuum apparatus capable of suppressing an increase in maintenance and maintenance costs and a substrate processing apparatus using the same.

この発明の第1の実施形態に係る真空装置が用いられた基板処理装置の一例を概略的に示す平面図1 is a plan view schematically showing an example of a substrate processing apparatus using a vacuum apparatus according to a first embodiment of the present invention. 図1中の2−2線に沿う概略的な断面図Schematic cross-sectional view along line 2-2 in FIG. ゲートバルブが開かれた状態を示す断面図Sectional view showing the gate valve opened シール板の斜視図Perspective view of seal plate シール板を取り外した状態を示す断面図Sectional drawing which shows the state which removed the sealing plate 第1の実施形態に係る真空装置が備えるシール板の変形例を示す断面図Sectional drawing which shows the modification of the sealing plate with which the vacuum apparatus which concerns on 1st Embodiment is equipped 弁体61の形状変形を示す図The figure which shows the shape deformation | transformation of the valve body 61 この発明の第2の実施形態に係るシール板の一例を示す断面図Sectional drawing which shows an example of the sealing plate which concerns on 2nd Embodiment of this invention 弁体とシール板との接触を示す図Diagram showing contact between valve body and seal plate 第2の実施形態に係るシール板の変形例を示す断面図Sectional drawing which shows the modification of the sealing plate which concerns on 2nd Embodiment. 第2の実施形態に係るシール板の変形例を示す断面図Sectional drawing which shows the modification of the sealing plate which concerns on 2nd Embodiment. この発明の第3の実施形態に係る真空装置を概略的に示す断面図Sectional drawing which shows schematically the vacuum apparatus which concerns on 3rd Embodiment of this invention 被処理基板を複数枚同時に収容可能な真空装置を概略的に示す断面図Sectional drawing which shows schematically the vacuum apparatus which can accommodate several to-be-processed substrates simultaneously

以下、この発明の実施形態を、図面を参照して説明する。参照する図面全てにわたり、同一の部分については同一の参照符号を付す。   Embodiments of the present invention will be described below with reference to the drawings. Throughout the drawings to be referred to, the same parts are denoted by the same reference numerals.

本説明においては被処理基板の一例としてFPD用基板を挙げ、このFPD基板に対して所定の処理、例えば、エッチング、あるいは成膜等を施す処理装置を例示しながら説明する。   In this description, an FPD substrate is taken as an example of a substrate to be processed, and a processing apparatus that performs predetermined processing such as etching or film formation on the FPD substrate will be described as an example.

(第1の実施形態)
図1は、この発明の第1の実施形態に係る真空装置が用いられた処理装置を概略的に示す平面図である。
(First embodiment)
FIG. 1 is a plan view schematically showing a processing apparatus in which a vacuum apparatus according to a first embodiment of the present invention is used.

図1に示すように、第1の実施形態に係る処理装置1は、被処理基板Gに処理を施す処理室、本例においては複数の処理室10a、10bと、処理前及び処理済の被処理基板Gを交換するロードロック室20と、ロードロック室20と処理室10a又は10b、並びに処理室10aと処理室10bとの間で被処理基板Gを搬送する搬送室30と、搬送室30に設けられた、被処理基板Gを搬送する搬送装置40と、を備えている。   As shown in FIG. 1, the processing apparatus 1 according to the first embodiment includes a processing chamber for processing a substrate to be processed G, in this example, a plurality of processing chambers 10a and 10b, and a processing target before and after processing. A load lock chamber 20 for exchanging the processing substrate G, a load lock chamber 20, the processing chamber 10a or 10b, a transfer chamber 30 for transferring the substrate to be processed G between the processing chamber 10a and the processing chamber 10b, and a transfer chamber 30 And a transfer device 40 for transferring the substrate G to be processed.

本例においては、処理室10a、10b、ロードロック室20、及び搬送室30は真空装置であり、それぞれ被処理基板Gを所定の減圧状態下におくことが可能な、気密に構成された容器本体50を備えている。容器本体50には、被処理基板Gを出し入れする開口部51が設けられている。   In this example, the processing chambers 10a and 10b, the load lock chamber 20, and the transfer chamber 30 are vacuum devices, and each is an airtight container capable of placing the substrate to be processed G under a predetermined reduced pressure state. A main body 50 is provided. The container body 50 is provided with an opening 51 for taking in and out the substrate G to be processed.

処理室10a、10bの容器本体50に設けられた開口部51は、ゲートバルブ室60を介して搬送室30の容器本体50に設けられた開口部51に接続される。同様にロードロック室20の容器本体50に設けられた開口部51は、ゲートバルブ室60を介して搬送室30の容器本体50に設けられた開口部51に接続されている。ゲートバルブ室60の内部にはゲートバルブの弁体61が収容されており、開口部51は弁体61により開閉される。本例では、弁体61は、処理室10a、10bの容器本体50、及びロードロック室20の容器本体50に密着されるように構成されており、弁体61は、それぞれの開口部51の周囲に密着することで、容器本体50を気密にシールする。   The opening 51 provided in the container main body 50 of the processing chambers 10 a and 10 b is connected to the opening 51 provided in the container main body 50 of the transfer chamber 30 through the gate valve chamber 60. Similarly, the opening 51 provided in the container main body 50 of the load lock chamber 20 is connected to the opening 51 provided in the container main body 50 of the transfer chamber 30 via the gate valve chamber 60. A gate valve valve body 61 is accommodated in the gate valve chamber 60, and the opening 51 is opened and closed by the valve body 61. In this example, the valve body 61 is configured to be in close contact with the container main body 50 of the processing chambers 10 a and 10 b and the container main body 50 of the load lock chamber 20. The container body 50 is hermetically sealed by closely contacting the periphery.

また、ロードロック室20は、大気側、即ち、基板処理装置1の外部に開放される開口部51を有している。外部に開放される開口部51は、処理前の被処理基板Gの外部からの搬入、処理済の被処理基板Gの外部への搬出に使用され、大気状態下に開放された弁体61により開閉される。   The load lock chamber 20 has an opening 51 that is opened to the atmosphere side, that is, to the outside of the substrate processing apparatus 1. The opening 51 opened to the outside is used for carrying in the unprocessed substrate G before processing and unloading the processed substrate G to the outside by the valve body 61 opened in an atmospheric state. Opened and closed.

図2は、図1中の2−2線に沿う概略的な断面図である。図2には、ロードロック室20の断面及び搬送室30の部分断面が示されている。また、図2はゲートバルブが閉じられた状態における断面図であり、図3にゲートバルブが開かれた状態を示す断面を示す。   FIG. 2 is a schematic cross-sectional view taken along line 2-2 in FIG. FIG. 2 shows a cross section of the load lock chamber 20 and a partial cross section of the transfer chamber 30. FIG. 2 is a cross-sectional view in a state in which the gate valve is closed, and FIG. 3 shows a cross-section in a state in which the gate valve is opened.

図2に示すように、本例における弁体61は、ロードロック室20の容器本体50に設けられた開口部51に密着される。図2及び図3においては、便宜上、ロードロック室20の容器本体50に設けられた大気側の開口部51に参照符号51aを付し、減圧側(搬送室30側)の開口部51に参照符号51bを付す。   As shown in FIG. 2, the valve body 61 in this example is in close contact with an opening 51 provided in the container body 50 of the load lock chamber 20. 2 and 3, for the sake of convenience, reference numeral 51a is attached to the opening 51 on the atmosphere side provided in the container body 50 of the load lock chamber 20, and the opening 51 on the decompression side (conveying chamber 30 side) is referred to. The code | symbol 51b is attached | subjected.

大気側の開口部51aは大気に開放されるが、減圧側(搬送室30側)の開口部51bはゲートバルブ室60に連通される。ゲートバルブ室60は、ロードロック室20の容器本体50に、枠状のシール部材62、例えば、Oリングを介して接続されており、ゲートバルブ室60はロードロック室20の容器本体50に気密に接続される。   The opening 51 a on the atmosphere side is open to the atmosphere, but the opening 51 b on the decompression side (the transfer chamber 30 side) communicates with the gate valve chamber 60. The gate valve chamber 60 is connected to the container main body 50 of the load lock chamber 20 via a frame-shaped seal member 62, for example, an O-ring, and the gate valve chamber 60 is airtight to the container main body 50 of the load lock chamber 20. Connected to.

また、ゲートバルブ室60は、搬送室30の容器本体50に設けられた開口部51にも連通される。ゲートバルブ室60は、搬送室30の容器本体50に、枠状のシール部材63、例えば、Oリングを介して接続される。これにより、ゲートバルブ室60は搬送室30の容器本体50に気密に接続される。   The gate valve chamber 60 is also communicated with an opening 51 provided in the container body 50 of the transfer chamber 30. The gate valve chamber 60 is connected to the container body 50 of the transfer chamber 30 via a frame-shaped seal member 63, for example, an O-ring. Thereby, the gate valve chamber 60 is hermetically connected to the container body 50 of the transfer chamber 30.

さらに、第1の実施形態においては、容器本体50の開口部51a及び51bを囲むように枠状に形成されたシール板70を、開口部51の周囲に備えている。枠状のシール板70の斜視図を図4に示しておく。   Furthermore, in the first embodiment, a seal plate 70 formed in a frame shape so as to surround the openings 51 a and 51 b of the container body 50 is provided around the opening 51. A perspective view of the frame-shaped seal plate 70 is shown in FIG.

シール板70は、容器本体側表面71a、及びこの容器本体側表面71aに相対する弁体側表面71bの双方に枠状シール部材72a、72bを有している。枠状シール部材72a、72bは、容器本体側表面71a及び弁体側表面71bそれぞれに形成されたシール部材用溝73a、73bの内部に嵌め込まれている。シール板70は、枠状シール部材72aを介して容器本体50に接続されることで、シール板70は容器本体50に気密に接続される。弁体61は、容器本体50に接触することなく、シール板70の弁体側表面71bに接触される。弁体61は、枠状シール部材72bを介してシール板70に密着することで、容器本体50を気密にシールする。枠状シール部材72bの一例は、バイトン(登録商標)、フロロプラスなどのフッ素ゴムOリングである。   The seal plate 70 has frame-shaped seal members 72a and 72b on both the container main body side surface 71a and the valve body side surface 71b opposite to the container main body side surface 71a. The frame-shaped seal members 72a and 72b are fitted into seal member grooves 73a and 73b formed in the container main body side surface 71a and the valve body side surface 71b, respectively. The seal plate 70 is connected to the container main body 50 in an airtight manner by being connected to the container main body 50 via the frame-shaped seal member 72a. The valve body 61 is brought into contact with the valve body-side surface 71 b of the seal plate 70 without contacting the container body 50. The valve body 61 seals the container main body 50 in an airtight manner by closely contacting the seal plate 70 via the frame-shaped seal member 72b. An example of the frame-shaped seal member 72b is a fluorine rubber O-ring such as Viton (registered trademark) or Fluoroplus.

シール板70は、容器本体50に設けられた開口部51の周囲に着脱自在に取り付けられる。このため、例えば、図5に示すように、シール板70は、容器本体50から取り外すことができる。   The seal plate 70 is detachably attached around the opening 51 provided in the container body 50. For this reason, for example, as shown in FIG. 5, the seal plate 70 can be removed from the container body 50.

シール板70は、ゲートバルブを開閉するごとに弁体61に接触する。さらに、弁体61は、容器本体50の内部の圧力が、大気状態から減圧状態、減圧状態から大気状態と変換されるごとに変形する。このため、シール板70は弁体61と擦れ合う。   The seal plate 70 contacts the valve body 61 every time the gate valve is opened and closed. Further, the valve body 61 is deformed each time the pressure inside the container body 50 is changed from the atmospheric state to the reduced pressure state and from the reduced pressure state to the atmospheric state. For this reason, the seal plate 70 rubs against the valve body 61.

このようにシール板70は、弁体61と接触及び擦れ合うことから、傷が発生する可能性がある。シール板70に傷が発生した場合には交換しなければならないが、シール板70は、容器本体50から取り外すことができるので、交換が容易である。   Thus, since the seal plate 70 contacts and rubs against the valve body 61, there is a possibility that scratches may occur. If the seal plate 70 is damaged, it must be replaced. However, since the seal plate 70 can be removed from the container body 50, the replacement is easy.

しかも、弁体が容器本体に直接に接触する方式の場合には、開口部の周囲に傷が発生してしまった場合には容器本体ごと交換しなければならない。   Moreover, in the case where the valve body is in direct contact with the container body, the entire container body must be replaced if a flaw occurs around the opening.

この点、第1の実施形態においてはシール板70のみを交換すれば良いので、容器本体50は交換不要である。容器本体50は高価であるが、シール板70は容器本体50に比較して格段に安価である。   In this regard, in the first embodiment, since only the seal plate 70 needs to be replaced, the container body 50 does not need to be replaced. The container body 50 is expensive, but the seal plate 70 is much cheaper than the container body 50.

よって、第1の実施形態によれば、処理室、ロードロック室、及び搬送室等に代表される真空装置の保守維持費の増大を抑制することが可能である。また、保守維持費の増大を抑制することが可能な真空装置を用いた基板処理装置を得ることができる。   Therefore, according to the first embodiment, it is possible to suppress an increase in maintenance and maintenance costs of vacuum devices represented by a processing chamber, a load lock chamber, a transfer chamber, and the like. In addition, a substrate processing apparatus using a vacuum apparatus that can suppress an increase in maintenance cost can be obtained.

また、第1の実施形態において、シール板70に傷が発生する可能性や、傷の発生に伴うパーティクルの発生をより抑制したい場合には、次のような工夫を施すと良い。   Further, in the first embodiment, when it is desired to further suppress the possibility that the seal plate 70 is damaged or the generation of particles accompanying the generation of the damage, the following device may be applied.

シール板70の表面、少なくとも弁体61や容器本体50と擦れ合う弁体側表面71b、容器本体側表面71aに、硬質アルマイトをかけたり、硬質アルマイト上に表面処理、例えば、フッ素樹脂含浸処理を施したりする。これにより、シール板70の表面を、シール板70を構成する材料、例えば、アルミニウムの表面をそのまま露出させておく場合に比較して、シール板70の表面の滑りを良くすることができ、シール板70に傷が発生する可能性を抑制することができる。   The surface of the seal plate 70, at least the valve body side surface 71b that rubs against the valve body 61 and the container body 50, and the container body side surface 71a are subjected to hard anodizing, or surface treatment such as fluororesin impregnation is performed on the hard anodized. To do. Thereby, compared with the case where the surface of the seal plate 70 is exposed as it is, the surface of the material constituting the seal plate 70, for example, the surface of aluminum, the surface of the seal plate 70 can be made more slippery. The possibility of scratches occurring on the plate 70 can be suppressed.

また、第1の実施形態において、シール板70によるシール性を向上させたい場合には、次のような工夫を施すと良い。   Further, in the first embodiment, when it is desired to improve the sealing performance by the seal plate 70, the following device may be applied.

例えば、シール板70の容器本体側表面71aに備えられたシール部材72aと、弁体側表面71bに備えられたシール部材72bとを、弁体61の押圧方向Aと平行して一直線上に配置する。具体的には、図6に示すように、枠状シール部材72aの中心74aと、枠状シール部材72bの中心74bとを弁体61の押圧方向Aと平行して一直線上に配置する。これにより、枠状シール部材72aと枠状シール部材72bとを互いにずらして配置する場合に比較して、弁体61と容器本体50との間に、シール板70をより強く挟み込むことができ、シール板70によるシール性を向上させることができる。   For example, the seal member 72a provided on the container body side surface 71a of the seal plate 70 and the seal member 72b provided on the valve body side surface 71b are arranged in a straight line in parallel with the pressing direction A of the valve body 61. . Specifically, as shown in FIG. 6, the center 74 a of the frame-shaped seal member 72 a and the center 74 b of the frame-shaped seal member 72 b are arranged on a straight line parallel to the pressing direction A of the valve body 61. Thereby, compared with the case where the frame-shaped seal member 72a and the frame-shaped seal member 72b are shifted from each other, the seal plate 70 can be sandwiched more strongly between the valve body 61 and the container body 50, The sealing performance by the seal plate 70 can be improved.

(第2の実施形態)
第2の実施形態は、弁体61とシール板70との擦れを、さらに低減する例に関する。
(Second Embodiment)
The second embodiment relates to an example in which the friction between the valve body 61 and the seal plate 70 is further reduced.

弁体61は、容器本体50の内部が減圧状態にあるとき、容器本体50の内部圧力と外部圧力との圧力差を受ける。最も顕著な場合は、図7に示すように、容器本体50が減圧状態で、弁体61に大気圧が掛かっている場合である。このような状況は、ロードロック室20の大気側開口部51aの周囲を気密にシールする弁体に見ることができる。   The valve body 61 receives a pressure difference between the internal pressure of the container body 50 and the external pressure when the inside of the container body 50 is in a reduced pressure state. The most prominent case is when the container body 50 is in a depressurized state and the valve body 61 is under atmospheric pressure as shown in FIG. Such a situation can be seen in a valve body that hermetically seals the atmosphere-side opening 51a of the load lock chamber 20.

弁体61の内側と外側との間に大きな圧力差があると、弁体61は変形する。例えば、弁体61の外側が大気状態で、内側が減圧状態であるときには、弁体61は、図7に示すように、シール板70側に向かって凹となるように変形する。   If there is a large pressure difference between the inside and the outside of the valve body 61, the valve body 61 is deformed. For example, when the outside of the valve body 61 is in an atmospheric state and the inside is in a decompressed state, the valve body 61 is deformed so as to be concave toward the seal plate 70 side as shown in FIG.

図7では、弁体の垂直断面における変形を示しているが、ロードロック室20の開口部51aは、水平方向に広い開口であるため、弁体の変形も水平断面における変形の方が大きい。   Although FIG. 7 shows the deformation in the vertical cross section of the valve body, the opening 51a of the load lock chamber 20 is a wide opening in the horizontal direction, so that the deformation of the valve body is also greater in the horizontal cross section.

このような変形を抑制するために、例えば、弁体の外側(大気側)表面にリブなどの補強部材を取り付ける等の工夫を行うが、完全に変形を抑えることは出来ない。したがって、シール板70の弁体側表面71bのうち、シール部材72bより内側表面(図中点線円75内に示す)が、弁体61と強く擦れる。このため、点線円75に示す部分において傷が発生しやすくなる。   In order to suppress such deformation, for example, a contrivance such as attaching a reinforcing member such as a rib to the outer surface (atmosphere side) of the valve body is performed, but the deformation cannot be completely suppressed. Therefore, the inner surface (shown in a dotted circle 75 in the drawing) of the valve body side surface 71b of the seal plate 70 rubs strongly with the valve body 61. For this reason, scratches are likely to occur in the portion indicated by the dotted circle 75.

図8は、この発明の第2の実施形態に係るシール板の一例を示す断面図である。   FIG. 8 is a cross-sectional view showing an example of a seal plate according to the second embodiment of the present invention.

そこで、図8に示すように、第2の実施形態に係るシール板70Aにおいては、弁体側表面71bのうち、この弁体側表面71bに備えられたシール部材72bよりも内側の表面が、このシール部材72bよりも外側の表面よりも低くする。これにより、弁体61が、シール板70側に向かって凹となるように変形したとしても、弁体側表面71bのシール部材72bより内側の表面は、弁体61と接触しない、あるいはほとんど接触しない構成とすることができる。   Therefore, as shown in FIG. 8, in the seal plate 70A according to the second embodiment, the inner surface of the valve body side surface 71b with respect to the seal member 72b provided on the valve body side surface 71b is the seal plate. Lower than the outer surface of the member 72b. Thereby, even if the valve body 61 is deformed so as to be concave toward the seal plate 70 side, the surface inside the seal member 72b of the valve body side surface 71b does not contact or hardly contacts the valve body 61. It can be configured.

このように第2の実施形態によれば、シール部材72bより内側の表面が、弁体61と接触しない、あるいはほとんど接触しない構成とできるので、弁体61とシール板70との擦れを、さらに低減させることができる。   As described above, according to the second embodiment, the inner surface of the seal member 72b can be configured not to contact or hardly contact the valve body 61. Therefore, the friction between the valve body 61 and the seal plate 70 can be further reduced. Can be reduced.

また、擦れが低減される結果、傷が発生しない、あるいはより発生し難くすることができ、傷の発生に伴ったパーティクルの発生をも抑制することができる。パーティクルの発生が抑制されれば、被処理基板Gを、より清浄な環境下で処理することができるので、品質の良いFPD等の生産にも有利である。   Further, as a result of the reduction of rubbing, scratches can be prevented from occurring or less likely to occur, and the generation of particles accompanying the occurrence of scratches can also be suppressed. If the generation of particles is suppressed, the substrate G to be processed can be processed in a cleaner environment, which is advantageous for producing a high-quality FPD or the like.

なお、第2の実施形態は、上記第1の実施形態において説明した工夫、即ち、シール板70の表面、少なくとも弁体61や容器本体50と擦れ合う弁体側表面71b、容器本体側71aに、硬質アルマイトをかけたり、硬質アルマイト上に表面処理をしたりする工夫、並びにシール部材72aとシール部材72bとを、弁体61の押圧方向Aと平行して一直線上に配置する工夫と、組み合わせて実施することができる。   In the second embodiment, the device described in the first embodiment, that is, the surface of the seal plate 70, at least the valve body side surface 71b that rubs against the valve body 61 and the container body 50, and the container body side 71a are hard. Combined with a device that applies alumite or surface treatment on hard alumite, and a device that arranges the seal member 72a and the seal member 72b in a straight line parallel to the pressing direction A of the valve body 61 can do.

また、第2の実施形態の構成、即ち、シール部材72bよりも内側の表面を、シール部材72bよりも外側の表面よりも低くする構成は、容器本体50の開口部51の周囲に、シール部材用溝を設けた真空装置にも適用することができる。   The configuration of the second embodiment, that is, the configuration in which the inner surface of the seal member 72b is lower than the outer surface of the seal member 72b, the seal member around the opening 51 of the container main body 50. The present invention can also be applied to a vacuum apparatus provided with a working groove.

さらに、第2の実施形態において、パーティクルの発生を、より抑制したい場合には、次のような工夫をすると良い。   Furthermore, in the second embodiment, when it is desired to further suppress the generation of particles, the following device may be used.

弁体61は、シール板70に密着しているとき、シール板70の弁体側表面71bに接触する。図9に示すように、たとえ、第2の実施形態に係るシール板70の場合であっても、シール板70の弁体側表面71bのうち、シール部材72bより外側表面(図中点線円76内に示す)が、弁体61と接触する。弁体61、及びシール板70の双方が金属であった場合には、接触により傷がつき、パーティクルが発生する可能性がある。   When the valve body 61 is in close contact with the seal plate 70, the valve body 61 contacts the valve body-side surface 71 b of the seal plate 70. As shown in FIG. 9, even in the case of the seal plate 70 according to the second embodiment, of the valve body side surface 71b of the seal plate 70, the surface outside the seal member 72b (inside the dotted line circle 76 in the figure). Is in contact with the valve body 61. When both the valve body 61 and the seal plate 70 are made of metal, there is a possibility that the contact damages and particles are generated.

そこで、図10に示すように、弁体側表面71bのうち、シール部材72bよりも外側の表面上に、耐摩耗性部材77を設ける。耐摩耗性部材77の一例は樹脂材である。樹脂材の例としては、ポリテトラフルオロエチレン(PTFE)やポリアセタール(POM)等を挙げることができる。   Therefore, as shown in FIG. 10, a wear-resistant member 77 is provided on the outer surface of the valve body side surface 71b from the seal member 72b. An example of the wear resistant member 77 is a resin material. Examples of the resin material include polytetrafluoroethylene (PTFE) and polyacetal (POM).

このように、弁体61がシール板70と密着したとき、弁体61とシール板70とが接触する面、本例では、弁体側表面71bのうち、シール部材72bよりも外側の表面上に、耐摩耗性部材77を設けることで、弁体61、及びシール板70の双方が金属であった場合でも、金属同士の接触を防ぐことができ、パーティクルの発生を、より抑制することができる。   In this way, when the valve body 61 comes into close contact with the seal plate 70, on the surface where the valve body 61 and the seal plate 70 come into contact, in this example, on the surface outside the seal member 72b of the valve body side surface 71b. By providing the wear-resistant member 77, even when both the valve body 61 and the seal plate 70 are made of metal, contact between metals can be prevented, and generation of particles can be further suppressed. .

さらに、弁体61と耐摩耗性部材77との接触面積を、より小さくしたい場合には、図11に示すように、弁体側表面71bに備えられたシール部材72bの線径dbを、容器本体側表面71aに備えられたシール部材72aの線径daよりも大きくすると良い。   Furthermore, when it is desired to reduce the contact area between the valve body 61 and the wear-resistant member 77, as shown in FIG. 11, the wire diameter db of the seal member 72b provided on the valve body side surface 71b is changed to a container body. It may be larger than the wire diameter da of the sealing member 72a provided on the side surface 71a.

このように、シール部材72bの線径dbを、シール部材72aの線径daよりも大きくすることで、弁体側表面71bのうち、シール部材72bより外側の表面の面積を小さくすることができ、耐摩耗性部材77の面積を小さくすることができる。耐摩耗性部材77の面積が小さくなることで、弁体61と耐摩耗性部材77との接触面積を、より小さくすることができる。弁体61と耐摩耗性部材77との接触面積が小さくなれば、例えば、弁体61に傷がつくことで発生するような、弁体61自体に起因したパーティクルの発生を、より抑制することが可能となる。   Thus, by making the wire diameter db of the seal member 72b larger than the wire diameter da of the seal member 72a, the area of the surface outside the seal member 72b of the valve body side surface 71b can be reduced. The area of the wear resistant member 77 can be reduced. By reducing the area of the wear-resistant member 77, the contact area between the valve body 61 and the wear-resistant member 77 can be further reduced. If the contact area between the valve body 61 and the wear-resistant member 77 is reduced, for example, the generation of particles caused by the valve body 61 itself, which is generated when the valve body 61 is damaged, is further suppressed. Is possible.

また、シール部材72bの線径dbを、シール部材72aの線径daよりも大きくした場合においても、シール部材72bの中心74bと、シール部材72aの中心74bとを弁体61の押圧方向Aと平行して一直線上に配置することが良い。このようにすることで、シール板70によるシール性を向上させることができる。   Even when the wire diameter db of the seal member 72b is larger than the wire diameter da of the seal member 72a, the center 74b of the seal member 72b and the center 74b of the seal member 72a are It is good to arrange in parallel on a straight line. By doing in this way, the sealing performance by the seal plate 70 can be improved.

(第3の実施形態)
第3の実施形態は、真空装置を小型化する例に関する。
(Third embodiment)
The third embodiment relates to an example of downsizing a vacuum device.

第1、第2の実施形態において説明したように、この発明の実施形態においては、シール板70、70Aを新たに設ける。このため、シール板70、70Aの分、真空装置が大きくなってしまう。   As described in the first and second embodiments, the seal plates 70 and 70A are newly provided in the embodiment of the present invention. For this reason, a vacuum apparatus will become large by the part of the sealing plates 70 and 70A.

図12は、この発明の第3の実施形態に係る真空装置の一例を示す断面図である。   FIG. 12 is a sectional view showing an example of a vacuum apparatus according to the third embodiment of the present invention.

そこで、図12に示すように、第3の実施形態においては、容器本体50の開口部51の周囲に、シール板70(又は70A)を埋め込む埋め込み部80を設けるようにした。   Therefore, as shown in FIG. 12, in the third embodiment, an embedding portion 80 for embedding the seal plate 70 (or 70A) is provided around the opening 51 of the container body 50.

このように第3の実施形態によれば、シール板70(又は70A)を、開口部51の周囲に設けられた、埋め込み部80に埋め込むようにしたので、シール部材70(又は70A)が、容器本体50から突出することが無く、あるいは突出量を減らすことができ、シール板70(又は70A)を備えた真空装置の小型化を促進することができる。   Thus, according to the third embodiment, since the seal plate 70 (or 70A) is embedded in the embedded portion 80 provided around the opening 51, the seal member 70 (or 70A) is It can be prevented from projecting from the container body 50, or the projecting amount can be reduced, and the miniaturization of the vacuum apparatus including the seal plate 70 (or 70A) can be promoted.

なお、第3の実施形態は、上記第1の実施形態において説明した工夫や、第2の実施形態、あるいは第2の実施形態において説明した工夫と、組み合わせて実施することができる。   The third embodiment can be implemented in combination with the device described in the first embodiment, the device described in the second embodiment, or the second embodiment.

また、図12においては、埋め込み部80を大気側の開口部51aの周囲に設ける例を示しているが、反対に減圧側(搬送室30側)の開口部51bの周囲に設けるようにしても良いし、開口部51a、及び51bの双方に設けるようにしても良い。   12 shows an example in which the embedding part 80 is provided around the opening 51a on the atmosphere side, but conversely, it may be provided around the opening 51b on the decompression side (the transfer chamber 30 side). Alternatively, it may be provided in both the openings 51a and 51b.

以上、この発明を第1乃至第3の実施形態に従って説明したが、この発明は上記第1乃至第3の実施形態に限定されることはなく、種々の変形が可能である。   Although the present invention has been described according to the first to third embodiments, the present invention is not limited to the first to third embodiments, and various modifications can be made.

例えば、第1乃至第3の実施形態においては、容器本体内に、被処理基板を一枚収容する真空装置を例示してきたが、例えば、図13に示すように、容器本体50が、被処理基板Gを複数枚同時に収容可能な真空装置にも適用できる。   For example, in the first to third embodiments, the vacuum apparatus that accommodates one substrate to be processed in the container main body has been exemplified. However, for example, as shown in FIG. The present invention can also be applied to a vacuum apparatus that can accommodate a plurality of substrates G at the same time.

しかも、被処理基板を複数枚同時に収容可能な容器本体は、被処理基板を一枚収容する容器本体に比較して大型になることが通常であり、価格も高い。このため、この発明は、被処理基板を複数枚同時に収容可能な容器本体は真空装置において、より有効に適用できる。   In addition, a container main body that can accommodate a plurality of substrates to be processed is usually larger and more expensive than a container main body that accommodates a single substrate to be processed. Therefore, the present invention can be more effectively applied to a container body that can simultaneously store a plurality of substrates to be processed in a vacuum apparatus.

さらに、上記第1乃至第3の実施形態では、被処理基板としてFPD用基板を示したが、被処理基板はFPD用基板に限定されず、太陽電池用基板や半導体ウエハ等の他の基板であってもよい。   Further, in the first to third embodiments, the FPD substrate is shown as the substrate to be processed. However, the substrate to be processed is not limited to the FPD substrate, and may be another substrate such as a solar cell substrate or a semiconductor wafer. There may be.

1…基板処理装置、10a、10b…処理部、20…ロードロック室、30…搬送室、50…容器本体、51…開口部、60…ゲートバルブ室、61…弁体、70…シール板、71a…容器側表面、71b…弁体側表面、72a、72b…枠状シール部材、80…埋め込み部。   DESCRIPTION OF SYMBOLS 1 ... Substrate processing apparatus, 10a, 10b ... Processing part, 20 ... Load lock chamber, 30 ... Transfer chamber, 50 ... Container main body, 51 ... Opening part, 60 ... Gate valve chamber, 61 ... Valve body, 70 ... Seal plate, 71a ... container side surface, 71b ... valve body side surface, 72a, 72b ... frame-shaped sealing member, 80 ... embedding part.

Claims (7)

被処理基板を真空状態下におくことが可能な、気密に構成された容器本体と、
前記容器本体に設けられた、前記被処理基板を出し入れする開口部と、
前記開口部を開閉する弁体と、
前記開口部を囲むように枠状に形成され、容器本体側表面、及びこの容器本体側表面に相対する弁体側表面の双方に枠状シール部材を備えた、前記開口部の周囲に着脱自在に取り付けられるシール板と、
を具備し、
前記シール板の前記容器本体側表面に備えられた枠状シール部材の中心と、前記弁体側表面に備えられた枠状シール部材の中心とが、前記弁体の押圧方向と平行して一直線上に配置され、
前記弁体側表面のうち、この弁体側表面に備えられた枠状シール部材よりも内側の表面が、この枠状シール部材よりも外側の表面よりも低くされていることを特徴とする真空装置。
An airtight container body capable of placing the substrate to be processed under vacuum; and
An opening provided in the container body for taking in and out the substrate to be processed;
A valve body for opening and closing the opening;
It is formed in a frame shape so as to surround the opening, and is provided with a frame-shaped sealing member on both the container body side surface and the valve body side surface opposite to the container body side surface, and is detachable around the opening. With a sealing plate attached,
Equipped with,
The center of the frame-shaped seal member provided on the surface of the container body of the seal plate and the center of the frame-shaped seal member provided on the surface of the valve body are in a straight line parallel to the pressing direction of the valve body. Placed in
A vacuum device characterized in that, of the valve body side surfaces, a surface inside a frame-shaped seal member provided on the valve body-side surface is lower than a surface outside the frame-shaped seal member .
前記弁体側表面のうち、この弁体側表面に備えられた枠状シール部材よりも外側の表面上に、耐摩耗性部材を備えていることを特徴とする請求項1に記載の真空装置。 The vacuum apparatus according to claim 1 , further comprising a wear-resistant member on a surface outside the frame-like seal member provided on the valve-body-side surface of the valve-body-side surface. 前記弁体側表面に備えられた枠状シール部材の幅が、前記容器本体側表面に備えられた枠状シール部材の幅よりも大きいことを特徴とする請求項1又は請求項2に記載の真空装置。 The vacuum according to claim 1 or 2 , wherein a width of the frame-shaped seal member provided on the valve body side surface is larger than a width of the frame-shaped seal member provided on the container body side surface. apparatus. 前記容器本体の開口部周囲に、前記シール板が埋め込まれる埋め込み部が設けられていることを特徴とする請求項1から請求項3のいずれか一項に記載の真空装置。 The vacuum apparatus according to any one of claims 1 to 3 , wherein an embedded portion in which the seal plate is embedded is provided around an opening of the container main body. 前記容器本体が、前記被処理基板を複数枚同時に収容可能であることを特徴とする請求項1から請求項4のいずれか一項に記載の真空装置。 The vacuum apparatus according to any one of claims 1 to 4, wherein the container main body can accommodate a plurality of the substrates to be processed at the same time. 前記弁体の前記シール板側表面と反対の表面には、弁体の変形を抑制するための補強部材が取り付けられていることを特徴とする請求項1から請求項5のいずれか一項に記載の真空装置。 The sealing plate side surface and the opposite surface of said valve body, claim 1, wherein a reinforcing member for preventing deformation of the valve body is attached to one of the claims 5 The vacuum apparatus described. 被処理基板を真空状態下におくことが可能な、前記被処理基板に処理を施す処理室と、
前記被処理基板を大気状態下及び真空状態下の双方におくことが可能な、処理前及び処理済の被処理基板を交換するロードロック室と、
前記被処理基板を真空状態下におくことが可能な、前記ロードロック室と前記処理室との間で前記被処理基板を搬送する搬送室と、を備えた基板処理装置であって、
前記処理室、前記ロードロック室、及び前記搬送室の少なくともいずれか一つが、請求項1から請求項6のいずれか一項に記載された真空装置を用いて構成されていることを特徴とする基板処理装置。
A processing chamber for processing the substrate to be processed, which is capable of placing the substrate to be processed in a vacuum state;
A load lock chamber for exchanging the substrate to be processed before and after processing, wherein the substrate to be processed can be placed in both an atmospheric state and a vacuum state;
A substrate processing apparatus comprising: a transfer chamber for transferring the substrate to be processed between the load lock chamber and the processing chamber, wherein the substrate to be processed can be placed in a vacuum state;
At least one of the processing chamber, the load lock chamber, and the transfer chamber is configured using the vacuum apparatus according to any one of claims 1 to 6. Substrate processing equipment.
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