KR101137138B1 - Vacuum device and substrate processing device - Google Patents

Abstract

In order to provide a vacuum apparatus which can suppress an increase in maintenance cost, the present invention provides an airtight container main body 50 and a container main body 50 provided with a gas-tight structure which can hold the substrate G in a vacuum state. It is formed in a frame shape so as to surround the opening part 51 which carries out the process board | substrate G, the valve body 61 which opens and closes the opening part 51, and the opening part 51, and this container main body side surface 71a, and this container It is provided with the sealing plate 70 detachably attached to the circumference | surroundings of the opening part 51 provided with the frame-shaped sealing member 72a, 72b in both of the valve body side surface 71b facing the main body side surface 71a. do.

Description

VACUUM DEVICE AND SUBSTRATE PROCESSING DEVICE

TECHNICAL FIELD This invention relates to a vacuum apparatus and a substrate processing apparatus. Specifically, It is related with the sealing part which airtightly seals the inside of a vacuum apparatus.

In the manufacturing process of the flat panel display (FPD) represented by a liquid crystal display (LCD), predetermined processes, such as an etching or film-forming, are performed to the board | substrate for FPD. As a substrate processing apparatus which performs such a process, the multi-chamber type substrate processing apparatus provided with several process chamber is known (for example, patent document 1).

The multi-chamber type substrate processing apparatus has a conveyance chamber in which the conveying apparatus which conveys the FPD board | substrate (to-be-processed substrate) was provided, The rod which exchanges a process chamber or an unprocessed board | substrate and a processed board | substrate around this conveyance chamber. A lock room (substrate exchange room) etc. is provided. These conveyance chambers, processing chambers, and load lock chambers are vacuum apparatuses, and these vacuum apparatuses are evacuated using an exhaust mechanism to bring the interior into a predetermined reduced pressure state.

The vacuum apparatus includes a container body configured to be airtight, and the container body is provided with an opening for dispensing the substrate to be processed. The opening is opened and closed using a gate valve. When the opening is closed by the gate valve, the inside of the container main body is hermetically sealed, so that the pressure inside the container main body can be reduced to a predetermined pressure or can be switched between the atmospheric state and the reduced pressure state. The structural example of a gate valve is described in the said patent document 1.

As also described in Patent Literature 1, the gate valve has a valve body, and the valve body is sealed to the periphery of the opening of the container body, whereby the periphery of the opening is sealed. O-ring is used as the sealing member. The O ring is fitted into an O ring groove formed around the opening of the container body.

Patent Document 1: Japanese Patent Application Laid-Open No. 5-196150

The valve body contacts around the opening of the container body each time the gate valve is opened or closed.

In addition, whenever the pressure inside the container main body is changed between the atmospheric state and the reduced pressure state, the stress caused by the atmospheric pressure is repeatedly applied to the valve body, so that some deformation is repeated. For this reason, the periphery of the opening may rub against the valve body each time the air condition and the vacuum state are repeated, and scratches may occur around the opening and the valve body.

If scratches occur around the opening, the container body itself needs to be replaced. For this reason, there exists a situation that the maintenance cost of a substrate processing apparatus using a vacuum apparatus is easy to increase. The occurrence of scratches may also be a factor of generation of particles.

An object of the present invention is to provide a vacuum device capable of suppressing an increase in maintenance cost and a substrate processing device using the same.

The vacuum apparatus which concerns on the 1st aspect of this invention is an airtight container main body which can hold a to-be-processed board | substrate in a vacuum state, the opening part which carries out the said to-be-processed board | substrate provided in the said container main body, and opens and closes the said opening part. Attached to and detached from the circumference of the opening, which is formed in a frame shape so as to surround the opening, and provided with a frame-shaped sealing member on both the container body side surface and the valve body side surface facing the container body side surface. It is provided with the sealing plate which can be mounted.

The substrate processing apparatus which concerns on the 2nd aspect of this invention is a process chamber which can process a to-be-processed board | substrate which can hold a to-be-processed board | substrate, and places the to-be-processed board | substrate in both an atmospheric state and a vacuum state. And a transfer chamber for conveying the substrate to be processed between the load lock chamber and the processing chamber in which the substrate to be processed can be exchanged before and after the treatment, and the processing substrate can be kept in a vacuum state. As a substrate processing apparatus, at least one of the said process chamber, the said load lock chamber, and the said conveyance chamber is comprised using the vacuum apparatus which concerns on the said 1st aspect.

A vacuum apparatus according to a third aspect of the present invention includes a container body configured to be airtight in order to keep a substrate under vacuum, an opening for discharging the substrate to be processed provided in the container body, and a valve body for opening and closing the opening. And a frame-shaped sealing member provided on the valve body side surface of the opening portion so as to surround the opening, and is inside the frame-shaped sealing member provided on the valve body side surface of the valve body side surface of the container body. Has a lower surface than the outer surface of the frame-shaped sealing member.

A vacuum apparatus according to a fourth aspect of the present invention is a process chamber in which a substrate to be processed can be placed in a vacuum state and a processing chamber for processing the substrate to be processed, and the substrate to be processed in both an atmospheric state and a vacuum state. A substrate having a load lock chamber for exchanging a substrate to be processed before and after processing, and a transfer chamber for conveying the substrate to be processed between the load lock chamber and the processing chamber, wherein the substrate can be vacuumed. As the processing apparatus, at least one of the processing chamber, the load lock chamber, and the transfer chamber is configured by using the vacuum apparatus according to the vacuum apparatus according to the third aspect.

According to the present invention, it is possible to provide a vacuum device capable of suppressing an increase in maintenance cost and a substrate processing device using the same.

1 is a plan view schematically showing an example of a substrate processing apparatus using a vacuum apparatus according to a first embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view taken along the line 2-2 in FIG. 1;
3 is a cross-sectional view showing a state in which a gate valve is opened;
4 is a perspective view of the sealing plate,
5 is a cross-sectional view showing a state where the sealing plate is separated;
6 is a cross-sectional view showing a modification of the sealing plate included in the vacuum apparatus according to the first embodiment;
7 is a view showing a shape deformation of the valve body 61;
8 is a cross-sectional view showing an example of a sealing plate according to a second embodiment of the present invention;
9 is a view showing contact between a valve body and a sealing plate;
10 is a cross-sectional view showing a modification of the sealing plate according to the second embodiment;
11 is a cross-sectional view showing a modification of the sealing plate according to the second embodiment;
12 is a sectional view schematically showing a vacuum device according to a third embodiment of the present invention;
Fig. 13 is a sectional view schematically showing a vacuum device that can simultaneously accommodate a plurality of substrates to be processed.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described with reference to drawings. Throughout the drawings to be referred, the same reference numerals are assigned to the same parts.

In this description, an FPD substrate is taken as an example of a substrate to be processed, and a description will be given by exemplifying a processing apparatus that performs a predetermined process, for example, etching or film formation, on the FPD substrate.

(1st embodiment)

1 is a plan view schematically showing a processing apparatus in which a vacuum apparatus according to a first embodiment of the present invention is used.

As shown in FIG. 1, the processing apparatus 1 which concerns on 1st Embodiment is the processing chamber which performs the process to the to-be-processed board | substrate G, in this example, the some process chamber 10a, 10b, and the to-be-processed object. The load lock chamber 20 which exchanges the process board G, the load lock chamber 20, the process chamber 10a or 10b, and the conveyance chamber 30 which conveys the to-be-processed board | substrate G between the process chamber 10a and the process chamber 10b. And the conveying apparatus 40 which conveys the to-be-processed substrate G provided in the conveyance chamber 30. As shown in FIG.

In this example, the processing chambers 10a, 10b, the load lock chamber 20, and the transfer chamber 30 are vacuum devices, and the container body 50 that is airtightly configured, in which the substrate G to be processed can be placed in a predetermined reduced pressure state, respectively. ). The container main body 50 is provided with the opening part 51 which carries out the to-be-processed substrate G.

The opening part 51 provided in the container main body 50 of the process chambers 10a and 10b is connected to the opening part 51 provided in the container main body 50 of the conveyance chamber 30 via the gate valve chamber 60. Similarly, the opening part 51 provided in the container main body 50 of the load lock chamber 20 is connected to the opening part 51 provided in the container main body 50 of the conveyance chamber 30 via the gate valve chamber 60. . The valve body 61 of the gate valve is accommodated in the gate valve chamber 60, and the opening part 51 is opened and closed by the valve body 61. In this example, the valve body 61 is configured to be in close contact with the container main body 50 of the processing chambers 10a and 10b and the container main body 50 of the load lock chamber 20, so that the valve body 61 may be respectively in contact with each other. By being in close contact with the circumference of the opening 51, the container body 50 is hermetically sealed.

In addition, the load lock chamber 20 has an opening part 51 which opens to the atmosphere side, ie, the exterior of the substrate processing apparatus 1. The opening part 51 opened to the outside is used for carrying in from the exterior of the to-be-processed substrate G before a process, and carrying out to the exterior of the processed to-be-processed substrate G, and is opened and closed by the valve body 61 opened under atmospheric conditions. .

FIG. 2 is a schematic cross-sectional view taken along the line 2-2 in FIG. 1. 2, the cross section of the load lock chamber 20 and the partial cross section of the conveyance chamber 30 are shown. 2 is sectional drawing in the state in which the gate valve was closed, and shows the cross section which shows the state in which the gate valve was opened in FIG.

As shown in FIG. 2, the valve body 61 in this example is in close contact with an opening 51 provided in the container body 50 of the load lock chamber 20. In FIG.2 and FIG.3, 51a is attached | subjected to the opening part 51 of the atmosphere side provided in the container main body 50 of the load lock chamber 20, and the opening part 51 of the pressure reduction side (conveyance chamber 30 side) is shown. ) And the reference numeral 51b.

The opening part 51a on the atmospheric side is opened to the atmosphere, but the opening part 51b on the pressure reducing side (the conveying chamber 30 side) is connected to the gate valve chamber 60. The gate valve chamber 60 is connected to the container body 50 of the load lock chamber 20 through a frame-shaped sealing member 62, for example, an O-ring, and the gate valve chamber 60 is connected to the load lock chamber ( 20 is hermetically connected to the container body 50.

In addition, the gate valve chamber 60 is also connected to the opening part 51 provided in the container main body 50 of the transfer chamber 30. The gate valve chamber 60 is connected to the container main body 50 of the transfer chamber 30 via a frame-shaped sealing member 63, for example, an O-ring. As a result, the gate valve chamber 60 is hermetically connected to the container main body 50 of the transfer chamber 30.

In addition, in 1st Embodiment, the sealing plate 70 formed in the frame shape so that the opening part 51a and 51b of the container main body 50 may be provided in the circumference | surroundings of the opening part 51 is provided. The perspective view of the sealing plate 70 of a frame shape is shown in FIG.

The sealing plate 70 has frame-shaped sealing members 72a and 72b on both the container main body side surface 71a and the valve body side surface 71b facing this container main body side surface 71a. Frame-shaped sealing members 72a and 72b are fitted inside the sealing member grooves 73a and 73b formed in the container body side surface 71a and the valve body side surface 71b, respectively. The sealing plate 70 is connected to the container main body 50 via the frame-shaped sealing member 72a, and the sealing plate 70 is hermetically connected to the container main body 50. The valve body 61 is not in contact with the container body 50 but is in contact with the valve body side surface 71b of the sealing plate 70. The valve body 61 tightly seals the container main body 50 by being in close contact with the sealing plate 70 through the frame-shaped sealing member 72b. One example of the frame-shaped sealing member 72b is a fluorine rubber O ring such as Viton (registered trademark) and FloroPlus.

The sealing plate 70 is detachably mounted around the opening 51 provided in the container main body 50. For this reason, for example, as shown in FIG. 5, the sealing plate 70 can be separated from the container body 50.

The sealing plate 70 contacts the valve body 61 every time the gate valve is opened or closed. Moreover, the valve body 61 deform | transforms whenever the pressure in the inside of the container main body 50 is changed from a standby state to a reduced pressure state and a reduced pressure state to a standby state. For this reason, the sealing plate 70 rubs with the valve body 61.

Thus, since the sealing plate 70 contacts and rubs with the valve body 61, there exists a possibility that a scratch may arise. If a scratch occurs in the sealing plate 70, it must be replaced. However, since the sealing plate 70 can be separated from the container body 50, it is easy to replace.

In addition, in the case of a system in which the valve body directly contacts the container body, if a scratch occurs around the opening, it must be replaced for each container body.

In this regard, since the sealing plate 70 only needs to be replaced in the first embodiment, the container body 50 does not need to be replaced. Although the container main body 50 is expensive, the sealing plate 70 is remarkably cheap compared with the container main body 50.

Therefore, according to 1st Embodiment, it is possible to suppress the increase of the maintenance cost of the vacuum apparatus represented by a process chamber, a load lock chamber, a conveyance chamber, etc. Moreover, the substrate processing apparatus using the vacuum apparatus which can suppress the increase of maintenance cost can be obtained.

In addition, in 1st Embodiment, when the possibility of a scratch generate | occur | producing in the sealing plate 70 and the generation | occurrence | production of the particle by the generation of a scratch further are to be suppressed, the following devises may be implemented.

The surface of the sealing plate 70, at least the valve body side surface 71b to be rubbed with the valve body 61 or the container body 50, the container body side surface 71a is covered with hard alumite, or surface treated on the hard alumite. For example, a fluororesin impregnation process is performed. Thereby, compared with the case where the surface of the sealing plate 70 has exposed the material which comprises the sealing plate 70, for example, the surface of aluminum as it is, the sliding of the surface of the sealing plate 70 can be made favorable. It is possible to suppress the possibility that scratches occur in the sealing plate 70.

In addition, in 1st Embodiment, when it is going to improve the sealing property by the sealing plate 70, the following devises may be implemented.

For example, the sealing member 72a provided in the container main body side surface 71a of the sealing plate 70, and the sealing member 72b provided in the valve body side surface 71b are the pressure direction A of the valve body 61. Place on a straight line parallel to. Specifically, as shown in FIG. 6, the center 74a of the frame-shaped sealing member 72a and the center 74b of the frame-shaped sealing member 72b are parallel to the pressing direction A of the valve body 61. Place in a straight line. Thereby, compared with the case where the frame-shaped sealing member 72a and the frame-shaped sealing member 72b are mutually displaced, the sealing plate 70 is more strongly sandwiched between the valve body 61 and the container main body 50. The sealing property by the sealing plate 70 can be improved.

(2nd embodiment)

2nd Embodiment relates to the example which reduces the grazing of the valve body 61 and the sealing plate 70 further.

When the inside of the container main body 50 is in a reduced pressure state, the valve body 61 receives the pressure difference between the internal pressure of the container main body 50 and an external pressure. In the most remarkable case, as shown in FIG. 7, when the container main body 50 is in a reduced pressure state, atmospheric pressure is applied to the valve body 61. Such a situation can be seen in the valve body which hermetically seals the periphery of the atmospheric opening 51a of the load lock chamber 20.

If there is a large pressure difference between the inside and the outside of the valve body 61, the valve body 61 deforms. For example, when the outer side of the valve body 61 is in a standby state and the inner side is in a reduced pressure state, the valve body 61 is deformed to be concave toward the sealing plate 70 side as shown in FIG. 7.

Although the deformation | transformation in the vertical cross section of a valve body is shown in FIG. 7, since the opening part 51a of the load lock chamber 20 is a wide opening in a horizontal direction, the deformation of a valve body also has a large deformation in a horizontal cross section.

In order to suppress such deformation | transformation, although devising, for example, attaching a reinforcing member, such as a rib, is carried out on the outer surface (atmosphere side) of a valve body, it is impossible to suppress deformation completely. Therefore, in the valve body side surface 71b of the sealing plate 70, the inner surface (shown in the dashed-circle circle 75 in drawing) strongly rubs with the valve body 61 than the sealing member 72b. For this reason, a scratch is easy to generate | occur | produce in the part shown with the dotted line circle | round | yen 75.

It is sectional drawing which shows an example of the sealing plate which concerns on 2nd Embodiment of this invention.

Therefore, as shown in FIG. 8, in the sealing plate 70A which concerns on 2nd Embodiment, the surface inside of the valve body side surface 71b is more than the sealing member 72b with which this valve body side surface 71b was equipped. It is made lower than the surface outside of this sealing member 72b. Thus, even if the valve body 61 is deformed to be concave toward the sealing plate 70 side, the surface inside the sealing member 72b of the valve body side surface 71b does not contact the valve body 61. It can be set as the structure which does not contact or hardly touches.

Thus, according to 2nd Embodiment, since the surface inside of the sealing member 72b does not contact or hardly touches the valve body 61, it is possible to set it as the valve body 61 and the sealing plate. The grazing of 70 can be further reduced.

Further, as a result of reducing the scratch, scratches may not occur or may be more difficult to occur, and generation of particles due to scratches may also be suppressed. When generation | occurrence | production of a particle is suppressed, since the to-be-processed substrate G can be processed in a clean environment, it is advantageous also for production of high quality FPD.

Moreover, 2nd Embodiment is the invention demonstrated by said 1st Embodiment, ie, the surface of the sealing plate 70, the valve body side surface 71b friction with at least the valve body 61 and the container main body 50, a container The device which covers hard alumite on the main body side 71a, or surface-treats on hard alumite, and the sealing member 72a and the sealing member 72b are in parallel with the pressurizing direction A of the valve body 61 in a straight line. It can carry out in combination with the devised to arrange | position to.

In addition, the structure of 2nd Embodiment, ie, the structure which makes the surface inside of the sealing member 72b lower than the surface outside of the sealing member 72b, has the periphery of the opening part 51 of the container main body 50. It can also be applied to a vacuum device provided with a groove for a sealing member.

In addition, in 2nd Embodiment, when it is going to suppress generation | occurrence | production of particle | grains further, what is necessary is just to devise the following devise.

When the valve body 61 is in close contact with the sealing plate 70, the valve body 61 comes into contact with the valve body side surface 71b of the sealing plate 70. As shown in FIG. 9, even in the case of the sealing plate 70 which concerns on 2nd Embodiment, in the valve body side surface 71b of the sealing plate 70, the surface outside the sealing member 72b (in the figure) Shown in the dashed circle 76) is in contact with the valve body 61. When both the valve body 61 and the sealing plate 70 are metal, it may scratch by contact and a particle may generate | occur | produce.

Then, as shown in FIG. 10, the abrasion resistant member 77 is provided on the surface outside the sealing member 72b among the valve body side surfaces 71b. One example of the wear resistant member 77 is a resin material. Examples of the resin material include polytetrafluoroethylene (PTFE), polyacetal (POM), and the like.

Thus, when the valve body 61 comes into close contact with the sealing plate 70, the sealing member (in the valve body side surface 71b) is the surface in which the valve body 61 and the sealing plate 70 contact each other. By providing the wear-resistant member 77 on the surface outside the 72b), even when both the valve body 61 and the sealing plate 70 are metal, the contact of metals can be prevented and particle | grains generate | occur | produce. Can be suppressed more. ?

In addition, in the case where the contact area between the valve body 61 and the wear resistant member 77 is to be made smaller, as shown in FIG. 11, the linear diameter db of the sealing member 72b provided on the valve body side surface 71b is represented. What is necessary is just to make it larger than the linear diameter da of the sealing member 72a with which the container main body side surface 71a was equipped.

Thus, by making the linear diameter db of the sealing member 72b larger than the linear diameter da of the sealing member 72a, the area of the outer surface of the valve body side surface 71b is smaller than the sealing member 72b. It is possible to reduce the area of the wear resistant member 77. By decreasing the area of the wear resistant member 77, the contact area between the valve body 61 and the wear resistant member 77 can be made smaller. When the contact area between the valve body 61 and the wear resistant member 77 decreases, for example, the generation of particles due to the valve body 61 itself, which is caused by scratching the valve body 61, can be further suppressed. It becomes possible.

Moreover, also when the linear diameter db of the sealing member 72b is made larger than the linear diameter da of the sealing member 72a, the center 74b of the sealing member 72b and the center 74a of the sealing member 72a are also It is good to arrange this in a straight line parallel with the pressurizing direction A of the valve body 61. By doing in this way, the sealing property by the sealing plate 70 can be improved.

(Third embodiment)

The third embodiment relates to an example of miniaturizing a vacuum device.

As described in the first and second embodiments, in the embodiment of the present invention, the sealing plates 70 and 70A are newly provided. For this reason, a vacuum apparatus will increase as much as the sealing plates 70 and 70A.

It is sectional drawing which shows an example of the vacuum apparatus which concerns on 3rd Embodiment of this invention.

Therefore, as shown in FIG. 12, in 3rd Embodiment, the embedding part 80 which embeds the sealing plate 70 (or 70A) is provided in the circumference | surroundings of the opening part 51 of the container main body 50. As shown in FIG. .

Thus, according to 3rd Embodiment, since the sealing plate 70 (or 70A) was made to embed in the embedding part 80 provided around the opening part 51, the sealing member 70 (or 70A) is a container. It is possible not to protrude from the main body 50 or to reduce the amount of protruding, thereby facilitating the miniaturization of the vacuum apparatus provided with the sealing plate 70 (or 70A).

In addition, 3rd Embodiment can be implemented in combination with the invention demonstrated by the said 1st Embodiment, the invention demonstrated by 2nd Embodiment, or 2nd Embodiment.

In addition, although the example in which the embedding part 80 is provided in the circumference | surroundings of the opening part 51a of the air side is shown in FIG. You may provide it in both of the opening part 51a and 51b.

As mentioned above, although this invention was demonstrated according to 1st-3rd embodiment, this invention is not limited to the said 1st-3rd embodiment, Various deformation | transformation are possible.

For example, in 1st thru | or 3rd embodiment, although the vacuum apparatus which accommodates one to-be-processed board | substrate is illustrated in the container main body, for example, as shown in FIG. It can also be applied to a vacuum device that is acceptable at the same time.

In addition, the container body which can simultaneously accommodate a plurality of substrates to be processed is usually larger in size than the container body that accommodates one substrate to be processed, and the price is also high. For this reason, the present invention can be applied more effectively to a container body capable of accommodating a plurality of substrates to be processed simultaneously.

In addition, although the FPD board | substrate was shown as the to-be-processed board | substrate in the said 1st-3rd embodiment, the to-be-processed board | substrate is not limited to the board | substrate for FPD, It may be other board | substrates, such as a solar cell board | substrate and a semiconductor wafer.

DESCRIPTION OF SYMBOLS 1: Substrate processing apparatus, 10a, 10b: process part, 20: load lock chamber, 30: conveyance chamber, 50: container main body, 51: opening part, 60: gate valve chamber, 61: valve body, 70: sealing plate, 71a: container Side surface, 71b: Valve body side surface, 72a, 72b: Frame shape sealing member, 80: Buried part

Claims (11)

An airtight container body capable of placing a substrate under vacuum in a vacuum state,
An opening for dispensing the substrate to be processed, provided in the container body;
A valve body for opening and closing the opening;
It is formed in a frame shape so as to surround said opening, and it is detachably attached to the circumference | surroundings of the said opening part provided with the frame shape sealing member in both the container main body side surface and the valve body side surface facing this container main body side surface. Sealing plate mounted
Provided with
The inner surface of the valve body side surface being lower than the outer surface based on the position of the frame-shaped sealing member based on the position of the frame-shaped sealing member.
Vacuum device, characterized in that.
The method of claim 1,
The center of the frame-shaped sealing member provided on the container body side surface of the sealing plate and the center of the frame-shaped sealing member provided on the valve body side surface are disposed in a straight line in parallel with the pressing direction of the valve body. Vacuum device, characterized in that.
delete The method according to claim 1 or 2,
The vacuum apparatus characterized by the above-mentioned valve body side surface being provided with an abrasion resistant member on the surface outside the frame-shaped sealing member provided in the said valve body side surface.
The method of claim 2,
The width | variety of the frame-shaped sealing member provided in the said valve body side surface is larger than the width | variety of the frame-shaped sealing member provided in the said container main body side surface.
The method according to claim 1 or 2,
And a buried portion in which the sealing plate is embedded is provided around the opening of the container body. The method according to claim 1 or 2,
And said container body is capable of simultaneously accommodating a plurality of substrates to be processed.
The method according to claim 1 or 2,
A vacuum apparatus, characterized in that a reinforcing member for suppressing deformation of the valve body is attached to a surface opposite to the sealing plate side surface of the valve body.
A processing chamber in which the substrate to be processed is subjected to processing, wherein the substrate can be vacuumed;
A load lock chamber for exchanging pre-processed and processed substrates capable of placing the substrates in both a standby state and a vacuum state;
Transfer chamber which conveys the said to-be-processed board | substrate between the said load lock chamber and the process chamber in which the said to-be-processed board | substrate can be put in a vacuum state.
A substrate processing apparatus having a
At least one of the said process chamber, the said load lock chamber, and the said conveyance chamber is comprised using the vacuum apparatus of Claim 1 or Claim 2.
Substrate processing apparatus, characterized in that.
A container body configured to be airtight in order to keep the substrate under vacuum in a vacuum state;
An opening for dispensing the substrate to be processed provided in the container body;
A valve body for opening and closing the opening;
The frame-shaped sealing member provided on the valve body side surface of the opening portion so as to surround the opening portion.
And
The inner surface of the valve body side surface of the container body is lower than the outer surface based on the position of the frame-shaped sealing member based on the position of the frame-shaped sealing member. Thing
Vacuum device, characterized in that.
A processing chamber in which the substrate to be processed is subjected to processing, wherein the substrate can be vacuumed;
A load lock chamber for exchanging pre-processed and processed substrates capable of placing the substrates in both a standby state and a vacuum state;
Transfer chamber which conveys the said to-be-processed board | substrate between the said load lock chamber and the process chamber in which the said to-be-processed board | substrate can be put in a vacuum state.
A substrate processing apparatus having a
At least any one of the said process chamber, the said load lock chamber, and the said conveyance chamber is comprised using the vacuum apparatus of Claim 10.
Substrate processing apparatus, characterized in that.

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