JP4914009B2 - 電気伝導体 - Google Patents
電気伝導体 Download PDFInfo
- Publication number
- JP4914009B2 JP4914009B2 JP2004560140A JP2004560140A JP4914009B2 JP 4914009 B2 JP4914009 B2 JP 4914009B2 JP 2004560140 A JP2004560140 A JP 2004560140A JP 2004560140 A JP2004560140 A JP 2004560140A JP 4914009 B2 JP4914009 B2 JP 4914009B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- wire
- weight
- antimony
- tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
- C23C2/022—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by heating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
- C23C2/024—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by cleaning or etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/08—Tin or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coating With Molten Metal (AREA)
- Insulated Conductors (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Valve Device For Special Equipments (AREA)
- Glass Compositions (AREA)
- Cable Accessories (AREA)
Description
74%から98.9%までの錫
1%から10%までのアンチモン
0.1%から25%までの銅
直径0.40mmの銅ワイヤはロジンの中を通され、乾燥のために静置され;その後、ワイヤは60℃−80℃に予熱される。
0.90mmのワイヤを使用し、そして約3.3cm/秒の速度でそれを浸して、約400℃の温度で合金溶槽を維持して、例1が繰り返された。
Claims (17)
- 銅芯からなり、円柱状のワイヤ形状を有し、円柱状のワイヤ形状の長さに沿って電気を伝導することができる電気ワイヤにおいて、前記銅芯を、錫、アンチモン及び銅からなる合金の溶融槽に所定の速度で連続して浸漬することによって、前記銅芯の外部表面全体に錫、アンチモン及び銅からなる合金の被覆層が形成されており、前記合金が、錫74−98.9重量%、アンチモン1−10重量%及び銅0.1重量%以上からなる電気ワイヤ。
- 前記合金が、錫95重量%、アンチモン4重量%及び銅1重量%から成る請求項1に記載の電気ワイヤ。
- 請求項1に記載の電気ワイヤが、
低レベル信号用の接続ケーブル、
電源供給用の接続ケーブル、
プリント回路トラック、
結合、信号、パルス若しくは電源のトランス、
双極、アレイ若しくはミクロストライプのアンテナ、又は
信号用、電源供給用若しくは電磁気スクリーン用のコネクター
に用いられる電気ワイヤの使用方法。 - 請求項3に記載のトランスにおいて、電気ワイヤの覆いが不伝導性の黒い絹で作製され、ワイヤ自体上に織ってあるトランス。
- 前記電気ワイヤが、
低レベル信号用の接続ケーブル、
電源供給用の接続ケーブル、
プリント回路トラック、
結合、信号、パルス若しくは電源のトランス、
双極、アレイ若しくはミクロストライプのアンテナ、及び
信号用、電源供給用若しくは電磁気スクリーン用のコネクター
からなる群から選ばれる機器の内部に組み込まれる請求項1に記載の電気ワイヤ。 - 請求項1に記載の電気ワイヤからなる巻線で作製されている電気的な分配経路のための電源トランス。
- 銅芯からなり、円柱状のワイヤ形状を有し、円柱状のワイヤ形状の長さに沿って電気を伝導することができる電気ワイヤにおいて、前記銅芯の外部表面全体を錫74−98.9重量%、アンチモン1−10重量%及び銅0.1重量%以上からなる合金の層で被覆するために、前記銅芯を錫74−98.9重量%、アンチモン1−10重量%及び銅0.1重量%以上からなる合金の溶融槽へ所定の速度で連続して浸漬し、伝導金属である前記銅芯上に合金層を形成した電気ワイヤ。
- 前記合金が、錫95重量%、アンチモン4重量%及び銅1重量%から成る請求項7に記載の電気ワイヤ。
- 請求項7に記載の電気ワイヤが、
低レベル信号用の接続ケーブル、
電源供給用の接続ケーブル、
プリント回路トラック、
結合、信号、パルス若しくは電源のトランス、
双極、アレイ若しくはミクロストライプのアンテナ、又は
信号用、電源供給用若しくは電磁気スクリーン用のコネクター
に用いられる電気ワイヤの使用方法。 - 前記電気ワイヤが、
低レベル信号用の接続ケーブル、
電源供給用の接続ケーブル、
プリント回路トラック、
結合、信号、パルス若しくは電源のトランス、
双極、アレイ若しくはミクロストライプのアンテナ、及び
信号用、電源供給用若しくは電磁気スクリーン用のコネクター
からなる群から選ばれる機器の内部に組み込まれる請求項7に記載の電気ワイヤ。 - 請求項7に記載の電気ワイヤからなる巻線で作製されている電気的な分配経路のための電源トランス。
- 請求項11に記載の電源トランスにおいて、電気ワイヤの覆いが不伝導性の黒い絹で作製され、ワイヤ自体上に織ってある電源トランス。
- 銅芯からなり、円柱状のワイヤ形状を有し、円柱状のワイヤ形状の長さに沿って電気を伝導することができる電気ワイヤの製造方法であって、錫74−98.9重量%、アンチモン1−10重量%及び銅0.1重量%以上からなる合金の溶融槽に伝導金属である前記銅芯を所定の速度で連続して浸漬する工程を含み、前記銅芯の外部表面全体に錫74−98.9重量%、アンチモン1−10重量%及び銅0.1重量%以上からなる合金層を形成させる電気ワイヤの製造方法。
- 合金が、錫95重量%、アンチモン4重量%及び銅1重量%から成る請求項13に記載の電気ワイヤの製造方法。
- 溶融槽が、300℃〜450℃の範囲の温度である請求項13に記載の電気ワイヤの製造方法。
- 浸漬工程前に、
伝導金属である銅芯がフラックスを通過する工程、
60℃〜90℃の範囲の温度で銅芯を予熱させる工程、
を更に含み、浸漬工程が3秒間である請求項13に記載の電気ワイヤの製造方法。 - 前記電気ワイヤが、
低レベル信号用の接続ケーブル、
電源供給用の接続ケーブル、
プリント回路トラック、
結合、信号、パルス若しくは電源のトランス、
双極、アレイ若しくはミクロストライプのアンテナ、及び
信号用、電源供給用若しくは電磁気スクリーン用のコネクター
からなる群から選ばれる機器の内部に組み込まれる工程を更に含む請求項13に記載の電気ワイヤの製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT002672A ITMI20022672A1 (it) | 2002-12-18 | 2002-12-18 | Conduttori elettrici. |
ITMI2002A002672 | 2002-12-18 | ||
PCT/IB2003/006245 WO2004055834A1 (en) | 2002-12-18 | 2003-12-17 | Electric conductors |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006511041A JP2006511041A (ja) | 2006-03-30 |
JP2006511041A5 JP2006511041A5 (ja) | 2012-01-05 |
JP4914009B2 true JP4914009B2 (ja) | 2012-04-11 |
Family
ID=32587869
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004560140A Expired - Fee Related JP4914009B2 (ja) | 2002-12-18 | 2003-12-17 | 電気伝導体 |
Country Status (10)
Country | Link |
---|---|
US (1) | US7501578B2 (ja) |
EP (1) | EP1581955B1 (ja) |
JP (1) | JP4914009B2 (ja) |
CN (1) | CN100401429C (ja) |
AT (1) | ATE421154T1 (ja) |
AU (1) | AU2003289662A1 (ja) |
DE (1) | DE60325899D1 (ja) |
DK (1) | DK1581955T3 (ja) |
IT (1) | ITMI20022672A1 (ja) |
WO (1) | WO2004055834A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3015762B1 (fr) * | 2013-12-19 | 2017-12-15 | Nexans | Element electriquement conducteur allonge resistant a l'oxydation |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2744063A (en) * | 1951-12-11 | 1956-05-01 | Gen Motors Corp | Electrodeposition of tin-antimonycopper alloys |
JPS60253115A (ja) * | 1984-05-29 | 1985-12-13 | 古河電気工業株式会社 | Sn又はSn合金メツキ導体の製造法 |
JPH03229848A (ja) * | 1990-02-05 | 1991-10-11 | Furukawa Electric Co Ltd:The | 溶融メッキ線の製造方法 |
JPH10286689A (ja) * | 1997-04-16 | 1998-10-27 | Fuji Electric Co Ltd | はんだ合金 |
JPH11211143A (ja) * | 1998-01-29 | 1999-08-06 | Matsushita Electric Ind Co Ltd | 分離型空気調和装置の電源板 |
JP2000119602A (ja) * | 1998-10-16 | 2000-04-25 | Tomoegawa Paper Co Ltd | 線材の繊維状被覆の固定用材料及び固定方法 |
JP2001230130A (ja) * | 2000-02-16 | 2001-08-24 | Tamura Seisakusho Co Ltd | 電源トランス |
JP2001262391A (ja) * | 2000-03-14 | 2001-09-26 | Ishihara Chem Co Ltd | スズ−銅系合金メッキ浴並びに当該皮膜を形成した電子部品 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
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US2774063A (en) * | 1954-02-05 | 1956-12-11 | Photocon Res Products | Sequential circuit control device |
US2950149A (en) * | 1957-01-29 | 1960-08-23 | John B Thomson | Relatively reciprocable shaft and bearing |
US3027269A (en) * | 1959-09-09 | 1962-03-27 | Yawata Iron & Steel Co | Process for coating ferrous metal with aluminum |
DE1957031C3 (de) * | 1969-11-13 | 1974-09-05 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Vorrichtung zum Herstellen von Zinn- oder Zinnlegierungsschichten auf Draht aus Kupfer oder Kupferlegierungen durch Feuerverzinnen |
FR2472252A1 (fr) * | 1979-12-18 | 1981-06-26 | Thomson Brandt | Cable electrique multifilaire isole, a conducteurs proteges, soudables et non thermo collants |
US4314230A (en) * | 1980-07-31 | 1982-02-02 | Raychem Corporation | Devices comprising conductive polymers |
DD220915A1 (de) | 1984-01-20 | 1985-04-10 | Mansfeld Kom W Pieck Fi F Ne M | Verfahren zur herstellung von draht aus metallegierungen mit einer solidustemperatur unter 600 k |
JPS6123737A (ja) | 1984-07-09 | 1986-02-01 | Nippon Mining Co Ltd | 耐熱性及び導電性に優れた銅合金 |
JPS61154790A (ja) | 1984-12-27 | 1986-07-14 | Toshiba Corp | 軸受メタル肉盛溶接用ワイヤ |
JPS61190058A (ja) | 1985-02-19 | 1986-08-23 | Hitachi Cable Ltd | 溶融メツキ方法 |
CN1005852B (zh) * | 1986-10-22 | 1989-11-22 | 北京市电信设备厂 | 电缆护套用多元铅合金和生产方法 |
EP0481493B1 (en) | 1990-10-18 | 1996-02-07 | Sumitomo Electric Industries, Limited | Fuse Conductor |
US5491036A (en) * | 1992-03-27 | 1996-02-13 | The Louis Berkman Company | Coated strip |
JP2942458B2 (ja) * | 1993-04-16 | 1999-08-30 | 住友電気工業株式会社 | フラットケーブル用導体の製造方法および製造設備 |
DE4442186C2 (de) * | 1994-11-26 | 1999-03-04 | Glyco Metall Werke | Schichtwerkstoff und Verfahren zu seiner Herstellung |
JP2002521794A (ja) * | 1998-07-21 | 2002-07-16 | パオロ・アゴスティネリ | 録音及び再生装置におけるオーディオ信号用、較正できる接続ケーブル |
JP2000156450A (ja) * | 1998-11-19 | 2000-06-06 | Hitachi Cable Ltd | 電子部品用リード |
JP3266242B2 (ja) * | 1999-10-12 | 2002-03-18 | 理研電線株式会社 | 錫めっき線の熱酸化黄変防止法 |
-
2002
- 2002-12-18 IT IT002672A patent/ITMI20022672A1/it unknown
-
2003
- 2003-12-17 CN CNB2003801057308A patent/CN100401429C/zh not_active Expired - Fee Related
- 2003-12-17 DE DE60325899T patent/DE60325899D1/de not_active Expired - Lifetime
- 2003-12-17 JP JP2004560140A patent/JP4914009B2/ja not_active Expired - Fee Related
- 2003-12-17 US US10/539,907 patent/US7501578B2/en not_active Expired - Fee Related
- 2003-12-17 DK DK03778694T patent/DK1581955T3/da active
- 2003-12-17 EP EP03778694A patent/EP1581955B1/en not_active Expired - Lifetime
- 2003-12-17 WO PCT/IB2003/006245 patent/WO2004055834A1/en active Application Filing
- 2003-12-17 AU AU2003289662A patent/AU2003289662A1/en not_active Abandoned
- 2003-12-17 AT AT03778694T patent/ATE421154T1/de active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2744063A (en) * | 1951-12-11 | 1956-05-01 | Gen Motors Corp | Electrodeposition of tin-antimonycopper alloys |
JPS60253115A (ja) * | 1984-05-29 | 1985-12-13 | 古河電気工業株式会社 | Sn又はSn合金メツキ導体の製造法 |
JPH03229848A (ja) * | 1990-02-05 | 1991-10-11 | Furukawa Electric Co Ltd:The | 溶融メッキ線の製造方法 |
JPH10286689A (ja) * | 1997-04-16 | 1998-10-27 | Fuji Electric Co Ltd | はんだ合金 |
JPH11211143A (ja) * | 1998-01-29 | 1999-08-06 | Matsushita Electric Ind Co Ltd | 分離型空気調和装置の電源板 |
JP2000119602A (ja) * | 1998-10-16 | 2000-04-25 | Tomoegawa Paper Co Ltd | 線材の繊維状被覆の固定用材料及び固定方法 |
JP2001230130A (ja) * | 2000-02-16 | 2001-08-24 | Tamura Seisakusho Co Ltd | 電源トランス |
JP2001262391A (ja) * | 2000-03-14 | 2001-09-26 | Ishihara Chem Co Ltd | スズ−銅系合金メッキ浴並びに当該皮膜を形成した電子部品 |
Also Published As
Publication number | Publication date |
---|---|
EP1581955B1 (en) | 2009-01-14 |
CN1726564A (zh) | 2006-01-25 |
WO2004055834A1 (en) | 2004-07-01 |
ATE421154T1 (de) | 2009-01-15 |
DK1581955T3 (da) | 2009-05-11 |
EP1581955A1 (en) | 2005-10-05 |
US7501578B2 (en) | 2009-03-10 |
US20060054347A1 (en) | 2006-03-16 |
AU2003289662A1 (en) | 2004-07-09 |
DE60325899D1 (de) | 2009-03-05 |
JP2006511041A (ja) | 2006-03-30 |
ITMI20022672A1 (it) | 2004-06-19 |
CN100401429C (zh) | 2008-07-09 |
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