CN100401429C - 电导体 - Google Patents

电导体 Download PDF

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Publication number
CN100401429C
CN100401429C CNB2003801057308A CN200380105730A CN100401429C CN 100401429 C CN100401429 C CN 100401429C CN B2003801057308 A CNB2003801057308 A CN B2003801057308A CN 200380105730 A CN200380105730 A CN 200380105730A CN 100401429 C CN100401429 C CN 100401429C
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electric wire
copper
manufacturing
alloy
electric
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CN1726564A (zh
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帕劳阿高斯蒂尼
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C23C2/022—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by heating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C23C2/024—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by cleaning or etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08—Tin or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coating With Molten Metal (AREA)
  • Insulated Conductors (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Valve Device For Special Equipments (AREA)
  • Glass Compositions (AREA)
  • Cable Accessories (AREA)

Abstract

本发明公开的电线由能够传导电流的金属线构成，其外表面包裹在由特定的金属按设定量组成的合金中。

Description

电导体
发明领域
本发明涉及电线领域。
背景技术
小的和可变的电信号例如声频信号的传输已经证明是一种比本领域已经知道的要复杂得多的现象，这是因为在电信号的传输中，发生了听众可听见的现象，如声音的音色、空间性和刺耳度，虽然这些现象不能用仪器来鉴别。
由用来制造传统电线的铜造成的高频的失真和中声频的压缩(packing)是可听见的并且立即被银布线(silver wiring)察觉。
为了克服上述问题，美国专利6399885公开了由许多电线组成的电缆，这些电线按串联或并联的方式排放，各自由不同的金属(具体是金、铜、或银)制造，所述的电线彼此绝缘并被包裹在介电护皮中。
尽管这些电线很可靠，但由于需要用金并且制造复杂，它们显然难以按工业水平来提供。
另一种解决办法是应用滤波器或补偿电路，以便补偿由部件的金属和布线产生的各种音色或失真。但是，其结果不完全令人满意，失真仍然存在，无法消除并能被听众察觉。
鉴于单独使用银可产生非常清晰的无失真的声音，但这种声音很弱并且确实太金属性的事实，因此，消除上述的与纯金属相关的负面因素就非常重要。
发明内容
令人惊喜地发现，有可能以完全令人满意的方法解决上述问题，所述的方法是使用金属线，在它的表面上沉积由合适的金属按设定的百分比组成的合金。
另外，已经发现，本说明书所叙述的和所主张保护的电线不仅完美地解决了上述的问题，而且还可用于其它的应用，在这些应用中电信号传输的纯度对于获得优秀的最终性能是必需的。
具体实施方式
本发明的电线由能够传导电流的普通金属构成，例如铜线，其外表面覆盖在含锡、锑和铜的合金之中。
优选地，构成该合金的各种金属以下列浓度存在：
锡    74％-989％
锑    1％-10％
铜    01％-25％
更优选地，本发明合金由锡95％、锑4％、铜1％构成。
通常，随着合金层厚度增加，电线的品质也提高。
为了得到本发明电线，将金属线浸渍在包含熔融合金的池(浴)中。显然，电线停留在池中的时间取决于池的温度、构成电线的金属的种类和电线的尺寸，以便使合金沉积在电线上而不会由于在过高的温度浸泡的时间太长而使电线发生熔化或损坏。
如果，例如，电线的直径是0.4mm，使用的池有300℃-450℃之间的温度，则电线浸泡的时间是大约三秒钟。
在浸渍入熔融的合金池之前，金属线最好先通过一种焊剂，其种类为通常用于电气材料的焊接或用于电路制造的种类，例如松香，然后让它干燥，该焊剂能提高熔融合金对电线的粘合性。
如果需要，在浸渍入合金浴之前，可以将电线预热到，例如60°-90℃之间的温度。
以下是制造本发明电线的实施例。
实施例1
将直径0 40mm的铜线通过松香，让它干燥，然后将该铜线预热到60°-80℃。
然后将该电线以3m/min的速度浸渍入装有熔融的由锡(95％)、锑(4％)和铜(1％)构成的合金的坩埚中，其温度为大约400℃，浸泡时间为大约3秒钟。
然后将沉积了一层合金的电线冷却。
实施例2
重复实施例1，使用0 90mm电线，并以大约33cm/sec的速度将其浸渍，保持合金池的温度在大约400℃。
用按照以上实施例制造的电线进行的试验表明，分辨率(resolution)有了相当大的提高，因为在例如声频或视频领域中，与其有关的参数都提高了：环境、微观对比度和颜色。
本发明电线适合于非常宽广范围的应用，不仅可作为低水平信号用的接线电缆，而且可用作电力供应接线电缆，用于印刷电路轨道，用于耦合、信号、脉冲和电力变压器，用于偶极、阵列和微波传送带天线，用于供信号或电力供应用的连接线以及用于电磁屏蔽的连接器。
本发明特别涉及电力变压器，用于模拟、数字和脉冲信号的配电网和/或耦合变压器，它们的线圈是用上述的电线制造的。
优选地，用于本发明变压器的介电护皮是用黑丝(black silk)制造的，优选编织在电线本身上面。
特别是，所述的变压器能够提高声频信号中的动力学，降低供电噪声；它们还能够提高微信息和环境，改变录制和重放(复制)系统的音色；所述的现象也能够在耦合变压器中获得。
将所述电力变压器用于视频系统，可提高颜色和对比度，降低噪声。
用上述的电线制造的用于数字信号的变压器与用其它电线材料制造的变压器比较，对于上述参数已经产生了非常好的结果。

Claims (6)

1.由能够传导电流的金属构成的电线，其外表面覆盖在一层含锡、锑和铜的合金层中，其特征在于，所述的合金由：74-98.9wt％锡、1-10wt％锑和0.1-10wt％铜组成。
2.如权利要求1所述的电线，其特征在于，所述的合金由：95wt％锡、4wt％锑和1wt％铜组成。
3.如权利要求1所述的电线，其特征在于，所述的能够传导电流的金属是铜。
4.如权利要求2所述的电线，其特征在于，所述的能够传导电流的金属是铜。
5.如权利要求1-4任一项所述的电线的用途，其可用于低水平信号的接线电缆的制造，用于电力供应的接线电缆的制造，用于印刷电路轨道和耦合、信号、脉冲和电力变压器的制造，偶极、阵列和微波传输带天线的制造，用于信号或电力供应的连接线以及电磁屏蔽的连接线的制造。
6.用于配电网的电力变压器，其线圈是用如权利要求1-4任一项的电线制造的。
CNB2003801057308A 2002-12-18 2003-12-17 电导体 Expired - Fee Related CN100401429C (zh)

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IT002672A ITMI20022672A1 (it) 2002-12-18 2002-12-18 Conduttori elettrici.
ITMI2002A002672 2002-12-18

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CN1726564A CN1726564A (zh) 2006-01-25
CN100401429C true CN100401429C (zh) 2008-07-09

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US (1) US7501578B2 (zh)
EP (1) EP1581955B1 (zh)
JP (1) JP4914009B2 (zh)
CN (1) CN100401429C (zh)
AT (1) ATE421154T1 (zh)
AU (1) AU2003289662A1 (zh)
DE (1) DE60325899D1 (zh)
DK (1) DK1581955T3 (zh)
IT (1) ITMI20022672A1 (zh)
WO (1) WO2004055834A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3015762B1 (fr) * 2013-12-19 2017-12-15 Nexans Element electriquement conducteur allonge resistant a l'oxydation

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US6399885B1 (en) * 1998-07-21 2002-06-04 Paolo Agostinelli Audio signal connection cable for recording and reproduction devices

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Publication number Priority date Publication date Assignee Title
US3692578A (en) * 1969-11-13 1972-09-19 Siemens Ag Method of producing tin layers or tin alloy layers on copper or copper alloy wires by hot tin plating
US4524241A (en) * 1979-12-18 1985-06-18 Thomson-Brandt Insulated multiwire electric cable having protected solderable and non-heat-sealing conductors
US4314230A (en) * 1980-07-31 1982-02-02 Raychem Corporation Devices comprising conductive polymers
DD220915A1 (de) * 1984-01-20 1985-04-10 Mansfeld Kom W Pieck Fi F Ne M Verfahren zur herstellung von draht aus metallegierungen mit einer solidustemperatur unter 600 k
JPS6123737A (ja) * 1984-07-09 1986-02-01 Nippon Mining Co Ltd 耐熱性及び導電性に優れた銅合金
JPS61154790A (ja) * 1984-12-27 1986-07-14 Toshiba Corp 軸受メタル肉盛溶接用ワイヤ
CN86107231A (zh) * 1986-10-22 1987-05-20 北京市电信设备厂 电缆护套用多元铅合金和生产方法
US6399885B1 (en) * 1998-07-21 2002-06-04 Paolo Agostinelli Audio signal connection cable for recording and reproduction devices

Also Published As

Publication number Publication date
DE60325899D1 (de) 2009-03-05
DK1581955T3 (da) 2009-05-11
ITMI20022672A1 (it) 2004-06-19
JP2006511041A (ja) 2006-03-30
EP1581955A1 (en) 2005-10-05
US20060054347A1 (en) 2006-03-16
CN1726564A (zh) 2006-01-25
AU2003289662A1 (en) 2004-07-09
US7501578B2 (en) 2009-03-10
ATE421154T1 (de) 2009-01-15
EP1581955B1 (en) 2009-01-14
JP4914009B2 (ja) 2012-04-11
WO2004055834A1 (en) 2004-07-01

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