456164456164
五、發明説明⑴ 發明領域 本發明係關於可撓性導線或 波干擾（EM丨）遮蔽膜，尤其有關一種&卩刷電路板之電磁 形成該電磁波干擾遮蔽膜的方法。 由物理蒸氣沉積來 發明背景 電磁波干擾（e I e c t r。ma g n e t i e i n t e f 簡稱EM I)爲不想要的能量放射，其 e=nee，以下 過⑴其中o.u至於_至超 (川)的範園。 MHz部分爲兴線電頻率干擾 EMI的放射係伴隨電子設備的使用而 L個等ΓΕΜΙ的放射將造成電子設備η: 干擾而產生雜訊的問題，於是影響到，例如無 器材、實驗儀器及人工心臟等等，的正常運· 目前世界上先進國家已經對電子設備之最大可允許ΕΜι放 射立下標準，例如美國聯邦通訊委員會（FCC)於ns3年對 會生ΙΟΚΗζ至lGGOMHz的數位電子產品立下標準。 E Μ丨的消除一般可藉由在各項電子元件或設備上形成 —具低阻抗的遮蔽層而將放射包住。對於一般硬的非導電 衬料的Ε Μ I遮蔽方法常用的包括在電子設備的塑膠外殼上 ，成一金屬性塗層，例如噴漆、化學金屬化及眞空金屬化 等，及直接包覆以一金屬箔。金屬的種類包括銅、銀、 銘·、鎳、銀、金、鋅等。 目前由於電子設備的日趨微小化，可撓性印刷電路板V. Description of the Invention 领域 Field of the Invention The present invention relates to a flexible wire or wave interference (EM 丨) shielding film, and more particularly to a method of forming an electromagnetic wave interference shielding film by brushing the electromagnetic waves of a circuit board. BACKGROUND OF THE INVENTION Physical vapor deposition Background of the invention Electromagnetic wave interference (e I e c t r. Ma g n e t i e n t e f for short EM I) is an unwanted emission of energy, with e = nee, where the following o.u is to _ to Chao (chuan) of Fanyuan. The MHz part is a radio system that interferes with EMI with radio frequency. With the use of electronic equipment, the emission of L and other ΓΕΜΙ will cause electronic equipment η: interference and the problem of noise, so it affects, for example, no equipment, experimental instruments and labor The normal operation of the heart and so on. At present, advanced countries in the world have set standards for the maximum allowable EMI emission of electronic equipment. For example, the United States Federal Communications Commission (FCC) has established digital electronics products that will produce IOKΗζ to 1GGOMHz in 3 years. standard. The elimination of E Μ 丨 can generally be covered by radiation by forming a low-impedance shielding layer on various electronic components or equipment. For the EMI shielding method of general hard non-conductive lining materials, it is commonly used to form a metallic coating on the plastic shell of electronic equipment, such as spray painting, chemical metallization, hollow metallization, etc., and directly cover it with a metal. Foil. The types of metals include copper, silver, indium, nickel, silver, gold, zinc, and the like. At present, due to the miniaturization of electronic equipment, flexible printed circuit boards
^ 4561 64 五、發明説明（2) 腦、大耳士、κ 器整合成—體的1㈠個人電 路板上i各種1C ^器等。再者’裝置於該可挽性印刷電 板上 < 各種1C叫片的數目（密度} 算功能越來越強，偵撂可姑w A A水越巧及丨c印片的運 性襻绫所ϋ Φ 印刷電路板及相配合的可撓 :生導線所發射出_1也愈來愈強，因此必須在 挽 表面形成EMI遜蔽層，以防止對鄰 電 庙 不想要的影響。 π 匕電子扠備產生 Η SI撓Ϊ導線及可撓性印刷電路板的ΕΜ丨遮蔽膜的 刷導線或可撓性印刷電路板的-表面上印 金屬性塗層及/或包覆以一導電黏性膠帶。前 =了金屬外尚需靠非金屬化學品作爲介質才能有足夠附 $力；而後者則包含一高分子基材，鍍於該基材一表面上 的金屬層及形成於該金屬層上的黏著劑層。以印刷方 金屬性塗層作爲EMI遮蔽膜，因爲其非完全的金屬膜，故 必須施予相當厚度（例如约2 0 " m或高）才能具有低阻抗的 性質，導致可撓性導線或印刷電路板可撓性的降低，此外 其Ε Μ I遮蔽能力亦不盡理想，尚需再外覆以該導電黏性勝 帶。然而’可撓性導線或印刷電路板本身一般均具有用於 外接IC晶片的插座、連接埠或連接孔等，此等部&必須被 維持曝露狀態，不可覆以Ε Μ I遮蔽膜。於是，該導電黏性 膠帶必須被預先形成對應於該等不欲形成Ε Μ丨遮蔽膜部份 的窗口，才能被包覆於可撓性導線或印刷電路板的外表 面，造成費時費工及產量無法提昇的瓶頸。 五、發明説明⑶ 、 本發明之主要目的即在提供一種不具有上述先前技藝 之缺點的可撓性導線或可撓性印刷電路板的Ε1Π遮蔽膜形 成方法。 本發明之另一目的在提供一種具Ε{^遮蔽膜的可撓性 片狀電子設備。 發明要旨 j達成上述發明目的依本發明所完成的一種於可撓性 導士或:撓性印刷電路板形成電磁波干擾（EMI}遮蔽膜的 万法，包含下列步驟： 蔽膜2;: 了挽性導線或印刷電路板的欲被形細遮 及 b丨於該清潔過的表面上物理蒸氣沈積一第一金屬膜； c)於該第一金屬膜上形成一最終保護膜。 較佳地，本發明方法進—步包含： b’）於步驟〇之前於該第一金 或電鍍方式形成一第二金屬膜匕 /、、氣沈積 /或耐磨擦性而被作爲該第一全屬此膜第；、气屬膜具抗氧化及 較佳地’本發明方法的步驟） z漆或蠟層。 電鍍方式於兹第一金屬膜上形Π::;理蒸氣沈積或 耐磨擦性的第-冷_凰瞄而柞鱼、.至屬膜具抗氧化及 二丨叼弟一金屬艇而作爲孩最終保護膜。 、佳地’本發明方法的步驟b)的物理蒸氣沈積爲錢^ 4561 64 V. Description of the invention (2) The brain, ears, and κ devices are integrated into a single body on a personal circuit board, and various 1C devices are provided. Furthermore, it is installed on the removable printed board < the number (density) of various 1C bids is becoming more and more powerful. ϋ Φ Printed circuit board and matching flexible: _1 emitted by green wires is also getting stronger and stronger, so an EMI shielding layer must be formed on the surface to prevent unwanted effects on neighboring electric temples. π Dagger Electronics Fork generation of SI flexible conductors and EMI of flexible printed circuit boards. Brushed conductors of the shielding film or flexible printed circuit boards. The surface is printed with a metallic coating and / or covered with a conductive adhesive tape. Front = The metal has to rely on non-metallic chemicals as a medium to have sufficient adhesion; the latter includes a polymer substrate, a metal layer plated on a surface of the substrate, and formed on the metal layer Adhesive layer. The printed metal coating is used as the EMI shielding film. Because it is not a complete metal film, it must be applied with a considerable thickness (for example, about 20 " m or higher) to have low impedance properties, resulting in Reduced flexibility of flexible wires or printed circuit boards The shielding ability of ML is also not ideal, and it needs to be covered with the conductive adhesive tape. However, 'flexible wires or printed circuit boards themselves generally have sockets, ports or connection holes for external IC chips, etc. These parts must be maintained in an exposed state and cannot be covered with an EMI masking film. Therefore, the conductive adhesive tape must be previously formed with a window corresponding to the portion of the EMI masking film that is not intended to be formed. It is covered on the outer surface of the flexible wire or printed circuit board, which causes a bottleneck that takes time and labor, and the output cannot be improved. 5. Description of the invention (3) The main purpose of the present invention is to provide a method that does not have the disadvantages of the foregoing prior art. A method for forming an E1Π shielding film for a flexible wire or a flexible printed circuit board. Another object of the present invention is to provide a flexible sheet-shaped electronic device having an E {^ shielding film. Summary of the Invention A method for forming an electromagnetic wave (EMI) shielding film on a flexible guide or a flexible printed circuit board completed by the present invention includes the following steps: The shielding film 2; The circuit board to be brushed is covered and b 丨 physical vapor deposition of a first metal film on the cleaned surface; c) forming a final protective film on the first metal film. Preferably, the method of the present invention The further step includes: b ') forming a second metal film, gas deposition, or abrasion resistance on the first gold or electroplating method before step 0 and making the first all belong to this film; 2. The gas-based membrane has anti-oxidation and preferably 'the steps of the method of the present invention) Z paint or wax layer. The electroplating method is formed on the first metal film Π ::; the first cold film of the vapor deposition or abrasion resistance, and the metal film with anti-oxidation and anti-oxidation properties Baby ultimate protective film. Good place 'physical vapor deposition of step b) of the method of the present invention is money
456164 五、發明説明⑷ 鍍〇 膜 金 米 較佳地，本發明方法的第一金屬膜爲銅、銀、金或銘 並且其厚度介於0.2微米至1〇微米。 較佳地，本發明方法的第二金屬膜係鎳、鉻、鎳合 鉻合金或不銹鋼膜，並且其厚度介於〇·1微米至lG微 本發明亦提供一種具電磁波干擾（EM1)遮蔽膜的可撓 性片狀電子設備，包含： 一可撓片狀電子設備，其具有一絕緣表面； 一沈積於該絕緣表面的第一金屬膜，該第一金屬膜伯 _、銀、金或鋁膜，並且其厚度介於Q 2至1Q微米；·' 一形成於該一金屬膜上的第二金屬膜，該第二金 '彳、鉻、鎳合金、鉻合金或不銹鋼膜，並且其厚度 〇 · 1至i G微米；及 、/予反4於 一形成於該第二金屬膜上的最終保護膜，該 版爲以塗佈方式所报ώ m 4„ 承1保護 成 較 佳 地， 本發 明 的 第 較 佳 地， 本發 明 的 第 較 佳 地， 本發 明 的 第 二 較 佳 地， 本發 明 的 第 _ 較 佳 地， 本發 明 的 第 二 較 佳 地， 本發 明 的 第 二 較佳 地， 本發 明 的 最 終 形 微米456164 V. Description of the Invention ⑷ Plating 0 Film Gold Rice Preferably, the first metal film of the method of the present invention is copper, silver, gold, or indium and has a thickness between 0.2 micrometers and 10 micrometers. Preferably, the second metal film of the method of the present invention is a nickel, chromium, nickel-chromium alloy or stainless steel film, and its thickness is between 0.1 micrometer and 1 micrometer. The invention also provides a shielding film with electromagnetic interference (EM1) The flexible sheet electronic device includes: a flexible sheet electronic device having an insulating surface; a first metal film deposited on the insulating surface, the first metal film being silver, gold, or aluminum Film, and its thickness is between Q 2 and 1Q microns; · 'a second metal film formed on the first metal film, the second gold', chromium, nickel alloy, chromium alloy or stainless steel film, and its thickness 〇 1 to i Gum; and / or anti-4 in a final protective film formed on the second metal film, the plate is reported as a coating method. The first preferred invention, the second preferred invention, the second preferred invention, the _ preferred invention, the second preferred invention, the second preferred invention Ground-shaped micrometers of the present invention
的 修正 補充 456164 I號 881134^ 曰 五、發明說明（5) 蠟層。 較佳地，本發明的最終保護膜為藉塗佈清漆所形 清漆層。 較佳地’在本發明方法的步驟（a)清潔之前，該表面 不欲被形成EM I遮蔽獏的部份被貼以一耐高溫黏性躍帶而 加予遮蓋。 發明之詳細說明 本發明對一片狀的可撓性電子設備提供一新穎的ΕΜΙ 遮蔽臈製備方法。本發明方法具有簡單、產量高及所形成 EMI遮蔽膜品質優良等優點。 適用於本發明的片狀可换性電子設備並無特別限制， 一般係指可撓性導線及尚未被焊接上丨C晶片的可撓性印刷 電路板。典型的可撓性導線包含藉由蝕刻而形成於一聚醯 亞胺基材上的複數條平行金屬導線及一覆於該複數條平行 金屬^線上的聚酿亞胺絕緣膜。典型的可换性印刷電路板 具有類似於可撓性導線的結構’但前者具有較複雜的線路 圖案及用於外接IC晶片的插座、連接埠或連接孔等，甚至 具有多層的金屬層（中間間隔有絕緣層基材）。以下將以可 撓性印刷電路板為例來說明本發明的一較佳的實施態樣， 其中的主要步驟及步驟b)至C)的作用如圖〗a&ib所示β 。 該可撓性印刷電路板的一表面上必須被維持曝露狀態 的插座、連接埠或連接孔部份被貼以一耐高溫黏性勝帶， 例如以聚醯亞胺為基材的黏性膠帶，而加予遮蓋。Amendment Supplement 456164 I No. 881134 ^ V. Description of the invention (5) Wax layer. Preferably, the final protective film of the present invention is a varnish layer formed by applying a varnish. Preferably, before the step (a) of the method of the present invention, the part of the surface that is not to be shielded by the EM I is covered with a high-temperature-resistant adhesive tape. DETAILED DESCRIPTION OF THE INVENTION The present invention provides a novel method for preparing EMI shielding materials for one-piece flexible electronic devices. The method of the invention has the advantages of simplicity, high yield and excellent quality of the EMI shielding film formed. The sheet-shaped interchangeable electronic device applicable to the present invention is not particularly limited, and generally refers to a flexible lead and a flexible printed circuit board that has not been soldered to a C chip. A typical flexible wire includes a plurality of parallel metal wires formed on a polyimide substrate by etching, and a polyimide insulating film covering the plurality of parallel metal wires. A typical interchangeable printed circuit board has a structure similar to a flexible wire, but the former has a more complicated circuit pattern and sockets, ports or connection holes for external IC chips, and even has multiple metal layers (middle Spaced with an insulating substrate). In the following, a flexible printed circuit board is taken as an example to illustrate a preferred embodiment of the present invention. The main steps and the effects of steps b) to C) are shown in FIG. A & ib. A part of the socket, port or connection hole of the flexible printed circuit board that must be maintained in an exposed state is pasted with a high temperature resistant adhesive tape, such as a polyimide-based adhesive tape. And add cover.
\\Chenlin\19991l03\pl900\parl969Aniend01.ptc 第8頁 2001.05. 29.008 456164 號 881134(^ 参年rfr修正 修正 a i、發明說明（6) 多…以桩ί ^性有機溶劑’例如異丙醇，擦拭該表面-或 心中m過的可撓性印刷電路板送入-滅鍍反 ΐίΐ^ΐϊ的濺㈣作條件下，例如：iqw5 一 卜氛，室溫至15Qt溫度，HG分鐘’ 微牛0 ^ : a’js在该表面上濺鍍—層厚度介於〇_ 2微米至10 ί:;Ϊί屬膜，例如鋼、銀、金或紹膜。於本發明的 ;ΐ=:: V 於2xl〇-3 torr堡力及5.5 κ"_氣 .^ C溫度濺鍍2分鐘時間而形成一厚度約〇, 6微 於該銅膜上再以類似的條件濺鍍一厚度約〇_ 3 ，未不銹鋼臈來保護該銅膜使其不易氧化 31 6被用作為射靶。 ^ ^ 一石油蠟接著被塗佈於該不銹鋼膜上進行防手紋處理 不錄鋼膜及銅膜°最後’除去該耐高溫黏 !·生膠f即可獲得一具有ΕΜΙ遮蔽膜的可撓性印刷電路板。 於本發明的另—較佳實施例中，一可撓性印刷電路板除了 未被塗佈該石油蠟外被以相同的步驟形成一鋼 膜的EMI遮蔽膜。 另綱 本發明方法所獲得的EM I遮蔽膜，其外觀不具有裂 縫:，且附著情形優良，不易從該可撓性印刷電路板的 面剝落，而且實質上不損及該可撓性印刷電路板的可撓、 ί*·^» 〇\\ Chenlin \ 19991l03 \ pl900 \ parl969Aniend01.ptc Page 8 2001.05. 29.008 456164 No. 881134 (^ rfr correction and amendment ai, description of the invention (6) and more ... use organic solvents such as isopropyl alcohol to wipe The surface-or the flexible printed circuit board passing through the heart-is fed into the plate under anti-plating conditions, such as: iqw5 atmosphere, room temperature to 15Qt temperature, HG minutes' micro cattle 0 ^ : a'js is sputtered on the surface-the layer thickness is between 0_ 2 microns and 10 ί:; ίί is a film, such as steel, silver, gold or Shao film. In the present invention; ΐ = :: V 于 2xl 〇-3 torr strength and 5.5 κ " _ gas. ^ C temperature sputtering for 2 minutes to form a thickness of about 0.6 micron on the copper film and then sputtering a thickness of about 0_3 under similar conditions. Stainless steel was used to protect the copper film from being easily oxidized. 31 6 was used as a target for shooting. ^ ^ A petroleum wax was then coated on the stainless steel film for anti-handprint treatment. The steel film and copper film were not removed. Finally, the High temperature resistance! • Raw rubber f can obtain a flexible printed circuit board with an EMI shielding film. In another preferred embodiment of the present invention, The flexible printed circuit board is formed of a steel film EMI shielding film in the same steps except that the petroleum wax is not coated. In addition, the EM I shielding film obtained by the method of the present invention does not have cracks in its appearance: and The adhesion is excellent, it is not easy to peel off from the surface of the flexible printed circuit board, and it does not substantially damage the flexibility of the flexible printed circuit board. Ί * · ^ »〇
456164 弇.fe 號 88113499 年月曰 修正 '圖式簡單說明 圖1 a為依本發明的一較佳實施例的方法之流程方塊 圖。 圖1 b顯示一可撓性印刷電路板於圖1 a流程的步驟b)至 c)時的剖面示意圖。No. 456164 弇 .fe No. 88113499 Revised 'Simplified description of the drawing' Figure 1a is a block diagram of a method according to a preferred embodiment of the present invention. FIG. 1 b is a schematic cross-sectional view of a flexible printed circuit board during steps b) to c) in the process of FIG. 1 a.
WChenl ίη\19991103\pl900\parl969Amend〇Lptc 第9-1頁 2001.05. 30.010WChenl ίη \ 19991103 \ pl900 \ parl969Amend〇Lptc page 9-1 2001.05. 30.010