JP4864307B2 - エアーギャップを選択的に形成する方法及び当該方法により得られる装置 - Google Patents

エアーギャップを選択的に形成する方法及び当該方法により得られる装置 Download PDF

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JP4864307B2
JP4864307B2 JP2004284815A JP2004284815A JP4864307B2 JP 4864307 B2 JP4864307 B2 JP 4864307B2 JP 2004284815 A JP2004284815 A JP 2004284815A JP 2004284815 A JP2004284815 A JP 2004284815A JP 4864307 B2 JP4864307 B2 JP 4864307B2
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dielectric material
air gap
etching
manufacturing
dielectric
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JP2005123607A (ja
JP2005123607A5 (enExample
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ゲラルト・バイヤー
ジャン・ポール・ゲノー・ドゥ・ミュシー
カレン・メックス
ビクター・サトクリフ
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Interuniversitair Microelektronica Centrum vzw IMEC
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    • H10W20/096—
    • H10W10/021—
    • H10W10/20—
    • H10W20/072—
    • H10W20/081—
    • H10W20/46—
    • H10P14/6334—
    • H10P14/6336—
    • H10P14/6342—
    • H10P14/665—
    • H10P14/6905—
    • H10P14/6922—
    • H10P50/283—
    • H10W20/071—
    • H10W20/0765—
    • H10W20/095—

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Drying Of Semiconductors (AREA)
  • Window Of Vehicle (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
JP2004284815A 2003-09-30 2004-09-29 エアーギャップを選択的に形成する方法及び当該方法により得られる装置 Expired - Fee Related JP4864307B2 (ja)

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US50761303P 2003-09-30 2003-09-30
US60/507613 2003-09-30

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JP2005123607A JP2005123607A (ja) 2005-05-12
JP2005123607A5 JP2005123607A5 (enExample) 2005-11-04
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US (2) US7078352B2 (enExample)
EP (1) EP1521302B1 (enExample)
JP (1) JP4864307B2 (enExample)
AT (1) ATE505813T1 (enExample)
DE (1) DE602004032198D1 (enExample)

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Also Published As

Publication number Publication date
EP1521302B1 (en) 2011-04-13
US20050074961A1 (en) 2005-04-07
EP1521302A1 (en) 2005-04-06
US7078352B2 (en) 2006-07-18
JP2005123607A (ja) 2005-05-12
ATE505813T1 (de) 2011-04-15
DE602004032198D1 (de) 2011-05-26
US7319274B2 (en) 2008-01-15
US20060177990A1 (en) 2006-08-10

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