JP4851613B2 - 半導体ウエハ表面保護用粘着テープ - Google Patents

半導体ウエハ表面保護用粘着テープ Download PDF

Info

Publication number
JP4851613B2
JP4851613B2 JP2010220068A JP2010220068A JP4851613B2 JP 4851613 B2 JP4851613 B2 JP 4851613B2 JP 2010220068 A JP2010220068 A JP 2010220068A JP 2010220068 A JP2010220068 A JP 2010220068A JP 4851613 B2 JP4851613 B2 JP 4851613B2
Authority
JP
Japan
Prior art keywords
semiconductor wafer
adhesive tape
protecting
pressure
sensitive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010220068A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011151355A (ja
Inventor
啓時 横井
祥文 岡
正三 矢野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THE FURUKAW ELECTRIC CO., LTD.
Original Assignee
THE FURUKAW ELECTRIC CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THE FURUKAW ELECTRIC CO., LTD. filed Critical THE FURUKAW ELECTRIC CO., LTD.
Priority to JP2010220068A priority Critical patent/JP4851613B2/ja
Priority to CN201080054015.6A priority patent/CN102754200B/zh
Priority to KR1020127014335A priority patent/KR101230736B1/ko
Priority to PCT/JP2010/073054 priority patent/WO2011078193A1/ja
Priority to TW099145115A priority patent/TWI465541B/zh
Publication of JP2011151355A publication Critical patent/JP2011151355A/ja
Application granted granted Critical
Publication of JP4851613B2 publication Critical patent/JP4851613B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
    • C08G18/6216—Polymers of alpha-beta ethylenically unsaturated carboxylic acids or of derivatives thereof
    • C08G18/622—Polymers of esters of alpha-beta ethylenically unsaturated carboxylic acids
    • C08G18/6225—Polymers of esters of acrylic or methacrylic acid
    • C08G18/6229—Polymers of hydroxy groups containing esters of acrylic or methacrylic acid with aliphatic polyalcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
    • C08G18/6216—Polymers of alpha-beta ethylenically unsaturated carboxylic acids or of derivatives thereof
    • C08G18/625—Polymers of alpha-beta ethylenically unsaturated carboxylic acids; hydrolyzed polymers of esters of these acids
    • C08G18/6254—Polymers of alpha-beta ethylenically unsaturated carboxylic acids and of esters of these acids containing hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/003—Presence of (meth)acrylic polymer in the primer coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C09J2475/003—Presence of polyurethane in the primer coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
JP2010220068A 2009-12-22 2010-09-29 半導体ウエハ表面保護用粘着テープ Active JP4851613B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010220068A JP4851613B2 (ja) 2009-12-22 2010-09-29 半導体ウエハ表面保護用粘着テープ
CN201080054015.6A CN102754200B (zh) 2009-12-22 2010-12-21 半导体晶片表面保护用胶带
KR1020127014335A KR101230736B1 (ko) 2009-12-22 2010-12-21 반도체 웨이퍼 표면 보호용 점착 테이프
PCT/JP2010/073054 WO2011078193A1 (ja) 2009-12-22 2010-12-21 半導体ウエハ表面保護用粘着テープ
TW099145115A TWI465541B (zh) 2009-12-22 2010-12-22 Insulating tape for semiconductor wafer surface protection

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009291497 2009-12-22
JP2009291497 2009-12-22
JP2010220068A JP4851613B2 (ja) 2009-12-22 2010-09-29 半導体ウエハ表面保護用粘着テープ

Publications (2)

Publication Number Publication Date
JP2011151355A JP2011151355A (ja) 2011-08-04
JP4851613B2 true JP4851613B2 (ja) 2012-01-11

Family

ID=44195720

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010220068A Active JP4851613B2 (ja) 2009-12-22 2010-09-29 半導体ウエハ表面保護用粘着テープ

Country Status (5)

Country Link
JP (1) JP4851613B2 (zh)
KR (1) KR101230736B1 (zh)
CN (1) CN102754200B (zh)
TW (1) TWI465541B (zh)
WO (1) WO2011078193A1 (zh)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5898445B2 (ja) * 2011-09-30 2016-04-06 リンテック株式会社 基材フィルムおよび該基材フィルムを備えた粘着シート
KR101393895B1 (ko) * 2011-11-02 2014-05-13 (주)엘지하우시스 절단성이 우수한 반도체 웨이퍼 표면보호용 점착필름
KR101985049B1 (ko) 2012-02-17 2019-05-31 후루카와 덴키 고교 가부시키가이샤 반도체 웨이퍼 표면 보호용 점착 테이프
JP5138102B1 (ja) * 2012-02-17 2013-02-06 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープ
JP5367903B2 (ja) * 2012-03-19 2013-12-11 古河電気工業株式会社 半導体ウェハ表面保護用粘着テープ
JP5100902B1 (ja) * 2012-03-23 2012-12-19 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープ
JP2013229563A (ja) * 2012-03-26 2013-11-07 Furukawa Electric Co Ltd:The 半導体ウェハ表面保護用粘着テープ
JP5193376B1 (ja) * 2012-03-26 2013-05-08 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープ
JP5117630B1 (ja) * 2012-07-06 2013-01-16 古河電気工業株式会社 半導体ウェハ表面保護用粘着テープおよびそれを用いた半導体ウェハの製造方法
KR101539133B1 (ko) * 2012-07-10 2015-07-23 (주)엘지하우시스 반도체 웨이퍼 표면보호 점착필름 및 그의 제조방법
JP5480415B1 (ja) * 2012-10-11 2014-04-23 古河電気工業株式会社 半導体ウェハ加工用粘着テープ
CN103272746B (zh) * 2013-05-23 2016-04-27 沈阳黎明航空发动机(集团)有限责任公司 一种喷漆象形保护区域保护方法
JP6168553B2 (ja) * 2013-08-30 2017-07-26 日立マクセル株式会社 ダイシング用粘着テープおよび半導体チップの製造方法
JP6333596B2 (ja) * 2014-03-26 2018-05-30 リンテック株式会社 樹脂層付きワーク固定シートの製造方法
JP6366975B2 (ja) * 2014-03-27 2018-08-01 デクセリアルズ株式会社 接着フィルム巻装体、接続体の製造方法及び電子部品の接続方法
JP6528259B2 (ja) * 2014-08-19 2019-06-12 リンテック株式会社 表面保護フィルム
WO2016027908A1 (ja) * 2014-08-19 2016-02-25 リンテック株式会社 表面保護フィルム
TWI679117B (zh) * 2014-09-19 2019-12-11 日商琳得科股份有限公司 表面保護薄膜
JP5823591B1 (ja) * 2014-10-01 2015-11-25 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープおよび半導体ウエハの加工方法
CN112625609B (zh) * 2015-03-30 2022-11-08 琳得科株式会社 树脂膜形成用片及树脂膜形成用复合片
JP6486176B2 (ja) * 2015-04-15 2019-03-20 株式会社ディスコ 被加工物の切削加工方法
KR102528633B1 (ko) * 2015-04-30 2023-05-03 린텍 가부시키가이샤 워크 가공용 점착 테이프
WO2017072901A1 (ja) * 2015-10-29 2017-05-04 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープおよび半導体ウエハの加工方法
WO2017138310A1 (ja) * 2016-02-10 2017-08-17 デンカ株式会社 粘着シート
KR102040244B1 (ko) * 2016-02-23 2019-11-04 주식회사 엘지화학 반도체 웨이퍼 표면 보호용 점착 필름 및 그 제조 방법
SG11201804425RA (en) * 2016-03-03 2018-09-27 Lintec Corp Adhesive tape for semiconductor processing and method for producing semiconductor device
KR20180125977A (ko) * 2016-03-30 2018-11-26 린텍 가부시키가이샤 필름상 접착제, 반도체 가공용 시트 및 반도체 장치의 제조 방법
WO2018043391A1 (ja) * 2016-08-29 2018-03-08 古河電気工業株式会社 マスク一体型表面保護テープ
CN109312199B (zh) * 2016-09-20 2021-11-02 琳得科株式会社 半导体加工用粘合片
KR101940550B1 (ko) * 2017-08-10 2019-01-22 애경화학 주식회사 박막 고점착성을 가지는 oca용 아크릴 점착제 조성물 및 그 제조방법
JP7066998B2 (ja) * 2017-08-23 2022-05-16 デクセリアルズ株式会社 スペーサ含有テープ
JP7092526B2 (ja) * 2018-03-14 2022-06-28 マクセル株式会社 バックグラインド用粘着テープ
EP3786246A4 (en) * 2018-04-24 2022-01-19 Mitsui Chemicals Tohcello, Inc. SELF-ADHESIVE FILM AND ELECTRONIC DEVICE PRODUCTION METHOD
KR102239210B1 (ko) * 2018-06-04 2021-04-09 주식회사 엘지화학 백 그라인딩 테이프
TWI673172B (zh) * 2018-07-26 2019-10-01 福科膠研股份有限公司 晶圓承載方法
CN110828352A (zh) * 2018-08-07 2020-02-21 福科胶研股份有限公司 晶圆承载方法
JP7408278B2 (ja) 2018-11-28 2024-01-05 グンゼ株式会社 バックグラインドテープ用の用基体フィルム
JPWO2020137980A1 (ja) * 2018-12-25 2021-11-18 積水化学工業株式会社 粘着テープ
KR20210149688A (ko) * 2019-03-29 2021-12-09 린텍 가부시키가이샤 반도체 가공용 보호 시트 및 반도체 장치의 제조 방법
JP7292151B2 (ja) * 2019-08-23 2023-06-16 理想科学工業株式会社 感熱孔版原紙用支持体及び感熱孔版原紙
EP3919578A1 (en) * 2020-06-02 2021-12-08 Nitto Denko Corporation Pressure-sensitive adhesive sheet for semiconductor processing
KR20230135057A (ko) * 2021-01-18 2023-09-22 에이지씨 가부시키가이샤 필름 및 반도체 패키지의 제조 방법
KR20240032112A (ko) * 2021-07-13 2024-03-08 닛토덴코 가부시키가이샤 점착 시트
DE112022003007T5 (de) * 2021-07-13 2024-04-11 Nitto Denko Corporation Druckempfindliche Haftmittellage
CN117642475A (zh) * 2021-07-13 2024-03-01 日东电工株式会社 粘合片
TWI790004B (zh) * 2021-11-18 2023-01-11 山太士股份有限公司 段差填補的保護膠帶以及研磨方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002069396A (ja) * 2000-08-29 2002-03-08 Mitsui Chemicals Inc 半導体ウエハ保護用粘着フィルム及びそれを用いる半導体ウエハの裏面加工方法
JP2003306654A (ja) * 2002-04-16 2003-10-31 Furukawa Electric Co Ltd:The 放射線硬化型粘着テープ
JP4493296B2 (ja) * 2002-07-26 2010-06-30 日東電工株式会社 加工用粘着シートとその製造方法
WO2004069951A1 (ja) * 2003-02-05 2004-08-19 The Furukawa Electric Co., Ltd. ウエハ貼着用粘着テープ
US20050031822A1 (en) * 2003-08-07 2005-02-10 Mitsui Chemicals, Inc. Adhesive sheet
JP2005068420A (ja) * 2003-08-07 2005-03-17 Mitsui Chemicals Inc 粘着シート
JP4776189B2 (ja) * 2004-08-03 2011-09-21 古河電気工業株式会社 ウエハ加工用テープ
CN1827367A (zh) * 2005-02-23 2006-09-06 日东电工株式会社 多层片材及其制造方法和使用这种多层片材的粘合片材
JP5026832B2 (ja) * 2007-03-22 2012-09-19 古河電気工業株式会社 半導体デバイス加工用粘着テープ
JP5089358B2 (ja) * 2007-12-04 2012-12-05 古河電気工業株式会社 ウエハ加工用テープ
JP2009242776A (ja) * 2008-03-14 2009-10-22 Furukawa Electric Co Ltd:The 半導体ウエハ表面保護用粘着テープ
JP2009221324A (ja) * 2008-03-14 2009-10-01 Soken Chem & Eng Co Ltd 光学部材用粘着剤およびこれを利用した光学部材用保護フィルム
JP5457703B2 (ja) * 2008-03-31 2014-04-02 三井化学株式会社 ダイシングフィルム

Also Published As

Publication number Publication date
TWI465541B (zh) 2014-12-21
WO2011078193A1 (ja) 2011-06-30
TW201124503A (en) 2011-07-16
KR101230736B1 (ko) 2013-02-07
CN102754200A (zh) 2012-10-24
KR20120066685A (ko) 2012-06-22
CN102754200B (zh) 2015-05-27
JP2011151355A (ja) 2011-08-04

Similar Documents

Publication Publication Date Title
JP4851613B2 (ja) 半導体ウエハ表面保護用粘着テープ
JP7207778B2 (ja) 半導体加工用粘着テープ、及び半導体装置の製造方法
JP5718515B1 (ja) 半導体ウエハ表面保護用粘着テープおよび半導体ウエハの加工方法
JP7079200B2 (ja) 半導体ウェハ表面保護用粘着テープ及び半導体ウェハの加工方法
JP6053909B2 (ja) 半導体ウエハ表面保護用粘着テープおよびその製造方法
JP6169067B2 (ja) 電子部品加工用粘着テープ
JP4954572B2 (ja) 半導体ウエハ加工用保護シート、及びそれを用いた半導体ウエハの加工方法
JP6917166B2 (ja) ダイシング用粘着テープ、ダイシング用粘着テープの製造方法、および半導体チップの製造方法
WO2019181730A1 (ja) 粘着テープおよび半導体装置の製造方法
JP5697061B1 (ja) 半導体ウェハ加工用粘着テープおよび半導体ウェハの加工方法
JPWO2015046341A1 (ja) 粘着シート
JP2012209429A (ja) 半導体ウエハ加工用粘着テープ及び半導体ウエハの加工方法
JP7326249B2 (ja) 粘着テープおよび半導体装置の製造方法
JP5016703B2 (ja) 粘着シート及び電子部品の製造方法
KR102642081B1 (ko) 점착 테이프 및 반도체 장치의 제조 방법
TWI605502B (zh) Semiconductor wafer surface protection adhesive tape and semiconductor wafer processing method
JP2011213922A (ja) 半導体ウエハ加工用粘着シート
JPWO2018083986A1 (ja) ステルスダイシング用粘着シート
WO2023281861A1 (ja) 半導体加工用保護シートおよび半導体装置の製造方法
WO2023281858A1 (ja) 半導体加工用保護シートおよび半導体装置の製造方法
JP2012211227A (ja) 表面保護用粘着テープ
WO2023281859A1 (ja) 半導体加工用保護シートおよび半導体装置の製造方法
JP2014209629A (ja) 半導体ウエハ加工用粘着シート
JP2023108420A (ja) ワーク加工用シート
WO2019181401A1 (ja) 粘着テープおよび半導体装置の製造方法

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110329

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20110526

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20110531

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110627

TRDD Decision of grant or rejection written
A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20110907

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110920

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20111020

R151 Written notification of patent or utility model registration

Ref document number: 4851613

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20141028

Year of fee payment: 3

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350