JP4789446B2 - 基板の処理装置 - Google Patents

基板の処理装置 Download PDF

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Publication number
JP4789446B2
JP4789446B2 JP2004279848A JP2004279848A JP4789446B2 JP 4789446 B2 JP4789446 B2 JP 4789446B2 JP 2004279848 A JP2004279848 A JP 2004279848A JP 2004279848 A JP2004279848 A JP 2004279848A JP 4789446 B2 JP4789446 B2 JP 4789446B2
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JP
Japan
Prior art keywords
pipe
liquid
gas
chamber
gas pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2004279848A
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English (en)
Japanese (ja)
Other versions
JP2006093591A (ja
Inventor
秀樹 末吉
明典 磯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2004279848A priority Critical patent/JP4789446B2/ja
Priority to TW094130710A priority patent/TWI278031B/zh
Priority to CNB2005101057296A priority patent/CN100553801C/zh
Priority to KR1020050090145A priority patent/KR100742678B1/ko
Publication of JP2006093591A publication Critical patent/JP2006093591A/ja
Application granted granted Critical
Publication of JP4789446B2 publication Critical patent/JP4789446B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1316—Methods for cleaning the liquid crystal cells, or components thereof, during manufacture: Materials therefor

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Nozzles (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2004279848A 2004-09-27 2004-09-27 基板の処理装置 Active JP4789446B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004279848A JP4789446B2 (ja) 2004-09-27 2004-09-27 基板の処理装置
TW094130710A TWI278031B (en) 2004-09-27 2005-09-07 Apparatus for treating substrates
CNB2005101057296A CN100553801C (zh) 2004-09-27 2005-09-27 基板的处理装置
KR1020050090145A KR100742678B1 (ko) 2004-09-27 2005-09-27 기판의 처리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004279848A JP4789446B2 (ja) 2004-09-27 2004-09-27 基板の処理装置

Publications (2)

Publication Number Publication Date
JP2006093591A JP2006093591A (ja) 2006-04-06
JP4789446B2 true JP4789446B2 (ja) 2011-10-12

Family

ID=36234243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004279848A Active JP4789446B2 (ja) 2004-09-27 2004-09-27 基板の処理装置

Country Status (4)

Country Link
JP (1) JP4789446B2 (zh)
KR (1) KR100742678B1 (zh)
CN (1) CN100553801C (zh)
TW (1) TWI278031B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4954795B2 (ja) * 2007-05-31 2012-06-20 芝浦メカトロニクス株式会社 基板の保持装置及び基板の処理方法
KR101041168B1 (ko) * 2008-12-29 2011-06-14 정우리 저압분무장치
CN102078866A (zh) * 2009-11-26 2011-06-01 昆山厚声电子工业有限公司 薄膜片状基板的掩膜清洗烘干工艺
CN102091700B (zh) * 2009-12-10 2013-03-06 中芯国际集成电路制造(上海)有限公司 晶圆的喷雾清洗方法
JP6423204B2 (ja) * 2014-09-01 2018-11-14 株式会社モリタホールディングス 車両用収納装置及び支持部材
JP6865402B2 (ja) * 2017-07-10 2021-04-28 パナソニックＩｐマネジメント株式会社 洗浄方法及び洗浄装置
CN110180822A (zh) * 2019-06-18 2019-08-30 徐州玉伟机械设备有限公司 一种汽车变速箱齿轮生产用自动清洗装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51137628A (en) * 1975-05-26 1976-11-27 Nippon Steel Corp Method of correcting spangle pattern on surface of zinc coated steel strip
JPS63248464A (ja) * 1987-03-31 1988-10-14 Nisshin Steel Co Ltd 二流体ノズルヘツダ
JP3257340B2 (ja) * 1995-05-24 2002-02-18 松下電器産業株式会社 液体塗布方法、液体塗布装置およびスリットノズル
JP3626610B2 (ja) * 1998-11-02 2005-03-09 東京エレクトロン株式会社 処理装置及び処理方法
JP4611482B2 (ja) * 2000-02-22 2011-01-12 株式会社テック・ヤスダ バイス用のインデックスワークホルダ
JP3926593B2 (ja) * 2001-09-14 2007-06-06 大日本スクリーン製造株式会社 基板処理装置
WO2003071594A1 (fr) * 2002-02-25 2003-08-28 Sumitomo Precision Products Co., Ltd Dispositif de traitement de substrats de type support
JP2004237282A (ja) * 2003-01-16 2004-08-26 Kyoritsu Gokin Co Ltd 二流体ノズル

Also Published As

Publication number Publication date
TWI278031B (en) 2007-04-01
TW200631085A (en) 2006-09-01
CN1772400A (zh) 2006-05-17
JP2006093591A (ja) 2006-04-06
CN100553801C (zh) 2009-10-28
KR100742678B1 (ko) 2007-07-25
KR20060051701A (ko) 2006-05-19

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