JP4685584B2 - 塗布、現像装置 - Google Patents

塗布、現像装置 Download PDF

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Publication number
JP4685584B2
JP4685584B2 JP2005297989A JP2005297989A JP4685584B2 JP 4685584 B2 JP4685584 B2 JP 4685584B2 JP 2005297989 A JP2005297989 A JP 2005297989A JP 2005297989 A JP2005297989 A JP 2005297989A JP 4685584 B2 JP4685584 B2 JP 4685584B2
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JP
Japan
Prior art keywords
block
coating
substrate
unit
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2005297989A
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English (en)
Japanese (ja)
Other versions
JP2006287178A5 (https=
JP2006287178A (ja
Inventor
伸明 松岡
伸一 林
安 林田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2005297989A priority Critical patent/JP4685584B2/ja
Priority to SG200601316A priority patent/SG126044A1/en
Priority to EP06004600A priority patent/EP1701215A3/en
Priority to KR1020060022803A priority patent/KR101100503B1/ko
Priority to CN2006100898674A priority patent/CN1854898B/zh
Priority to TW095108257A priority patent/TWI296824B/zh
Priority to US11/373,118 priority patent/US7474377B2/en
Publication of JP2006287178A publication Critical patent/JP2006287178A/ja
Publication of JP2006287178A5 publication Critical patent/JP2006287178A5/ja
Application granted granted Critical
Publication of JP4685584B2 publication Critical patent/JP4685584B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP2005297989A 2005-03-11 2005-10-12 塗布、現像装置 Expired - Lifetime JP4685584B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2005297989A JP4685584B2 (ja) 2005-03-11 2005-10-12 塗布、現像装置
SG200601316A SG126044A1 (en) 2005-03-11 2006-03-03 Coating and developing system
EP06004600A EP1701215A3 (en) 2005-03-11 2006-03-07 Coating and developing system
CN2006100898674A CN1854898B (zh) 2005-03-11 2006-03-10 涂敷、显影装置
KR1020060022803A KR101100503B1 (ko) 2005-03-11 2006-03-10 도포· 현상장치
TW095108257A TWI296824B (en) 2005-03-11 2006-03-10 Coating and developing apparatus
US11/373,118 US7474377B2 (en) 2005-03-11 2006-03-13 Coating and developing system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005069682 2005-03-11
JP2005297989A JP4685584B2 (ja) 2005-03-11 2005-10-12 塗布、現像装置

Publications (3)

Publication Number Publication Date
JP2006287178A JP2006287178A (ja) 2006-10-19
JP2006287178A5 JP2006287178A5 (https=) 2007-11-22
JP4685584B2 true JP4685584B2 (ja) 2011-05-18

Family

ID=36582048

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005297989A Expired - Lifetime JP4685584B2 (ja) 2005-03-11 2005-10-12 塗布、現像装置

Country Status (6)

Country Link
US (1) US7474377B2 (https=)
EP (1) EP1701215A3 (https=)
JP (1) JP4685584B2 (https=)
KR (1) KR101100503B1 (https=)
SG (1) SG126044A1 (https=)
TW (1) TWI296824B (https=)

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SG162801A1 (en) * 2005-06-29 2010-07-29 Nikon Corp Exposure apparatus, substrate processing method, and device producing method
US7766565B2 (en) * 2005-07-01 2010-08-03 Sokudo Co., Ltd. Substrate drying apparatus, substrate cleaning apparatus and substrate processing system
JP4519037B2 (ja) * 2005-08-31 2010-08-04 東京エレクトロン株式会社 加熱装置及び塗布、現像装置
JP4687682B2 (ja) 2007-03-30 2011-05-25 東京エレクトロン株式会社 塗布、現像装置及びその方法並びに記憶媒体
JP2008258208A (ja) * 2007-03-30 2008-10-23 Tokyo Electron Ltd 塗布、現像装置及びその方法並びに記憶媒体
JP4908304B2 (ja) 2007-04-27 2012-04-04 東京エレクトロン株式会社 基板の処理方法、基板の処理システム及びコンピュータ読み取り可能な記憶媒体
US8636458B2 (en) * 2007-06-06 2014-01-28 Asml Netherlands B.V. Integrated post-exposure bake track
KR100904392B1 (ko) * 2007-06-18 2009-06-26 세메스 주식회사 기판 처리 장치
KR100897850B1 (ko) 2007-06-18 2009-05-15 세메스 주식회사 기판 처리 장치
JP5006122B2 (ja) 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4957426B2 (ja) * 2007-07-19 2012-06-20 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像装置の運転方法並びに記憶媒体
KR100914004B1 (ko) 2007-07-27 2009-08-26 삼성기전주식회사 인쇄회로기판 노광 자동화 시스템 및 그 작동방법
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JP5128918B2 (ja) 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5179170B2 (ja) 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ 基板処理装置
DE102008047234B4 (de) 2008-09-12 2018-12-06 Henkel Ag & Co. Kgaa Reparaturdüse und Reparatursystem
JP4751460B2 (ja) 2009-02-18 2011-08-17 東京エレクトロン株式会社 基板搬送装置及び基板処理システム
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JP5736687B2 (ja) * 2009-10-06 2015-06-17 東京エレクトロン株式会社 基板処理装置
JP4941570B2 (ja) * 2010-03-04 2012-05-30 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
JP5102861B2 (ja) 2010-05-28 2012-12-19 東京エレクトロン株式会社 基板処理システム用加熱装置の昇温制御方法、プログラム、コンピュータ記録媒体及び基板処理システム
JP5338757B2 (ja) 2010-07-09 2013-11-13 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5408059B2 (ja) 2010-07-09 2014-02-05 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5490741B2 (ja) * 2011-03-02 2014-05-14 東京エレクトロン株式会社 基板搬送装置の位置調整方法、及び基板処理装置
JP5964654B2 (ja) * 2012-05-24 2016-08-03 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理方法
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JP5758509B2 (ja) * 2014-01-17 2015-08-05 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理方法および基板処理装置
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JP6552931B2 (ja) * 2015-09-18 2019-07-31 東京エレクトロン株式会社 基板処理装置及び基板処理方法
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Also Published As

Publication number Publication date
TWI296824B (en) 2008-05-11
US7474377B2 (en) 2009-01-06
SG126044A1 (en) 2006-10-30
EP1701215A3 (en) 2012-04-04
EP1701215A2 (en) 2006-09-13
TW200731330A (en) 2007-08-16
US20060201616A1 (en) 2006-09-14
KR20060098339A (ko) 2006-09-18
JP2006287178A (ja) 2006-10-19
KR101100503B1 (ko) 2011-12-29

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