JP4662943B2 - コンタクトの形成中、コンタクトホール幅の増大を防ぐ方法 - Google Patents

コンタクトの形成中、コンタクトホール幅の増大を防ぐ方法 Download PDF

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Publication number
JP4662943B2
JP4662943B2 JP2006539499A JP2006539499A JP4662943B2 JP 4662943 B2 JP4662943 B2 JP 4662943B2 JP 2006539499 A JP2006539499 A JP 2006539499A JP 2006539499 A JP2006539499 A JP 2006539499A JP 4662943 B2 JP4662943 B2 JP 4662943B2
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Japan
Prior art keywords
contact hole
layer
contact
barrier layer
native oxide
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Expired - Fee Related
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JP2006539499A
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English (en)
Japanese (ja)
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JP2007511087A5 (https=
JP2007511087A (ja
Inventor
エム． ホッパー ドーン
博幸 木下
ウー クリスティ
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Advanced Micro Devices Inc
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Advanced Micro Devices Inc
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Publication date
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/033—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics
    • H10W20/034—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics bottomless barrier, adhesion or liner layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/054—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers by selectively removing parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2006539499A 2003-11-08 2004-10-08 コンタクトの形成中、コンタクトホール幅の増大を防ぐ方法 Expired - Fee Related JP4662943B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/705,631 US7005387B2 (en) 2003-11-08 2003-11-08 Method for preventing an increase in contact hole width during contact formation
PCT/US2004/033417 WO2005048342A1 (en) 2003-11-08 2004-10-08 Method for preventing an increase in contact hole width during contact formation

Publications (3)

Publication Number Publication Date
JP2007511087A JP2007511087A (ja) 2007-04-26
JP2007511087A5 JP2007511087A5 (https=) 2007-11-29
JP4662943B2 true JP4662943B2 (ja) 2011-03-30

Family

ID=34552414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006539499A Expired - Fee Related JP4662943B2 (ja) 2003-11-08 2004-10-08 コンタクトの形成中、コンタクトホール幅の増大を防ぐ方法

Country Status (8)

Country Link
US (1) US7005387B2 (https=)
JP (1) JP4662943B2 (https=)
KR (1) KR101180977B1 (https=)
CN (1) CN1883045A (https=)
DE (1) DE112004002156T5 (https=)
GB (1) GB2423635B (https=)
TW (1) TWI359475B (https=)
WO (1) WO2005048342A1 (https=)

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* Cited by examiner, † Cited by third party
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US20080038910A1 (en) * 2006-08-10 2008-02-14 Advanced Micro Devices, Inc. Multiple lithography for reduced negative feature corner rounding
US20090050471A1 (en) * 2007-08-24 2009-02-26 Spansion Llc Process of forming an electronic device including depositing layers within openings
US12444651B2 (en) 2009-08-04 2025-10-14 Novellus Systems, Inc. Tungsten feature fill with nucleation inhibition
JP6494940B2 (ja) * 2013-07-25 2019-04-03 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 異なるサイズのフィーチャへのボイドフリータングステン充填
US9972504B2 (en) 2015-08-07 2018-05-15 Lam Research Corporation Atomic layer etching of tungsten for enhanced tungsten deposition fill
KR102607331B1 (ko) * 2018-07-13 2023-11-29 에스케이하이닉스 주식회사 고종횡비 구조를 위한 갭필 방법 및 그를 이용한 반도체장치 제조 방법
CN116259575A (zh) * 2022-09-07 2023-06-13 上海华力集成电路制造有限公司 钨填充工艺的改善方法
CN119452753A (zh) 2023-01-05 2025-02-14 富士电机株式会社 半导体装置及其制造方法

Family Cites Families (21)

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Publication number Priority date Publication date Assignee Title
JPH0513411A (ja) * 1991-07-02 1993-01-22 Nec Corp 半導体装置の製造方法
JPH0661181A (ja) 1992-08-11 1994-03-04 Sony Corp バリアメタルの形成方法
JP3237917B2 (ja) * 1992-09-22 2001-12-10 沖電気工業株式会社 半導体素子の製造方法
JPH06349824A (ja) * 1993-06-10 1994-12-22 Toshiba Corp 半導体装置の製造方法
JPH09116009A (ja) * 1995-10-23 1997-05-02 Sony Corp 接続孔の形成方法
JPH09139358A (ja) * 1995-11-13 1997-05-27 Sony Corp 半導体装置の製造方法
US5985762A (en) * 1997-05-19 1999-11-16 International Business Machines Corporation Method of forming a self-aligned copper diffusion barrier in vias
TW388095B (en) * 1997-05-20 2000-04-21 United Microelectronics Corp Method for improving planarization of dielectric layer in interconnect metal process
JP3201318B2 (ja) * 1997-11-05 2001-08-20 日本電気株式会社 半導体装置の製造方法
US5994211A (en) * 1997-11-21 1999-11-30 Lsi Logic Corporation Method and composition for reducing gate oxide damage during RF sputter clean
US6303505B1 (en) * 1998-07-09 2001-10-16 Advanced Micro Devices, Inc. Copper interconnect with improved electromigration resistance
US6511575B1 (en) * 1998-11-12 2003-01-28 Canon Kabushiki Kaisha Treatment apparatus and method utilizing negative hydrogen ion
KR100277086B1 (ko) * 1999-01-02 2000-12-15 윤종용 반도체 장치 및 그 제조 방법
JP4221859B2 (ja) * 1999-02-12 2009-02-12 株式会社デンソー 半導体装置の製造方法
US6348709B1 (en) * 1999-03-15 2002-02-19 Micron Technology, Inc. Electrical contact for high dielectric constant capacitors and method for fabricating the same
JP2000323571A (ja) * 1999-05-14 2000-11-24 Sony Corp 半導体装置の製造方法
KR100316721B1 (ko) * 2000-01-29 2001-12-12 윤종용 실리사이드막을 구비한 반도체소자의 제조방법
KR20010077743A (ko) * 2000-02-08 2001-08-20 박종섭 비트 라인 및 그 제조 방법
US6498091B1 (en) * 2000-11-01 2002-12-24 Applied Materials, Inc. Method of using a barrier sputter reactor to remove an underlying barrier layer
US6624066B2 (en) 2001-02-14 2003-09-23 Texas Instruments Incorporated Reliable interconnects with low via/contact resistance
US20030073304A1 (en) * 2001-10-16 2003-04-17 Applied Materials, Inc. Selective tungsten stud as copper diffusion barrier to silicon contact

Also Published As

Publication number Publication date
GB2423635A (en) 2006-08-30
US20050101148A1 (en) 2005-05-12
WO2005048342A1 (en) 2005-05-26
GB0608285D0 (en) 2006-06-07
TWI359475B (en) 2012-03-01
CN1883045A (zh) 2006-12-20
DE112004002156T5 (de) 2006-09-14
KR101180977B1 (ko) 2012-09-07
JP2007511087A (ja) 2007-04-26
US7005387B2 (en) 2006-02-28
TW200524077A (en) 2005-07-16
KR20060107763A (ko) 2006-10-16
GB2423635B (en) 2007-05-30

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