JP4605359B2 - 鉛フリーの酸性スズ−ビスマス系合金電気メッキ浴 - Google Patents
鉛フリーの酸性スズ−ビスマス系合金電気メッキ浴 Download PDFInfo
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- JP4605359B2 JP4605359B2 JP2004305204A JP2004305204A JP4605359B2 JP 4605359 B2 JP4605359 B2 JP 4605359B2 JP 2004305204 A JP2004305204 A JP 2004305204A JP 2004305204 A JP2004305204 A JP 2004305204A JP 4605359 B2 JP4605359 B2 JP 4605359B2
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- acid
- bismuth
- tin
- alloy
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- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
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JP2004305204A JP4605359B2 (ja) | 2004-10-20 | 2004-10-20 | 鉛フリーの酸性スズ−ビスマス系合金電気メッキ浴 |
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JP2004305204A JP4605359B2 (ja) | 2004-10-20 | 2004-10-20 | 鉛フリーの酸性スズ−ビスマス系合金電気メッキ浴 |
Publications (3)
Publication Number | Publication Date |
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JP2006117980A JP2006117980A (ja) | 2006-05-11 |
JP2006117980A5 JP2006117980A5 (ko) | 2008-07-10 |
JP4605359B2 true JP4605359B2 (ja) | 2011-01-05 |
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JP2004305204A Active JP4605359B2 (ja) | 2004-10-20 | 2004-10-20 | 鉛フリーの酸性スズ−ビスマス系合金電気メッキ浴 |
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JP (1) | JP4605359B2 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9666547B2 (en) | 2002-10-08 | 2017-05-30 | Honeywell International Inc. | Method of refining solder materials |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005016819B4 (de) * | 2005-04-12 | 2009-10-01 | Dr.-Ing. Max Schlötter GmbH & Co KG | Elektrolyt, Verfahren zur Abscheidung von Zinn-Wismut-Legierungsschichten und Verwendung des Elektrolyten |
CN101918510B (zh) * | 2008-01-09 | 2013-07-10 | 阿克佐诺贝尔股份有限公司 | 含有螯合剂的酸性水溶液及其用途 |
EP2221396A1 (en) * | 2008-12-31 | 2010-08-25 | Rohm and Haas Electronic Materials LLC | Lead-Free Tin Alloy Electroplating Compositions and Methods |
CN101899691B (zh) * | 2010-07-16 | 2012-05-23 | 施吉连 | 一种在微波高频电路板上电镀锡铈铋合金的方法 |
US9850588B2 (en) * | 2015-09-09 | 2017-12-26 | Rohm And Haas Electronic Materials Llc | Bismuth electroplating baths and methods of electroplating bismuth on a substrate |
KR102617125B1 (ko) * | 2021-12-24 | 2023-12-27 | 주식회사 호진플라텍 | 저온 솔더를 위한 인듐-비스무스 합금용 전기 도금액 |
KR102617129B1 (ko) * | 2022-11-23 | 2023-12-27 | 주식회사 호진플라텍 | 비스무스 치환 방지 성능이 향상된 저온 솔더를 위한 인듐-비스무스 합금용 전기 도금액 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000219993A (ja) * | 1999-02-01 | 2000-08-08 | C Uyemura & Co Ltd | 電気錫合金めっき方法及び電気錫合金めっき装置 |
JP2000265294A (ja) * | 1999-03-15 | 2000-09-26 | Matsushita Electric Ind Co Ltd | 錫及び錫合金めっき浴、めっき皮膜及び半導体装置用のリードフレーム |
JP2001026898A (ja) * | 1998-11-05 | 2001-01-30 | C Uyemura & Co Ltd | 錫−銅合金電気めっき浴及びそれを使用するめっき方法 |
JP2001172791A (ja) * | 1999-12-16 | 2001-06-26 | Ishihara Chem Co Ltd | スズ−銅系合金メッキ浴、並びに当該メッキ浴によりスズ−銅系合金皮膜を形成した電子部品 |
JP2002080993A (ja) * | 2000-06-23 | 2002-03-22 | C Uyemura & Co Ltd | 錫−銅合金電気めっき浴及びそれを使用するめっき方法 |
JP2002339095A (ja) * | 2001-05-16 | 2002-11-27 | Dr Ing Max Schloetter Gmbh & Co Kg | スズ−ビスマス−銅合金の析出方法 |
JP2004183091A (ja) * | 2002-07-25 | 2004-07-02 | Shinriyou Denshi Kk | 錫−銀−銅含有めっき液、電解めっき方法、錫−銀−銅含有めっき被膜、並びにこのめっき被膜を使用したはんだ付け方法 |
JP2004244719A (ja) * | 2003-01-24 | 2004-09-02 | Ishihara Chem Co Ltd | スズ又はスズ合金の脂肪族スルホン酸メッキ浴 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0663110B2 (ja) * | 1988-09-22 | 1994-08-17 | 上村工業株式会社 | ビスマス―錫合金電気のめっき浴 |
JP2819180B2 (ja) * | 1990-02-22 | 1998-10-30 | 信康 土肥 | すず―鉛―ビスマス合金めっき浴 |
JPH08225985A (ja) * | 1995-02-15 | 1996-09-03 | Okuno Chem Ind Co Ltd | ビスマス−スズ合金めっき浴 |
JPH1025595A (ja) * | 1996-07-12 | 1998-01-27 | Ishihara Chem Co Ltd | スズ及びスズ合金めっき浴 |
US6176996B1 (en) * | 1997-10-30 | 2001-01-23 | Sungsoo Moon | Tin alloy plating compositions |
-
2004
- 2004-10-20 JP JP2004305204A patent/JP4605359B2/ja active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001026898A (ja) * | 1998-11-05 | 2001-01-30 | C Uyemura & Co Ltd | 錫−銅合金電気めっき浴及びそれを使用するめっき方法 |
JP2000219993A (ja) * | 1999-02-01 | 2000-08-08 | C Uyemura & Co Ltd | 電気錫合金めっき方法及び電気錫合金めっき装置 |
JP2000265294A (ja) * | 1999-03-15 | 2000-09-26 | Matsushita Electric Ind Co Ltd | 錫及び錫合金めっき浴、めっき皮膜及び半導体装置用のリードフレーム |
JP2001172791A (ja) * | 1999-12-16 | 2001-06-26 | Ishihara Chem Co Ltd | スズ−銅系合金メッキ浴、並びに当該メッキ浴によりスズ−銅系合金皮膜を形成した電子部品 |
JP2002080993A (ja) * | 2000-06-23 | 2002-03-22 | C Uyemura & Co Ltd | 錫−銅合金電気めっき浴及びそれを使用するめっき方法 |
JP2002339095A (ja) * | 2001-05-16 | 2002-11-27 | Dr Ing Max Schloetter Gmbh & Co Kg | スズ−ビスマス−銅合金の析出方法 |
JP2004183091A (ja) * | 2002-07-25 | 2004-07-02 | Shinriyou Denshi Kk | 錫−銀−銅含有めっき液、電解めっき方法、錫−銀−銅含有めっき被膜、並びにこのめっき被膜を使用したはんだ付け方法 |
JP2004244719A (ja) * | 2003-01-24 | 2004-09-02 | Ishihara Chem Co Ltd | スズ又はスズ合金の脂肪族スルホン酸メッキ浴 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9666547B2 (en) | 2002-10-08 | 2017-05-30 | Honeywell International Inc. | Method of refining solder materials |
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JP2006117980A (ja) | 2006-05-11 |
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