JP5278675B2 - スズ−ビスマス合金層沈着(析出)のための電解液及び方法 - Google Patents
スズ−ビスマス合金層沈着(析出)のための電解液及び方法 Download PDFInfo
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- JP5278675B2 JP5278675B2 JP2008505749A JP2008505749A JP5278675B2 JP 5278675 B2 JP5278675 B2 JP 5278675B2 JP 2008505749 A JP2008505749 A JP 2008505749A JP 2008505749 A JP2008505749 A JP 2008505749A JP 5278675 B2 JP5278675 B2 JP 5278675B2
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- bismuth
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- 239000003792 electrolyte Substances 0.000 title claims description 40
- 230000008021 deposition Effects 0.000 title claims description 16
- 238000000034 method Methods 0.000 title claims description 16
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 title claims description 14
- 229910001152 Bi alloy Inorganic materials 0.000 title claims description 9
- 229910052797 bismuth Inorganic materials 0.000 claims description 28
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical group [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 27
- -1 alkyl sulfonic acids Chemical class 0.000 claims description 15
- 239000002736 nonionic surfactant Substances 0.000 claims description 7
- IUTCEZPPWBHGIX-UHFFFAOYSA-N tin(2+) Chemical class [Sn+2] IUTCEZPPWBHGIX-UHFFFAOYSA-N 0.000 claims description 6
- 150000003460 sulfonic acids Chemical class 0.000 claims description 5
- 230000002378 acidificating effect Effects 0.000 claims description 4
- JDIBGQFKXXXXPN-UHFFFAOYSA-N bismuth(3+) Chemical class [Bi+3] JDIBGQFKXXXXPN-UHFFFAOYSA-N 0.000 claims description 4
- 150000003557 thiazoles Chemical class 0.000 claims description 2
- 238000000151 deposition Methods 0.000 description 20
- 238000000576 coating method Methods 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 13
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical class CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 10
- 239000008151 electrolyte solution Substances 0.000 description 10
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- SUMDYPCJJOFFON-UHFFFAOYSA-N isethionic acid Chemical compound OCCS(O)(=O)=O SUMDYPCJJOFFON-UHFFFAOYSA-N 0.000 description 4
- 229940098779 methanesulfonic acid Drugs 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- WQPMYSHJKXVTME-UHFFFAOYSA-N 3-hydroxypropane-1-sulfonic acid Chemical compound OCCCS(O)(=O)=O WQPMYSHJKXVTME-UHFFFAOYSA-N 0.000 description 3
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 3
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- CCIVGXIOQKPBKL-UHFFFAOYSA-M ethanesulfonate Chemical compound CCS([O-])(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-M 0.000 description 3
- 229910052500 inorganic mineral Inorganic materials 0.000 description 3
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000011707 mineral Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- LJYOXSMOJRTHIL-UHFFFAOYSA-N propane-1,2-disulfonic acid Chemical compound OS(=O)(=O)C(C)CS(O)(=O)=O LJYOXSMOJRTHIL-UHFFFAOYSA-N 0.000 description 3
- MGNVWUDMMXZUDI-UHFFFAOYSA-N propane-1,3-disulfonic acid Chemical compound OS(=O)(=O)CCCS(O)(=O)=O MGNVWUDMMXZUDI-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- YEDUAINPPJYDJZ-UHFFFAOYSA-N 2-hydroxybenzothiazole Chemical compound C1=CC=C2SC(O)=NC2=C1 YEDUAINPPJYDJZ-UHFFFAOYSA-N 0.000 description 2
- HSXUNHYXJWDLDK-UHFFFAOYSA-N 2-hydroxypropane-1-sulfonic acid Chemical compound CC(O)CS(O)(=O)=O HSXUNHYXJWDLDK-UHFFFAOYSA-N 0.000 description 2
- DXYYSGDWQCSKKO-UHFFFAOYSA-N 2-methylbenzothiazole Chemical compound C1=CC=C2SC(C)=NC2=C1 DXYYSGDWQCSKKO-UHFFFAOYSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- AFAXGSQYZLGZPG-UHFFFAOYSA-L ethane-1,2-disulfonate Chemical compound [O-]S(=O)(=O)CCS([O-])(=O)=O AFAXGSQYZLGZPG-UHFFFAOYSA-L 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- OPUAWDUYWRUIIL-UHFFFAOYSA-L methanedisulfonate Chemical compound [O-]S(=O)(=O)CS([O-])(=O)=O OPUAWDUYWRUIIL-UHFFFAOYSA-L 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 150000004867 thiadiazoles Chemical class 0.000 description 2
- 239000000080 wetting agent Substances 0.000 description 2
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 1
- MSBGPEACXKBQSX-UHFFFAOYSA-N (4-fluorophenyl) carbonochloridate Chemical compound FC1=CC=C(OC(Cl)=O)C=C1 MSBGPEACXKBQSX-UHFFFAOYSA-N 0.000 description 1
- QUKGLNCXGVWCJX-UHFFFAOYSA-N 1,3,4-thiadiazol-2-amine Chemical compound NC1=NN=CS1 QUKGLNCXGVWCJX-UHFFFAOYSA-N 0.000 description 1
- BIGYLAKFCGVRAN-UHFFFAOYSA-N 1,3,4-thiadiazolidine-2,5-dithione Chemical compound S=C1NNC(=S)S1 BIGYLAKFCGVRAN-UHFFFAOYSA-N 0.000 description 1
- FAYAYUOZWYJNBD-UHFFFAOYSA-N 1,3-benzothiazol-6-amine Chemical compound NC1=CC=C2N=CSC2=C1 FAYAYUOZWYJNBD-UHFFFAOYSA-N 0.000 description 1
- ORIIXCOYEOIFSN-UHFFFAOYSA-N 1,3-benzothiazol-6-ol Chemical compound OC1=CC=C2N=CSC2=C1 ORIIXCOYEOIFSN-UHFFFAOYSA-N 0.000 description 1
- UHGULLIUJBCTEF-UHFFFAOYSA-N 2-aminobenzothiazole Chemical compound C1=CC=C2SC(N)=NC2=C1 UHGULLIUJBCTEF-UHFFFAOYSA-N 0.000 description 1
- GDGIVSREGUOIJZ-UHFFFAOYSA-N 5-amino-3h-1,3,4-thiadiazole-2-thione Chemical compound NC1=NN=C(S)S1 GDGIVSREGUOIJZ-UHFFFAOYSA-N 0.000 description 1
- HMPUHXCGUHDVBI-UHFFFAOYSA-N 5-methyl-1,3,4-thiadiazol-2-amine Chemical compound CC1=NN=C(N)S1 HMPUHXCGUHDVBI-UHFFFAOYSA-N 0.000 description 1
- KZHGPDSVHSDCMX-UHFFFAOYSA-N 6-methoxy-1,3-benzothiazol-2-amine Chemical compound COC1=CC=C2N=C(N)SC2=C1 KZHGPDSVHSDCMX-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229920005682 EO-PO block copolymer Polymers 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229940045714 alkyl sulfonate alkylating agent Drugs 0.000 description 1
- 150000008052 alkyl sulfonates Chemical class 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 229950011260 betanaphthol Drugs 0.000 description 1
- JALQQBGHJJURDQ-UHFFFAOYSA-L bis(methylsulfonyloxy)tin Chemical compound [Sn+2].CS([O-])(=O)=O.CS([O-])(=O)=O JALQQBGHJJURDQ-UHFFFAOYSA-L 0.000 description 1
- 150000001621 bismuth Chemical class 0.000 description 1
- 150000001622 bismuth compounds Chemical class 0.000 description 1
- MGLUJXPJRXTKJM-UHFFFAOYSA-L bismuth subcarbonate Chemical compound O=[Bi]OC(=O)O[Bi]=O MGLUJXPJRXTKJM-UHFFFAOYSA-L 0.000 description 1
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(III) oxide Inorganic materials O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 description 1
- MNMKEULGSNUTIA-UHFFFAOYSA-K bismuth;methanesulfonate Chemical compound [Bi+3].CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O MNMKEULGSNUTIA-UHFFFAOYSA-K 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- AFAXGSQYZLGZPG-UHFFFAOYSA-N ethanedisulfonic acid Chemical compound OS(=O)(=O)CCS(O)(=O)=O AFAXGSQYZLGZPG-UHFFFAOYSA-N 0.000 description 1
- 229920005676 ethylene-propylene block copolymer Polymers 0.000 description 1
- NVVZQXQBYZPMLJ-UHFFFAOYSA-N formaldehyde;naphthalene-1-sulfonic acid Chemical compound O=C.C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 NVVZQXQBYZPMLJ-UHFFFAOYSA-N 0.000 description 1
- 239000003673 groundwater Substances 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003760 magnetic stirring Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- OPUAWDUYWRUIIL-UHFFFAOYSA-N methanedisulfonic acid Chemical compound OS(=O)(=O)CS(O)(=O)=O OPUAWDUYWRUIIL-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229940044654 phenolsulfonic acid Drugs 0.000 description 1
- 229920001983 poloxamer Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- KCXFHTAICRTXLI-UHFFFAOYSA-N propane-1-sulfonic acid Chemical compound CCCS(O)(=O)=O KCXFHTAICRTXLI-UHFFFAOYSA-N 0.000 description 1
- HNDXKIMMSFCCFW-UHFFFAOYSA-M propane-2-sulfonate Chemical compound CC(C)S([O-])(=O)=O HNDXKIMMSFCCFW-UHFFFAOYSA-M 0.000 description 1
- HNDXKIMMSFCCFW-UHFFFAOYSA-N propane-2-sulphonic acid Chemical compound CC(C)S(O)(=O)=O HNDXKIMMSFCCFW-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- CBDKQYKMCICBOF-UHFFFAOYSA-N thiazoline Chemical compound C1CN=CS1 CBDKQYKMCICBOF-UHFFFAOYSA-N 0.000 description 1
- 238000004876 x-ray fluorescence Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Mechanical Engineering (AREA)
Description
きず、なおも欠点である。ウィスカーは針状のスズの単結晶として定義される。これらは通常、数マイクロメーターの直径を有しているが、数ミリメーターの長さにも到達し得る。電子部品が小型化されるペースが進む結果、ウィスカー形成が近接する導電部品の短絡化を引き起こし得るようになった。これは、電気及び電子機器に、相当量の経済的損失と共に、機能不良を引き起こし得る。
3Sn0+2Bi3+ → 3Sn2++2Bi0↓
この電荷交換反応中に沈着するビスマスは、自然に陽極から剥がれ落ちる多孔性のスポンジ状のコーティングの形態で沈着し、それにより、電解液が浸透し、それゆえ部品もコートされる。この場合には、これらビスマス粒子も電着層中に取り込まれ、それゆえさらに技術的には無用な極めて樹枝状の層を生じさせる。これは同様に生産中止に帰着し得る。
は、表面に黒色汚れを引き起こし得る。電気めっきがその後続けられた場合、所謂サンドイッチコーティングが生ずる。電荷交換反応によって製造されるスズビスマス層は、電解沈着された二層のスズ−ビスマス層の間に形成されてしまう。ピンが機械的に加工される場合、この層配列はクラック形成につながり得、該層を剥げ落ちさせ得、貧弱なはんだぬれ性になり得る。
チオール−2が挙げられる。前記のうち、特に好ましいのは、2−メルカプトベンゾチアゾールである。用語“チアジアゾール化合物”は、置換された又は非置換の、飽和の又は不飽和のチアジアゾール化合物のいずれをも定義するためのものである。チアジアゾール化合物の可能な例は:2−アミノ−5−メチル−1,3,4−チアジアゾール、2−アミノ−5−メルカプト−1,3,4−チアジアゾール、2−メルカプト−5−メチル−1
,3,4−チアジアゾール、2−アミノ−1,3,4−チアジアゾール及び2,5−ジメルカプト−1,3,4−チアジアゾールが挙げられる。チアゾール及びチアジアゾール化合物はそれ自身で又は互いに組合せて使用することができる。
以下のものを含む電解液を調製した:
150g/l メタンスルホン酸、70質量%
80g/l スズ[Sn(CH3SO3)2として]
3.5g/l ビスマス[Bi(CH3SO3)3として]
1g/l カテコール
4g/l EO/POブロックコポリマー(BASF社のプルロニック(Pluronic)PE6400、分子量約2,900)
1g/l メタクリル酸
200mg/l 2−メルカプトベンゾチアゾール
温度: 40℃
電流密度: 10A/dm2
運動: 磁気撹拌、700rpm
継続時間: 2分間
実施例1と同様の条件下で、以下の組成を有する電解液からの沈着を実施した。
150g/l メタンスルホン酸、70質量%
80g/l スズ[Sn(CH3SO3)2として]
3.5g/l ビスマス[Bi(CH3SO3)3として]
1g/l カテコール
5g/l 12EO基を有する2−ナフトールエトキシレート(BASF社のルガルバン(Lugalvan)BNO−12)
0.5g/l ナフタレンスルホン酸ホルムアルデヒド縮合物(BASF社のタモール(Tamol)NN4501)
Claims (1)
- 電流が中断される場合、電荷交換の間に、新たに沈着されたスズ−ビスマス表面上へのビスマスの沈着を防止する方法であって、
一種以上のアルキルスルホン酸及び/又はアルカノールスルホン酸、
一種以上の可溶性スズ(II)塩、
一種以上の可溶性ビスマス(III)塩、及び
一種以上の非イオン性界面活性剤
を含むスズ−ビスマス合金の沈着のための水性酸性電解液中に、
一種以上のチアゾール化合物を含むことを特徴とする、方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005016819.1 | 2005-04-12 | ||
DE200510016819 DE102005016819B4 (de) | 2005-04-12 | 2005-04-12 | Elektrolyt, Verfahren zur Abscheidung von Zinn-Wismut-Legierungsschichten und Verwendung des Elektrolyten |
PCT/EP2006/002183 WO2006108476A2 (de) | 2005-04-12 | 2006-03-09 | Elektrolyt und verfahren zur abscheidung von zinn-wismut-legierungsschichten |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008536011A JP2008536011A (ja) | 2008-09-04 |
JP2008536011A5 JP2008536011A5 (ja) | 2012-03-15 |
JP5278675B2 true JP5278675B2 (ja) | 2013-09-04 |
Family
ID=36527525
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008505749A Active JP5278675B2 (ja) | 2005-04-12 | 2006-03-09 | スズ−ビスマス合金層沈着(析出)のための電解液及び方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5278675B2 (ja) |
KR (1) | KR20070120592A (ja) |
DE (1) | DE102005016819B4 (ja) |
TW (1) | TWI328052B (ja) |
WO (1) | WO2006108476A2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2419551A2 (de) * | 2009-03-18 | 2012-02-22 | Basf Se | Elektrolyt und oberflächenaktive additive für die galvanische abscheidung glatter, dichter aluminium-schichten aus ionischen flüssigkeiten |
CN102656735A (zh) * | 2009-12-15 | 2012-09-05 | 巴斯夫欧洲公司 | 作为电化学电池和电池组的电解质溶液中的添加剂的噻唑类化合物 |
CN112701351B (zh) * | 2020-12-29 | 2022-08-19 | 中国科学院宁波材料技术与工程研究所 | 一种非水性电解液及其制备方法以及一种锂离子电池 |
CN113293409B (zh) * | 2021-05-28 | 2022-06-24 | 中南大学 | 一种电解制备致密平整铋金属的方法 |
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JPH0781196B2 (ja) * | 1986-07-04 | 1995-08-30 | 株式会社大和化成研究所 | 有機スルホン酸塩からのビスマス及びビスマス合金めつき浴 |
US5174887A (en) * | 1987-12-10 | 1992-12-29 | Learonal, Inc. | High speed electroplating of tinplate |
WO1990004048A1 (en) * | 1988-10-14 | 1990-04-19 | Atochem North America, Inc. | A method, bath and cell for the electrodeposition of tin-bismuth alloys |
JP3274232B2 (ja) * | 1993-06-01 | 2002-04-15 | ディップソール株式会社 | 錫−ビスマス合金めっき浴及びそれを使用するめっき方法 |
JPH1025595A (ja) * | 1996-07-12 | 1998-01-27 | Ishihara Chem Co Ltd | スズ及びスズ合金めっき浴 |
JP3292055B2 (ja) * | 1996-09-03 | 2002-06-17 | 上村工業株式会社 | 錫−ビスマス合金電気めっき浴及びそれを使用するめっき方法 |
JP2000100850A (ja) * | 1998-09-24 | 2000-04-07 | Ebara Udylite Kk | 低融点金属バンプの形成方法 |
JP4077119B2 (ja) * | 1999-06-30 | 2008-04-16 | エヌ・イーケムキャット株式会社 | 錫−ビスマス合金電気めっき浴およびめっき方法 |
JP2001040497A (ja) * | 1999-07-27 | 2001-02-13 | Ne Chemcat Corp | 錫−ビスマス合金めっき皮膜で被覆された電子部品 |
US6706418B2 (en) * | 2000-07-01 | 2004-03-16 | Shipley Company L.L.C. | Metal alloy compositions and plating methods related thereto |
US6726827B2 (en) * | 2002-01-17 | 2004-04-27 | Lucent Technologies Inc. | Electroplating solution for high speed plating of tin-bismuth solder |
JP4441726B2 (ja) * | 2003-01-24 | 2010-03-31 | 石原薬品株式会社 | スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法 |
JP4441725B2 (ja) * | 2003-11-04 | 2010-03-31 | 石原薬品株式会社 | 電気スズ合金メッキ方法 |
JP4524483B2 (ja) * | 2004-04-28 | 2010-08-18 | 石原薬品株式会社 | スズ又はスズ合金メッキ方法 |
JP4389083B2 (ja) * | 2004-08-10 | 2009-12-24 | 石原薬品株式会社 | 鉛フリーのスズ−ビスマス系合金電気メッキ浴 |
JP4605359B2 (ja) * | 2004-10-20 | 2011-01-05 | 石原薬品株式会社 | 鉛フリーの酸性スズ−ビスマス系合金電気メッキ浴 |
JP4273266B2 (ja) * | 2005-03-23 | 2009-06-03 | 石原薬品株式会社 | 溶解電流抑制式のスズ合金電気メッキ方法 |
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KR20070120592A (ko) | 2007-12-24 |
TW200643231A (en) | 2006-12-16 |
JP2008536011A (ja) | 2008-09-04 |
WO2006108476A3 (de) | 2007-05-31 |
TWI328052B (en) | 2010-08-01 |
DE102005016819B4 (de) | 2009-10-01 |
WO2006108476A2 (de) | 2006-10-19 |
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